KR101110002B1 - Elastic contactor for test of semiconductor device and meathod for manufacturing the same - Google Patents

Abstract

PURPOSE: An elastic contactor for test a semiconductor device and a manufacturing method thereof are provided to remarkably improve the lifetime and accuracy of a contactor as well as prevent the contamination and damage of a mixing conductive part by miniaturizing a gap between the conductive parts of the contactor. CONSTITUTION: A contactor body(100) is composed of a plate type test part(110) and a plurality of fixing parts(120). The fixing part includes a guide hole(121) and a coupling hole(122) around the test part in a radial shape. A conductive member is inserted into a conductive hole and the lower part of the conductive member is projected to the bottom surface of the test part. A conductive part fills a conductive mixture, in which the metal conductive material of powder and a silicon material are mixed, in the conductive hole. A protecting paper(400) is attached to the upper side of the test part and absorbs the conductive mixture on the contact surface with the conductive part.

Description

Elastic contactor for test of semiconductor device and method of manufacturing the same {Elastic contactor for test of semiconductor device and meathod for manufacturing the same}

The present invention relates to a contactor for testing a semiconductor device, and more particularly, to refine the spacing of the electrically conductive portion and to implement a contact method by the conductive member to further improve precision and durability, and to manufacture a separate mold such as a contactor. The present invention relates to an elastic contactor for testing a semiconductor device and a method of manufacturing the same, which may not only require the convenience of manufacturing a contactor but also reduce the manufacturing cost.

In general, the semiconductor device is subjected to a test to determine the failure of the electrical performance after the manufacturing process.

At this time, the positive test of the semiconductor device is performed by the electrical signal between the terminal of the semiconductor device and the test circuit board through the contactor while the contactor that serves as an electrical relay is inserted between the terminal of the semiconductor device and the test circuit board of the inspection equipment. It will be judged if it is delivered.

Such a semiconductor device test contactor is a situation in which pogo pins or silicon contactors using pogo pins are used.

Among them, the silicon contactor is formed in a shape in which a conductive portion made of a conductive material is formed in a hole penetrated in a vertical direction in a main body formed of an insulating silicon material, and the main body is fixed to a separate fixing plate.

On the other hand, in recent years, as the integration and miniaturization of semiconductor devices tend to be miniaturized, the terminal size and spacing of semiconductor devices are also miniaturized. Accordingly, the conductive parts of silicon contactors must also cope with miniaturization. Due to its characteristics, it is necessary to improve its durability.

On the other hand, when looking at the conventional contactor, as in the Korean Patent Laid-Open No. 2002-0079350, by forming a liquid silicon injection to form an insulating silicon body having a vertical through hole, the silicon and metal powder in the through hole of the body In order to fill the mixed mixed conductor, upper and lower molds are installed with magnets generated by magnets to correspond to each other, and when the mixed conductive material of silicon and metal powder is injected, the conductive mixture penetrates by magnetic force. Disclosed are a contactor having a conductive portion formed in a through-hole of an insulated silicon body by gathering inside a hole and curing the mixed conductive material, and a manufacturing method thereof.

However, in the above contactor, a plurality of pressing force and silicon elastic recovery are repeated in the insulating silicon main body and the mixed conductive part filled in the through hole thereof by the semiconductor device terminal and the test circuit board during the semiconductor test process. Deterioration and life of the electrical performance due to contamination and breakage of the mixed conductive portion, such as the falling of the conductive particles due to repeated contact of the surface of the mixed conductive portion exposed to the semiconductor device terminal with the semiconductor device terminal, which shortens the life of the contactor Remarkably deteriorating precision has a very serious problem that can not be properly tested the semiconductor device.

In addition, in the manufacturing method, an injection mold is necessary to form an insulated silicon body. In order to cope with the shapes and sizes of various semiconductor devices, injection molds having various shapes and sizes must be manufactured. There is a problem that leads to a rise in production cost.

In addition, in order to install the investment-fining pin for generating magnetic force in the mold, the configuration of the manufacturing apparatus becomes complicated, which also increases the manufacturing cost. There is a problem that can not be.

The present invention has been made to solve the above problems, to minimize the gap between the conductive portion of the contactor, and to have the indirect contact when contacting the semiconductor element terminal and the inspection circuit board to prevent contamination and breakage of the mixed conductive portion It is an object of the present invention to provide an elastic contactor for testing a semiconductor device and a method of manufacturing the same, which can significantly improve the lifespan and precision of the contactor.

In addition, in the contactor manufacturing method, the semiconductor can be manufactured in various shapes and sizes without the need for a separate injection mold, investment property, or other additional parts, thereby reducing the unit cost and reducing the spacing. Another object of the present invention is to provide an elastic contactor for device testing and a method of manufacturing the same.

As a specific means for achieving the above object, in the contactor for inspecting the good or bad of the semiconductor element by relaying the electrical connection between the terminal of the semiconductor element and the inspection circuit board of the semiconductor equipment,

It consists of a plate-shaped inspection portion and a plurality of fixed portions having a guide hole and a coupling hole radially around the inspection portion, wherein the inspection portion is made of an insulated PCB substrate from which double-sided copper foil is formed with a plurality of conductive holes penetrating up and down. main body;

A conductive member embedded in the conductive hole so that a lower portion of the conductive member protrudes to the bottom of the inspection unit;

A conductive portion filled with a conductive mixture in which a silicon material and a powdered metal conductive material are mixed in the conductive hole; And

It is attached to the upper surface of the inspection portion, the conductive mixture is absorbed on the contact surface with the conductive portion comprises a protective paper forming a conductive contact,

An insulating PCB substrate having an inspection part and a fixing part and having copper foils of both sides removed thereon, using a punching means such as a punching machine or a laser hole processing machine on the surface of the substrate, and a guide hole and a coupling hole corresponding to the inspection part and the fixing part. A substrate punching step of punching a ball;

A conductive member insertion step of inserting a metallic conductive member made of a metal ball or a metal rod into the conductive hole formed by the PCB substrate drilling step;

A conductive mixture filling step of forming a conductive portion by elastically fixing a filling and conductive member by using an injection means for a conductive mixture in which a silicon material and a powdered metal conductive material are mixed in the conductive hole into which the conductive member is inserted; And

A protective paper made of an insulating mesh or nonwoven fabric is attached to the upper surface of the PCB board with an insulating adhesive, and a protective paper attaching step of sequentially forming a conductive contact portion is formed by absorbing a conductive mixture in a portion corresponding to the conductive hole of the protective paper. It can be achieved by manufacturing the contactor.

As described above, according to the present invention, the elastic contactor for testing a semiconductor device and a method of manufacturing the same can minimize the gap between the conductive parts filled with the conductive mixture, protect the conductive parts with the lower resin film and the upper protective paper, and the semiconductor device terminals. By contacting the test circuit board with the protective paper and the conductive member, it is possible to prevent the contamination and damage of the conductive part, and to improve the precision and greatly extend the life of the contactor during inspection of the semiconductor device. It can be.

In addition, in the contactor manufacturing method, since a part including a separate injection mold is not additionally used to obtain the contactor main body, a significant reduction in the manufacturing cost and the gap between the conductive parts invested in the use of the contactor according to the shape and size of the semiconductor element. It is possible to obtain an effect that can be easily reduced.

1 is a perspective view of an elastic contactor for testing the semiconductor device of the present invention.
2 is a cross-sectional view of a first embodiment of the elastic contactor for testing semiconductor devices.
3 is a cross-sectional view of a second embodiment of the elastic contactor for testing semiconductor devices.
Figure 4 is a flow chart of the process steps of the method for manufacturing an elastic contactor for testing the semiconductor device of the present invention.
5 is a cross-sectional view showing a substrate manufacturing step of the contactor of the method for manufacturing an elastic contactor for testing a semiconductor device of the present invention.
Figure 6a and 6b is a cross-sectional view showing a resin film forming step of the method of manufacturing an elastic contactor for testing semiconductor device of the present invention.
7 is a cross-sectional view showing a conductive member insertion step of the method for manufacturing an elastic contactor for testing semiconductor devices of the present invention.
8 is a cross-sectional view showing a conductive mixture filling step of the method for manufacturing an elastic contactor for testing a semiconductor device of the present invention.
9 is a cross-sectional view showing a protective paper attaching step of the method for manufacturing an elastic contactor for testing a semiconductor device of the present invention.
10 is a cross-sectional view showing a conductive contact coating state of the method for manufacturing an elastic contactor for testing a semiconductor device of the present invention.
Figure 11 is another embodiment showing the substrate perforation step of the method for manufacturing the elastic contactor for testing the semiconductor device of the present invention.
12 is a cross-sectional view showing a state of use of the elastic contactor for testing a semiconductor device of the present invention.

The terms or words used in this specification and claims are not to be construed as limiting in their usual or dictionary meanings, and the inventors may appropriately define the concept of terms in order to best explain their invention in the best way possible. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, It should be understood that various equivalents and modifications may be present.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of an elastic contactor for testing the semiconductor device of the present invention, FIG. 2 is a cross-sectional view of a first embodiment of the elastic contactor for testing the semiconductor device of the present invention, and FIG. 3 is a second embodiment of the elastic contactor for testing the semiconductor device of the present invention. It is a cross section.

As shown in FIGS. 1 and 2, the elastic contactor 1 for testing a semiconductor device of the present invention is composed of a contactor main body 100, a conductive member 200, a conductive portion 300, and a protective paper 400. .

Here, the contactor main body 100 is composed of an insulated PCB substrate, and is formed in a state where the double-sided copper foil of the PCB substrate is removed, and the main body 100 is in contact with the terminals 11 of the semiconductor element 10. The inspection unit 110 and the main body 100 is composed of a fixing unit 120 for fixing the inspection equipment and the inspection circuit board 20.

At this time, the inspection unit 110, the plurality of conductive holes 111 corresponding to the arrangement of the terminal 11 of any one of the semiconductor device 10 is formed so as to penetrate up and down.

The fixing part 120 includes a guide hole 121 and a bolt for inserting a guide means (not shown in the figure) to guide the position to fix the main body 100 to the inspection equipment and the inspection circuit board 20. The coupling hole 122 is formed through the coupling means (not shown in the figure) for the fixing fixing key.

Meanwhile, as illustrated in FIG. 2, an insulating resin film 500 is attached to the bottom of the inspection unit 110 of the main body 100, but the resin film 500 is connected to the conductive hole 111. The through hole 510 having a diameter smaller than that of the conductive hole 111 can be formed.

In addition, the conductive hole 111 of the inspection unit 110 is an expansion hole 112 having a relatively thick and large diameter based on the thickness of the main body 100 from the top, as shown in FIG. 3, and the expansion hole 112. It can be configured as a multi-stage hole made of a reduction hole 113 having a relatively thin and narrow diameter to the bottom of the).

The conductive member 200 is embedded in the conductive hole 111 and is configured to protrude to the bottom surface of the inspection unit 110.

At this time, the conductive member 200 may be composed of a conductive metal sphere, or may be composed of a metal rod forming a hemispherical shape of the lower portion, it is preferable to have a diameter smaller than the diameter of the conductive hole 111.

In addition, the conductive member 200 may be formed of a ball or a bar made of any one of plastic, glass, ceramic, and rubber. In this case, a conductive material is coated on the surface of the conductive member 200 to conduct conductivity. It can be configured to have a metal sphere or a metal rod.

Meanwhile, as shown in FIG. 2, the conductive member 200 is inserted into the conductive hole 111 so that the conductive member 200 is seated on the upper surface of the through hole 510 of the resin film 500 and the lower portion of the conductive member 200 is formed in the through hole 510. It can be configured to protrude to the bottom of the predetermined).

In addition, the conductive member 200, the conductive member 200 is inserted into the expansion hole 112 as shown in Figure 3 seated on the upper surface of the reduction hole 113 and the lower portion of the conductive member 200 is reduced It can be configured to project a predetermined surface to the bottom of the hole (113).

At this time, the conductive member 200 protruding downward is preferably configured to protrude to about 0.05 ~ 0.1mm.

The conductive portion 300 is formed by filling a conductive mixture in the conductive hole 111. The conductive mixture is formed by mixing a silicon material and a powdered metal conductive material.

That is, the conductive hole 111 is filled and the conductive member 200 is fixed by the conductive mixture, and the silicon material is mixed to have a predetermined elastic fluidity in the conductive member 200.

The protective paper 400 is attached to the upper surface of the inspection unit 110, the conductive mixture is absorbed on the contact surface with the conductive portion 300 to form a conductive contact portion 410, the conductive paper 400 is conductive It is configured to prevent the conductive material particles contained in the mixture from falling off to the outside.

In this case, the protective paper 400 may be made of an insulating material mesh or nonwoven fabric having good absorption without electricity.

In addition, a conductive coating layer 420 coated with any one of gold, silver, tin, nickel, and a conductive metal is formed on the surface of the conductive contact portion 410 of the protective paper 400, which is used to improve the conductivity of the conductive contact portion 410. It is configured to further improve.

Hereinafter, a method of manufacturing an elastic contactor for testing a semiconductor device having the above configuration will be described.

Figure 4 is a flow chart of the process steps of the method for manufacturing an elastic contactor for testing semiconductor devices.

As shown in FIG. 4, the method for manufacturing an elastic contactor for testing a semiconductor device according to the present invention includes a substrate drilling step (S100), a resin layer forming step (S200), a conductive member insertion step (S300), and a conductive mixture filling step (S400). And, it is possible by performing the protective paper attachment step (S500).

Wherein the substrate drilling step (S100), as shown in Figure 5, having an inspection part and a fixed part, and having an insulated PCB substrate from which copper foil on both sides is removed, such as punching machine or laser hole processing machine on the surface of the PCB substrate The plurality of conductive holes 111 corresponding to the arrangement of the terminals 11 of any one of the semiconductor devices 10 are formed to penetrate up and down in the inspection unit 110 by using a puncturing means, and the fixing unit ( In the 120, the coupling hole 122 is coupled to the coupling means such as a guide hole 121 and the bolt is inserted into the guide means for guiding the position to fix the contactor body 100 to the inspection equipment and the inspection circuit board 20 Will penetrate through.

Thereafter, while performing the resin layer forming step (S200),

In the resin layer forming step (S200), the insulating resin film 500 of the synthetic resin material is attached to the bottom surface of the PCB substrate with an insulating adhesive as shown in FIG. 6A, and the insulating resin film 500 is attached as shown in FIG. 6B. The through hole 510 is formed to be in communication with the conductive hole 111 of the inspection unit 110, the through hole 510 is to be drilled to have a smaller diameter than the conductive hole 111 The conductive holes 111 and the through holes 510 are formed in multiple stages.

Thereafter, the conductive member insertion step (S300) is performed,

Inserting the conductive member (S300), as shown in Figure 7 is to insert the metallic conductive member made of a metal ball or metal rod in the conductive hole formed by the PCB substrate drilling step (S100).

At this time, the conductive member 200 is embedded in the conductive hole 111 is accommodated, it is preferable to be embedded in the upper surface of the through hole of the insulating resin film and protrude 0.05 ~ 0.1mm to the bottom surface of the through hole 510.

Thereafter, the conductive mixture filling step (S400) is performed,

In the conductive mixture filling step (S400), as shown in FIG. 8, the conductive mixture filled with a silicon material and a powdered metal conductive material is filled in the conductive hole 111 into which the conductive member 200 is inserted, thereby providing a constant elasticity. The branches form the conductive portion 300.

At this time, the conductive mixture is filled in the conductive hole 111 and at the same time to fix the conductive member 200 embedded in the conductive hole 111, the conductive member 200 to the conductive portion 300 having elasticity By the external force is to be fixed to have a predetermined elasticity.

After that, the protective paper attaching step (S500) is performed,

In the protective paper attaching step (S500), as shown in FIG. 9, a protective paper 400 made of an insulating mesh or a nonwoven fabric is attached to the upper surface of the PCB substrate, but the conductive paper 111 is attached to the conductive hole 111 of the protective paper 400. The mixture is absorbed to form a conductive contact portion 410 having conductivity.

Here, when the protective paper 400 is attached, an insulating adhesive may be used, and the adhesion may be performed by using a conductive hole in a state in which the protective paper 400 is temporarily attached to the upper surface of the PCB substrate by using a characteristic of a mesh or nonwoven fabric having excellent absorbency. It is possible to protect the conductivity of the conductive contact portion 410 formed on the protective paper 400 by applying to portions other than 111.

In addition, the coating layer forming step of forming a conductive coating layer 420 by coating a coating liquid of any one of gold, silver, tin, nickel, conductive metal on the surface of the surface conductive contact portion 410 of the protective paper 400 as shown in FIG. (S600) may be further performed, which is performed to further improve the conductivity of the conductive contact portion 410.

Meanwhile, as shown in FIG. 11, when the conductive hole 111 is formed in the substrate drilling step S100, an expansion hole 112 having a large diameter formed relatively thickly from an upper side of the PCB substrate, and the expansion hole ( It is possible to form a multi-stage reduction hole 113 having a relatively small diameter formed in communication with the lower portion of the 112.

This, by inserting the conductive member 200 in the conductive member insertion step (S300) is inserted into the expansion hole 112 to be seated on the top of the reduction hole 113 and protruded 0.05 ~ 0.1mm into the bottom surface of the reduction hole 113. In this case, the conductive holes 111 including the multi-stage expansion holes 112 and the reduction holes 113 may be embedded in the conductive holes 111 even without performing the resin layer forming step S200. The conductive member 200 is to be formed to protrude to the lower portion of the inspection unit (110).

The elastic contactor for testing a semiconductor device manufactured by the above series of processes is to conduct electrical conduction in the vertical direction by the conductive contact portion 410, the conductive portion 300, and the conductive member 200 from the top.

Hereinafter, the operation of the elastic contactor for testing a semiconductor device manufactured as described above will be described in detail with reference to the accompanying drawings.

First, looking at the installation relationship of the contactor 1 of the present invention,

As illustrated in FIG. 12, the contactor 1 may be installed on the test equipment and the test circuit board 20 in order to inspect the good or weakness of the semiconductor device 10 using the contactor 1. The contactor 1 of the present invention is seated and fixed to the upper surface of the test circuit board 20 by the guide means and the fixing means.

In this case, the contactor 1 to be seated and fixed is installed such that the conductive member 200 exposed to the lower portion is interviewed on the upper surface of the test circuit board 20.

Subsequently, the semiconductor device 10 to be inspected is mounted on the contactor 1, and each terminal 11 formed at the lower part of the semiconductor device 10 has a conductive contact portion formed at an upper portion of the contactor 1. The interview can be made at 410.

Subsequently, the electrical signal is sent to the inspection circuit board 20 and the semiconductor element 10 according to a conventional inspection, and at the same time, a constant pressing force is applied to the upper portion of the semiconductor element 10. By acting as an electrical signal relay between the semiconductor device 10 and the test circuit board 20, the good or bad of the semiconductor device 10 is determined according to whether the electrical signal is energized.

That is, when an electrical signal is transmitted to the semiconductor element 10 and the test circuit board 20, the contactor 1 of the present invention contacts the terminal 11 of the semiconductor element 10 from the top thereof. And electrical signals in the vertical direction by the lower conductive portion 300 of the conductive contact portion 410 and the conductive member 200 exposed and protruding from the lower portion of the conductive portion 300 to the lower portion of the inspection portion 110. Is transmitted to determine whether an electrical signal is transmitted between the terminal 11 of each semiconductor element 10 and the test circuit board 20.

At this time, the conductive member 200 in contact with the test circuit board 20 is a predetermined elastic force is generated by the conductive portion 300 having a predetermined elasticity, the semiconductor element 10 and the test circuit by the elastic force Even if a pressing force is applied to the substrate 20, the pressure transmitted to the semiconductor element 10 and the test circuit board 20 can be adjusted.

As described above, the elastic contactor for testing the semiconductor device of the present invention and the manufacturing method thereof,

By a series of manufacturing methods, the gap between the conductive parts filled with the conductive mixture can be miniaturized, and the manufacturing cost can be remarkably reduced. Also, in terms of the performance, the contactor by the metal sphere and the protective paper can be used. The durability and precision can be improved.

100: main body 110: inspection unit
111: conductive hole 112: expansion hole
113: reduction hole 120: fixed portion
121: guide ball 122: coupling hole
200: conductive member 300: conductive part
400: protective paper 410: conductive contact
500: resin film 510: conductive contact
520: conductive coating layer
S100: substrate drilling step S200: conductive member insertion step
S300: conductive mixture filling step S400: protective paper attaching step
S500: resin layer forming step S600: coating layer forming step

Claims (11)

In the contactor for inspecting the good or bad of the semiconductor element by relaying the electrical connection between the terminal of the semiconductor element and the inspection circuit board of the semiconductor device,
It consists of a plurality of fixing parts 120 having a guide hole 121 and a coupling hole 122 radially around the plate-shaped inspection unit 110 and the inspection unit 110, the upper and lower through the inspection unit 110. A contactor body 100 made of an insulated PCB substrate from which a double-sided copper foil having a plurality of conductive holes 111 formed thereon is removed;
A conductive member 200 inserted into the conductive hole 111 and having a lower portion protruding to the bottom of the inspection unit 110;
A conductive part 300 filled with a conductive mixture in which a silicon material and a powdered metal conductive material are mixed in the conductive hole 111; And
A semiconductor device test, comprising a protective paper 400 attached to an upper surface of the inspection unit 110 and absorbing a conductive mixture on a contact surface with the conductive portion 300 to form a conductive contact portion 410. Elastic contactor.
The method of claim 1,
The insulating resin film 500 is attached to the bottom surface of the inspection unit 110 of the main body 100 and communicates with the conductive hole 111 and has a through hole 510 having a diameter smaller than that of the conductive hole 111. Including but not limited to
The conductive member 200 is inserted into the conductive hole 111 to be seated on the upper surface of the through hole 510 of the resin film 500 and configured so that the lower portion of the conductive member 200 protrudes to the bottom surface of the through hole 510. An elastic contactor for testing a semiconductor device, characterized in that.
The method of claim 1,
The conductive hole 111 of the inspection unit 110, the expansion hole 112 is formed in the upper portion, the lower portion is composed of a multi-stage hole consisting of a reduction hole 113 having a narrower diameter than the expansion hole 112,
The conductive member 200 is inserted into the expansion hole 112 is seated on the upper surface of the reduction hole 113 and the lower portion of the conductive member 200 is characterized in that configured to project to the bottom surface of the reduction hole 113 Elastic contactor for testing semiconductor devices.
The method of claim 1,
The conductive member 200 is a conductive contactor for the semiconductor device test, characterized in that composed of any one of the conductive metal sphere or the metal rod of the lower hemisphere.
The method of claim 4, wherein
The conductive member 200 is composed of any one of a ball or a bar made of any one material of plastic, glass, ceramic, rubber,
An electrically conductive contactor for semiconductor device testing, characterized in that the conductive material is coated on the surface of the conductive member 200 to form a conductive metal sphere or a metal rod.
The method of claim 1,
The protective paper 400, the elastic contactor for testing a semiconductor device, characterized in that composed of any one of the non-electric insulating mesh or nonwoven fabric.
The method of claim 1,
Elastic contactor for testing a semiconductor device, characterized in that to form a conductive coating layer 420 coated with any one of gold, silver, tin, nickel, conductive metal, on the surface of the surface conductive contact portion 410 of the protective paper (400).
In the manufacturing method of the contactor which inspects the good or bad of a semiconductor element by relaying an electrical connection between the terminal of a semiconductor element, and the test circuit board of a semiconductor device,
An insulating PCB substrate having an inspection part and a fixing part and having copper foils of both sides removed thereon, using a punching means such as a punching machine or a laser hole processing machine on the surface of the substrate, and a guide hole and a coupling hole corresponding to the inspection part and the fixing part. A substrate puncturing step (S100) for puncturing a ball;
A conductive member insertion step (S300) of inserting a metallic conductive member made of a metal ball or a metal rod into the conductive hole formed by the PCB substrate drilling step (S100);
A conductive mixture filling step (S400) of forming a conductive part by elastically fixing a filling and conductive member by using an injection means for a conductive mixture in which a silicon material and a powdered metal conductive material are mixed in the conductive hole into which the conductive member is inserted; And
Protective paper attaching step (S500) of attaching a protective paper made of an insulating mesh or non-woven fabric to the upper surface of the PCB substrate with an insulating adhesive, the conductive mixture is absorbed in a portion corresponding to the conductive hole of the protective paper to form a conductive contact portion having conductivity Method of manufacturing an elastic contactor for testing a semiconductor device, characterized in that performed by.
The method of claim 8,
Substrate punching step (S100) Next step,
Attaching an insulating resin film to the bottom of the PCB substrate with an insulating adhesive, and forming a resin layer (S200) for drilling a through hole having a diameter smaller than the conductive hole in communication with the conductive hole by means of a drilling means; Do more,
In the conductive member inserting step (S300), the conductive member is embedded in the conductive hole, so that it is seated on the upper part of the through-hole of the insulating resin film and inserted into the bottom surface of the through-hole so as to protrude from 0.05 to 0.1 mm. .
The method of claim 8,
In the substrate drilling step (S100)
The conductive hole may include an expansion hole formed from an upper portion of the PCB substrate and a reduction hole having a small diameter communicating with the lower portion of the expansion hole in multiple stages.
In the conductive member insertion step (S300), the conductive member is embedded in the expansion hole is seated in the upper part of the shrinking hole and the elastic contactor manufacturing method for the semiconductor device test, characterized in that it is inserted into the bottom of the shrinking hole to protrude 0.05 ~ 0.1mm.
The method of claim 8,
In the protective paper attachment step (S500),
The coating layer forming step (S600) of forming a conductive coating layer is further performed by coating a coating liquid made of any one of gold, silver, tin, nickel, and a conductive metal on the surface of the conductive contact portion of the protective paper 400. An elastic contactor for manufacturing a semiconductor device test.

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