JP2005172603A - Substrate inspection apparatus and manufacturing method for connecting jig used for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus which reduces man-hours for connecting a contactor for inspection with an inspection processing section. <P>SOLUTION: The apparatus comprises a plurality of contacts 31, a scanner 4, which acquires signals for inspection from a plurality of inspection points via the plurality of contacts 31 and performs inspection for a substrate on the basis of the acquired signals, and a pitch-converting block 33 which electrically connects a basal end section of each contact 31 to the scanner 4. The scanner 4 comprises a plurality of electrode sections 41. The pitch-converting block 33 is a member for converting the pitch of the basal end section of the plurality of contacts 31 into the pitch of the plurality of electrode sections 41. The pitch-converting block 33 comprises upper electrode sections 35, lower electrode sections 37, and conductor sections 36 which are integrally fixed, wherein the upper electrode sections 35 are arranged to be connected to each basal end section of the plurality of contacts 31, the lower electrode sections 37 are arranged to be connected to each of the plurality of electrode sections 41, and the conductor sections 36 connect the upper electrode sections 35 to the lower electrode sections 37. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate inspection apparatus that inspects a substrate by bringing the tip of an inspection contact into contact with a substrate to be inspected, and a method for manufacturing a connection jig used in such a substrate inspection apparatus. The present invention is not limited to a printed wiring board, but includes, for example, electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. In this specification, these various wiring boards are collectively referred to as “substrates”.

  In order to carry out board inspection for inspecting the continuity of wiring patterns formed on the board and the presence or absence of short circuits between the wiring patterns, a plurality of inspection points such as pads and lands formed on the wiring patterns are used. A plurality of inspection contacts held in a needle shape are simultaneously pressed and brought into contact with each other, and a substrate inspection is performed using an inspection processing unit that selectively inputs and outputs inspection signals between the plurality of inspection contacts. A substrate inspection apparatus to perform is known (for example, refer to Patent Document 1). In such a substrate inspection apparatus, a wire cable is used for connection between each inspection contact and the inspection processing unit.

FIG. 12 is a configuration diagram showing the connection between the inspection contact and the inspection processing unit in such a substrate inspection apparatus. In FIG. 12, an inspection unit 100 for holding an inspection contact includes an inspection contact 101, a jig head portion 102 for holding a plurality of inspection contacts 101 in a multi-needle shape, and a jig head portion 102. A pitch conversion block 103 to be held, a scanner 104 as an inspection processing unit, and a wire cable 105 for connecting the inspection contact 101 and the scanner 104 are shown. In addition, the jig head unit 102 holds the tip of the inspection contact 101 so as to correspond to the arrangement of inspection points formed on the inspection target substrate protruding from the upper surface of the jig head unit 102. Here, the inspection contact 101 is made of an elastic material, and is held at different angles from the base portion to the distal end portion according to the position of the inspection point. The base pitch is converted at the tip. Then, when the inspection target substrate is pressed against the jig head portion 102, the inspection contact 101 is elastically contacted with each inspection point, and the inspection signal is transmitted from the scanner 104 to the wire cable 105 and the inspection contact 101. Are input / output to / from a predetermined inspection point, and the wiring pattern is inspected.
JP 2002-131359 A

  By the way, in recent years, the pitch of inspection points of a substrate to be inspected has become very fine, and the number of inspection points is also large. In the above-described substrate inspection apparatus, the number of contacts 101 is, for example, about several thousand. Used. However, the pitch conversion by the inspection contact 101 is extremely limited, and the pitch of the tip portion that contacts the inspection point of the substrate and the pitch of the base portion to be connected to the scanner 104 are not so different. On the other hand, since the pitch of the scanner connection terminals is relatively coarse, a wire must be used to connect the contact 102 for inspection with a fine pitch and the scanner 104. For example, even if it is going to use a printed wiring board instead of a wire, it is very difficult to wire with high density according to the pitch of a base. Here, when connecting with a wire cable, about several thousand wire cables 105 for connecting the scanner 104 and the contact 101 are also used. For this reason, there is an inconvenience that the man-hour for connecting the contact 101 and the scanner 104 by the wire cable 105 increases. In particular, when inspecting different substrates, the arrangement of inspection points on the wiring pattern is also different. Therefore, the jig head portion 102 that holds the contact 107 is changed according to the arrangement of the inspection points, and a new contact 101 is obtained. Since the scanner 104 and the scanner 104 must be reconnected by the wire cable 105, the number of man-hours for connecting the wire cable 105 is remarkable.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a substrate inspection apparatus capable of reducing the number of connection steps between an inspection contact and an inspection processing unit. And it aims at providing the manufacturing method of the connection jig utilized for such a board | substrate inspection apparatus.

  In order to achieve the above-described object, the board inspection apparatus according to the first means of the present invention acquires a signal for inspection from a plurality of inspection points on a wiring pattern provided on the board, and uses the acquired signal as the acquired signal. An inspection processing unit for inspecting the substrate based on the substrate, and a connection jig for electrically connecting a plurality of inspection points and the inspection processing unit, wherein the inspection processing unit includes the plurality of inspection signals. The connection jig is a member for converting the interval between the plurality of inspection points into the interval between the plurality of electrode portions, and each of the plurality of inspection points. A first conductive portion arranged to contact, a second conductive portion arranged to contact each of the plurality of electrode portions, and a conductive portion connecting the first and second conductive portions, respectively. It is characterized by being consolidated together

  In the above-described substrate inspection apparatus, the connection jig is formed as a block made of a non-conductive material in which a through hole is formed from a position corresponding to the first conductive portion to a position corresponding to the second conductive portion. The through hole is subjected to a conductive treatment from one end to the other end.

  Then, in the above-described substrate inspection apparatus, the thin layer photocuring material is scanned while selectively irradiating a laser beam having a predetermined wavelength, and the thin layer formed in this manner is laminated to form a block. The through hole is formed as a stack of portions that are not irradiated with laser light.

  Further, in the above-described substrate inspection apparatus, the connection jig is formed as a block made of a non-conductive material, and the conductive portion is embedded in the block.

  Further, in the above-described substrate inspection apparatus, the connecting jig is an inkjet method, a portion corresponding to the base material is a non-conductive paint such as a resin, and a portion corresponding to the conductive portion is a layer formed by spraying a conductive paint. It is characterized by forming and forming blocks by stacking layers.

  In the above-described substrate inspection apparatus, the tip portion is in contact with the plurality of inspection points on the wiring pattern provided on the substrate interposed between the substrate and the connection jig, and the first conductive portion of the connection jig It is further characterized by further comprising a plurality of contacts that are held in a multi-needle shape and in contact with the base end.

  Further, in the above-described substrate inspection apparatus, the contact is made of an elastic body and is configured to adjust a difference in pitch between the inspection point of the substrate and the first conductive portion of the connection jig. It is said.

  In addition, the method for manufacturing a connection jig for a substrate inspection apparatus according to the second means of the present invention includes the first and second planes parallel to each other and the second from the position corresponding to the inspection point on the first plane. A base material portion forming step for forming a base material portion having a through hole extending between positions corresponding to the electrode portions of the inspection processing portion on a plane, and a conductive portion forming step for conducting between both end portions of the through hole It is characterized by comprising.

  And in the manufacturing method of the above-mentioned board | substrate inspection apparatus connecting jig, the said base material part formation process accommodated in the container according to the shape information showing the shape of the said base material part set beforehand. A laser light irradiation step of selectively irradiating the liquid with a laser beam and forming a layer of the base material portion so that a portion not irradiated with the laser beam becomes a hole, and a photocurable resin on the formed layer The substrate is formed by stacking liquid layers, irradiating the photocurable resin liquid layer with the laser light to form a laminate, and repeating the lamination step.

  Furthermore, in the manufacturing method of the connection jig for a substrate inspection apparatus described above, the conductive part forming step is characterized in that the conductive part is formed by performing electroless copper plating on the inner wall of the through hole.

  Further, in the above-described method for manufacturing a connection jig for a substrate inspection apparatus, the conductive part forming step further includes a step of filling a resin into the through hole to which the electroless copper plating has been applied, and a filling of the resin into the through hole. Polishing the first and second planes of the base material portion formed, and applying electroless copper plating to the through holes and both ends of the resin filled in the through holes in the first and second planes And a conductive part forming step for forming the first and second conductive parts.

  And in the manufacturing method of the above-mentioned board | substrate inspection apparatus connecting jig, in the said electroconductive part formation process, the antioxidant process is further given to the surface of the formed said 1st and 2nd electroconductive part, It is characterized by the above-mentioned. .

  Moreover, in the manufacturing method of the connection jig for a substrate inspection apparatus described above, in the conductive part forming step, the conductive part is formed by filling the through hole with a conductive paste and curing the conductive paste. It is characterized by that.

  And in the manufacturing method of the connection jig | tool for a board | substrate inspection apparatus mentioned above, the said electroconductive part formation process forms the said electroconductive part by inserting an electroconductive wire in the said through-hole.

  Furthermore, in the manufacturing method of the connection jig for a substrate inspection apparatus described above, in the conductive portion forming step, the wire is inserted so as to protrude from both end portions of the through hole, and the conductive portion forming step further includes the wire And a step of polishing the protruding portion of the resin-molded wire to the first and second plane positions.

  Moreover, in the manufacturing method of the connection jig for a substrate inspection apparatus described above, in the conductive part formation step, the cross-sectional part of the wire polished to the first and second plane positions may be further subjected to an anti-oxidation treatment. It is a feature.

  In the above-described board inspection apparatus, the connection jig is provided with contacts made of conductive elastic bodies in the through holes, and the contacts penetrate the through holes so as to be deformable in the through holes. It is characterized by.

  Furthermore, in the above-described substrate inspection apparatus, the connection jig is arranged such that the contact tip is in contact with the inspection point of the substrate and the base end is in contact with the electrode portion of the inspection processing unit. Yes.

  Moreover, in the manufacturing method of the connection jig for a substrate inspection apparatus described above, a step of forming a through hole at a position corresponding to a base end portion of the plurality of contacts in the first plate member, and a second plate shape Forming a through hole at a position corresponding to the plurality of electrode portions for receiving the plurality of inspection signals included in the inspection processing unit in the member; and the through hole formed in the first plate member Inserting a conductive wire between the first plate-like member and the through-hole formed in the second plate-like member so as to project both ends from the first and second plate-like members; Resin-molding the second plate-like member and the wires inserted through these plate-like members, and projecting portions of the resin-molded wire up to the surface positions of the first and second plate-like members And a polishing step. That.

  The board inspection apparatus having such a configuration can electrically connect a plurality of contacts and an inspection processing unit without using a wire cable, thereby reducing the number of connection steps between the plurality of contacts and the inspection processing unit. can do.

  And the manufacturing method of the connection jig | tool for board | substrate inspection apparatuses of such a structure manufactures the connection jig | tool which can electrically connect a some contactor and an inspection process part, without using a wire cable. Can do.

  Embodiments according to the present invention will be described below with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted. FIG. 1 is a schematic diagram showing an example of the configuration of a substrate inspection apparatus according to an embodiment of the present invention. A substrate inspection apparatus 1 shown in FIG. 1 includes an inspection unit 3D for inspecting a wiring pattern formed on a lower surface of a substrate 2 to be inspected held at an inspection position by an unillustrated holding mechanism, and an upper surface of the substrate 2 An inspection unit 3U for inspecting the formed wiring pattern, a scanner 4, a tester controller 5, a control unit 6, and an operation panel 7 are provided.

  Moreover, inspection unit 3D, 3U is provided with the some contactor 31 made into multineedle shape, respectively. The contacts 31 included in each of the inspection units 3D and 3U are arranged and held corresponding to the positions of inspection points such as lands and pads on the wiring patterns formed on the upper surface and the lower surface of the substrate 2, respectively. .

  Then, the inspection unit 3U is lowered by an unillustrated lifting mechanism, and the tips of the plurality of contacts 31 in the inspection unit 3U are used as inspection points on the wiring pattern formed on the upper surface of the substrate 2 held at the inspection position. , Each contact. Further, the inspection unit 3D is raised by an unillustrated elevating mechanism, and the tips of the plurality of contacts 31 in the inspection unit 3D serve as inspection points on the wiring pattern formed on the lower surface of the substrate 2 held at the inspection position. , Each contact. On the other hand, the base ends of the contacts 31 of both inspection units 3D and 3U are electrically connected to the scanner 4, respectively.

  In addition, since inspection unit 3D and inspection unit 3U are the same composition besides being arranged in the up-and-down object, inspection unit 3D is explained below and explanation about inspection unit 3U is omitted.

  FIG. 2 is a partial cross-sectional view for explaining an example of the configuration of the inspection unit 3D. The inspection unit 3D includes a jig head portion 32 that holds the contact 31 in a multi-needle shape, and supports the jig head portion 32, and the base of the contact 31 of the jig head portion 32 is connected to the electrode portion 41 of the scanner 4. A pitch conversion block 33 that is electrically connected and a frame 34 that fixes the pitch conversion block 33 to the housing of the substrate inspection apparatus 1 are provided. The jig head unit 32 includes a contact 31, plate-shaped guide plates 321, 322, and 323 that restrain and hold the contact 31, and a support column 324 that supports the guide plates 321, 322, and 323 in parallel. . The pitch conversion block 33 includes an upper surface electrode part 35, a conductive part 36, and a lower surface electrode part 37. In addition, the scanner 4 is disposed below the frame 34, and an electrode portion 41 is provided on the upper surface of the scanner 4.

  The guide plates 321, 322, and 323 are formed with substantially circular insertion holes 325, 326, and 327, respectively. Further, the insertion hole 325 of the guide plate 321 is formed at a position corresponding to the inspection point position of the substrate 2. In this case, the insertion holes 325 are, for example, 600 μm apart from the inspection point position interval of the substrate 2, and the diameter of the insertion holes 325 is, for example, 300 μm. On the other hand, the insertion hole 327 of the guide plate 323 is formed at a position corresponding to the position of the upper surface electrode portion 35 on the upper surface of the pitch conversion block 33. In this case, the interval between the insertion holes 327 is approximately the same as that of the insertion hole 325, and is approximately 600 μm, for example.

  When the contact 31 is inserted into the insertion holes 325, 326, and 327, the contact 31 is restrained by the insertion holes 325, 326, and 327, and the tip portion of the contact 31 is the inspection point of the substrate 2. The base end portion of the contact 31 is guided to a position corresponding to the position of the upper surface electrode portion 35. Further, the jig head portion 32 and the pitch conversion block 33 are connected with the guide plate 323 facing the pitch conversion block 33, and the base end portion of the contact 31 comes into contact with the upper surface electrode portion 35. The tip of the projection slightly protrudes from the upper surface of the jig head 32, and when the upper surface of the jig head 32 is pressed against the substrate 2, the tip of the contact 31 elastically contacts the inspection point of the substrate 2. Has been.

  The upper surface of the pitch conversion block 33 is provided with an upper surface electrode portion 35 that is in contact with the base end portion of the contact 31, and the upper surface electrode portion 35 is interposed via a conductive portion 36 that vertically penetrates the pitch conversion block 33. It is connected to a lower surface electrode portion 37 provided on the lower surface of the pitch conversion block 33, and the upper surface electrode portion 35, the lower surface electrode portion 37, and the conductive portion 36 are integrally fixed together by an insulating material such as a resin. FIG. 3 is a perspective view showing an example of the appearance of the pitch conversion block 33. The pitch conversion block 33 has a substantially trapezoidal shape, for example. The pitch conversion block 33 may have various shapes such as a cube, a quadrangular column, a cylinder, and a truncated cone, and is practically a thick plate or a cube. However, in the illustrated example, the principle of the present invention is used. In order to make it easier to understand, the one having a substantially trapezoidal shape is shown. The upper surface electrode portions 35 provided on the upper surface of the pitch conversion block 33 are arranged corresponding to the position of the proximal end portion of the contact 31, and the interval between the upper surface electrode portions 35 is matched with the interval of the proximal end portion of the contact 31. For example, it is about 600 μm. On the other hand, the lower surface electrode portion 37 provided on the lower surface of the pitch conversion block 33 is arranged corresponding to the position of the electrode portion 41 of the scanner 4, and the interval between the lower surface electrode portions 37 is matched to the interval between the electrode portions 41, for example It is about 1.2 mm.

  Returning to FIG. 2, the frame 34 is for fixing the inspection unit 3 </ b> D to an unillustrated housing of the substrate inspection apparatus 1, and is composed of a plate-like member such as aluminum or iron, and is pitched on the upper surface of the frame 34. A conversion block 33 is attached. An opening 341 is provided at the center of the frame 34, and the lower surface electrode portion 37 of the pitch conversion block 33 attached to the upper surface of the frame 34 is positioned inside the opening 341.

  The electrode part 41 provided on the upper surface of the scanner 4 receives an inspection signal guided from the inspection point of the substrate 2 through the contact 31, the upper surface electrode part 35, the conductive part 36, and the lower surface electrode part 37. For this purpose, the electrode part 41 is in contact with the lower surface electrode part 37 through the opening 341 of the frame 34.

  Next, the operation of the substrate inspection apparatus 1 configured as described above will be described. 1 and 2, the manufacturer or the user attaches a pitch conversion block 33 manufactured according to the substrate 2 to be inspected to the frame 34, and further attaches the jig head portion 32 to the pitch conversion block 33. When the user operates the operation panel 7 to input an inspection start instruction, the inspection unit 3D is raised by the lifting mechanism (not shown) according to the control signal from the control unit 6, the inspection unit 3U is lowered, and the contactor 31 is elastically contacted with the substrate 2. Then, an inspection instruction signal is output from the control unit 6 to the tester controller 5, and a control signal is output from the tester controller 5 to the scanner 4. Further, in accordance with a control signal from the tester controller 5, the scanner 4 performs inspection on the wiring pattern of the substrate 2 via the electrode portion 41, the lower surface electrode portion 37, the conductive portion 36, the upper surface electrode portion 35, and the contact 31. Inspection signals are sequentially and selectively output to the points, and the inspection signals are acquired from the inspection points on the wiring pattern accordingly. Based on the inspection signals, the presence or absence of conduction between the inspection points A resistance value or the like is detected, and the substrate is inspected for disconnection or short-circuit in the wiring of the substrate 2.

  According to the above embodiment, by attaching the pitch conversion block 33 to the frame 34, the contact 31 and the scanner 4 can be electrically connected without using a wire cable. Connection man-hours can be reduced. Further, since the contact 31 and the scanner 4 are connected without using a wire cable, the inspection signal is not affected by the impedance of the wire cable, and the inspection accuracy can be improved. Further, since there is no need to manually connect the contact 31 and the scanner 4 one by one with a wire cable, erroneous wiring due to human error can be avoided, and the reliability of the substrate inspection apparatus 1 is improved. Can be made. Further, since the upper surface electrode portion 35, the lower surface electrode portion 37, and the conductive portion 36 are integrally fixed in the pitch conversion block 33, for example, in order to inspect different substrates, the arrangement of inspection points and the base of the contactor 31 Even if the arrangement of the end positions is changed, a new board can be inspected by exchanging the pitch conversion block 33 according to the arrangement, so that it is necessary to newly perform wiring work using a wire cable. Therefore, the man-hour for wiring work can be reduced.

  Note that the arrangement of the upper surface electrode portion 35 and the lower surface electrode portion 37 constitutes the pitch conversion block 33 in accordance with the arrangement of the base end portion of the contactor 31 and the arrangement of the electrode portion 41, respectively. The pitch conversion block 33 may be created according to the type of the scanner 4, but if circumstances permit in relation to the arrangement of inspection points on the substrate to be inspected, for example, the arrangement of the upper surface electrode portion 35 and the lower surface electrode portion 37 is corrected. Using the pitch conversion block 33 arranged in a grid pattern, the base end portion arrangement of the contact 31 and the arrangement of the electrode portion 41 are matched with the arrangement of the upper surface electrode portion 35 and the lower surface electrode portion 37 of the pitch conversion block 33 to form a regular lattice. The pitch may be changed by the jig head 32 according to the arrangement of the inspection points on the substrate. Thereby, the pitch conversion block 33 can be standardized. For example, even when different substrates are inspected, it is possible to reduce the creation of the pitch conversion block 33 anew.

  Further, the example in which the scanner 4 is disposed directly below the pitch conversion block 33 and the electrode portion 41 provided on the upper portion of the scanner 4 is brought into direct contact with the lower surface electrode portion 37 has been shown. For example, as shown in FIG. The printed wiring board 8 is disposed between the pitch conversion block 33 and the frame 34, and the electrode portion 41 and the lower surface electrode portion 37 are connected via the printed wiring substrate 8, so that the arrangement position of the scanner 4 is changed to the pitch. You may make it the position away from right under the conversion block 33. FIG. Thereby, for example, when it is difficult to dispose the scanner 4 directly below the pitch conversion block 33 due to structural restrictions of the substrate inspection apparatus 1, the degree of freedom of the disposition position of the scanner 4 can be increased. . Such a configuration is possible because the pitch of the lower surface electrode portion 37 can be set with a relatively large margin by the pitch conversion block 33.

  Further, for example, as shown in FIG. 5, a through hole 334 that connects a position corresponding to the inspection point position of the substrate 2 on the upper surface of the pitch conversion block 33 and a position corresponding to the electrode portion 41 on the lower surface of the pitch conversion block 33 is provided. A configuration may be adopted in which the contact 31 is made elastic by giving a space to the through hole 334 and the contact 31 is inserted, and the jig head portion 32 is not used. In this case, the contact 31 also functions as the conductive portion 36. Then, when the substrate 2 is pressed against the upper surface of the pitch conversion block 33, an inspection signal is input / output between the inspection point of the substrate 2 and the electrode portion 41 via the contact 31. Thereby, since it can be set as the structure which does not use the jig | tool head part 32, the structure of the board | substrate inspection apparatus 1 can be simplified.

(First manufacturing method of pitch conversion block)
Next, the first manufacturing method of the pitch conversion block according to the present invention will be described. FIG. 6 is a cross-sectional view for explaining an example of a manufacturing method of the pitch conversion block 33 shown in FIG. First, the base material portion 331 shown in FIG. The base material portion 331 includes an upper surface 332 and a lower surface 333 that are parallel to each other, and a through hole 334 that connects a position where the upper surface electrode portion 35 is to be formed on the upper surface 332 and a position where the lower surface electrode portion 37 is to be formed on the lower surface 333. Yes.

  FIG. 7 is a diagram illustrating an example of an optical modeling apparatus used in the base material portion forming process for manufacturing the base material portion 331. As this type of stereolithography apparatus, for example, one described in Japanese Patent Laid-Open No. 05-229017 is known. An optical modeling apparatus 11 shown in FIG. 7 includes, for example, a control computer 12 formed of a personal computer, a modeling tank 14 containing a liquid ultraviolet curable resin 13, and an ultraviolet laser, for example, in response to a control signal from the control computer 12. A laser beam irradiation device 15 that irradiates the ultraviolet curable resin 13 with light, a modeling shelf 16 disposed in the modeling tank 14, and a lifting mechanism 17 that moves the modeling shelf 16 up and down in response to a control signal from the control computer 12. And. In addition, the control computer 12 stores, for example, three-dimensional data 18 representing the shape of the base material portion 331 generated in advance by three-dimensional CAD (Computer Aided Design).

  First, a control signal based on the three-dimensional data 18 is output from the control computer 12 to the laser beam irradiation device 15 in a state where the modeling shelf 16 is submerged in the vicinity of the liquid surface of the ultraviolet curable resin 13. The liquid surface of the ultraviolet curable resin 13 is scanned with the ultraviolet laser light so that the ultraviolet laser light strikes a portion other than the portion where the through-hole is to be formed by the irradiation device 15, and on the modeling shelf 16 scanned with the laser light. When the ultraviolet curable resin 13 is cured, a lower cross-sectional layer of the base material portion 331 is formed. Next, according to the control signal from the control computer 12, the elevating mechanism 17 sinks the modeling shelf 16 by, for example, 10 to 50 μm, in some cases 100 μm, and repeats the above-described scanning of the ultraviolet laser light, thereby A new cross-sectional layer is formed on the formed cross-sectional layer, and the portion where the ultraviolet laser beam did not hit remains as a through hole, and the scanning of the ultraviolet laser beam and the settling of the modeling shelf 16 are thus repeated. The base material part 331 is formed.

  FIGS. 6B and 6C are cross-sectional views for explaining a process of forming a conductive portion 36 that conducts both end portions of the through hole 334. First, electroless copper plating is performed on the entire surface including the inner wall of the through hole 334 in the base material portion 331 to form a conductor layer 335 (FIG. 6B). Next, the resin 336 is filled in the through hole 334 and cured, and then the surfaces of the upper surface 332 and the lower surface 333 are polished to remove the conductor layer 335 formed on the surfaces of the upper surface 332 and the lower surface 333 ( FIG. 6 (c)). As a result, a so-called through-hole-shaped conductive portion 36 is formed on the inner wall of the through hole 334.

  The resin 336 serves as a base for forming the upper surface electrode portions 35 and 37. For example, when both end surfaces of the through-hole-shaped conductive portion 36 are used as the upper surface electrode portions 35 and 37 as they are, the resin 336 is used. It is good also as a structure which is not filled with 336.

  FIGS. 6D and 6E are cross-sectional views for explaining a conductor portion forming step for forming the upper surface electrode portions 35 and 37. First, electroless copper plating is applied to the entire base material portion 331 (FIG. 6D). Thereby, the conductor layer 337 is formed on the surfaces of the upper surface 332 and the lower surface 333 including both end surfaces of the conductive portion 36 and the resin 336. Next, the conductor layer 337 is subjected to a so-called photoengraving process using a photoresist laminating process, an exposure process, a developing process, and an etching process, so that the conductor layers other than the both end surfaces of the conductive portion 36 and the resin 336 are obtained. 337 is removed and upper surface electrode portions 35 and 37 are formed (FIG. 6E).

  Further, the upper surface electrode portions 35 and 37 are subjected to an anti-oxidation treatment by plating the surfaces of the upper surface electrode portions 35 and 37 with, for example, nickel (Ni) or gold (Au).

  Thereby, the pitch conversion block 33 can be manufactured. Further, the user generates the three-dimensional data 18 by, for example, three-dimensional CAD based on the position data of the inspection point of the substrate 2 to be inspected, and uses the three-dimensional data 18 to inspect the substrate 2. Since the pitch conversion block 33 can be manufactured, manual wiring work is not required to manufacture the pitch conversion block 33, and erroneous wiring due to human error can be avoided, and manual manufacturing is possible. Man-hours can be reduced.

  In addition, although the example which uses optical shaping | molding was shown as a base-material part formation process which manufactures the base-material part 331, for example, the resin melt | dissolved by heating is taken out little by little from the tip of a thin nozzle, and it forms while stacking the resin "Heat-melting laminating system" that forms a powder, "Powder molding system" that uses powdered resin or the like as a raw material to heat and harden with high-power laser light, and cuts and stacks sheet-like materials with laser light or a cutter The base material portion 331 may be manufactured by other known three-dimensional modeling methods such as a “sheet lamination method” in which the shape is formed by the above method.

(Second manufacturing method of pitch conversion block)
Next, the second manufacturing method of the pitch conversion block according to the present invention will be described. FIG. 8 is a cross-sectional view for explaining an example of a manufacturing method of the pitch conversion block 33 shown in FIG. First, the base material portion 331 shown in FIG. 8A is manufactured in the same manner as the base material portion 331 shown in FIG. Next, the through-hole 334 is filled with a conductive paste and cured (FIG. 8B).

  Thereby, the pitch conversion block 33 can be manufactured.

(Third manufacturing method of pitch conversion block)
Next, a third manufacturing method of the pitch conversion block according to the present invention will be described. FIG. 9 is a cross-sectional view for explaining an example of a manufacturing method of the pitch conversion block 33 shown in FIG. First, the base material portion 331 shown in FIG. 9A is manufactured in the same manner as the base material portion 331 shown in FIG. Next, the conductive wire is inserted into the through hole 334 as the conductive portion 36 (FIG. 9B).

  Next, a resin 336 is filled in the gap between the wire and the through hole 334, and the wire exposed from the upper surface 332 and the lower surface 333 is molded with the resin 336 (FIG. 9C). Then, the surfaces of the upper surface 332 and the lower surface 333 are polished (FIG. 9D). In this case, both end cross-sectional portions of the wire which is the conductive portion 36 are used as the upper surface electrode portions 35 and 37, respectively. Furthermore, the upper surface electrode portions 35 and 37 are subjected to an anti-oxidation treatment by plating the surfaces of both end cross-sections of the wire with, for example, nickel (Ni) or gold (Au).

  Thereby, the pitch conversion block 33 can be manufactured.

  In addition, you may use this as the pitch conversion block 33 shown in FIG. 5 by inserting the contactor 31 in the through-hole 334 using the base-material part 331 shown to Fig.9 (a).

(Fourth manufacturing method of pitch conversion block)
Next, the 4th manufacturing method of the pitch conversion block which concerns on this invention is demonstrated. FIG. 10 is a cross-sectional view for explaining an example of a manufacturing method of the pitch conversion block 33 shown in FIG. First, when the guide plate 323 and the plate-like member 338a of the jig head portion 32 are made to correspond to each other, the position corresponding to the insertion hole 327 on the plate-like member 338a, that is, the base end portion of the contactor 31 respectively. A through hole 334a is formed at the position. Further, through holes 334b are formed at positions corresponding to the positions of the electrode portions 41 of the scanner 4 on the plate-like member 338b (FIG. 10A).

  Next, with the plate-like member 338a and the plate-like member 338b facing each other in parallel, the conductive portion 36 made of, for example, a conductive wire is inserted into the through hole 334a and the through hole 334b in a skewered manner. Then, both end portions of the conductive portion 36 are protruded from the plate-like members 338a and 338b (FIG. 10B). Next, the plate-like members 338a and 338b and the entire conductive portion 36 are molded with a resin 339 (FIG. 10C).

  Next, the protruding portions at both ends of the conductive portion 36 molded with the resin 339 are polished to the surface positions of the plate-like members 338a and 338b (FIG. 10D). In this case, both end cross-sectional portions of the wire which is the conductive portion 36 are used as the upper surface electrode portions 35 and 37, respectively. Furthermore, the upper surface electrode portions 35 and 37 are subjected to an anti-oxidation treatment by plating the surfaces of both end cross-sections of the wire with, for example, nickel (Ni) or gold (Au).

  Thereby, the pitch conversion block 33 can be manufactured. Further, the side surface portion of the pitch conversion block 33 may be shaped by appropriately polishing or the like.

(Fifth manufacturing method of pitch conversion block)
Next, a fifth manufacturing method of the pitch conversion block according to the present invention will be described. FIG. 11 is a schematic perspective view for explaining an example of a manufacturing method of the pitch conversion block 33 shown in FIG. This manufacturing method is an “inkjet method” in which a shape is formed while ejecting a fine resin or adhesive from a head portion having a fine nozzle. In the case of the ink jet system, for example, a number of fine nozzles arranged in a line are translated while ejecting ink therefrom, and the portion corresponding to the base material of the pitch conversion block is not a resin or the like. In the portion corresponding to the conductive paint and the conductive portion, the conductive paint is sprayed to form a layer, and the layers are stacked while repeating scanning to form a block. In this case, like the above-described optical modeling, the conductive portion is automatically formed by stacking layers without forming the through hole once and forming the conductive portion thereon.

  According to the above-described embodiment, the pitch conversion block enables a large pitch conversion, and the pitch conversion block can adjust the pitch difference between the electrode portion of the scanner and the inspection point of the substrate. . In addition, when the inspection points of the substrate are dense, conventionally, it has been necessary to set the pitch of the contacts in accordance with the pitch of the dense portions of the inspection points. Regardless, it is possible to electrically connect the inspection point and the electrode portion of the scanner directly or via a contact at the conductive portion of the pitch conversion block.

It is a mimetic diagram showing an example of composition of a substrate inspection device concerning one embodiment of the present invention. It is a fragmentary sectional view for demonstrating an example of a structure of the test | inspection unit shown in FIG. It is a perspective view which shows an example of the external appearance of the pitch conversion block shown in FIG. It is a side view for demonstrating an example of a structure of the test | inspection unit shown in FIG. It is a fragmentary sectional view which shows an example of a structure of the pitch conversion block shown in FIG. It is sectional drawing for demonstrating an example of the 1st manufacturing method of the pitch conversion block shown in FIG. It is a figure which shows an example of the optical modeling apparatus used for the base-material part formation process which manufactures the base-material part shown in FIG. It is sectional drawing for demonstrating an example of the 2nd manufacturing method of the pitch conversion block shown in FIG. It is sectional drawing for demonstrating an example of the 3rd manufacturing method of the pitch conversion block shown in FIG. It is sectional drawing for demonstrating an example of the 4th manufacturing method of the pitch conversion block shown in FIG. It is a schematic perspective view for demonstrating an example of the manufacturing method of the pitch conversion block shown in FIG. It is the block diagram which showed the connection of the contact for a test | inspection and the test | inspection process part in the board | substrate inspection apparatus which concerns on background art.

Explanation of symbols

1 Substrate inspection device 2 Substrate 4 Scanner (inspection processing unit)
DESCRIPTION OF SYMBOLS 11 Stereolithography apparatus 12 Control computer 13 UV curable resin (photocuring material)
14 Modeling tank (container)
15 Laser beam irradiation device 16 Modeling shelf 17 Lifting mechanism 18 Three-dimensional data (shape information)
31 Contact 32 Jig Head 33 Pitch Conversion Block (Connection Jig)
34 Frame 35 Upper surface electrode portion (first conductive portion)
36 conductive portion 37 bottom electrode portion (second conductive portion)
41 Electrode part 331 Base material part 332 Upper surface (first plane)
333 bottom surface (second plane)
334, 334a, 334b Through-holes 335, 337 Conductor layers 336, 339 Resin 338a Plate member (first plate member)
338b Plate member (second plate member)

Claims (19)

An inspection processing unit that acquires an inspection signal from a plurality of inspection points on a wiring pattern provided on the substrate, and inspects the substrate based on the acquired signal, and a plurality of inspection points and the inspection processing unit And a connection jig for electrically connecting between them,
The inspection processing unit includes a plurality of electrode units for receiving the plurality of inspection signals,
The connecting jig is a member for converting an interval between the plurality of inspection points into an interval between the plurality of electrode portions, and is a first conductive portion arranged to contact each of the plurality of inspection points. And a second conductive portion arranged so as to come into contact with each of the plurality of electrode portions, and a conductive portion connecting the first and second conductive portions, respectively. A board inspection apparatus characterized by the above.   The connecting jig is formed as a block made of a non-conductive material in which a through hole is formed from a position corresponding to the first conductive portion to a position corresponding to the second conductive portion, and one end of the connecting jig is connected to the through hole. The substrate inspection apparatus according to claim 1, wherein a conductive process is performed from one end to the other end.   A thin layer of photocuring material is scanned while selectively irradiating a laser beam having a predetermined wavelength, and a thin layer formed in this manner is laminated to form a block. 3. The substrate inspection apparatus according to claim 2, wherein the substrate inspection apparatus is formed as a stack of portions not irradiated with light.   The board inspection apparatus according to claim 1, wherein the connection jig is formed as a block made of a non-conductive material, and the conductive portion is embedded in the block.   The connecting jig uses an ink jet method, the portion corresponding to the base material is made of a non-conductive paint such as resin, and the portion corresponding to the conductive portion is formed by spraying a conductive paint and stacking the layers. The substrate inspection apparatus according to claim 4, wherein the block is formed by:   The tip is in contact with the plurality of inspection points on the wiring pattern provided on the substrate, and the base end is in contact with the first conductive portion of the connection jig. The substrate inspection apparatus according to claim 1, further comprising a plurality of contacts held in a needle shape.   7. The substrate inspection according to claim 6, wherein the contact is made of an elastic body and is configured to adjust a difference in pitch between the inspection point of the substrate and the first conductive portion of the connection jig. apparatus. A through-hole extending between first and second planes parallel to each other and a position corresponding to the inspection point on the second plane from a position corresponding to the inspection point on the first plane is provided. A base material part forming step for forming the base material part;
The manufacturing method of the connection jig | tool for board | substrate inspection apparatuses of Claim 1 provided with the electroconductive part formation process which conducts between the both ends of the said through-hole. The base material portion forming step selectively irradiates the photocurable resin liquid accommodated in the container according to the shape information indicating the shape of the base material portion set in advance, and the laser light is not irradiated. A laser beam irradiation step of forming one layer of the base material portion so that the portion becomes a hole;
A photocurable resin liquid layer is overlaid on the formed layer, the laser light irradiation is performed on the photocurable resin liquid layer to form a laminate, and the laminate process is repeated to form the substrate portion. The method for manufacturing a connection jig for a substrate inspection apparatus according to claim 8.   10. The method of manufacturing a connection jig for a substrate inspection apparatus according to claim 8, wherein the conductive part forming step forms the conductive part by performing electroless copper plating on an inner wall of the through hole. . The conductive part forming step further includes a step of filling a resin into a through hole subjected to the electroless copper plating,
Polishing the first and second planes of the base material portion in which the through hole is filled with resin;
A conductive portion forming step of forming the first and second conductive portions by performing electroless copper plating on the through holes and both ends of the resin filled in the through holes in the first and second planes. The method for manufacturing a connection jig for a substrate inspection apparatus according to claim 10.   12. The method of manufacturing a connection jig for a substrate inspection apparatus according to claim 11, wherein, in the conductive portion forming step, an anti-oxidation treatment is further performed on the surfaces of the formed first and second conductive portions.   10. The substrate inspection apparatus according to claim 8, wherein the conductive portion forming step forms the conductive portion by filling the through hole with a conductive paste and curing the conductive paste. Manufacturing method of connecting jig.   10. The method of manufacturing a connection jig for a substrate inspection apparatus according to claim 8, wherein the conductive portion forming step forms the conductive portion by inserting a conductive wire into the through hole. In the conductive portion forming step, the wire is inserted to protrude from both end portions of the through hole,
The conductive portion forming step further includes a step of resin molding the protruding portion of the wire,
The manufacturing method of the connection jig | tool for board | substrate inspection apparatuses of Claim 14 provided with the process of grind | polishing the protrusion part of the said resin-molded wire to the said 1st and 2nd plane position.   16. The connection jig for a substrate inspection apparatus according to claim 15, wherein, in the conductive part forming step, an oxidation preventing process is further applied to a cross-section of the wire polished to the first and second planar positions. Production method.   2. The connection jig according to claim 1, wherein a contact made of a conductive elastic body is provided in each through hole, and the contact passes through the through hole so as to be deformable in the through hole. Board inspection equipment.   18. The substrate inspection apparatus according to claim 17, wherein the connecting jig is disposed so that a tip of a contact is in contact with an inspection point of the substrate and a base is in contact with an electrode portion of an inspection processing unit. . Forming a through hole at a position corresponding to a base end portion of the plurality of contacts in the first plate-like member;
Forming a through hole at a position corresponding to the plurality of electrode portions for receiving the plurality of inspection signals included in the inspection processing unit in the second plate-shaped member;
Conductive so as to project both end portions from the first and second plate-like members between the through-hole formed in the first plate-like member and the through-hole formed in the second plate-like member. A step of inserting a sex wire,
A step of resin molding the first and second plate-like members and the wires inserted through these plate-like members;
2. The method of manufacturing a connection jig for a substrate inspection apparatus according to claim 1, further comprising the step of polishing the protruding portion of the resin-molded wire to the surface position of the first and second plate-like members. .

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