TW201038956A - Probing system for integrated circuit device - Google Patents

Abstract

A probing system for integrated circuit device, which transmits testing data/signal between an automatic test equipment (ATE) and an integrated circuit device, is disclosed. The probing system comprising a test head having a first transceiving module; a test station having a test unit couple to the test head to perform test operation; a communication module having a second transceiving module configured to exchange data with the first transceiving module; an integrated circuit device having at least one core circuit being tested; and at least one test module having a self-test circuit couple to the core circuit and the communication module for performing the core circuit self-testing.

Description

201038956 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an integrated circuit component detecting system. [Prior Art] In general, an integrated circuit component on a wafer must first be tested for its electrical characteristics to determine whether the integrated circuit component is good. A good integrated circuit will be selected for subsequent packaging processes, and defective products will be discarded to avoid additional packaging costs. The automatic test equipment (ATE) uses a probe of a test card to contact a signal pad of a device to be tested, so as to transmit a test signal of a measuring machine to a device to be tested, and measure The electrical parameters are transmitted back to the measuring machine. However, as semiconductor manufacturing technology continues to innovate, the operating speed of integrated circuit components (such as transistors) continues to increase, and conventional techniques use probes (ie, mechanical inspection) to detect wafers, thus providing overall time precision ( Overall time accuracy (OTA) cannot keep up with the fast-growing wafer work speed. Therefore, the conventional automatic detecting device is obviously not suitable for the electrical test of the future rapid integrated circuit components. SUMMARY OF THE INVENTION The present invention provides an integrated circuit component detecting system that can transmit a detection signal and a test signal between a test machine including a first transceiver module and an integrated circuit component tested by the tester. Test data such as test gas parameters. Implementing a fan, the integrated circuit component comprising - a core circuit, an electrical (four) circuit electrically connected to the core circuit (Buiu_in s heart such as 201038956 circuit, BIST), and an operation for controlling the self-test circuit a controller and a second transceiver module for exchanging test data with the first transceiver module

In another embodiment, the detection system of an integrated circuit component includes a test head having a first transceiver module and a test bench having a detection unit coupled to the test head for testing. . The detection system further includes a communication module, the communication module has a second transceiver module, which can exchange data with the first transceiver module in a wireless communication manner; an integrated circuit component having a core to be tested And a test module having a self-test circuit coupled to the core circuit and the communication module for self-testing of the core circuit. In still another embodiment, an integrated circuit component detection system includes a test head, a test station, and an integrated circuit component. The test head includes a first transceiver module. The test station includes a detection unit that is flanked by the test head for testing. The integrated circuit component comprises a communication module, a plurality of tested core circuits and at least one test module. Each test module has a core circuit such as pure money and a self-test circuit of the communication module for self-testing of the core circuits. These core circuits are fabricated separately on the die. The communication module includes a second transceiver module for setting a communication module with the first transceiver module, and the core circuit and the at least one test module are packaged in a single package. [Embodiment] FIG. 1 illustrates an embodiment of the present invention, which utilizes wireless communication to transmit between a test machine 20 and a device under test 30. Test data. The test machine 20 includes a first transceiver module 22, a physical layer module 24 electrically connected to the first transceiver module 22, a detection unit 26 electrically connected to the physical layer module 24, and an electrical connection. The diagnostic unit 28 of the physical layer module 24. The device under test 30 can be a system on chip, including a core circuit 32, a self-test circuit 34 electrically connected to the core circuit 32, and a control circuit 34 for controlling the self-test circuit 34. The controller 36 and a second transceiver module 38 that can exchange test data with the first transceiver module 22. The first transceiver module 22 and the second transceiver module 38 each include a transceiver and an antenna. The core circuit 32 can be a memory circuit, a logic circuit or an analog circuit. The design technique of the self-test circuit 34 can be referred to the application of the inventor of the Chinese Patent No. 088103352 and the application No. 09〇1784. Preferably, the device under test 30 further includes a clock generator 40 electrically connected to the second transceiver module 38 and a power regulator 42 electrically connected to the second transceiver module 38. The test machine 20 transmits an RF signal through the first transceiver module 22, and the second transceiver module receives the RF signal to drive the power regulator 42 to generate power required for the operation of the device under test 3 . In addition, the device under test 30 may further include an identifier register to store an identification code (iD) of the device under test 30. During the electrical detection, the test machine 2 transmits an RF signal by the first receiving group 22, and the second transceiver module of the device under test 3 receives the RF signal to drive the power stable. The voltage generating device 42 generates the power required for the operation of the device under test. The detecting unit 26 of the testing machine 2 further sets the identification code of each component to be tested through the 201038956 transceiver module 22, and each component to be tested The system stores the identification code in the identifier register 44. After that, the detecting unit 26 transmits a start command to the second transceiver module of the device under test 3 to "activate the self-test circuit 34 to perform the Electrical detection of the core circuit 32. In one embodiment, the diagnostic unit 28 collects the components to be tested, and the test data returned after the test is completed, thereby diagnosing the advantages and disadvantages of each component to be tested and analyzing the cause of failure of the defective component. The physical layer module 24 controls the transmission and reception of the data 0 signal. Fig. 2 illustrates an integrated circuit component test system 80 according to another embodiment of the present invention, which is applied to an electrical test of a wafer 9 comprising a plurality of devices to be tested. In particular, the integrated circuit component test system 8 is applied to the electrical detection of the wafer level. In addition, the wafer 9A may further include a power supply line 92 surrounding the device under test 30, and the power required for the operation of the device under test 3 is taken from the power supply line 92 instead of being stabilized via the power. The voltage converter 42 receives the power generated by the radio frequency signal. In particular, the power supply line Q 92 is disposed on the cutting line of the wafer 90. 3 illustrates an integrated circuit component test system 70 in accordance with another embodiment of the present invention, which is applied to a final test of a package die 72. The wafer 90 shown in Fig. 2 is cut along the power supply line % into individual test elements 30 to be tested. After screening by the integrated circuit component test system 8 of Fig. 2, the device under test 30 having good electrical characteristics will be packaged into the package die 72, and the defective component 30 to be tested will be discarded. Then, the detecting unit 26 of the testing machine 20 transmits a start command to the second transceiver module 38 of the device under test 3 via the first transceiver module 22 to activate the self-test circuit 34 to perform the core circuit 32 201038956 Electrical detection. Thereafter, the diagnostic unit 28 collects the test data returned by the device under test 3 after the test is completed, and the g meter can be used to diagnose the quality of the device under test 30 and analyze the cause of failure of the defective device.

Fig. 4 is a view showing an integrated circuit component detecting system of another embodiment of the present invention. The test machine 20 of the integrated circuit component detecting system further includes a conveyor 62 electrically connected to the mains. The device under test 3 is disposed on a circuit board, and the circuit board 5G can be connected to the mains via the transmission device (4), and the power required for the operation of the device under test 30 is taken from the circuit board %, that is, The grounding is taken from the conveying device 62. The transport device 62 can transmit the circuit board 50 to a predetermined test position 64, and the detecting unit 26 of the test machine transmits a start command to the second transceiver of the device under test through the first transceiver module 22 The module 38 activates the self-test circuit 34 to perform electrical detection of the core circuit 32. Then, the diagnostic unit 28 collects the test data returned by each of the components to be tested, and then diagnoses whether the components to be tested meet the specifications of the electrical properties and analyzes the failure causes of the defective components. The integrated circuit component sensing system 10 of Figure 1 can be modified by changing the configuration of its internal modules or components to increase the flexibility of a variety of applications. Fig. 5 illustrates an integrated circuit component detecting system MO of another embodiment of the present invention. The integrated circuit component detecting system 100 includes a tester u and a integrated circuit component (DUT) l20 to be tested. The test machine 110 includes a test head m, a test station 112, and a carrier 113. The test station 112 includes a diagnostic unit 132 and a detection unit 134, wherein the diagnostic unit Π2 is a free option that provides diagnostic functionality. The test head 111 includes a physical layer module 115 and a first transceiver module 114 that is coupled to the physical layer module U5. The physical layer module 201038956 is coupled to the detecting unit 134, and the diagnostic unit 132 is coupled to the detecting unit I34. The carrier 113 carries the DUT 120 and includes a communication module 116 and a power regulator 117. The communication module 116 includes a second transceiver module 13A, a communication controller 118, and a clock generator 119. The communication controller 118 is electrically coupled to the second transceiver module 13A. The clock generator 119 is electrically connected to the second transceiver module 130 and the communication controller U8&dut 120 to provide a clock signal. The DUT 120 (e.g., system single chip (s〇c)) includes a core circuit 121 and a test module 12 2 . In one embodiment, the test module

122 includes a memory BIST 123, a logic BIST 124, an analog BIST 125, and a test controller 126. In another embodiment, the test module j 22 may only include a combination of the memory BIST 123, the logic BIST 124 or the analog BIST 125 ' or any of the BIST circuits connected to the test controller 126.

The DUT 120 can be located on the carrier 113 and obtain operating power from the carrier ι13. Additionally, the DUT 120 can be delivered to a predetermined location by the delivery device. In one embodiment, the core circuit 121 can include a memory circuit, a logic circuit, and a analog circuit. The core circuit 121 is coupled to the memory BIST 123, the logic BIST 124, and the analog BIST 125' and the operation of the BIST circuits is controlled by the test controller 126. In another embodiment, the core circuit ι21 can be a single memory circuit, a logic circuit or an analog circuit, or a combination of any two of the above. The core circuit 121 is coupled to the corresponding memory BIST 123, logic BIST 124 or analog BIST 125. The test data and the tested electrical parameters are transmitted between the test head 11 and the carrier U3 by means of the first transceiver module 14 and the second transceiver module 13 in a wireless communication manner. In other words, the first transceiver module 114 and the second transceiver module 13 exchange test data with each other. 201038956 The physical layer module 115 and the communication controller 118 respectively control the transmission and reception of data signals. In one embodiment, the first transceiver module 114 and the second transceiver module 13 each include a transceiver and an antenna. The power regulator 117 is electrically coupled to the communication module 116 and the DUT 120. The test machine 11 transmits an RF signal from the first transceiver module 丨丨4, and the second transceiver module 130 receives the RF signal to drive the power regulator 117' to generate the operating power required by the DUT 120. Figure 6 illustrates an integrated circuit component detecting system 140 in accordance with another embodiment of the present invention. Compared to the system 1 shown in FIG. 5, the test module 122 is changed to be included in the carrier 113 of the test machine 110. Therefore, the DUT 120 includes only the core circuit 121 and is easy to manufacture. The power regulator 117 is electrically connected to the communication module 116, the test module 122, and the DUT 120·. Fig. 7 illustrates an integrated circuit component detecting system 150 according to another embodiment of the present invention. Compared with FIG. 5, the communication module 116 is changed to be included in the Dut 12,. Therefore, the DUT 120· includes the core circuit 121, the test module 122, and the communication module 116, and the carrier 113 of the test machine 110" only includes the power regulator U7. A power regulator 117 is electrically connected to the DUT 120. Figure 8 is a diagram showing the signal transmission of a detection system capable of detecting a complex number of duTs in accordance with an embodiment of the present invention. The test machine system includes a test bench and a plurality of test heads, and each test head corresponds to a communication module. Test data such as the test signal and the electrical parameters of the ''two test' are transmitted wirelessly between the test head and the communication module. In particular, the communication is performed in a one-to-one manner. Each communication module is electrically connected to a test module, and the test module is connected to a core circuit. Since this embodiment includes a plurality of test heads, the test efficiency of 201038956 can be significantly improved. Figure 9 is a diagram showing the signal transmission of a detection system capable of detecting a complex dut according to another embodiment of the present invention. The test machine system includes a test stand and a test head. The test head corresponds to a plurality of communication modules. Test data such as test signals and tested electrical parameters are transmitted wirelessly between the test head and a plurality of communication modules. In particular, the communication is performed in a one-to-many manner. Each communication module is coupled to a test module, which is connected to a core circuit 0. FIG. 10 illustrates an integrated circuit component detection system 1000 according to another embodiment of the present invention. The integrated circuit component detecting system 1000 includes a tester i〇i〇 and a DUT 1020. The tester 1 〇 1 〇 includes a test head i J i, a test stand 1012 and a carrier 1〇13. The test station 110 includes a diagnostic unit i 〇 32 and a detection unit 1034, wherein the diagnostic unit 〇 32 is an optional component to provide a diagnostic function. The test head 1011 includes a physical layer module 1〇15 and a first transceiver module 1〇14 connected to the physical layer module 1015. The physical layer 10 module 1015 is coupled to the detecting unit 1034, and the diagnostic unit 1032 is also coupled to the detecting unit 1034. The carrier 1 〇 13 is configured to load the DUT 1020 and includes a power regulator 1〇17. The DUT 1020 using the 3D packaging technology includes a communication module ι 16 , a test module 1022 and a plurality of core circuits 1 〇 21 , wherein the communication module 1016 , the test module 1 〇 22 and the core circuits 1021 are each fabricated on a die. The communication module 1 〇 16 includes a communication controller 丨〇丨8, a clock generator 1019 and a second transceiver module 1〇3〇. The communication controller 1018 is electrically coupled to the second transceiver module 1 〇 3 〇, and the clock generator 11-201038956 1019 is electrically coupled to the second transceiver module 1030, the communication control The device 1 01 8 and the DUT 1020 provide a clock signal. In one embodiment, the test module 1022 includes a memory BIST 1023, a logic BIST 1024, an analog BIST 1〇25, and a test controller 1026. In another embodiment, the test module 1022 can include only a combination of a memory BIST 1023, a logical BIST 1024, or an analog BIST 1025, or any two BIST circuits connected to the test controller 1〇26. ❹ The DUT 120 can be located on the carrier 1013 and obtain operating power from the carrier 1013. Alternatively, the DUT 1 020 can be transported by the transport device to a predetermined location. In one embodiment, the core circuits 1021 can include memory circuits, logic circuits, and analog circuits. The core circuits 1021 are coupled to the memory BIST 1023, the logic BIST 1024, and the analog BIST 1025, and the operations of the BIST circuits are controlled by the test controller 1026. In another embodiment, the core circuits 1021 can be a single memory circuit, a logic circuit or an analog circuit, or a combination of any of the above. The core circuits 1021 are coupled to corresponding memory BIST 1023, logic BIST 1024, or analog BIST 1 025. The test signals and the tested electrical parameters are transmitted between the test head 1011 and the carrier 1〇13 by wireless communication through the first transceiver module 1014 and the second transceiver module 1〇3〇. In other words, the first transceiver module 1014 and the second transceiver module 1030 exchange test data with each other. The physical layer module 1015 and the communication controller 1018 respectively control transmission and reception of data signals. In one embodiment, the first transceiver module 1014 and the second transceiver module 1030 each include a transceiver and an antenna. The power regulator ι〇17 electrical connection -12- 201038956 is connected to the communication module 1016 and the DUT 1020. The tester 1 〇1 传送 transmits the RF signal by the first transceiver module 1014, and the second transceiver module receives the RF signal to drive the power regulator 1017, thereby generating the operation required by the DUT 1020. electric power. Fig. 11 illustrates an integrated circuit component detecting system 1 100 of another embodiment of the present invention. The integrated circuit component detecting system 1 100 includes a tester 丨丨丨〇 and a DUT 1120. Compared with the integrated circuit component detecting system 0 1000 shown in FIG. 10, the DUT 1120 using the 3D packaging technology includes a communication module 1016, a plurality of test modules 1022, and a plurality of core circuits 1〇21, wherein each core The circuit 1021 is fabricated on a die by the same test module 1 22, and the communication module 101 6 is fabricated on a different die. Fig. 12 illustrates an integrated circuit component detecting system 1200 according to another embodiment of the present invention. The integrated circuit component detecting system 12A includes a tester 121A and a DUT 1220. Compared with the integrated circuit component detecting system 1000 shown in FIG. 1A, the DUT 1220 using the 3D packaging technology includes a communication module 1016 〇, a test module 1 〇 22, and a plurality of core circuits 1 〇 21, wherein The communication module 1016 and the test module 1 22 are fabricated on the same die, and the die is different from the die of the core circuit 1021. Fig. 13 illustrates an integrated circuit component detecting system 1300 according to another embodiment of the present invention. The integrated circuit component detecting system 13A includes a tester 131A and a DUT 1320. The first transceiver module 1314 and the first transceiver module 1330 exchange data in a different wireless connection mode than the integrated circuit component detection system 1000 shown in FIG. In an embodiment, the first transceiver module 1314 and the first transceiver module 133 are in a wired manner - 13 - 201038956 3 data exchange, in another implementation, the first transceiver module measures The transceiver module 1330 exchanges data in an optical connection manner. :: The art system transmits test data with mechanical components (probes), so the overall a(10) degree cannot keep up with the fast-growing wafer security speed. In contrast, the integrated circuit component detection system of the second embodiment transmits the test data between the test port and the device to be tested in different manners, and thus the overall time precision is consistent with the integrated circuit of the device to be tested without being mechanically Component limit

It can be applied to the electrical detection of high-speed integrated circuits. In particular, the integrated circuit component detecting system of the present invention can be used to diagnose the cause of failure of the component to be tested, in addition to performing electrical detection of the device to be tested. In addition, the integrated circuit component detecting system of the present invention is not limited to the integrated circuit component applied to a single crystal grain, but can be applied to an integrated circuit component which is manufactured by the technique. The technical and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the present invention is not limited by the scope of the invention, and the invention is intended to cover various alternatives and modifications. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing an integrated circuit component detecting system according to an embodiment of the present invention. FIG. 2 is a view showing an integrated circuit component detecting system according to another embodiment of the present invention. FIG. 3 is a view showing an integrated body according to another embodiment of the present invention. Circuit element detecting system FIG. 4 illustrates an integrated circuit component detecting system according to another embodiment of the present invention. FIG. 5 illustrates an integrated circuit component detecting system according to another embodiment of the present invention. FIG. 6 illustrates another embodiment of the present invention. Integrated circuit component detecting system; FIG. 7 illustrates an integrated circuit component detecting system according to another embodiment of the present invention; FIGS. 8 and 9 are schematic diagrams showing signal transmission of the integrated circuit component detecting system of the embodiment of the present invention; Integral circuit component detecting system according to another embodiment of the present invention, FIG. 11 illustrates an integrated circuit component detecting system according to another embodiment of the present invention, and FIG. 12 illustrates an integrated circuit component detecting system according to another embodiment of the present invention; 13 shows an integrated circuit component detecting system according to another embodiment of the present invention. [Main component symbol description] 1 Cascade circuit component detecting system 22 first transceiver module 26 detection unit 30 device under test 34 self-test circuit 38 second transceiver module 42 power regulator 50 circuit board 62 transport device 70 integrated circuit component detection system 80 integrated circuit component detection system 20 test machine 24 physical layer mode Group 28 Diagnostic Unit 32 Core Circuit 36 Controller 40 Clock Generator 44 Labels Register 60 Integrated Circuit Component Detection System 64 Predetermined Test Location 72 Package Die 90 Wafer-15 - 201038956 100 Integrated Circuit Component Detection System 110 Test machine

111 test head 113 carrier 115 physical layer module 117 power regulator 119 clock generator 121 core circuit 123 memory BIST Ο 125 analog BIST 130 second transceiver module 134 detection unit 110 'test machine 120 ' DUT 110 " Test machine 120" DUT 10 10 tester 〇 1 012 test bench 1014 first transceiver module 1016 communication module 1 01 8 communication controller 1020 DUT 1022 test module 1024 logic BIST 1026 test controller 1032 diagnostic unit 112 test station 114 First transceiver module 116 communication module 11 8 communication controller 120 DUT 122 test module 124 logic BIST 126 test controller 132 diagnostic unit 140 integrated circuit component detection system 1131 carrier 1 50 integrated circuit component detection system 113 " Carrier 1000 Integrated Circuit Component Detection System 1011 Test Head 1013 Carrier 1015 Physical Layer Module 1017 Power Regulator 1019 Clock Generator 1021 Core Circuit

1023 memory BIST

1025 analog BIST 1030 second transceiver module 1034 detection unit 16- 201038956

1100 integrated circuit component detection system 1110 tester 1120 DUT 1200 integrated circuit component detection system

1220 Tester 1220 DUT 1300 Integrated Circuit Component Detection System 1310 Tester

1320 DUT -17-

Claims (1)

201038956 VII. Patent application scope: 1. An integrated circuit component detection system, comprising: a test head comprising a first transceiver module; a test station comprising a detection unit, the detection unit being lightly connected to the test head Testing; and an integrated circuit component comprising a communication module, a plurality of tested core circuits, and at least one test module; The communication module includes a second transceiver module for setting data exchange with the first transceiver module; wherein each core circuit is separately fabricated on different dies; wherein the at least one test module has a corresponding Quantitatively coupled to the core circuit and the self-test circuit of the communication module for self-testing of the core circuits; wherein the communication module, the core circuits, and the at least one test module are packaged in a single Inside the package. 2. The integrated circuit riding detection system according to claim i, wherein the communication mode red and the at least one test module are respectively fabricated on two crystal grains, and the two crystal grains are different from the crystal grains of the core circuits . 3. The integrated circuit element noon detection system according to claim 1, wherein the number of the core circuits and the at least one test module are the same, and each core circuit is manufactured differently from its corresponding test module. , u, the day of the grain, and the communication module is made in a different grain. 4. According to the integrated circuit element of claim 1 and the ~4 pieces of the remaining system, wherein the communication module and the at least one test module are fabricated in the same die, and the die is different -18-201038956 The die of the core circuit. 5. The integrated circuit component detection system of claim 1, wherein the communication module further comprises a clock generator coupled to the second transceiver module. 6. The integrated circuit component detection system of claim 5, wherein the communication module further comprises a communication controller coupled to the second transceiver module and the clock generator. 7. The integrated circuit component detection system of claim 5, wherein the clock generator is coupled to the test module. The integrated circuit component detecting system according to the request item further includes a power regulator for providing the integrated circuit component, wherein the second transceiver module receives the signal transmitted by the first transceiver module to drive the The power regulator generates electricity. 9. The integrated circuit component detecting system of claim 8, wherein the integrated circuit component is located in a carrier including the power regulator, and self-obtaining its operating power. 10. The integrated circuit component detecting system according to claim i, wherein the test head further comprises a physical layer module coupled to the first transceiver module. U. The integrated circuit component detection system of claim i, wherein the test station further comprises a diagnostic unit coupled to the detection unit. 12. The integrated circuit component detection system of claim i, wherein the self test circuit is a memory self test circuit. The integrated circuit of claim i (4) is a detection system, wherein the self-test circuit is a logic self-test circuit. 14' The integrated circuit component detecting system according to claim i, wherein the self-test circuit is a logic analog test circuit. • 19- 201038956 15· According to the integrated circuit component detecting system of claim 1, the first transceiver module wirelessly exchanges data with the second transceiver module. 16. According to the integrated item of claim 1 The circuit component detecting system, the first transceiver module performs data exchange with the second transceiver module in a wired manner. 17. The integrated circuit component detecting system according to claim 1, wherein the first transceiver module is The optical connection mode and the second transceiver module exchange data. Ο -20-