KR200372268Y1 - Integrated silicone contactor with interposer board - Google Patents

Integrated silicone contactor with interposer board Download PDF

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Publication number
KR200372268Y1
KR200372268Y1 KR20-2004-0030186U KR20040030186U KR200372268Y1 KR 200372268 Y1 KR200372268 Y1 KR 200372268Y1 KR 20040030186 U KR20040030186 U KR 20040030186U KR 200372268 Y1 KR200372268 Y1 KR 200372268Y1
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South Korea
Prior art keywords
silicon
contactor
contactors
conductive
integrated
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KR20-2004-0030186U
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Korean (ko)
Inventor
김종원
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주식회사 아이에스시테크놀러지
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Priority to KR20-2004-0030186U priority Critical patent/KR200372268Y1/en
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Publication of KR200372268Y1 publication Critical patent/KR200372268Y1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Abstract

기존의 집적화된 실리콘 콘택터의 사이에 매개판을 삽입함으로써, 임의의 높이가 필요한 어떠한 테스트 조건에도 대응할 수 있는 실리콘 콘택터에 관한 고안. 본 고안에 따르면, 도1과 같이 구성되는 실리콘 콘택터가 상하로 각각 구비된다. 상기 상하 실리콘 콘택터 사이에 매개판이 개재되는데, 이 매개판에는 상기 실리콘 콘택터의 도전성 실리콘부에 대응하는 위치에 상하 실리콘 콘택터의 도전성 실리콘부를 연결시키는 연결부가 형성된다. 상기 매개판으로는 인쇄회로기판을 사용할 수 있고, 이 경우에 상기 연결부는 인쇄회로기판에 형성된 비어홀(via hole)인 것이 바람직하다.Design of a silicon contactor that can cope with any test condition requiring any height by inserting an intermediate plate between existing integrated silicon contactors. According to the present invention, the silicon contactor configured as shown in FIG. 1 is provided up and down, respectively. An intermediate plate is interposed between the upper and lower silicon contactors, and the intermediate plate is provided with a connection portion connecting the conductive silicon portions of the upper and lower silicon contactors to a position corresponding to the conductive silicon portion of the silicon contactor. A printed circuit board may be used as the intermediate plate, and in this case, the connection part may be a via hole formed in the printed circuit board.

Description

매개판을 포함하는 집적화 실리콘 콘택터{Integrated silicone contactor with interposer board}Integrated silicone contactor with intermediary board {Integrated silicone contactor with interposer board}

본 고안은 반도체 시험용 장비(테스트지그 등)의 소켓 콘택터에 관한 것으로서, 보다 구체적으로는 본 출원인이 선출원한 발명특허(특허 제448414호, "집적화된 실리콘 콘택터 및 그 제작장치와 제작방법")의 일부 개량사항에 관한 것이다.The present invention relates to a socket contactor of a semiconductor test equipment (test jig, etc.), and more specifically, to the invention patent (patent 448414, "Integrated silicon contactor and its manufacturing apparatus and manufacturing method") filed by the applicant. It is about some improvements.

도1은 상기 선출원 발명에 관계된 집적화된 실리콘 콘택터(10)의 단면도이다. BGA(ball grid array) 반도체소자(20)의 볼리드(ball lead, 22)가 접촉되는 도전성 실리콘부(12)와 도전성 실리콘부(12) 사이에서 절연층 역할을 하는 절연 실리콘부(14)로 구성된다. 실리콘 콘택터(10)는 반도체소자의 테스트를 수행하는 PCB인 소켓보드(24)에 탑재되어 있다. 소켓보드(24)의 접촉패드(26)에는 도전성 실리콘부(12)가 접촉되어 반도체소자의 볼리드(22)와 소켓보드(24)의 접촉패드(26)가 전기적으로 연결된다. 도전성 실리콘부(12)는 실리콘에 도전성 파우더를 혼합하여 굳힌 것으로서 전기가 흐르는 도체로 작용하며 실리콘에 탄성이 있으므로 소켓보드(24) 또는 반도체소자(20)와 수평이 맞지 않아도 접촉이 양호하게 된다. 절연 실리콘부(14)는 도전성 실리콘부(12)의 사이사이에 충전되어 전체 콘택터(10)의 위치를 안정되게 하고 소자의 리드가 눌러졌을 때 도전성 실리콘부(12)가 원래의 형태로 수직으로 세워질 수 있도록 한다.1 is a cross-sectional view of an integrated silicon contactor 10 in accordance with the above-described prior invention. To the insulating silicon portion 14 serving as an insulating layer between the conductive silicon portion 12 and the conductive silicon portion 12 to which the ball lead 22 of the ball grid array (BGA) semiconductor element 20 is contacted. It is composed. The silicon contactor 10 is mounted on a socket board 24, which is a PCB for testing semiconductor devices. The conductive silicon portion 12 is in contact with the contact pads 26 of the socket board 24 to electrically connect the ball lead 22 of the semiconductor device with the contact pads 26 of the socket board 24. The conductive silicon portion 12 is hardened by mixing conductive powder with silicon, and acts as a conductor through which electricity flows. Since the silicon is elastic, contact with the socket board 24 or the semiconductor element 20 does not occur even if it is not horizontal. The insulating silicon portion 14 is filled between the conductive silicon portions 12 to stabilize the position of the entire contactor 10, and the conductive silicon portions 12 are perpendicular to the original shape when the lead of the device is pressed. To be erected.

그러나 도1과 같은 실리콘 콘택터에서는 그 소재상 및 공정상의 한계로 인해 최대 두께를 약 1.5mm 이상으로 제작하기가 곤란하다. 왜냐하면 절연성 실리콘부(12) 사이사이에 도전성 실리콘부(12)를 형성하는 공정이 액상의 실리콘에 의해 이루어지고 또한 도전성 실리콘부(12)의 간격이 매우 좁기 때문에, 두께를 크게 하면 인접한 도전성 실리콘부(12)가 서로 맞닿는 브리지 불량이 발생하기 때문이다(도2 참조).However, in the silicon contactor as shown in FIG. 1, it is difficult to produce a maximum thickness of about 1.5 mm or more due to its material and process limitations. Because the process of forming the conductive silicon portion 12 between the insulating silicon portions 12 is made of liquid silicon and the distance between the conductive silicon portions 12 is very small, the thickness of the adjacent conductive silicon portions is increased. This is because a bridge failure in which (12) abuts on each other occurs (see FIG.

실제로 상기 실리콘 콘택터를 테스트용 콘택터로 사용하는데 있어서는 실리콘 콘택터의 상부에 접촉하는 피시험용 반도체소자와, 실리콘 콘택터의 하부에 접촉하는 소켓보드 사이의 거리가 1.5mm 이상 필요한 경우가 있기 때문에, 이러한 케이스에 대처하기 위해서는 두꺼운 실리콘 콘택터가 필요하게 된다.In practice, in using the silicon contactor as a test contactor, the distance between the semiconductor device under test in contact with the upper portion of the silicon contactor and the socket board in contact with the lower portion of the silicon contactor may be 1.5 mm or more. To cope, a thick silicon contactor is required.

본 출원인은 상기 문제를 해소하기 위하여, 기존에 출원한 실리콘 콘택터 자체의 두께를 소정치 이상 크게 할 수는 없지만, 중간에 매개판을 삽입함으로써 원하는 높이의 테스트 조건에 대응할 수 있도록 하였다.In order to solve the above problem, the present applicant cannot increase the thickness of the silicon contactor itself, which has been previously filed, by more than a predetermined value, but it is possible to cope with test conditions of a desired height by inserting an intermediate plate in the middle.

따라서 본 고안의 목적은 기존의 집적화된 실리콘 콘택터의 사이에 매개판을 삽입함으로써, 임의의 높이가 필요한 어떠한 테스트 조건에도 대응할 수 있는 실리콘 콘택터를 제공하는 것이다.Accordingly, an object of the present invention is to provide a silicon contactor capable of responding to any test condition requiring an arbitrary height by inserting an intermediary plate between existing integrated silicon contactors.

도1은 선출원에 따른 실리콘 콘택터의 단면도.1 is a cross-sectional view of a silicon contactor according to a prior application.

도2는 상기 실리콘 콘택터의 공정상 발생하는 브리지 불량의 모식도.2 is a schematic diagram of a bridge failure occurring in the process of the silicon contactor.

도3은 본 고안에 따른 실리콘 콘택터의 분해사시도.Figure 3 is an exploded perspective view of a silicon contactor according to the present invention.

<도면번호><Drawing number>

집적화 실리콘 콘택터(10) 도전성 실리콘부(12) 절연 실리콘부(14) 반도체소자(20) 볼리드(22) 소켓보드(24) 접촉패드(26) 실리콘 콘택터(30, 30') 도전성 실리콘부(32, 32') 매개판(40) 연결부(42)Integrated silicon contactor 10 Conductive silicon portion 12 Insulating silicon portion 14 Semiconductor element 20 Bolled 22 Socket board 24 Contact pad 26 Silicon contactor 30, 30 'Conductive silicon portion ( 32, 32 ') media plate (40) connections (42)

본 고안은 상술한 것과 같은 집적화된 실리콘 콘택터에 매개판을 포함시킴으로써 실리콘 콘택터 자체의 두께에 대한 한계를 극복한 개량된 집적화 실리콘 콘택터를 제공한다.The present invention provides an improved integrated silicon contactor that overcomes limitations on the thickness of the silicon contactor itself by including a media plate in the integrated silicon contactor as described above.

본 고안에 따른 집적화 실리콘 콘택터는, 본 출원인이 선출원한 특허(특허 제448414호), 즉, 반도체소자의 리드가 접촉되는 다수의 도전성 실리콘부와, 이 도전성 실리콘부 사이에 형성되어 절연층 역할을 하는 다수의 절연 실리콘부를 포함하는 실리콘 콘택터의 단점을 보완하기 위하여 개량된 것이다.The integrated silicon contactor according to the present invention is a patent (Patent No. 448414) filed by the present applicant, that is, a plurality of conductive silicon portions in contact with the leads of the semiconductor element, and formed between the conductive silicon portions to serve as an insulating layer. It is an improvement in order to compensate for the disadvantage of the silicon contactor including a plurality of insulating silicon.

본 고안에 따르면, 도1과 같이 구성되는 실리콘 콘택터가 상하로 각각 구비된다. 상기 상하 실리콘 콘택터 사이에 매개판이 개재되는데, 이 매개판에는 상기 실리콘 콘택터의 도전성 실리콘부에 대응하는 위치에 상하 실리콘 콘택터의 도전성 실리콘부를 연결시키는 연결부가 형성된다. 상기 매개판으로는 인쇄회로기판을 사용할 수 있고, 이 경우에 상기 연결부는 인쇄회로기판에 형성된 비어홀(via hole)인 것이 바람직하다.According to the present invention, the silicon contactor configured as shown in FIG. 1 is provided up and down, respectively. An intermediate plate is interposed between the upper and lower silicon contactors, and the intermediate plate is provided with a connection portion connecting the conductive silicon portions of the upper and lower silicon contactors to a position corresponding to the conductive silicon portion of the silicon contactor. A printed circuit board may be used as the intermediate plate, and in this case, the connection part may be a via hole formed in the printed circuit board.

이하, 도면을 참조하여 본 고안의 실시예를 설명한다.Hereinafter, embodiments of the present invention will be described with reference to the drawings.

도3은 본 고안에 따른 집적화 실리콘 콘택터의 분해사시도로서, 도1과 같이 구성되는 실리콘 콘택터(30, 30')가 상하로 배치된다.3 is an exploded perspective view of an integrated silicon contactor according to the present invention, in which silicon contactors 30 and 30 'configured as shown in FIG. 1 are disposed up and down.

상기 실리콘 콘택터(30, 30') 사이에는 매개판(40)이 개재된다. 이 매개판(40)의 두께 T는 본 고안의 목적에 따라 상기 실리콘 콘택터(30, 30')의 두께 t보다 두꺼운데, T는 본 고안의 실리콘 콘택터를 사용하는 용도에 따라 임의로 설정된다.An intermediate plate 40 is interposed between the silicon contactors 30 and 30 '. The thickness T of the intermediate plate 40 is thicker than the thickness t of the silicon contactors 30 and 30 'according to the purpose of the present invention, and T is arbitrarily set according to the use of the silicon contactor of the present invention.

상기 매개판(40)에는, 상하 실리콘 콘택터(30, 30')의 도전성 실리콘부(32, 32')에 대응하는 위치에, 상하 실리콘 콘택터의 도전성 실리콘부(32, 32')를 연결시키는 연결부(42)가 형성되어 있다. 따라서 상부 실리콘 콘택터의 도전성 실리콘부(32)와 하부 실리콘 콘택터의 도전성 실리콘부(32')가 상호 전기적으로 연결될 수 있고, 결과적으로 상부 실리콘 콘택터(30)에 접촉하는 반도체소자(미도시)와 하부 실리콘 콘택터(30')에 접촉하는 소켓보드(미도시) 사이의 거리가 넓어질 수 있게 되어 본 고안의 목적이 달성된다.A connecting portion for connecting the conductive silicon portions 32 and 32 'of the upper and lower silicon contactors to the intermediate plate 40 at positions corresponding to the conductive silicon portions 32 and 32' of the upper and lower silicon contactors 30 and 30 '. (42) is formed. Therefore, the conductive silicon portion 32 of the upper silicon contactor and the conductive silicon portion 32 'of the lower silicon contactor may be electrically connected to each other, and as a result, a semiconductor device (not shown) and a lower portion contacting the upper silicon contactor 30 may be formed. The distance between the socket board (not shown) in contact with the silicon contactor 30 'can be widened to achieve the object of the present invention.

본 고안의 실시예에 있어서, 상기 매개판(40)으로는 에폭시나 베이클라이트 등의 인쇄회로기판을 사용하였고, 상기 연결부(42)는 인쇄회로기판에 포토리소그라피로 비어홀(via hole)을 형성하여 가공하였다.In an embodiment of the present invention, a printed circuit board such as epoxy or bakelite was used as the intermediate plate 40, and the connection part 42 was formed by forming a via hole through photolithography on the printed circuit board. It was.

상기 실리콘 콘택터(30, 30')와 매개판(40)은 접착제에 의해 부착하였는데,부착방식이 이에 한정되지는 않는다. 가령, 상하 실리콘 콘택터의 제작시에 매개판을 동시에 인서트몰드하는 방법으로도 실시가능하다.The silicon contactors 30 and 30 'and the medium plate 40 are attached by an adhesive, but the attachment method is not limited thereto. For example, it can also be carried out by the method of insert-molding an intermediate plate at the same time when manufacturing the upper and lower silicon contactors.

이상에서 본 고안의 기술사상을 한 가지 실시예로 설명하였다. 그러나 본 고안의 기술적 범위는 상술한 실시예에 한정되는 것이 아니라 첨부한 실용신안등록청구범위에 의해 결정되는 것이다.The technical idea of the present invention has been described above as an embodiment. However, the technical scope of the present invention is not limited to the above-described embodiment is determined by the appended utility model registration claims.

이상에서와 같이, 본 고안에 따르면 1.5mm 이상의 두께로는 가공할 수 없는 집적화 실리콘 콘택터의 사용 한계를 극복하여, 반도체소자와 소켓보드 사이의 거리가 넓이에 대응하여 어떠한 조건에서도 반도체소자를 테스트할 수 있게 된다.As described above, according to the present invention, by overcoming the limitation of using an integrated silicon contactor that cannot be processed to a thickness of 1.5 mm or more, the semiconductor device can be tested under any conditions corresponding to the wide distance between the semiconductor device and the socket board. It becomes possible.

Claims (4)

반도체소자의 리드가 접촉되는 다수의 도전성 실리콘부와, 이 도전성 실리콘부 사이에 형성되어 절연층 역할을 하는 다수의 절연 실리콘부를 포함하는 실리콘 콘택터에 있어서,A silicon contactor comprising a plurality of conductive silicon portions to which a lead of a semiconductor element contacts, and a plurality of insulating silicon portions formed between the conductive silicon portions to serve as an insulating layer, 상기와 같이 구성되는 실리콘 콘택터가 상하로 각각 구비되며,The silicon contactor configured as described above is provided up and down, respectively, 상기 실리콘 콘택터 사이에 개재되는 판으로서, 상기 상하 실리콘 콘택터의 도전성 실리콘부에 대응하는 위치에 상하 실리콘 콘택터의 도전성 실리콘부를 연결시키는 연결부가 형성되어 있는 매개판을 포함하는 것을 특징으로 하는 집적화 실리콘 콘택터.A plate interposed between the silicon contactors, the integrated silicon contactor comprising a medium plate formed with a connecting portion for connecting the conductive silicon portion of the upper and lower silicon contactors at a position corresponding to the conductive silicon portion of the upper and lower silicon contactors. 제1항에 있어서, 상기 매개판의 두께는 실리콘 콘택터의 두께보다 큰 것을 특징으로 하는 집적화 실리콘 콘택터.The integrated silicon contactor of claim 1, wherein the media plate has a thickness greater than that of the silicon contactor. 제1항에 있어서, 상기 매개판은 인쇄회로기판이고 상기 연결부는 인쇄회로기판에 형성된 비어홀인 것을 특징으로 하는 집적화 실리콘 콘택터.The integrated silicon contactor of claim 1, wherein the intermediate plate is a printed circuit board and the connection unit is a via hole formed in the printed circuit board. 제1항에 있어서, 상기 실리콘 콘택터와 매개판은 접착제에 의해 부착되는 것을 특징으로 하는 집적화 실리콘 콘택터.The integrated silicon contactor of claim 1, wherein the silicon contactor and the media plate are attached by an adhesive.
KR20-2004-0030186U 2004-10-26 2004-10-26 Integrated silicone contactor with interposer board KR200372268Y1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100997602B1 (en) 2008-08-08 2010-11-30 이용준 Semiconductor device test contactor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100997602B1 (en) 2008-08-08 2010-11-30 이용준 Semiconductor device test contactor

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