M363591 五、新型說明： Λ 【新型所屬之技術領域】 本創作係有關於一種測試系統，特別係關於一種半導 體裝置測試系統及其監控系統。 【先前技術】 於現今半導體技術，一般半導體晶圓上之晶粒，在運 ： 送至客戶或安裝在各種產品中之前得需要進行測試程序。 I 在普遍後端製程中，在晶粒仍為晶圓形式時，單一化晶粒， 並將上述晶粒封裝、燒入(burn in)且進一步測試。另一種半 導體製程’則是自晶圓上切割晶粒後’並不封裝晶粒’而 是進一步測試且進行燒入程序以獲得「已知較佳晶粒 (known good die)」。在更先進的半導體製程，亦有將晶圓 級(wafer level)之測試程序，此即為晶粒在為晶圓形式時進 行燒入且完全測試程序。 在上述半導體後端製程，有更先進且效率更高之半導 φ 體裝置測試系統之需求。 【新型内容】 本創作之目的係在於提供上述之半導體裝置測試系 統。 本創作係揭露一種半導體裝置監控系統，包含：一測 試設備，用以測試一半導體裝置，以進行一測試程序；一 測試系統伺服器，無線地傳送一測試資料至其測試設備， 以進行其測試程序，以及無線地接收自其測試設備所傳送 之一測試結果；一或多個控制終端，無線地接收自其測試 M363591 系統伺服器所傳送之其測試資料，藉以無線地傳送其測試 資料至其測試設備，以進行其測試程序，其中其控制終端 包括一可攜式裝置；一監控伺服器，耦合至其測試系統伺 服器，用以監控其控制終端之行動；其中其測試系統伺服 器無線地接收自一設計設備、一製造設備、其測試設備或 其控制終端所傳送之一測試請求，並無線地傳送其測試結 果至其設計設備、其製造設備或其控制終端；以及其中其 測試設備、其半導體裝置、其設計設備或其製造設備具有 無線辨識標籤以供其控制終端所讀取。 本創作亦揭露一種半導體裝置測試系統，包含：一測 試設備，用以測試一半導體裝置，以進行一測試程序；一 測試系統伺服器，無線地傳送一測試資料至其測試設備， 以進行其測試程序，以及無線地接收自其測試設備所傳送 之一測試結果；一或多個控制終端，無線地接收自其測試 系統伺服器所傳送之其測試資料，藉以無線地傳送其測試 資料至其測試設備，以進行其測試程序，其中其控制終端 包括可攜式裝置；其中其測試系統伺服器無線地接收自一 設計設備、一製造設備、其測試設備或其控制終端所傳送 之一測試請求，並無線地傳送其測試結果至其設計設備、 其製造設備或其控制終端；以及其中其測試設備、其半導 體裝置、其設計設備或其製造設備具有無線辨識標籤以供 其控制終端所讀取。 【實施方式】 本創作將配合其較佳實施例與後附之圖式詳述於下。 4 M363591 應可理解’本創作中之較佳實施例係僅用以說明，而非用 以限定本創作。此外，除文中之較佳實施例外，本創作亦 可廣泛應用於其他實_，並且本創作並㈣定於任何實 施例，而應視後附之申請專利範圍而定。 根據較佳實施例’第1圖為本創作之半導體裝置測試 系統⑽之。半導體裝㈣試祕⑽包括測試機 10與測試台20。賴機H)可料測試任何合適之半導體M363591 V. New description: Λ 【New technology field】 This creation department is about a test system, especially for a semiconductor device test system and its monitoring system. [Prior Art] In today's semiconductor technology, the die on a general semiconductor wafer is in need of a test procedure before being sent to a customer or installed in various products. In a common back-end process, where the die is still in wafer form, the die is singulated and the die is packaged, burned, and further tested. Another semi-conducting process is to "not encapsulate the die" after dicing the die from the wafer and further testing and performing a burn-in procedure to obtain a "known good die." In more advanced semiconductor processes, there is also a wafer level test procedure, which is a burn-in and complete test procedure for the die when it is in wafer form. In the above semiconductor back-end process, there is a need for a more advanced and efficient semi-conducting φ body device test system. [New Content] The purpose of this creation is to provide the above semiconductor device test system. The present invention discloses a semiconductor device monitoring system comprising: a test device for testing a semiconductor device to perform a test procedure; a test system server for wirelessly transmitting a test data to its test device for testing thereof a program, and wirelessly receiving one of the test results transmitted from its test device; one or more control terminals wirelessly receiving test data transmitted from the test M363591 system server thereof, thereby wirelessly transmitting its test data to the test data Testing the device for performing its test procedure, wherein its control terminal includes a portable device; a monitoring server coupled to its test system server for monitoring the action of its control terminal; wherein its test system server wirelessly Receiving a test request transmitted from a design device, a manufacturing device, its test device, or its control terminal, and wirelessly transmitting its test result to its design device, its manufacturing device, or its control terminal; and wherein its test device, Its semiconductor device, its design equipment or its manufacturing equipment have wireless identification Tags for controlling the read terminal. The present invention also discloses a semiconductor device test system comprising: a test device for testing a semiconductor device to perform a test procedure; and a test system server for wirelessly transmitting a test data to its test device for testing thereof a program, and wirelessly receiving one of the test results transmitted from its test device; one or more control terminals wirelessly receiving their test data transmitted from their test system server, thereby wirelessly transmitting their test data to their test a device for performing its test procedure, wherein its control terminal includes a portable device; wherein its test system server wirelessly receives a test request transmitted from a design device, a manufacturing device, its test device, or its control terminal, And wirelessly transmitting its test results to its design device, its manufacturing device or its control terminal; and wherein its test device, its semiconductor device, its design device or its manufacturing device has a wireless identification tag for its control terminal to read. [Embodiment] The present invention will be described in detail below in conjunction with its preferred embodiments and the accompanying drawings. 4 M363591 It should be understood that the preferred embodiment of the present invention is for illustrative purposes only and is not intended to limit the present invention. In addition, this creation may be applied to other realities, except for the preferred implementation of the text, and this creation is (4) set forth in any example and should be determined by the scope of the appended patent application. According to a preferred embodiment, Fig. 1 is a semiconductor device test system (10) of the present invention. The semiconductor package (4) test (10) includes a test machine 10 and a test stand 20. Lai H) can test any suitable semiconductor
裝置令纟切割之半導體晶圓之半導體晶粒或已分割 晶粒（已封裝或未封裝）。亦可將分m絲成為模組， 接受測試。於較佳實施例，測試機1G為—可攜式裝置，透 過傳輸路徑η與測試台2G溝通，讀遞#訊。上述傳輸 路徑12包妹外線⑽村料他實贱無線傳輸 方式上述貝成-般包括資料信號、位址信號、控制信號、 狀態信號、藉由賴機而產生之測試信號以及待測晶粒所 產生之回應信號。其中測試程序可包括電氣特性測試或晶 圓測試(wafer probe)。 敛述測°式系統100之操作。測試機10產生測試資料’ 將測試資料透過傳輸路徑12傳送至職台Μ，以執行測 -式程序！木針卡22之探針24接觸至置於平台％之晶圓 28平° 26可支撐及移動晶® 28。晶® 28具有複數個待 測之曰曰粒3G。Κ台2G透過探針卡22之探針24將測試 資料提供至晶圓28之晶粒3G，並接收晶粒所反應之信號。 上述晶粒30可為任何類型之積體電路晶片，包括但不限於 記憶體晶片、微處理器或微控制器、信號處理器、類比晶 片、特殊應用積體電路(ASIC)、數位邏輯電路等。 M363591 第一控制器32具有紅外線傳輸模組，透過連接器14、 傳輸路徑12，耦合至測試機10。測試機10所提供用以測 試晶圓28之晶粒30之測試資料，透過傳輸路徑12提供至 第一控制器32 ;而複數個晶粒30經測試後，產生之回應 資料，亦透過第一控制器32傳送至測試機10。 探針卡22包括複數個第二控制器34,亦具有紅外線通 訊模組，因此，第一控制器32能將自控制器10所接收之 測試資料，利用紅外線方式傳播至複數個第二控制器34， • 上述測試資料再經由複數個第二控制器34,透過探針卡22 内之導電線路（未顯示）電性傳送至晶粒30。而晶粒30產生 之回應資料同樣經由第二控制器34、第一控制器32以及 傳輸路徑12至測試機10。 複數個第二控制器個別地控制晶粒30之測試程序，每 一個第二控制器34可對應一個或多個晶粒30。第一控制 器32透過複數個第二控制器34，於第一控制器32與測試 機10之間，建立一個具有彈性的擴充傳輸介面。試舉例說 ® 明之，測試機10與測試台20之間之傳輸通道為一固定數 目，因此測試機10僅能同時測試一固定數目之晶粒。藉由 變更第一控制器32與第二控制器34之間傳輸介面，以及 第二控制器34數目，毋需改變連接至測試機10之傳輸通 道數目的情況下可增加晶粒30單位的測試數量。 第2圖根據本創作之較佳實施例，為測試台20之方塊 圖。測試台20包括第一控制器32、複數個第二控制器34、 測試單元36以及輸入輸.出單元38。第一控制器32控制測 試台20之操作。第一控制器32係透過紅外線傳輸，傳送 M363591 資訊至第二控制器34，以控制複數個第二控制器34之操 * 作。第二控制器34可對應一個或多個待測晶粒，將所接收 的測試指令或資訊傳送至測試單元36以進行測試程序。測 試單元36接收上述測試指令，將對待測物品執行測試程 序，並將產生的測試結果傳送至第二控制器34。複數個第 二控制器34將接收的測試結果紅外線地傳送至第一控制 器32。第一控制器32將測試結果透過輸入輸出單元38， 傳送至外部的測試機。於較佳實施例，上述測試單元36包 Φ 括探針卡。 第3圖根據本創作之較佳實施例，為第一控制器32之 方塊圖。其第一控制器32可將其控制器内的多個功能整合 成一個積體電路或由多個積體電路實現。第一控制器32包 括紅外線傳輸單元322、控制單元324、記憶體單元326以 及輸入/輸出單元328。紅外線傳輸單元322可無線地傳送 紅外線之測試信號至複數個第二控制器34;以及無線地接 收由複數個第二控制器34所傳送之測試結果。控制單元 _ 324係控制第一控制器32之操作。控制單元324可包含在 軟體控制下運作之微處理器，亦可包含固定線路的邏輯電 路，或上述兩者之組合。記憶體單元326係為儲存控制單 元324用以執行之資料及/或軟體的記憶體。輸入/輸出單元 328係用以提供第一控制器32與測試台20間之實體線路 輸入或輸出介面。 第4圖根據本創作之較佳實施例，為第二控制器34之 方塊圖。於較佳實施例，第二控制器34可為一紅外線傳輸 之控制模組，其可將其控制器内的多個功能整合成一個積 7 M363591 體電路或由多個積體電路實現。第二控制器34包括紅外線 ' 傳輸單元342、控制單元344、記憶體單元346以及探針輸 入/輸出單元348。紅外線傳輸單元342可將測試結果無線 地傳送至紅外線至第一控制器32 ;以及無線地接收由第一 控制器32所傳送之測試信號。控制單元344係控制第二控 制器34之操作。控制器344可包含在軟體控制下運作之微 處理器，亦可包含固定線路的邏輯電路，或上述兩者之組 合。記憶體單元346係為儲存控制器344用以執行之資料 • 及/或軟體的記憶體。探針輸入/輸出單元348係為於探針 24與第二控制器34之間的信號輸入或輸出介面。 第5圖根據本創作之較佳實施例，為測試機10之方塊 圖。測試機10包括無線傳輸單元102、紅外線傳輸單元 103、控制單元104、記憶體單元106、輸入單元108、警 示單元110、顯示單元112。無線傳輸單元102係用於傳送 與接收於測試機10與外部基地台（base station)(未顯示）之 間之無線訊號。紅外線傳輸單元103係用於傳送與接收測 ® 試機10與測試台20間之紅外線信號。控制單元104係控 制測試機10之操作。控制單元104可包含在軟體控制下運 作之微處理器，亦可包含固定線路的邏輯電路，或上述兩 者之組合。記憶體單元106係為儲存控制單元106用以執 行之資料及/或軟體的記憶體。輸入單元108係測試機10 之輸入介面。於較佳實施例，輸入單元包括鍵盤、觸碰螢 幕或聲控裝置，等多種輸入方式以輸入指令。警示單元110 係用以在一預設之狀態時，發出通知訊息，提醒測試機10 之使用者。於較佳實施例，該警示單元110包括喇叭、蜂 8 M363591 者益:、微，馬達’發出文字、音訊或震動訊號’通知使用 、顯不單70 112係用於提供顯示功能，於較佳實施例， ^^機1〇可利用圖形使用者介面（Graphical User Interface， _ 、使用者圖形方式顯示的操作介面顯示於顯示單 裝置，例如，行動終端。 作。使用者可^先設導/裝置測試系統100之操 ^ ug . .Λ. .. ^ 、】減排程或讀取測試機10内之記憶 1()2 :存之踯試排程資訊，或透過無線傳輸單元 致，=__°當到達歡的排程日期及時間， 警不早70110將發出通知訊息至使用者。 傳耠t後’：t上述測試排程資訊’測試機10透過紅外線 20 朗欲進行測試之測試台20。每一個測試台 20 1〇 可接^便進行測試程序。測試機10辨識 盡 '咨—^二·^ 2〇，若使用者符合操作權限及測試排程所 試ί :,"忒機1〇才能識別’並操控符合測試排程的測 2 0夕1G識別4合的測試台2 G，則先初始化測試台 之狀U使測試台2〇内的第一控制$ & 控制器34狀態一致，龙馇*难於+力— ”稷数個第一 r:=二V:二= 個二;第-控制器幻，則每-個第一 了在不叫率或時間上指轉應的第二控制 M363591 器傳輸。 測試台20設定後，測試機1〇傳送測試資訊或指令， 透過傳輸路徑12至測試台20進行測試程序。第一控制器 32接收測試資料或指令後，將測試資料或指令廣播至對應 的複數個第二控制器34。收到測試資料的第二控制器^ 透過探針卡22之探針24將測試資料傳送至待測晶粒3〇， 進行測試程序。 經測試之aa粒30對上述測試行為產生回應之測試結 果，並透過探針24、探針卡22之導電路徑（未顯示广將上 述測試結果傳送至對應之第二控制器34。接收晶粒％所 回應之測試結果之第二控 34將其資訊紅外線地傳送 至第一控制器32。透過傳輸路徑12，接收測試資料之第一 控制器32將測試結果傳送至測試機1()，並將其顯示於顯 測試機10之顯示單元112上。 參照第6圖，本創作亦揭露一種半導體裝置測試系統 6〇〇。測試系、统600部分部件與上述實施例相似，因此，相 似的4刀將不詳細敘述。半導體裝置測試系、统議包括測 试控制、、’，& 6G2、測試系統伺服器6()4以及測試設備嶋。 :又U 608係設計上述半導體裝置6〇3之構造；而製造 j㈣敎其設計’製造半導體裝置603。製成的半導 置>603則需要提供至測試設備606測試之。 a a測忒控制終端6〇2、測試設備㈧6、設計設備或製 又備6二可無線地傳送測試請求至測試系統伺服器 ns、'、f系統飼服器604將會安排測試排程，並傳送測 心枓至測試設備_以進行測試程序。 M363591 “ 測試控制終端602類似於第5圖之測試機10，係用於 控制測试s史備606之操作。測試控制終端6〇2可預失二 測試排程或漬取測試控制終端6〇2内之記憶體所儲存之測 試排程資訊，或透過無線傳輸下載或上載測試系統词= 604之測試排程資訊。測試控制終端6〇2可依據上述測試 排程或測試資料，無線地傳送測試資訊至測試設锖6恥進 行測試程序。於較佳實施例，測試控制終端6〇2亦可傳送 測試請求至測試系統伺服器6〇4，要求對測試設備6㈨進 • 行測試程序。測試系統伺服器604將會驗證上述發出測試 請求之測試控制終端602之權限，若其符合權限，則測試 系統伺服器604則會無線地傳送測試資料或命令至測試設 備606。接收測試資料之測試設備6〇6則會對半導體裝置 603進行測試程序。上述測試資料或命令可為適合用於測 試半導體裝置或晶粒之任何類型資料。測試資料可使測試 設備606執行特定測試；測試資料可為寫入至晶粒之測試 向量(testvectors)，或者測試資料可為測試命令與向量之組 ® 合。 測試系統伺服器604係控制測試設備606之操作；以 及接收測試控制終端602、測試設備606、設計設備608以 及製造設備608所傳送之測試請求，並據此控制測試設備 606之操作。測試系統伺服器6〇4可無線地傳送測試資料 至測試設備606 ’以控制或初始測試設備606之測試程序。 測試設備606係測試自製造設備而來的半導體裝置 603，。於較佳實施例，測試設備606之測試程序包括電氣特 性測试或晶圓測試(wafer probe)。測試設備606亦可包括切 11 M363591 割或封裝之設備。 一 測試程序完成後，測試設備606無線地傳送測試結果 資料至測試系統伺服器604。測試系統伺服器604視其請 求，其可無線地傳送測試結果資料至測試控制終端602、 設計設備008及/或製造設備61〇。測試結果可為任何適當 形式之資料。例如，測試結果可為半導體裝置測試後之回 所產生之原始輸出資料’測试結果可為上述原始輸出資料 之摘要或分析。測試設備606、設計設備608或製造設備 φ 610，可使用上述測試結果，隨時修改半導體裝置之設計或 製程，以增進半導體裝置之品質或良率。 設計設備608與製造設備610所進行之程序係在測試 設備606測試半導體裝置603之前。設計設備608設計半 導體裝置之電路，並平面規劃（floor planning)與佈局上述半 導體裝置，進而投片（tape out)。上述半導體設計程序僅為 例示，本創作之半導體設計程序可適用於任何合適之設計 蘀序。 φ 半導體裝置之設計由製造設備610所製造出產品。製 造設備610所使用的製程可適用於現今任何合適的半導體 製程。 於較佳實施例’上述每個測試設備606以及待測之半 導體裝置603皆具有無線辨識標籤612於其上。此標籤可 包括紅外線辨識標籤或射頻辨識標籤。可依照需求與應用 碭合，辨識標簸612的形式可為主動式標籤、被動式梯籤 戒半主動式標籤。於較佳實施例，設計設備6〇8或製造設 儀610亦可具有辨識標籤012以供識別。 12 M363591 待測之半導艚裝置603 一般可用晶圓卡匣或類似卡匣 或承載機構容納於其内，並將裝载上述半導體裝置003之 晶圓卡匣提供至製造設備610或測試設備606。辨識標籤 612可附著於上述晶圓卡匣或承載機構上，以供識別。測 試控制終端602 <裝備標籤讀取器於其内，以識別上述具 有辨識標籤612的待測半導體裝置603、測試設備606、設 計設備608或製造設備610 ° 基於上述，利用可攜式的測试控制終端602讀取具有 魯辨識標籤612的符測半導體裝置6〇3以及上述設備，將可 即時了解待測半導體裝置6〇3之資訊與狀態，並有效控管 半導體裝置603之整個生產流程。工廠内的線上人員亦可 方便讀取上述測試設備606、設計設備6〇8、製造設備61〇 之資訊，以助於管理之。 另外，本發明之半V體測試系統6〇〇内各個設備間的 資料傳輸架構亦可為實體網路連接或者無線傳輸與實體網 鲁路相互搭配使用。例如，設計設備6〇8、製造設備61〇與 測試系統伺服器604之間，可利用一般實體網路架構傳輸 貧訊；而測試控制終端6G2、測試系統舰器_以及測 武設備606之間，則可利用無線傳輪方式傳遞資訊。 參照第7圖，根據本創作之較佳實施例，為測試系統 :服器604之方塊圖。測試系統飼服器6〇4包括控制單元 ^貪料庫單元704、測試資料產生單元7〇6、分析單元 、無線傳輸單元710、輪入/輪出單元712以及驗證單元 。控制單元702係控制測試飼服器6〇4之齡。控制器 可包含在軟體控制下運作之微處理器，亦可包含固定 13 M363591 線路的邏輯電路，或上述兩者之組合。資料庫單元704所 * 儲存的資料包括控制單元702用以執行之資料及/或軟體； 測試設備之測試資料或測試結果；以及一個或多個測試設 備606、測試控制終端602、設計設備608以及製造設備 610之用戶資料及其使用權限。測試資料產生單元706係 根據測試設備606之種類及其測試程序類型，產生合適之 測試資料供其測試用。分析單元708係用於分析測試設備 606所傳送的測試結果。分析單元708產生之分析資料可 • 透過無線傳輸單元710，傳送至測試控制終端602、設計設 備608、測試設備606以及製造設備610，以供其參考，藉 以提昇半導體裝置之品質、良率或測試效能。無線傳輸單 元710係用以無線地傳送或接收無線訊息。輸入/輸出單元 712係用於提供輸入/輸出介面。驗證單元714係用於驗證 欲進入測試系統伺服器604,或發出測試請求至伺服器604 之用戶端。上述用戶端包括測試控制終端602、測試設備 606、設計設備608以及製造設備610。 • 以下將敘述網路監控之半導體裝置測試系統600之操 作。測試系統伺服器604係無線地接收由測試控制終端 602、測試設備606、設計設備608或製造設備610所傳送 之測試請求。測試系統伺服器604將驗證上述提出測試請 求之用戶端之權限，以確認此請求是否允許。當測試系統 伺服器604確認後，若允許此測試請求，則會發送測試資 料至對應之測試設備606，對待測之半導體裝置603進行 測試程序。測試設備606無線地傳送測試結果至測試系統 伺服器604。接收測試結果之測試系統伺服器604分析測 14 M363591 试結果’並將測試結果及其分析資訊無線地傳送至所需之 用戶端，例如，測試控制終端602、測試設備6〇6、設計設 備608以及製造設備610。上述用戶端之使用者將可利用 上述測試結果及其分析資訊’修改半導體裝置603之設計 或製程’以增進上述半導體裝置603之精度、良率或測試 品質。 參照第8圖’根據本創作之較佳實施例，為半導體裝 置監控系統800之系統方塊圖。半導體裝置監控系統8〇0 部分部件與上述實施例相似，因此’相似的部分將不依序 詳述。半導體裝置監控系統800包括一個或多個控制終端 802、测試糸統伺服器804、測試設備806以及監控祠服器 808。 控制終端802、測試設備806、監控伺服器8〇8、設計 設備812或製造設備814皆可無線地傳送測試請求至測試 系統伺服器804，而測試系統伺服器804將會安排測試排 程’並傳送測試資料至測試設備806以進行測試程序。 於較佳實施例，上述每個測試設備806以及待測之半 導體裝置810皆具有辨識標籤816於其上。此標籤816可 包括紅外線辨識標籤或射頻辨識標籤。可依照需求與應用 場合，辨識標籤816的形式可為主動式標籤、被動式標籤 或半主動式標籤。設計設備812或製造設備814亦可具有 辨識標籤816以供識別。控制終端802玎裝備標籤讀取器 於其内，以識別上述具有辨識標籤816的待測半導體裝置 、測試設備806、設.計設備812或製造設備814。 監控伺服器808耦合至測試系統伺腺器804,以監控該 15 M363591 測試設備806、待測半導體# /4t 等魃裝置810、設計設備812或製造 設備814。控制終端802可吉& ^ t / J罝接連線至監控伺服器808或 透過測試糸統伺服器804耦人s # _ , 褐合至監控伺服器808，藉以監 控伺服器808可對某一转定θ丄 卡％疋具有辨識標籤816之半導體裝 置或上述设備，進行定位、枵 ^ 5己與分析。監控伺服器808 可透過偵測標籤的射頻訊號或 或紅外線訊號衰減大小判斷辨 識軚織816與控制終端8〇2 卜 -ή-ΰτ^ „ 0 的相對位置。監控伺服器808A semiconductor die or a divided die (packaged or unpackaged) of a semiconductor wafer that is fabricated by a device. It is also possible to divide the m wire into a module and accept the test. In the preferred embodiment, the test machine 1G is a portable device that communicates with the test station 2G through the transmission path η to read the # message. The above transmission path 12 includes the outside line (10). The material is generally wirelessly transmitted. The above-mentioned data includes a data signal, an address signal, a control signal, a status signal, a test signal generated by a smashing machine, and a die to be tested. The resulting response signal. The test procedure may include an electrical property test or a wafer probe. The operation of the metering system 100 is condensed. The test machine 10 generates test data. The test data is transmitted to the station via the transmission path 12 to execute the test program! The probe 24 of the wood pin card 22 contacts the wafer placed on the platform %. The horizontal 26 can support and move the crystal 28. Crystal® 28 has a plurality of particles 3G to be tested. The stage 2G provides test data to the die 3G of the wafer 28 through the probe 24 of the probe card 22 and receives the signal reflected by the die. The die 30 may be any type of integrated circuit chip including, but not limited to, a memory chip, a microprocessor or a microcontroller, a signal processor, an analog chip, an application specific integrated circuit (ASIC), a digital logic circuit, etc. . M363591 The first controller 32 has an infrared transmission module coupled to the testing machine 10 through the connector 14, the transmission path 12. The test data provided by the test machine 10 for testing the die 30 of the wafer 28 is provided to the first controller 32 via the transmission path 12; and after the plurality of die 30 is tested, the response data generated is also transmitted through the first Controller 32 is passed to test machine 10. The probe card 22 includes a plurality of second controllers 34 and an infrared communication module. Therefore, the first controller 32 can transmit the test data received from the controller 10 to the plurality of second controllers by using infrared rays. 34, • The test data is further electrically transmitted to the die 30 via a plurality of second controllers 34 through conductive lines (not shown) in the probe card 22. The response data generated by the die 30 is also passed to the tester 10 via the second controller 34, the first controller 32, and the transmission path 12. A plurality of second controllers individually control the test sequence of the dies 30, and each of the second controllers 34 can correspond to one or more dies 30. The first controller 32 establishes a flexible extended transmission interface between the first controller 32 and the test machine 10 through the plurality of second controllers 34. For example, the transmission path between the test machine 10 and the test station 20 is a fixed number, so the test machine 10 can only test a fixed number of dies at the same time. By changing the transmission interface between the first controller 32 and the second controller 34, and the number of the second controllers 34, it is possible to increase the test of the die 30 units without changing the number of transmission channels connected to the testing machine 10. Quantity. Figure 2 is a block diagram of test station 20 in accordance with a preferred embodiment of the present invention. The test station 20 includes a first controller 32, a plurality of second controllers 34, a test unit 36, and an input/output unit 38. The first controller 32 controls the operation of the test bench 20. The first controller 32 transmits M363591 information to the second controller 34 via infrared transmission to control the operation of the plurality of second controllers 34. The second controller 34 can transmit the received test command or information to the test unit 36 for the test procedure corresponding to one or more of the die to be tested. The test unit 36 receives the above test command, executes a test program for the item to be tested, and transmits the generated test result to the second controller 34. A plurality of second controllers 34 infra-red transmit the received test results to the first controller 32. The first controller 32 transmits the test result to the external test machine through the input and output unit 38. In a preferred embodiment, the test unit 36 includes a probe card. Figure 3 is a block diagram of the first controller 32 in accordance with a preferred embodiment of the present invention. Its first controller 32 can integrate multiple functions within its controller into one integrated circuit or multiple integrated circuits. The first controller 32 includes an infrared transmission unit 322, a control unit 324, a memory unit 326, and an input/output unit 328. The infrared transmission unit 322 can wirelessly transmit the infrared test signal to the plurality of second controllers 34; and wirelessly receive the test results transmitted by the plurality of second controllers 34. Control unit _ 324 controls the operation of first controller 32. Control unit 324 can include a microprocessor that operates under the control of the software, a logic circuit that includes a fixed line, or a combination of the two. The memory unit 326 is a memory for storing data and/or software for the control unit 324 to execute. Input/output unit 328 is used to provide a physical line input or output interface between first controller 32 and test station 20. Figure 4 is a block diagram of a second controller 34 in accordance with a preferred embodiment of the present invention. In the preferred embodiment, the second controller 34 can be a control module for infrared transmission, which can integrate multiple functions in the controller into one 7 M363591 body circuit or multiple integrated circuits. The second controller 34 includes an infrared 'transmission unit 342, a control unit 344, a memory unit 346, and a probe input/output unit 348. The infrared transmission unit 342 can wirelessly transmit the test result to the first controller 32; and wirelessly receive the test signal transmitted by the first controller 32. Control unit 344 controls the operation of second controller 34. Controller 344 can include a microprocessor operating under software control, a fixed circuit logic, or a combination of the two. The memory unit 346 is a memory for storing data and/or software for the controller 344 to execute. The probe input/output unit 348 is a signal input or output interface between the probe 24 and the second controller 34. Figure 5 is a block diagram of test machine 10 in accordance with a preferred embodiment of the present invention. The test machine 10 includes a wireless transmission unit 102, an infrared transmission unit 103, a control unit 104, a memory unit 106, an input unit 108, a warning unit 110, and a display unit 112. The wireless transmission unit 102 is for transmitting and receiving wireless signals between the test machine 10 and an external base station (not shown). The infrared transmission unit 103 is for transmitting and receiving infrared signals between the test machine 10 and the test stand 20. Control unit 104 controls the operation of test machine 10. Control unit 104 may comprise a microprocessor operating under the control of the software, a logic circuit comprising fixed lines, or a combination of the two. The memory unit 106 is a memory for storing data and/or software for the control unit 106 to execute. Input unit 108 is the input interface of test machine 10. In a preferred embodiment, the input unit includes a keyboard, a touch screen or a voice control device, and the like, to input commands. The alert unit 110 is configured to issue a notification message to alert the user of the test machine 10 when in a predetermined state. In a preferred embodiment, the alert unit 110 includes a horn, a bee 8 M363591, and a micro, motor 'send text, audio or vibration signal' notification use, display 70 112 is used to provide a display function, preferably implemented For example, the graphical user interface ( _ , the graphical interface displayed by the user graphical display is displayed on the display device, for example, the mobile terminal. The user can first set the guide / device Test system 100 operation ^ ug . . . . . ^ ^,] reduction process or reading memory 1 () 2 in the test machine 10: save the test schedule information, or through the wireless transmission unit, =__ °When you arrive at the date and time of the schedule, the police will send a notification message to the user 7010. After the transmission of the t: 't test test schedule information' test machine 10 through the infrared 20 test bench 20 Each test station 20 can be connected to the test program. The test machine 10 recognizes the 'consultation ^ ^ 2 ^ 2 〇, if the user meets the operating authority and test schedule test ί :, " 1〇 can identify 'and control the test schedule 2 0 夕 1G identifies 4 test bench 2 G, first initializes the test bench U to make the first control $ & controller 34 in the test bench 2 状态 state, dragon 馇 * difficult + force - 稷A number of first r:= two V: two = two; the first - controller magic, then each of the first in the no call rate or time refers to the second control M363591 transmission. Test bench 20 settings Afterwards, the test machine transmits test information or instructions to perform a test procedure through the transmission path 12 to the test station 20. After receiving the test data or instructions, the first controller 32 broadcasts the test data or instructions to the corresponding plurality of second controls. The second controller that receives the test data transmits the test data to the die to be tested through the probe 24 of the probe card 22 to perform a test procedure. The tested aa particle 30 responds to the above test behavior. The test result is transmitted through the conductive path of the probe 24 and the probe card 22 (the above test result is not shown to be transmitted to the corresponding second controller 34. The second control 34 of the test result in response to receiving the die % will be The information is transmitted infrared to the first controller 32. Through transmission The first controller 32 receiving the test data transmits the test result to the test machine 1 () and displays it on the display unit 112 of the display tester 10. Referring to FIG. 6, the present disclosure also discloses a semiconductor device. The test system is 6. The parts of the test system and the system 600 are similar to those of the above embodiment. Therefore, a similar four-knife will not be described in detail. The semiconductor device test system, the general control includes test control, ', & 6G2, test The system server 6 () 4 and the test device 嶋: U 608 is designed to design the above-described semiconductor device 6 〇 3; and the manufacturing j (d) 敎 is designed to manufacture the semiconductor device 603. The fabricated semi-conducting > 603 needs to be provided to test equipment 606 for testing. Aa test control terminal 6 〇 2, test equipment (eight) 6, design equipment or system 6.2 can wirelessly transmit test requests to the test system server ns, ', f system feeder 604 will arrange test scheduling, and Transfer the heartbeat to the test device_ for the test procedure. M363591 "Test control terminal 602 is similar to test machine 10 of Figure 5 and is used to control the operation of test 606. Test control terminal 6〇2 can pre-empt two test schedules or pick-up test control terminals 6〇 The test schedule information stored in the memory in 2, or download or upload the test schedule information of the test system word = 604 through wireless transmission. The test control terminal 6〇2 can wirelessly transmit according to the above test schedule or test data. The test information is sent to the test setup to perform the test procedure. In the preferred embodiment, the test control terminal 6〇2 can also transmit a test request to the test system server 6〇4, requesting a test procedure for the test equipment 6 (9). The system server 604 will verify the above-mentioned authority of the test control terminal 602 that issued the test request. If it meets the authority, the test system server 604 will wirelessly transmit the test data or command to the test device 606. The test device that receives the test data 6〇6 will test the semiconductor device 603. The above test data or command can be any type of resource suitable for testing semiconductor devices or die. The test data may cause the test device 606 to perform a specific test; the test data may be test vectors written to the die, or the test data may be a combination of test commands and vectors. Test System Server 604 Control Test The operation of the device 606; and receiving the test request transmitted by the test control terminal 602, the test device 606, the design device 608, and the manufacturing device 608, and controlling the operation of the test device 606 accordingly. The test system server 6.4 can be wirelessly transmitted. The test data is passed to the test device 606' to control or test the test program of the initial test device 606. The test device 606 is a semiconductor device 603 that is tested from the manufacturing device. In the preferred embodiment, the test program of the test device 606 includes electrical characteristics. Test or wafer test. Test equipment 606 may also include a device that cuts or packages the 11 M363591. Upon completion of the test procedure, test equipment 606 wirelessly transmits test result data to test system server 604. Test system servo 604, depending on its request, can wirelessly transmit test result data to the test control terminal 602, Designing device 008 and/or manufacturing device 61. The test result can be any suitable form of information. For example, the test result can be the original output data generated after the semiconductor device is tested. The test result can be the above original output data. Summary or analysis. Test equipment 606, design equipment 608, or manufacturing equipment φ 610, may use the above test results to modify the design or process of the semiconductor device at any time to enhance the quality or yield of the semiconductor device. Design equipment 608 and manufacturing equipment 610 The procedure is performed before the test device 606 tests the semiconductor device 603. The design device 608 designs the circuitry of the semiconductor device and lays out and lays out the semiconductor device described above, and then tapes out. The above semiconductor design procedure is for illustrative purposes only, and the semiconductor design program of this creation can be applied to any suitable design sequence. The design of the φ semiconductor device is manufactured by the manufacturing equipment 610. The process used in manufacturing apparatus 610 can be applied to any suitable semiconductor process today. In the preferred embodiment, each of the test devices 606 and the semiconductor device 603 to be tested have a wireless identification tag 612 thereon. This tag can include an infrared identification tag or an RFID tag. According to the needs and applications, the identification label 612 can be in the form of an active label, a passive ladder or a semi-active label. In a preferred embodiment, the design device 〇8 or the manufacturing device 610 may also have an identification tag 012 for identification. 12 M363591 The semi-conductive device 603 to be tested is generally housed therein by a wafer cassette or similar cassette or carrier mechanism, and the wafer cassette loaded with the semiconductor device 003 is supplied to the manufacturing device 610 or the test device 606. . The identification tag 612 can be attached to the wafer cassette or carrier mechanism for identification. The test control terminal 602 is equipped with a tag reader to identify the semiconductor device to be tested 603, the test device 606, the design device 608, or the manufacturing device 610 having the identification tag 612, based on the above, using the portable test The test control terminal 602 reads the semiconductor device 6〇3 having the Lu identification tag 612 and the above device, and can immediately know the information and status of the semiconductor device 6〇3 to be tested, and effectively control the entire production process of the semiconductor device 603. . Online personnel in the factory can also easily read the above test equipment 606, design equipment 6〇8, manufacturing equipment 61〇 information to help manage. In addition, the data transmission architecture between the devices in the semi-V body test system 6 of the present invention can also be used for physical network connection or wireless transmission and physical network Lulu. For example, between the design device 6〇8, the manufacturing device 61〇, and the test system server 604, the general physical network architecture can be used to transmit the poor communication; and between the test control terminal 6G2, the test system ship_and the measurement device 606 , you can use wireless transmission to pass information. Referring to Figure 7, in accordance with a preferred embodiment of the present invention, a block diagram of a test system: server 604 is shown. The test system feeder 〇4 includes a control unit ghoul unit 704, a test data generating unit 〇6, an analyzing unit, a wireless transmission unit 710, a wheeling/rounding unit 712, and a verification unit. The control unit 702 controls the age of the test feeder 6〇4. The controller can include a microprocessor that operates under software control, a logic circuit that holds the 13 M363591 line, or a combination of the two. The data stored by the database unit 704 includes data and/or software used by the control unit 702; test data or test results of the test equipment; and one or more test equipment 606, test control terminal 602, design equipment 608, and The user profile of the manufacturing device 610 and its usage rights. The test data generation unit 706 generates suitable test data for testing according to the type of the test device 606 and the type of test program. Analysis unit 708 is used to analyze the test results transmitted by test equipment 606. The analysis data generated by the analysis unit 708 can be transmitted to the test control terminal 602, the design device 608, the test device 606, and the manufacturing device 610 through the wireless transmission unit 710 for reference, thereby improving the quality, yield, or test of the semiconductor device. efficacy. The wireless transmission unit 710 is for wirelessly transmitting or receiving wireless messages. Input/output unit 712 is used to provide an input/output interface. The verification unit 714 is for verifying that the test system server 604 is to be entered, or to issue a test request to the client of the server 604. The above-mentioned client includes a test control terminal 602, a test device 606, a design device 608, and a manufacturing device 610. • The operation of the semiconductor device test system 600 for network monitoring will be described below. Test system server 604 wirelessly receives test requests transmitted by test control terminal 602, test equipment 606, design equipment 608, or manufacturing equipment 610. The test system server 604 will verify the permissions of the above-mentioned client requesting the test request to confirm whether the request is permitted. When the test system server 604 confirms, if the test request is allowed, the test data is sent to the corresponding test device 606, and the semiconductor device 603 to be tested is subjected to a test procedure. Test equipment 606 wirelessly transmits test results to test system server 604. The test system server 604 receiving the test result analyzes the 14 M363591 test result 'and wirelessly transmits the test result and its analysis information to the required client, for example, the test control terminal 602, the test device 6〇6, and the design device 608. And manufacturing device 610. The user of the above-mentioned user terminal can use the above test results and its analysis information to modify the design or process of the semiconductor device 603 to improve the accuracy, yield or test quality of the semiconductor device 603. Referring to Figure 8, a system block diagram of a semiconductor device monitoring system 800 is shown in accordance with a preferred embodiment of the present invention. The components of the semiconductor device monitoring system 800 are similar to those of the above embodiment, so that the 'similar portions will not be described in detail. The semiconductor device monitoring system 800 includes one or more control terminals 802, a test server 804, a test device 806, and a monitoring server 808. Control terminal 802, test device 806, monitoring server 8.1, design device 812, or manufacturing device 814 can both transmit test requests wirelessly to test system server 804, and test system server 804 will schedule test schedules' Test data is transmitted to test equipment 806 for testing procedures. In the preferred embodiment, each of the test devices 806 and the semiconductor device 810 to be tested have an identification tag 816 thereon. This tag 816 can include an infrared identification tag or a radio frequency identification tag. The identification tag 816 can be in the form of an active tag, a passive tag, or a semi-active tag, depending on the needs and applications. Design device 812 or manufacturing device 814 may also have an identification tag 816 for identification. The control terminal 802 is equipped with a tag reader to identify the semiconductor device under test having the identification tag 816, the test device 806, the device 812, or the manufacturing device 814. Monitoring server 808 is coupled to test system servo 804 to monitor the 15 M363591 test device 806, the semiconductor to be tested, etc. 810, design device 812, or manufacturing device 814. The control terminal 802 can connect to the monitoring server 808 or connect to the monitoring server 808 through the test server 804, so that the monitoring server 808 can A semiconductor device having the identification tag 816 or the above-described device is rotated to perform positioning, analysis, and analysis. The monitoring server 808 can determine the relative position of the woven 816 and the control terminal 8 〇 2 ή - ή - ΰ τ ^ „ 0 by detecting the RF signal of the tag or the attenuation of the infrared signal. The monitoring server 808
取辨識標鐵816之資訊。透過這 些貢訊，監控伺服器808可樟，^ ^ v L 控制終端802之線上人員之行;二:二析持有可攜式 管理現場人貞與設備。4與讀“，將助於有效Take the information of the identification target 816. Through these confession, the monitoring server 808 can control the online personnel of the terminal 802; second: the second analysis holds the portable management site personnel and equipment. 4 with reading ", will help effective
參照第9圖，根據本發明之較佳實施例，為監 器808之功能方塊圖。監控伺服器8〇8包括控制單元卯2 資料庫單元904、分析單元_、網路傳輸單元观 /輸出單元910以及定位單元912。控制星开，J 令工刺早兀9〇2係批制f 試伺服器808之操作。控制單元902可包含在軟:铋市 運作之微處理器’亦可包含固定線路的邏‘電‘體，制下 兩者之組合。資料庫單元904所儲存的資料包二亡述 902用以執行之資料及/或軟體，·-個或多個測試/ = 設計設備812以及製造設備814之標次 又 、 、勢貞訊以及位署咨 訊。分析單元906係用於分析控制終端8〇2之〃_ 、貝 分析單元906產生之分析資料藉以提昇丰 ^為刀析。 叮卞等體裝置· 與現場人貝之效能。網路傳輸單元9〇8传田、，& 1不用从無、線式夺丨丨田 實體線路傳送或接收訊息。輸入/輪出單元《、'' 、 輸入/輸出介面。定位單元912耦合至和也 _ '、於提供 役制早疋902,係對 16 M363591 -控制終端802、測試設備806、待测半導體 設備812或製造設備814定位。 10、設計 本創作之測試系統利用無線傳輸方式 置，可增加原本測試台本身資源所限制的測試數t f裝 ::一控制器與第二控制器之間傳輸介面 ：二 ，數目’毋需改變連接至測試機之傳輸 二;控 下I增加料職置單㈣顚數#。若的7 =因此’賴機每次僅能測試6辨導體裝置。藉^ 认通道與輸出通道的比例，即可增加測試機每 將輸入通道變更為"固，如此，其餘u個傳： 為輸出通道之用。第一控制器接收此輸入通道所 、”、m㈣，並將其紅外線地廣播至多個第二 :二進行測試程序。複數個第二控制器將測試結果；送 1餘自複數㈣4㈣所接㈣賴結果可經由 =11個輸出通道傳輸至測試機，因此，增加 位的測試數目。 k飛早 本創_用紅外線傳輸方式傳輸測試資訊，利用光線 ]測忒貧訊，在高頻並無調變傳輸信號，將減少一般盔 線，時所導致的射頻干擾或天線效應㈣enna effects f提焉測試品質。特別對於容易產生射頻干擾之待測產 〇〇例如，射頻(RF)晶片，將助於改善測試品質。 &本創作之測試機，結合一般測試機與行動終端，較一 般測試機方便使用，使用者可隨身攜帶，以增加使用者之 機動性。且可利於與其他測試人員隨時通訊，並利用行動 17 M363591 通訊傳輸測試資訊，便利產線測試人員間之溝通。 另外，本創作所提供之半導體裝置測試系統將有助於 提供一個更即時，且便利之測試環境，相關製程上下游的 部門，例如製造部門與設計部門可透過測試系統伺服器要 求測試服務，並獲得即時的測試結果及分析資訊。上述部 門可依據此等資料，改善設計上或製造上的缺失，以增進 產品之良率或品質。 本創作以較佳實施例說明如上，然其並非用以限定本 • 創作所主張之專利權利範圍。其專利保護範圍當視後附之 申請專利範圍及其等同領域而定。凡熟悉此領域之技藝 者，在不脫離本專利精神或範圍内，所作之更動或潤飾， 均屬於本創作所揭示精神下所完成之等效改變或設計，且 應包含在下述之申請專利範圍内。Referring to Figure 9, a functional block diagram of a monitor 808 is provided in accordance with a preferred embodiment of the present invention. The monitoring server 8〇8 includes a control unit 资料2 database unit 904, an analysis unit_, a network transmission unit view/output unit 910, and a positioning unit 912. Control the star open, J makes the work stab early 9〇2 system batch f test server 808 operation. The control unit 902 can include a microprocessor that operates in a soft state, and can also include a logical 'electrical' body of a fixed line, and a combination of the two. The data packet stored in the database unit 904 is used to execute the data and/or software, and the test equipment 812 and the manufacturing equipment 814 are in the same state, the potential information, and the bit. Information from the Department. The analyzing unit 906 is configured to analyze the analysis data generated by the control unit 8〇2 and the analysis unit 906 to improve the analysis.叮卞 叮卞 装置 · 与 效能 效能 效能 效能 效能 效能 效能 效能The network transmission unit 9〇8, and & 1 does not need to transmit or receive messages from the non-wireless line of the physical field. Input/rounding unit ", '', input/output interface. The positioning unit 912 is coupled to and also in the service system 902, and is positioned to the 16 M363591 - control terminal 802, test device 806, semiconductor device 812 to be tested, or manufacturing device 814. 10, the design of the test system using wireless transmission mode, can increase the number of tests limited by the original test station resources tf installed:: a communication interface between a controller and the second controller: Second, the number ' needs to change Connect to the test machine's transmission 2; control I increase the material job list (four) number #. If 7 = therefore, the machine can only test 6 discriminating conductors at a time. By comparing the ratio of the channel to the output channel, the tester can be changed to change the input channel to "solid, so the other u pass: for the output channel. The first controller receives the input channel, ", m (four), and broadcasts it infra-red to a plurality of second: two test procedures. The plurality of second controllers will test the results; send one more than the plural (four) 4 (four) to receive (four) Lai The result can be transmitted to the test machine via =11 output channels, therefore, the number of test bits is increased. kFei early _ _ transmission of test information by infrared transmission, using light] to measure poor news, no modulation at high frequencies Transmitting signals will reduce the radio frequency interference or antenna effect caused by the general helmet line. (4) enna effects f improve the test quality. Especially for the radioactive (RF) wafers that are prone to radio frequency interference, for example, radio frequency (RF) wafers will help improve Test quality. The test machine of this creation, combined with the general test machine and mobile terminal, is more convenient to use than the general test machine, and the user can carry it with him to increase the mobility of the user, and can facilitate communication with other testers. And use the action 17 M363591 communication transmission test information to facilitate communication between the line testers. In addition, the semiconductor device test system provided by this creation It will help to provide a more immediate and convenient test environment. The upstream and downstream departments of the relevant processes, such as the manufacturing department and the design department, can request testing services through the test system server and obtain immediate test results and analysis information. Based on such information, improvements in design or manufacturing may be improved to enhance the yield or quality of the product. The present invention is described above in terms of preferred embodiments, and is not intended to limit the scope of patent rights claimed by the present invention. The scope of patent protection is subject to the scope of the patent application and its equivalents. Anyone who is familiar with the field will be modified or retouched without departing from the spirit or scope of this patent. Equivalent changes or designs made below are included in the scope of the patent application below.
18 M363591 【圖式簡單說明】 第1圖根據本創作較佳實施例，為本創作之半導體裝 置測試系統之示意圖。 第2圖根據本創作之較佳實施例，為測試台之方塊圖。 第3圖根據本創作之較佳實施例，為第一控制器之方 塊圖。 第4圖根據本創作之較佳實施例，為第二控制器之方 塊圖。 第5圖根據本創作之較佳實施例，為測試機之方塊圖。 第6圖根據本創作之較佳實施例，為半導體裝置測試 系統之方塊圖。 第7圖根據本創作之較佳實施例，為測試系統伺服器 之方塊圖。 第8圖根據本創作之較佳實施例，為半導體裝置監控 系統之方塊圖。 第9圖根據本創作之較佳實施例，為監控伺服器之方 塊圖。 【主要元件符號說明】 10 測試機 12 傳輸路徑 14 連接器 20 測試台 22 探針卡 24 探針 19 M36359118 M363591 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a semiconductor device test system according to the present preferred embodiment. Figure 2 is a block diagram of a test station in accordance with a preferred embodiment of the present invention. Figure 3 is a block diagram of the first controller in accordance with a preferred embodiment of the present invention. Figure 4 is a block diagram of a second controller in accordance with a preferred embodiment of the present invention. Figure 5 is a block diagram of a test machine in accordance with a preferred embodiment of the present invention. Figure 6 is a block diagram of a semiconductor device test system in accordance with a preferred embodiment of the present invention. Figure 7 is a block diagram of a test system server in accordance with a preferred embodiment of the present invention. Figure 8 is a block diagram of a semiconductor device monitoring system in accordance with a preferred embodiment of the present invention. Figure 9 is a block diagram of a monitoring server in accordance with a preferred embodiment of the present invention. [Main component symbol description] 10 Tester 12 Transmission path 14 Connector 20 Test bench 22 Probe card 24 Probe 19 M363591
26 平台 28 晶圓 30 晶粒 32 第一控制器 34 第二控制器 36 測試單元 38 輸入/輸出單元 100 測試糸統 102 無線傳輸單元 103 紅外線傳輸單元 104 控制單元 106 記憶體單元 108 輸入單元 110 警示單元 112 顯示單元 322 紅外線傳輸單元 324 控制單元 326 記憶體單元 328 輸入/輸出單元 342 紅外線傳輸單元 344 控制單元 346 記憶體單元 348 探針輸入/輸出單元 .600 測試系統 602 測試控制終端 20 M36359126 Platform 28 Wafer 30 Die 32 First Controller 34 Second Controller 36 Test Unit 38 Input/Output Unit 100 Test System 102 Wireless Transmission Unit 103 Infrared Transmission Unit 104 Control Unit 106 Memory Unit 108 Input Unit 110 Warning Unit 112 Display unit 322 Infrared transmission unit 324 Control unit 326 Memory unit 328 Input/output unit 342 Infrared transmission unit 344 Control unit 346 Memory unit 348 Probe input/output unit .600 Test system 602 Test control terminal 20 M363591
603 半導體裝置 604 測試系統伺服器 606 測試設備 608 設計設備 610 製造設備 612 辨識標籤 702 控制單元 704 資料庫單元 706 測試貢料產生早元 708 分析單元 710 無線傳輸單元 712 輸入/輸出單元 714 驗證單元 800 監控系統 802 控制終端 804 測試系統伺服器 806 測試設備 808 監控伺服器 810 半導體裝置 812 設計設備 814 製造設備 816 辨識標籤 902 控制單元 904 資料庫單元 906 分析單元 21 M363591 908 網路傳輸單元 910 輸入/輸出單元 912 定位單元603 Semiconductor device 604 Test system server 606 Test device 608 Design device 610 Manufacturing device 612 Identification tag 702 Control unit 704 Database unit 706 Test tribute generation Early element 708 Analysis unit 710 Wireless transmission unit 712 Input/output unit 714 Verification unit 800 Monitoring System 802 Control Terminal 804 Test System Server 806 Test Equipment 808 Monitoring Server 810 Semiconductor Device 812 Design Equipment 814 Manufacturing Equipment 816 Identification Label 902 Control Unit 904 Data Base Unit 906 Analysis Unit 21 M363591 908 Network Transmission Unit 910 Input/Output Unit 912 positioning unit
22twenty two