TW200739095A - Method for fabricating connecting jig, and connecting jig - Google Patents

Method for fabricating connecting jig, and connecting jig

Info

Publication number
TW200739095A
TW200739095A TW096105792A TW96105792A TW200739095A TW 200739095 A TW200739095 A TW 200739095A TW 096105792 A TW096105792 A TW 096105792A TW 96105792 A TW96105792 A TW 96105792A TW 200739095 A TW200739095 A TW 200739095A
Authority
TW
Taiwan
Prior art keywords
conductive material
board
material layer
test
connecting jig
Prior art date
Application number
TW096105792A
Other languages
Chinese (zh)
Inventor
Kiyoshi Numata
Masami Yamamoto
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW200739095A publication Critical patent/TW200739095A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

To provide a connecting jig used for a board test device in which the leading end of a test contact terminal is contacted with a board to be tested to test whether the board is good or no good, and to provide a method for fabricating the connecting jig. There is provided a method for fabricating a connecting jig for electrically connecting multiple needle-shaped terminals, which are pressure-contacted to a plurality of test points set on the wiring pattern of a board to be tested, with a test signal processor for receiving and testing an electrical signal from the board. A conductive material layer having a predetermined thickness is formed of a powdery conductive material, and a predetermined position on the conductive material layer is irradiated with laser light to sinter the conductive material. Another new conductive material layer is then layered on the conductive material layer, and a predetermined position on the another new conductive material layer is irradiated with laser light to sinter the conductive material. The above steps are repeated until the conductive portion is formed as a conductive path capable of electrically connecting a board test device with the test points. After the conductive path is formed, the conductive material that has not been sintered is removed.
TW096105792A 2006-02-21 2007-02-15 Method for fabricating connecting jig, and connecting jig TW200739095A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006044451A JP2007225345A (en) 2006-02-21 2006-02-21 Method of manufacturing connection tool, and connection tool

Publications (1)

Publication Number Publication Date
TW200739095A true TW200739095A (en) 2007-10-16

Family

ID=38437272

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105792A TW200739095A (en) 2006-02-21 2007-02-15 Method for fabricating connecting jig, and connecting jig

Country Status (3)

Country Link
JP (1) JP2007225345A (en)
TW (1) TW200739095A (en)
WO (1) WO2007097234A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI439698B (en) * 2011-09-30 2014-06-01 Hermes Testing Solutions Inc Probe card for circuit-testing and structure of probe substrate thereof
JP2021189052A (en) * 2020-05-29 2021-12-13 東洋電子技研株式会社 Probe unit
KR102649845B1 (en) * 2023-11-29 2024-03-21 주식회사 나노시스 Jig for semiconductor device testing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033566A (en) * 2000-07-18 2002-01-31 Oki Electric Ind Co Ltd Method for forming wiring pattern of printed wiring board
JP2005172603A (en) * 2003-12-10 2005-06-30 Nidec-Read Corp Substrate inspection apparatus and manufacturing method for connecting jig used for the same
JP4417192B2 (en) * 2004-07-02 2010-02-17 日本電産リード株式会社 Manufacturing method of connecting jig

Also Published As

Publication number Publication date
WO2007097234A1 (en) 2007-08-30
JP2007225345A (en) 2007-09-06

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