201107766 六、發明說明： 【發明所屬之技術領域】 本發明-般是關於一種半導體晶片測試插座，更確切 地沉，本發明是關於-種半導體晶片測試插座，盆 路板接觸的傳導石夕樹脂部件可靠地^ 關夕個柱塞，此些柱塞接觸作為測試目標的半導體晶片。 【先前技術】 如同本發明所屬技_域巾具有通常知識者所孰知 的試插座是用以測試半導體晶片是否能正常運作:、一 般來现，依照將架設至賴触的測顺針和 接觸並施加測試電流至測試電路板的 = 半導體⑼進行職。 用以測試半導體晶片的此種插座中，存在其 低半導體晶片的連接終端(焊錫球)受損的測試插座。在^ 試插座中，傳導石夕樹脂部件藉由垂直排列的金屬球f粉末 而形成於石夕樹脂構成的主要本體中，施加 ^末) 要本體下的測試電路板，心: 專利秘之峨插觸代表_子提出於韓國 專利及mG-2GG4-GlG1799號，韓國新型 侧917號，和日本專利說明書第Heisei. 遽。第1圖繪不依據習知技術使用傳導矽樹 體晶片測試插座之概念的剖面圖。 丨件的丰導 如第1圖所顯示’藉由垂直地配置提供於石夕樹脂 0的金屬球22而形成傳導石夕樹脂部件2〇，進—步來古兒σ， 201107766 ==膜5。各別地貼附至-樹脂底㈣的上方 H)的框架的支撐平板6〇通常麵合於石夕樹腊底部 體晶片具性連接於作為測試目標的半導 ，接測試電路板7〇的接觸部件乃 2 疋否正常由測試電路板70所決定。 = 在於因重複測二201107766 VI. Description of the Invention: [Technical Field] The present invention generally relates to a semiconductor wafer test socket, more specifically sinking, the present invention relates to a semiconductor wafer test socket, and the conductive contact of the basin plate contact The components reliably close the plunger, which contacts the semiconductor wafer as the test target. [Prior Art] As for the test socket of the present invention, the test socket known to those skilled in the art is used to test whether the semiconductor wafer can operate normally: generally, according to the measuring needle and contact which are erected to the touch And apply the test current to the test board = semiconductor (9). In such a socket for testing a semiconductor wafer, there is a test socket in which the connection terminal (solder ball) of the low semiconductor wafer is damaged. In the test socket, the conductive lithological resin component is formed in the main body of the lithium resin by vertically arranging the metal ball f powder, and the test circuit board under the body is applied. The plug-in representative is proposed in Korean Patent and mG-2GG4-GlG1799, Korean New Side 917, and Japanese Patent Specification Heisei. Figure 1 depicts a cross-sectional view of the concept of using a conductive eucalyptus wafer test socket in accordance with conventional techniques. As shown in FIG. 1 , the conductive material of the element is formed by vertically arranging the metal ball 22 supplied to the stone compound 0 to form a conductive stone etched resin member 2〇, and the step is to the ancient child σ, 201107766 == film 5 . The support plate 6 各 which is attached to the frame of the upper part H) of the resin bottom (4) is generally attached to the bottom of the Shih-Hula wax wafer and is connected to the semi-conductive material as the test target, and the contact of the test circuit board 7〇 Whether the component is 2 or not is normally determined by the test circuit board 70. = due to repeated measurement
If哥命，而使傳導销脂部件的上方表面受損^ ㈣題的技術已提出於韓國新型說明書登啡第 27_號和韓國專利說明書第1〇·2〇〇4_〇ι〇5⑽號。中= =些技術使得分離的金屬平板能接觸到半導體晶片的焊 曰圖f示出依據另一習知技術使用傳導石夕樹脂部件 的+導體曰曰片測試插座之概念的剖面圖。 利二I2 =广在本發明的申請人提出申請的韓國專 利也月曰第1〇-2_姻7393號中，柱塞3〇連接於 2G的上方末端。柱塞3Q具有測試凸塊，用來和 半導體S曰片的焊錫球接觸。柱塞3〇由頂蓋8〇容納，此技 術解決傳導销脂部件因接觸半導體晶片而受損的問體。 =丄依照製造過程，難以可靠地固定金屬製成的柱 塞至弹性南的傳導石夕樹脂部件，因此，保持柱塞於正確位 置並非易事。更進一步來說，重複測試時可自正確位置而 簡易地置換多個柱塞。 【發明内容】 201107766 據此，本發明有鑑於先前技術中發生的前述問題，且 本發明之-方面在於提供測試半導體晶片的插座，其具有 延長的壽命。 本發明之另一方面再於提供半導體晶片測試插座，其 架構使得除了簡化插座的組褒過程外，柱塞簡易地並可靠 地設置在正確位置。 為了達成前述方面，本發明提供一種半導體晶片測試 插座其具有.支撐平板，具有平板狀，耗合孔以厚度方 向穿過支撐平板的中央部分而形成；石夕樹脂底部，裝設於 支撐平板的輕合孔内’軸套自石夕樹脂底部朝外側突出；複 數個傳導雜脂料，藉由於厚度方向配置金屬球而形成 於軸套中，柱塞，置於每一傳導矽樹脂部件上，柱塞和半 導體晶片的相_錫球接觸；以及頂蓋，在相關柱塞的位 置上具有多個穿孔’接納空間形成於頂蓋的下方部份，使 得轴套插入至接納空間内，輕合頂蓋至石夕樹脂底部以固定 柱塞至销脂底部。®姉凸塊係提供於每-傳導補脂 部件的上絲面之中央部分上，以及插人孔，形成於每一 柱塞的中央部分中’使得每一傳導石夕樹脂部件的圓柱狀凸 塊插入相關柱塞的插入孔内。 進-步來說’每-柱塞可具有：圓柱狀本體，插入孔 通過圓柱狀本體而形成；多個探測凸塊，提供於圓柱狀本 體的上方終&上’探測凸塊接觸半導體晶片的相關焊錫 球，以及止動輪緣，自圓柱狀本體的周圍外表面朝外侧突 此外，下方凸塊可提供於每一柱塞的圓柱狀本體的下 方末端下，下方凸塊可具有截圓錐形狀，且截圓錐狀凹處 201107766 較佳地，的傳導石夕樹脂部件的戴圓錐狀凹處内β 夕固凹槽孔可形成於傳導矽樹脂部件間。 【實施方式】 例。以下將參考所附圖示詳細地說明本發明的較佳實施 座的為依據本發㈣-實施方式半導體w測試插 右，所不’依據本發明的實施方式的插座100具 厂β板60和矽樹脂底蓋10。耦合孔(未顯示)以 2讀平板⑼財央科而職，销脂底蓋 笔=、°又板狀支撐平板60 ’多個轴套12自石夕招十脂底 盍10朝上突出。 _ 支撐平板60是由不銹鋼構成，石夕樹脂底蓋1〇是通過 孔而架設至支撐平板6〇’耦合孔穿過支撐平板6〇的中 央部分而形成.。-般而言，石夕樹脂底蓋1〇藉由礙入射出成 型(insert injection molding)而形成。為了增加耦合力，架設 孔62較佳地於耦合孔附近穿過支撐平板6〇而形成，因此， 畐射出成型完成時，矽樹脂能可靠地穿過架設孔62而固定 於支撐平板6 0 (此技術已使用於製造習知測試插座的先前 技術）。 進一步來說，引導銷64耦合於支撐平板6〇，引導銷 64的功能是作為定位點，其引導插座，使得當測試完成時 讓插座設置在正確位置。 將更詳細地說明根據本發明的測試插座架構。 201107766 第4圖為沿著第3圖的線A-A，而得到的剖面圖。篦s 圖為第=圖的圓圈部份B的放大圖。 如第4圖所示，下方絕緣膜50是貼附至支撐平板6〇 的下方表面’以使測試電路板和測試插座絕緣。轴套曰 提供於至支撐平板6G的中央部分之發樹脂底蓋1〇 上，如第5圖所示，軸套12自支撐平板60朝上突出。 此外，複數個傳導矽樹脂部件20是藉由在軸套12中 以垂直方—向於石夕樹脂底蓋10配置金屬球而形成，圓柱形凸 塊26自每一傳導矽樹脂部件20的中央部分朝上突出。 如第5圖所示，多個柱塞3〇耦合於每—軸套12的上 方表面，並由頂蓋8〇所持定。 每-柱塞3G是由金屬構成，柱塞30具有圓柱形本體 32、探測凸塊34和止動輪緣36。探測凸塊34提供於圓柱 形本體32的上方末端，且止動輪緣％自圓柱形本體μ的 周圍外表面突出。插人孔39穿過圓柱形本體32的、 分而形成。 开°丨 傳導石夕^脂部件20的圓柱形凸塊26是插人至 個柱塞30的夕個插入孔39中，使得柱塞％可保持於j 位置。 啼 柱塞30的多個探測凸塊34個別 内，通孔穿過頂蓋80而形成。每 二；相關通孔82 置於放置凹處88内，放置凹處是二、止動輪緣36 方末端，，且放置凹處的直通U的下 進〆步來說，截圓錐狀下方 30之圓柱形本體32的下方末端下，进^美供於母—柱塞 成於每-傳導石續脂部件2G的上方表錐狀，處24是形 、面中。每一柱塞30 201107766 凸塊38是置於相關傳導賴脂部件2G的戴圓錐狀 内。 5此，柱塞30和傳導石夕樹脂部件2〇㈣接觸區域便 曰加了，使得測試電流可更可靠地流過柱塞3〇 脂部件20。 1寻等石夕樹 於下將更詳細地解釋頂蓋80。 頂蓋80的功用是持定多個柱塞30，通孔幻是於相關 =塞30的位置穿過頂蓋8〇而形成，接納空間是形成於頂 蓋的下方部分中，使得矽樹脂底部1〇的相關 访 至接納空間86内。 播入 進一步來說，使用矽樹脂黏著劑3將頂蓋8〇的下方末 端固定至矽樹脂底部的上方表面，頂蓋80是由工程塑 膠所構成，且特別地，頂蓋是由將PEI(p〇lyethrimide)^行 擠型而形成的聚醚亞胺(Ultem)構成。 通孔82垂直地通過頂蓋80而形成，使得柱塞3〇的探 測凸塊34將可和作為測試目標的半導體晶片的焊錫球接 觸’傾斜部件84較佳地形成於每一通孔82的上方末端中，If the life is fat, and the upper surface of the conductive pin member is damaged ^ (4) The technique has been proposed in the Korean new manual No. 27_ and Korean Patent Specification No. 1〇2〇〇4_〇ι〇5(10) . Medium == Some techniques enable the separated metal plate to contact the solder of the semiconductor wafer. Figure f shows a cross-sectional view of the concept of a +conductor chip test socket using a conductive resin component in accordance with another conventional technique. In the Korean patent, which is also filed by the applicant of the present application, the plunger 3〇 is connected to the upper end of the 2G. The plunger 3Q has test bumps for contacting the solder balls of the semiconductor S-chip. The plunger 3 is received by the top cover 8 ,. This technique solves the problem that the conductive pin member is damaged by contact with the semiconductor wafer. = According to the manufacturing process, it is difficult to reliably fix the plug made of metal to the elastic south conductive resin member, and therefore, it is not easy to keep the plunger in the correct position. Furthermore, multiple plungers can be easily replaced from the correct position during repeated testing. SUMMARY OF THE INVENTION Accordingly, the present invention is directed to the aforementioned problems occurring in the prior art, and an aspect of the present invention is to provide a socket for testing a semiconductor wafer having an extended life. Another aspect of the present invention further provides a semiconductor wafer test socket constructed such that the plunger is simply and reliably positioned in the correct position in addition to simplifying the stacking process of the socket. In order to achieve the foregoing aspects, the present invention provides a semiconductor wafer test socket having a support plate having a flat shape, and a consuming hole is formed in a thickness direction through a central portion of the support plate; and a bottom portion of the shixi resin is mounted on the support plate. The sleeve in the light fitting hole protrudes outward from the bottom of the Shishi resin; a plurality of conductive greases are formed in the sleeve by arranging the metal balls in the thickness direction, and the plunger is placed on each of the conductive resin members. The plunger and the semiconductor wafer are in contact with the solder ball; and the top cover has a plurality of perforations at the position of the associated plunger. The receiving space is formed in the lower portion of the top cover, so that the sleeve is inserted into the receiving space, and the sleeve is lightly engaged. The top cover is attached to the bottom of the Shixi resin to fix the plunger to the bottom of the pin. ® 姊 bumps are provided on the central portion of the upper surface of each of the conductive fat-retaining members, and insertion holes are formed in the central portion of each of the plungers to make the cylindrical projection of each of the conductive resin components The block is inserted into the insertion hole of the associated plunger. Further, the 'per-plunger may have a cylindrical body formed by the cylindrical body; a plurality of detecting bumps provided on the upper end of the cylindrical body and detecting the bumps contacting the semiconductor wafer The relevant solder ball, and the stop rim, protrude from the outer outer surface of the cylindrical body toward the outside, and the lower bump can be provided under the lower end of the cylindrical body of each plunger, and the lower bump can have a truncated conical shape And the truncated conical recess 201107766 Preferably, the beta conical recessed hole in the conical recess of the conductive lithographic resin member may be formed between the conductive resin members. [Embodiment] An example is given. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings in which a semiconductor device according to the present invention is inserted into the right, and the socket 100 according to the embodiment of the present invention has a beta plate 60 and Resin bottom cover 10. The coupling hole (not shown) is used for reading the tablet (9). The bottom of the pin is pen-shaped, and the plate-shaped support plate is 60. The multiple bushings 12 are from the top of the stone. The support plate 60 is made of stainless steel, and the core layer of the base material is formed by a hole that is erected to the support plate 6'' through the central portion of the support plate 6'. In general, the Shixia resin bottom cover 1 is formed by insert injection molding. In order to increase the coupling force, the erection hole 62 is preferably formed through the support plate 6〇 in the vicinity of the coupling hole. Therefore, when the 畐 injection molding is completed, the crepe resin can be reliably passed through the erection hole 62 and fixed to the support plate 60 ( This technique has been used in the prior art for manufacturing conventional test sockets. Further, the guide pin 64 is coupled to the support plate 6 〇, and the function of the guide pin 64 is as a positioning point that guides the socket so that the socket is placed in the correct position when the test is completed. The test socket architecture in accordance with the present invention will be explained in more detail. 201107766 Fig. 4 is a cross-sectional view taken along line A-A of Fig. 3.篦 s The figure is an enlarged view of the circled portion B of the Fig. As shown in Fig. 4, the lower insulating film 50 is attached to the lower surface ' of the support plate 6'' to insulate the test circuit board from the test socket. The sleeve 曰 is provided on the resin base cover 1 至 to the central portion of the support plate 6G, and as shown in Fig. 5, the sleeve 12 protrudes upward from the support plate 60. Further, a plurality of conductive resin members 20 are formed by arranging metal balls in the sleeve 12 in a vertical direction toward the core resin cover 10, and the cylindrical projections 26 are from the center of each of the conductive resin members 20. Partially protruding upwards. As shown in Fig. 5, a plurality of plungers 3 are coupled to the upper surface of each of the sleeves 12 and held by the top cover 8''. Each of the plungers 3G is made of metal, and the plunger 30 has a cylindrical body 32, a detecting projection 34, and a retaining rim 36. The detecting projection 34 is provided at the upper end of the cylindrical body 32, and the retaining rim % protrudes from the peripheral outer surface of the cylindrical body μ. The insertion holes 39 are formed through the divided portions of the cylindrical body 32. The cylindrical projection 26 of the conductive member 20 is inserted into the insertion hole 39 of the plunger 30 so that the plunger % can be maintained at the j position.多个 A plurality of detecting bumps 34 of the plunger 30 are individually formed, and a through hole is formed through the top cover 80. Every two; the relevant through hole 82 is placed in the placement recess 88, the placement recess is two, the end of the stop rim 36, and the downward pass of the straight U placed in the recess, the truncated cone below 30 Below the lower end of the cylindrical body 32, the female-plunger is formed in a tapered shape above the per-stone-reducing component 2G, and the portion 24 is in the shape and surface. Each of the plungers 30 201107766 bumps 38 is placed within the conical shape of the associated conductive lipophilic component 2G. 5, the contact area of the plunger 30 and the conductive diaper resin member 2 (4) is increased, so that the test current can flow more reliably through the plunger 3 resin member 20. 1 Finding Shi Xishu The top cover 80 will be explained in more detail below. The function of the top cover 80 is to hold a plurality of plungers 30. The through holes are formed through the top cover 8 at the position of the relevant plug 30. The receiving space is formed in the lower portion of the top cover, so that the bottom of the resin is 1〇 related visits to the reception space 86. Further, the lower end of the top cover 8 is fixed to the upper surface of the base of the resin using the resin adhesive 3, and the top cover 80 is made of engineering plastic, and in particular, the top cover is made of PEI ( P〇lyethrimide) consists of a polyetherimide (Ultem) formed by extrusion molding. The through hole 82 is formed vertically through the top cover 80 such that the detecting bump 34 of the plunger 3 is in contact with the solder ball of the semiconductor wafer as a test target. The inclined member 84 is preferably formed above each of the through holes 82. In the end,
且以預設角度朝通孔82的中央朝下傾斜，因此，探測凸塊 34可簡易地和焊錫球接觸。 A 此外，直徑增加的放置凹處88是形成於通孔82的下 方末端中，使得相關柱塞30的止動輪緣36可靠地固定至 放置凹處88内。 在此將更詳細地解釋根據本發明的插座之組件。 第6圖綠示依據本發明第一實施例測試插座的組件的 爆炸侧視圖。 201107766 參考第5圖和第6圖，㈣ 型技術而整舰喊於切付6㈣ ^ ^成 樹脂部件2G是提供於销料部丨㈣多傳導石夕 於後费下方絕緣膜50貼附至支稽平板 :面 穿孔52穿過下方絕緣膜5〇而π Λ、卜万表面’ 20的下方末端將通過穿孔52 ^ 導梦樹腊部件 (電極塾片）接觸。 而和測喊電路板的接觸部件 接著，柱塞30置於軸套12的上方表面 供於傳輔脂部件20的上方表面上的多個圓柱二^ 26插入至相關插入孔39内，插入孔是形成於柱塞 央部分中’使，柱塞3G能可靠地設置在正確位置。 進-步來況’圓柱形凸塊26插入相關插入孔3 防止柱塞30因執行重複測試而自正確位置被置換， 入孔39的周圍内側表面和圓柱形凸塊26的周圍: 接觸，將形成測試電流流動的額外路程。 最後，使用黏著劑將頂蓋80貼附至石夕樹脂底部⑺ 上方表面，使得頂蓋80可靠地持定柱塞3〇，在此， 12是插入至頂蓋80的接納空間86内。 此後，將說明根據本發明第二實施方式的半導 測試插座。 —日日月 第7圖 座的剖面圖 繪示根據本發明第二實施例半導體晶片测試插 如第7圖所示，在第二實施例中，在傳導矽樹脂部件 20間，凹槽孔28形成於梦樹脂底部的上方表面中（々羊細地 說，在軸套12的上方表面中）。 201107766 在執行半導體晶片測試時，施加於柱塞的負載傳輪至 傳導矽樹脂部件20，因此’傳導矽樹脂部件20可於水平方 向變形，導致整體插座受損。 如第二實施方式所例示的，在凹槽孔28形成於矽樹脂 底部的情況中，凹槽孔28可吸收造成傳導矽樹脂部件20 變形的壓力，因而防止插座受損。 如上所述，根據本發明半導體晶片測試插座的架構使 得柱塞耦合至傳導矽樹脂部件的上方表面，柱塞具有探測 凸塊’其與半導體晶片的焊錫球相接觸。因此，可防止傳 導石夕樹脂部件磨損，而延長插座的壽命。 進一步來說，圓柱形凸塊自每一傳導矽樹脂的上方表 面之中央部分朝上犬出，插入孔形成於每一柱塞的中+部 分中，每一傳導矽樹脂部件的圓柱形凸塊是插入至相關ς 塞的插入孔内。柱塞可簡易地設置在正確位置，因此，門 雖然本發明的基本精神是提供一種測試插座， 耦合於傳導矽樹脂部件之柱塞的架構， /、 ^ 具有通常知識者將可在不脫離如申以:支，域中 明的範圍和精神的情況下，明瞭各種可=路 置換。 ν &哪、添加和And it is inclined downward toward the center of the through hole 82 at a predetermined angle, and therefore, the detecting projection 34 can be easily brought into contact with the solder ball. Further, a diameter-increasing placement recess 88 is formed in the lower end of the through hole 82 such that the stop rim 36 of the associated plunger 30 is securely fixed into the placement recess 88. The assembly of the socket according to the invention will be explained in more detail herein. Fig. 6 is a green exploded view showing the assembly of the test socket in accordance with the first embodiment of the present invention. 201107766 Refer to Figure 5 and Figure 6, (4) type technology and the whole ship shouts to cut 6 (four) ^ ^ into the resin part 2G is provided in the pin part 丨 (4) multi-conducting stone 夕 于 后 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方Alignment: The face perforation 52 passes through the lower insulating film 5〇 and the lower end of the π Λ, 卜万 surface '20 will be contacted through the perforation 52 ^ guide tree wax component (electrode bract). And the contact member of the circuit board is next, the plunger 30 is placed on the upper surface of the sleeve 12, and a plurality of cylinders 26 on the upper surface of the transfer auxiliary member 20 are inserted into the associated insertion holes 39, and the insertion holes are inserted into the holes. It is formed in the central portion of the plunger so that the plunger 3G can be reliably placed in the correct position. Further, the cylindrical projection 26 is inserted into the associated insertion hole 3 to prevent the plunger 30 from being displaced from the correct position by performing repeated tests, around the inner side surface of the hole 39 and around the cylindrical projection 26: contact, An extra path of test current flow is formed. Finally, the top cover 80 is attached to the upper surface of the bottom layer (7) of the Shishi resin using an adhesive so that the top cover 80 securely holds the plunger 3, where 12 is inserted into the receiving space 86 of the top cover 80. Hereinafter, a semiconductor test socket according to a second embodiment of the present invention will be explained. - FIG. 7 is a cross-sectional view showing a semiconductor wafer test insert according to a second embodiment of the present invention, as shown in FIG. 7, in the second embodiment, between the conductive resin members 20, a recessed hole 28 is formed in the upper surface of the base of the dream resin (in the upper surface of the sleeve 12). 201107766 When the semiconductor wafer test is performed, the load applied to the plunger is transferred to the conductive resin member 20, so that the conductive resin member 20 can be deformed in a horizontal direction, resulting in damage to the entire socket. As exemplified in the second embodiment, in the case where the recessed hole 28 is formed in the bottom of the resin, the recessed hole 28 can absorb the pressure which causes the deformation of the conductive resin member 20, thereby preventing the socket from being damaged. As described above, the semiconductor wafer test socket according to the present invention is constructed such that the plunger is coupled to the upper surface of the conductive resin member, and the plunger has the detecting bump' which is in contact with the solder ball of the semiconductor wafer. Therefore, it is possible to prevent the wear of the resin component from being worn and to extend the life of the socket. Further, the cylindrical projections are upwardly directed from the central portion of the upper surface of each of the conductive resin, and the insertion holes are formed in the middle + portion of each of the plungers, and the cylindrical projections of each of the conductive resin members are It is inserted into the insertion hole of the relevant plug. The plunger can be easily placed in the correct position, therefore, although the basic spirit of the present invention is to provide a test socket that is coupled to the structure of the plunger that conducts the resin component, /, ^ who has the usual knowledge will not be able to According to the scope of the branch and the scope of the Ming and the spirit of the field, it is clear that all kinds of roads can be replaced. ν & which, add and
i ：SJ 201107766 【圖式簡單說明】 參考所附圖示由以下謹★ μ 明之前述和其他«咖瞭本發 體晶====使賴繼部件的半導 =2 ®繪不出依據另—f知技術使料導賴脂部件 的半V體晶片測試插座之概念的剖面圖。 第3圖為依據本發明第一實施方式半導體晶片測試插 座的平面圖。 第4圖為沿著第3圖的線A-A，而得到的剖面圖。 第5圖為第4圖的圓圈部份B的放大圖。 第6圖繪示依據本發明第一實施例測試插座的組件的 爆炸側視圖；以及 第7圖繪示根據本發明第二實施例半導體晶片測試插 座的剖面圖。 【主要元件符號說明】 第1圖： 1半導體晶片 2谭錫球 10矽樹脂底部 2〇傳導矽樹脂部件 22金屬球 40絕緣膜 50絕緣膜 60支撐平板 70測試電路板 72接觸部件 201107766 第2圖： 20傳導矽樹脂部件 30柱塞 80頂蓋 第3圖至第7圖： 3矽樹脂黏著劑 10矽樹脂底蓋 12軸套 20傳導矽樹脂部件 24截圓錐狀凹處 26圓柱形凸塊 28 凹槽孔 32圓柱形本體 34探測凸塊 36止動輪緣 38截圓錐狀下方凹處 39插入孔 50下方絕緣膜 52穿孔 60支撐平板 62架設孔 64引導銷 80頂蓋 82 通孔 84傾斜部件 86接納空間 88放置凹處 100插座 13i :SJ 201107766 [Simple description of the diagram] Refer to the attached diagram below for the following and other « 咖 本 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = A cross-sectional view of the concept of a semi-V-body wafer test socket for a material-leading component. Figure 3 is a plan view of a semiconductor wafer test socket in accordance with a first embodiment of the present invention. Fig. 4 is a cross-sectional view taken along line A-A of Fig. 3. Fig. 5 is an enlarged view of a circle portion B of Fig. 4. Figure 6 is a side elevational view showing the assembly of the test socket in accordance with the first embodiment of the present invention; and Figure 7 is a cross-sectional view showing the semiconductor wafer test socket in accordance with the second embodiment of the present invention. [Main component symbol description] Fig. 1: 1 semiconductor wafer 2 Tan tin ball 10 矽 resin bottom 2 〇 conductive 矽 resin component 22 metal ball 40 insulating film 50 insulating film 60 support plate 70 test circuit board 72 contact part 201107766 2: 20 Conductive silicone resin member 30 plunger 80 top cover Figs. 3 to 7: 3 矽 resin adhesive 10 矽 resin bottom cover 12 bushing 20 conductive enamel resin member 24 truncated conical recess 26 cylindrical projection 28 groove Hole 32 cylindrical body 34 detection projection 36 stop rim 38 truncated conical lower recess 39 insertion hole 50 under insulation film 52 perforation 60 support plate 62 erection hole 64 guide pin 80 top cover 82 through hole 84 slanting member 86 receiving space 88 place recess 100 socket 13