JP2007225345A - Method of manufacturing connection tool, and connection tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection tool used for a substrate inspection device for bringing a tip part of an inspecting contact into contact with a substrate of an inspection object to inspect quality of the substrate, and also to provide a method of manufacturing the contact tool. <P>SOLUTION: The method includes manufacturing the contact tool for connecting electrically a multistylus contact pressure-contacting with a plurality of inspection points set on a wiring pattern of the inspected substrate, to an inspection signal processor for receiving an electric signal from the substrate to conduct inspection. A prescribed thickness of conductive substance layer is formed of a powdery conductive substance, a prescribed position in the conductive substance layer is irradiated with a laser beam to sinter the conductive substance, a new conductive substance layer is overlaid onto the conductive substance layer, a prescribed position in the new conductive substance layer is irradiated with the laser beam to be sintered, the process hereinbefore is repeated until the conductive part is formed as a conductive path for making the substrate inspection device electrically connectible to the each inspection point, and the conductive substance not yet sintered is removed after the conductive path is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a connection jig used in a substrate inspection apparatus for inspecting the quality of a substrate by bringing the tip of an inspection contact into contact with a substrate to be inspected and a method for manufacturing the connection jig.
The present invention is not limited to a printed wiring board, but includes, for example, electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. In this specification, these various wiring boards are collectively referred to as “substrates”.

  In order to carry out board inspection for inspecting the continuity of each wiring pattern formed on the substrate and the presence or absence of short circuits between the wiring patterns, there are many inspection points such as pads and lands formed on the wiring pattern. One end of a plurality of test contacts held in the shape of needles is pressed and brought into contact with each other at the same time, and the other end of the test contacts is brought into pressure contact with the corresponding electrical contact of the test signal processing unit. There is known a substrate inspection apparatus that performs a substrate inspection by connecting to an inspection signal processing unit via the inspection signal processing unit, selectively inputting / outputting an inspection signal to / from the wiring of the substrate via an inspection terminal (for example, (See Patent Document 1). In such a substrate inspection apparatus, a wire cable is used for connection between each inspection contact and the inspection signal processing unit.

FIG. 13 is a configuration diagram showing the connection between the inspection contact and the inspection signal processing unit in such a substrate inspection apparatus. In FIG. 13, an inspection unit 100 for holding an inspection contact includes an inspection contact 101, an inspection signal processing unit 102 for holding a plurality of inspection contacts 101 in a multi-needle shape, and a jig head unit 102. A pitch conversion block 103 to be held, an inspection signal processing unit 104 that is an inspection signal processing unit, and a wire cable 105 that connects the inspection contact 101 and the inspection signal processing unit 104 are illustrated. In addition, the jig head unit 102 holds the tip of the inspection contact 101 so as to correspond to the arrangement of inspection points formed on the inspection target substrate protruding from the upper surface of the jig head unit 102. Here, the inspection contact 101 is made of an elastic material, and is held at different angles from the base to the tip according to the position of the inspection point and the contact point of the pitch conversion block 103, and some are upright. By inclining, the pitch of the base is converted at the tip.
Then, when the inspection target substrate is pressed against the jig head portion 102, the inspection contact 101 is elastically contacted (pressure contact) with each inspection point, and the inspection signal processing portion 104 performs inspection signal processing portion wire cable 105. And an inspection signal are input / output between a predetermined inspection point via the inspection contact 101 and the wiring pattern is inspected.

By the way, in recent years, the pitch of inspection points of a substrate to be inspected has become very fine, and the number of inspection points is also large. In the above-described substrate inspection apparatus, the number of contacts 101 is, for example, about several thousand. Used. However, the amount of pitch conversion by the inspection contact 101 is extremely limited, and the pitch of the tip portion that contacts the inspection point of the substrate and the pitch of the base portion to be connected to the inspection signal processing unit 104 are not so different. . On the other hand, since the pitch of the inspection signal processing unit connection terminals is relatively coarse, the connection between the inspection contact 102 with the fine pitch and the inspection signal processing unit 104 has to use wires.
For example, even if a printed wiring board is used instead of a wire, it is extremely difficult to perform wiring at a high density according to the pitch of the base. Here, when connecting with a wire cable, about several thousand wire cables 105 for connecting the inspection signal processing unit 104 and the contact 101 are also used. For this reason, there is a problem that the number of steps for connecting the contact 101 and the inspection signal processing unit 104 by the wire cable 105 increases.
In particular, when inspecting different substrates, the arrangement of inspection points on the wiring pattern is also different. Therefore, the jig head portion 102 that holds the contact 107 is changed according to the arrangement of the inspection points, and a new contact 101 is obtained. Since the inspection signal processing unit 104 must be reconnected by the wire cable 105, the increase in the number of connection steps of the wire cable 105 is remarkable.

In order to solve such a problem, a method of creating a connection jig using an optical modeling technique has been created (for example, see Patent Document 2). The connecting jig of Patent Document 2 irradiates ultraviolet laser light to a portion other than a portion where a through hole serving as a conductive portion is to be formed by a laser light irradiation device, and cures the ultraviolet curable resin. And since the part which was not irradiated with a laser beam is created as a through-hole, a conductive part is formed by inserting a conductive material such as a wire into this through-hole. The connection jig is formed through these steps.
However, the creation of a connecting jig that can be manufactured in a process with fewer manufacturing steps than the manufacturing method described in Patent Document 2 and its manufacturing method has been required.

JP 2002-131359 A JP 2005-172603 A

  The present invention has been made in view of such circumstances, and can be manufactured with a small number of manufacturing steps, and inspects an electrical signal from a substrate to be inspected even if the pitch of inspection points is very fine. Provided are a connection jig and a method for manufacturing the connection jig that can be reliably transmitted to a contact for inspection and an inspection signal processing section of a substrate inspection apparatus.

  According to the first aspect of the present invention, inspection is performed by receiving a multi-needle contact that is press-contacted to a plurality of inspection points set on a wiring pattern of a substrate to be inspected, and an electrical signal detected from the substrate to be inspected. A method of manufacturing a connection jig for electrically connecting an inspection signal processing device to be executed, wherein a conductive material layer having a predetermined thickness is formed of a powdered conductive material, and a laser beam is formed at a predetermined position in the conductive material layer. , The conductive material at the position is sintered to form a conductive portion, a new conductive material layer is placed on the conductive material layer, and a laser beam is applied to a predetermined position on the new conductive material layer. Irradiate and sinter the conductive material at the position to form a conductive portion, and the above-described steps until the conductive portion is formed as a conductive path capable of electrically connecting the substrate inspection apparatus and the inspection point Is repeated and the conductive path is formed, Providing connecting jig manufacturing method for manufacturing a connecting jig by removing the conductive material which is not.

  According to a second aspect of the present invention, the predetermined sintering position of each layer is in contact with one end portion arranged so that each of the conductive paths contacts one contactor and the electrode portion of the inspection signal processing device. The connecting jig manufacturing method according to claim 1, wherein the other end portion arranged in such a manner is linearly connected.

  According to a third aspect of the present invention, after removing the conductive substance, the space between the conductive paths is filled with a resin material to form a block shape having a predetermined shape. A connection jig manufacturing method is provided.

  The invention according to claim 4 is arranged such that one end is electrically connected to a multi-needle contact that is press-contacted to a plurality of inspection points set on the wiring pattern of the substrate to be inspected, and the other end A connecting jig arranged to be electrically connected to an inspection signal processing device for receiving an electrical signal detected from the substrate to be inspected and performing inspection of the substrate to be inspected, There is provided a connection jig characterized in that a conductive path electrically connecting a contact and the substrate inspection apparatus is made of a linear conductive material formed by sintering a conductive material.

  According to a fifth aspect of the present invention, the conductive path has one end disposed so as to contact one of the contacts, and the other end disposed so as to contact the electrode portion of the inspection signal processing device. The connection jig according to claim 4, wherein the connection jigs are linearly connected.

  The invention according to claim 6 provides the connection jig according to claim 4 or 5, wherein the conductive path has a laminated structure of the conductive material.

  The invention according to claim 7 is characterized in that the connecting jig is formed in a block shape having a predetermined shape by filling a space between the conductive paths with an insulating resin. A connection jig according to any one of the above is provided.

According to the invention described in claim 8, the inspection is performed by receiving a multi-needle contact that is press-contacted to a plurality of inspection points set on the wiring pattern of the substrate to be inspected and an electric signal detected from the substrate to be inspected. A connection jig for electrically connecting an inspection signal processing device to be executed, wherein the connection jig contacts one end of the inspection signal processing device and an electrode portion of the inspection signal processing device. A conductive path having a second end portion disposed on the conductive path, wherein the conductive path is formed by forming a conductive material layer of a powdered conductive material having a predetermined thickness and irradiating a predetermined position on the conductive material layer with laser light. Then, the conductive material at the position is sintered to form a conductive portion, a new conductive material layer is placed on the conductive material layer, and laser light is irradiated to a predetermined position in the new conductive material layer. , Sintering the conductive material at the position to form a conductive portion, Electrostatic unit provides a connection jig being formed as a laminated by conductive paths.
By providing these inventions, the above problems can be solved.

According to the first aspect of the present invention, a multi-needle contact that is pressed against a plurality of inspection points set on the wiring pattern of the substrate to be inspected, and an electrical signal detected from the substrate to be inspected are received. A method of manufacturing a connection jig for electrically connecting an inspection signal processing apparatus for performing an inspection, wherein a conductive material layer having a predetermined thickness is formed of a powdered conductive material, and is formed at a predetermined position in the conductive material layer. A conductive portion is formed by irradiating a laser beam to sinter the conductive material at the position, a new conductive material layer is placed on the conductive material layer, and a laser is applied to a predetermined position in the new conductive material layer. Irradiate light, sinter the conductive material at the position to form a conductive portion, until the conductive portion is formed as a conductive path that can electrically connect the substrate inspection device and the inspection point, The above steps were repeated to form the conductive path In order to remove the conductive material that has not been sintered, a connecting jig for electrically connecting the other end of the multi-needle contact that contacts the electrode portion of the substrate inspection device (inspection signal processing device) and the inspection point, It can be formed by an optical modeling technique using laser light irradiation. In particular, since the conductive path that electrically connects the electrode part and the other end of the contactor is formed by stereolithography technology in which the conductive part is formed by sintering a powdered conductive material, fine wiring A connection jig capable of responding to a pattern and a fine electrode portion is created.
Furthermore, since the conductive material that has not been sintered (unsintered conductive material) is removed after the conductive path is formed, unnecessary conductive material can be removed. The removed unnecessary conductive material can be used again.
In addition, it is possible to manufacture with fewer manufacturing steps as compared with the conventional connecting jig manufacturing method. In particular, it is possible to automatically perform the work of providing the wiring for the connection jig, which has been conventionally performed manually, and the manufacturing efficiency of the connection jig can be improved.

According to the second aspect of the present invention, the predetermined sintering positions of the respective layers are provided at one end portion arranged so that each of the conductive paths contacts one of the contacts and the electrode portion of the inspection signal processing device. Since the other end portion arranged so as to be in contact is determined to be connected linearly, the conductive paths are connected to each other by the laminated structure of the conductive portions of the respective layers and formed in a linear shape.
For this reason, the conductive path which this connection jig has can reliably connect the contactor and the electrode part electrically.

According to the third aspect of the present invention, after the conductive material is removed, the space between the conductive paths is filled with the resin material to form a block shape having a predetermined shape, so that the conductive paths can be reinforced. .
For this reason, the connection jig manufactured using this manufacturing method can manufacture a connection jig with high strength of the conductive path.

  According to the invention of claim 4, one end is disposed so as to be electrically connected to a multi-needle contact that is press-contacted to a plurality of inspection points set on the wiring pattern of the substrate to be inspected, The other end is a connection jig arranged to be electrically connected to an inspection signal processing apparatus that receives an electrical signal detected from the substrate to be inspected and performs inspection of the substrate to be inspected, Since the conductive path that electrically connects the needle contactor and the substrate inspection apparatus is made of a linear conductive material formed by sintering the conductive material, the pitch of the inspection points is very fine. However, it is possible to provide a connection jig capable of reliably transmitting an electrical signal from the substrate to be inspected to the inspection signal processing apparatus.

  According to the fifth aspect of the present invention, the conductive path has one end disposed so as to contact the one contact and the other end disposed so as to contact the electrode portion of the inspection signal processing device. Since the part is connected in a line, one contact of the multi-needle contact and the electrode part can be reliably connected by the conductive path.

  According to the invention of claim 6, since the conductive path has a laminated structure of the conductive material, the conductive path is formed by stacking a plurality of conductive materials, and the conductive path is fine. Even if it has a shape, it can be created efficiently.

  According to the seventh aspect of the present invention, the connecting jig reinforces the conductive path because the space between the conductive paths is filled with insulating resin and is formed in a block shape having a predetermined shape. And a connection jig with excellent durability can be provided.

  According to the invention described in claim 8, the inspection is performed by receiving a multi-needle contact that is press-contacted to a plurality of inspection points set on the wiring pattern of the substrate to be inspected and an electric signal detected from the substrate to be inspected. A connection jig for electrically connecting an inspection signal processing device to be executed, wherein the connection jig contacts one end of the inspection signal processing device and an electrode portion of the inspection signal processing device. A conductive path having a second end portion disposed on the conductive path, wherein the conductive path is formed by forming a conductive material layer of a powdered conductive material having a predetermined thickness and irradiating a predetermined position on the conductive material layer with laser light. Then, the conductive material at the position is sintered to form a conductive portion, a new conductive material layer is placed on the conductive material layer, and laser light is irradiated to a predetermined position in the new conductive material layer. , Sintering the conductive material at the position to form a conductive portion, Electrostatic unit, because it is formed as a laminated by conductive path provides a connection jig that can respond to and fine electrode unit according to a fine wiring pattern.

The best mode for carrying out the present invention will be described.
First, an embodiment of a connection jig according to the present invention will be described.
FIG. 1 is a partial cross-sectional view showing a state in which a connection jig according to an embodiment of the present invention is used and a contact and an electrode part are electrically connected. 2A and 2B show a connection jig according to an embodiment of the present invention, in which FIG. 2A is a sectional view, FIG. 2B is a plan view, and FIG. 2C is a bottom view.
As shown in FIG. 1, a connecting jig 1 according to the present invention includes a contact 2 arranged in a multi-needle shape, and an inspection signal processing unit 3 (signal processing) for judging conduction / short-circuiting of a substrate from detected electrical signals. Part). Further, as shown in FIG. 1, the connecting jig 1 plays a role of converting a narrow pitch on the contact 2 side into a wide pitch on the inspection signal processing unit 3 side.

The contact 2 is held by a jig head 21. The jig head 21 shown in FIG. 1 includes three plate-like guide plates 22 that restrain and hold the contact 2, and these guide plates. The support | pillar 23 which supports 22 in parallel is provided.
These guide plates 22 are formed with a substantially circular first insertion hole 221 for guiding the contact 2 to a desired position. The first insertion hole 221 provided in the uppermost (closest to the substrate) guide plate 22 is formed at a position corresponding to the inspection point position of the substrate.
On the other hand, the third insertion hole 223 of the lowermost (closest to the connection jig) guide plate 22 has a position corresponding to the position of the upper surface electrode portion formed on the upper surface of the connection jig 1 described later. Is formed.

When the contact 2 is inserted into the first and third insertion holes 221 and 223 of the three guide plates 22, the contact 2 is restrained by these insertion holes, and the tip portion of the contact 2 Is guided to a position corresponding to the inspection point position of the substrate, and the base end portion of the contact 2 is guided to a position corresponding to the position of the upper surface electrode portion.
Further, the third insertion hole 223 of the guide plate 22 makes the base end portion of the contact 2 come into contact with the upper surface electrode portion, while the tip of the contact 2 slightly protrudes from the upper surface of the uppermost guide plate 22. . Then, when the substrate is placed on the jig head 21, the inspection point of the substrate is pressed against the contact 2.

The upper surface portion of the connection jig 1 is provided with an upper surface electrode portion 11 that is in contact with the base end portion of the contact 2, and the lower surface portion of the connection jig 1 is provided with an electrode of an inspection signal processing unit 3 to be described later. A bottom electrode portion 12 for connecting to the portion 31 is formed. Between the upper surface electrode portion 11 and the lower surface electrode portion 12, there is formed a conductive path 13 made of a conductive material that is electrically connected thereto. The conductive path 13 electrically connects the upper electrode part 11 and the lower electrode part 12 to form an electric signal transmission path.
In addition, a reinforcing member 14 is formed so as to cover the periphery of the conductive path 13 in order to improve the protection and strength of the conductive path 13. In FIG. 1 showing this embodiment, the reinforcing member 14 forms a rectangular parallelepiped for the connecting jig 1.
Metal plating is applied to the surfaces of the upper surface electrode portion 11 and the lower surface electrode portion 12.

The upper surface electrode portion 11 is formed by providing a plurality of first electrode portions 111 that are electrically connected (contacted) with the proximal end portion of the contact 2. The diameter d1 of the first electrode portion 111 is preferably larger than the diameter of the contact 2 to be contacted. For example, the first electrode portion 111 is formed to have a diameter of 90 μm which is substantially the same as the diameter of the upper electrode portion 11, more preferably 110 μm which is larger than this diameter. It is formed. Moreover, although the pitch p1 provided with the upper surface electrode part 11 changes according to the test | inspection point of a board | substrate, it is formed in the pitch of 150 micrometers, for example.
The first electrode portion 111 is formed by one end portion of a conductive path 13 to be described later.

The lower surface electrode portion 12 is formed by providing a plurality of second electrode portions 121 that are electrically connected (contacted) to an inspection signal processing portion electrode portion 31 of the inspection signal processing portion 3 described later. The second electrode portion 121 is formed to have a larger contact area than the first electrode portion 111 in order to reliably and stably contact the inspection signal processing portion electrode portion 31.
As shown in FIG. 1 or FIG. 2, the second electrode portion 121 preferably has an enlarged electrode portion 131 so as to have a larger contact area than the first electrode portion 111. This is because the contact area can be increased by forming the enlarged electrode portion 131. By forming the enlarged electrode portion 131, the second electrode portion 121 is formed by the other end portion of the enlarged electrode portion 131. The contact area can be made larger than that of the one electrode portion 111.
The second electrode unit 121 may have a contact area set according to the inspection signal processing unit electrode unit 31, but the inspection signal processing unit electrode unit 31 has a contact area or Since the arrangement pitch is larger than that of the first electrode portion 111, the contact area and the pitch of the second electrode portion 121 can be increased as compared with the first electrode portion 111.

The shape and size of the second electrode part 121 are set according to the inspection signal processing part electrode part 31 as described above. For example, the diameter d2 of the second electrode part 121 is formed to be 900 μm, The pitch p2 is formed to 1270 μm.
The inspection signal processing unit electrode unit 31 is formed as a protruding electrode made of a spring probe or the like.

The conductive path 13 is an electric signal transmission path from the first electrode part 111 of the upper surface electrode part 11 to the second electrode part 121 of the lower surface electrode part 12. As shown in FIG. 2 or 3, the conductive path 13 is inclined so as to spread from the upper surface electrode portion 11 to the lower surface electrode portion 12. By forming in this way, the pitch conversion of each electrode part from the upper surface electrode part 11 to the lower surface electrode part 12 is attained.
The conductive path 13 is provided with an enlarged electrode portion 131 that forms the second electrode portion 121 at the lower end. The conductive path 13 may be formed in a tapered shape that gradually spreads from the upper end to the lower end so that the upper end forms the first electrode portion 111 and the lower end forms the second electrode portion 121.

The conductive path 13 is not particularly limited as long as it is formed of a powdered conductive material that is sintered by the irradiated laser beam. For example, powder such as copper (Cu), tungsten (W), and molybdenum (Mo) is used. Use substances.
The conductive path 13 is formed to have a laminated structure having a predetermined thickness. This is because the connecting jig 1 irradiates a layer of metal powder having a predetermined thickness with laser light, and the portion irradiated with the laser light is sintered (powdered metal powder (particles) is welded). This is because the conductive path 13 is formed by forming the conductive portion and depositing the conductive portion.
For this reason, the conductive path 13 is formed by laminating a plurality of conductive portions. This conductive portion is formed by irradiating a conductive material layer having a predetermined thickness described later with laser light. For this reason, the shape of the conductive portion is determined by the spot shape, angle, intensity, irradiation time, etc. of the laser light irradiation, but is formed in a prism, a cylinder, a quadrangular pyramid or a truncated cone.

In FIG. 1, a first hole 15 used for positioning the connecting jig 1 and the jig head 21 and a second hole 16 used for positioning the connecting jig 1 and the inspection signal processing unit 3 are further formed. The Using the fixtures (the first fixture 32 and the second fixture 33) that can be inserted into the first hole portion 15 and the second hole portion 16, respectively, the connecting jig 1 and the jig head 21. In addition, the inspection signal processing unit 3 can be fixed. For example, a screw can be used as the fixture.
Further, in this way, in the connection jig 1 according to the present invention, the pitch of the first electrode portions 111 of the upper surface electrode portion 11 can be designed to be substantially the same as the pitch of the multi-needle contact 2. .

Next, the manufacturing method of the connection jig which concerns on this invention is demonstrated.
FIG. 3 is a configuration diagram illustrating an example of a manufacturing apparatus for manufacturing the connection jig according to the present invention.
4 to 11 are cross-sectional views of the connection jig in each process in which the connection jig is manufactured. FIG. 12 is a flowchart showing the connection jig manufacturing method of the present invention.

First, design information (connection jig, conductive path, dimensions of the first electrode part and the second electrode part) of the connection jig 1 to be manufactured is determined. At this time, it is determined at which coordinate position of each conductive material layer the conductive portion is to be formed (S1).
As shown in FIG. 3, the conductive material layer 4 is formed so that the powdered conductive material has a predetermined thickness t1 (S2).
In FIG. 3, the conductive material layer 4 is disposed on the mounting table 6, and laser light irradiation means 5 for irradiating laser light from above the conductive material layer 4 (or the mounting table 6) is disposed. A control means 7 for controlling the operation of the means 5 is connected.
In this embodiment, tungsten is used as the conductive material. The conductive material has a particle size of 50 to 100 nm.
Further, in this embodiment, the predetermined thickness t1 is set to a thickness of about 1 μm. However, the thickness is not particularly limited, and a conductive portion having a sufficient strength is formed using a powdered conductive material by laser light. I don't mind if you can.

When the conductive material layer 4 is prepared, a coordinate position for irradiating the predetermined conductive material layer 4 with laser light is determined (S3).
Then, based on the determined coordinate position, laser light is irradiated from the laser light irradiation means 5 toward the surface layer of the conductive material layer 4. At this time, the portion irradiated with the laser beam is sintered by the energy of the laser beam (see FIG. 4). In FIG. 4, first, the lowermost portion is uniformly irradiated with laser light to form a lower base portion 41 and a support column 42 at an end portion.
Further, the output of the laser beam is appropriately adjusted and used as long as it is an output capable of sintering a powdered conductive material having a predetermined thickness t1.
The conductive material at the coordinate position irradiated with the laser light is sintered to form a conductive portion (S4).
At this time, when the laser light is irradiated at a substantially right angle to the conductive material layer 4, the conductive material forms an upright substantially cylindrical conductive portion.

The operation of the laser beam irradiation means 5 is controlled by the control means 7 in advance. A specific control method of the control means 7 includes, for example, a storage means (not shown) for storing the desired three-dimensional data of the connecting jig 1, and based on the three-dimensional data from the storage means, The coordinate position of the conductive material to be sintered is specified, and the specified coordinate position information is controlled to be irradiated with laser light.
More specifically, after the conductive material layer 4 is disposed, a coordinate position set on the conductive material layer 4 is set, and laser light is irradiated to the coordinate position.

Sintering occurs at the irradiated portion of the conductive material layer 4 irradiated with the laser light, and the particulate conductive material at the portion irradiated with the laser light is sintered to form the conductive portion 132 (S4). 4 to 11, the hatched portions indicate the portions of the conductive material that are not sintered, and the black portions indicate the portions of the conductive material that are sintered (conductive portions).
In the case of forming the conductive material layer 4 having the sintered portion shown in FIG. 4, for example, in order from the left end portion A toward the paper surface, B portion, C portion,..., J portion, right end portion By irradiating with K, the laser beam can be efficiently irradiated. In addition, since the left and right end portions A and K are formed as the support columns 42, they are formed with a thickness larger than that of the other portions B.
In the embodiment shown in FIG. 4, the portion of the enlarged electrode portion 131 included in the lower surface electrode portion 12 is not formed. For example, the enlarged electrode portion 131 is formed by extending the irradiation time. Also good.

  The first hole portion 15 and the second hole portion 16 shown in FIG. 1 are also formed so as to have a shape as shown in FIG. The conductive material inside the hole is in an unsintered state, and this unsintered conductive material is removed when the base or ceiling is removed.

When the irradiation of the laser beam to the conductive material layer 4 is completed, a new conductive material layer 4a is formed so as to overlap the conductive material layer 4 as shown in FIG. 5A (as shown in FIG. 12 (S4)). When returning to the back (S2)).
When the new conductive material layer 4a is formed, the control unit 7 determines the location to be irradiated with the next laser beam. In FIG. 5B, the portions indicated by dotted lines A1 to A11 indicate that the laser beam is next irradiated.
When the place (coordinate position) to which the laser beam is irradiated is determined, the laser beam is irradiated onto the coordinate position by the laser beam irradiation unit 5 as described above, and the conductive portion 132 is formed.

The steps as described above are repeated to form the conductive material layers 4, 4a to 4g as shown in FIG. For this reason, the conductive path 13 is formed by a plurality of conductive portions 132.
In addition, when the laser beam irradiation means 5 is located above the conductive material layer (or the mounting table 6) and irradiates laser light substantially perpendicular to the conductive material layer (or the mounting table 6), this conductive The path 13 is formed by laminating substantially cylindrical conductive portions 132. Also in this case, in order to form the slope of the conductive path 13, the conductive part 132 is arranged so as to be slightly shifted to form the slope of the conductive path 13 that enables pitch conversion.

FIG. 7 shows a state where the sintering to the conductive material by the laser beam is completed. As shown in FIG. 7, an electric signal transmission path is formed from the lower electrode portion 12 to the upper electrode portion 11 by the conductive path 13. Moreover, the support | pillar 42 which raises the intensity | strength of this connection jig 1 is also formed simultaneously.
In FIG. 7, the ceiling portion 43 is formed by irradiating the uppermost portion (the entire upper surface portion) with laser light.

Next, when the optical modeling by the laser beam is completed, the unsintered powdery conductive material is removed (S5).
At this time, as shown in FIG. 8, only the sintered portion remains, and this remaining portion 1 ′ becomes a conductive portion of the connection jig 1.

After removing the unsintered powdered conductive material, the reinforcing member 14 is filled in order to improve the strength of the remaining portion 1 'shown in FIG. 8 (see FIG. 9, (S6) in FIG. 12). An insulating synthetic resin is used for the reinforcing member 14. The reinforcing member 14 is filled into the remaining portion 1 ′ and cured.
By using the reinforcing member 14 in this way, the conductive paths 13 can be reinforced and each conductive path 13 can be kept in an insulated state.
In FIG. 9, the reinforcing member 14 is cured to form a rectangular parallelepiped.

When the reinforcing member 14 is filled, the base portion 41 and the ceiling portion 43 are scraped to form the upper surface electrode portion 11 and the lower surface electrode portion 12 (S7).
FIG. 10 shows a state where the base portion 41 is removed. In the manufacturing process shown in FIG. 10, the base portion 41 is polished in order to form the base portion 41 on the lower surface electrode portion 12. The polished base portion 41 is formed as the lower surface electrode portion 12. When the enlarged electrode portion 131 is provided, the enlarged electrode portion 131 is formed as the lower surface electrode portion 12.
After the foundation portion 41 is polished, a plating process is performed on the conductive path 13 disposed on the surface. In this case, since the ceiling part 43 can be used as a common electrode, the surface of the enlarged electrode part 131 of the lower surface electrode part 12 can be easily plated.
In FIG. 10, the support column 41 is also removed. However, if the conductive path 13 of the connecting jig 1 has sufficient strength, the support column may be removed, and the conductive path 13 is not strong enough. Does not have to be removed.

FIG. 11 shows a state where the ceiling 43 is removed. In the manufacturing process shown in FIG. 11, the ceiling portion 43 is polished in order to form the ceiling portion 43 on the upper surface electrode portion 11 (or the first electrode portion 111). The polished ceiling portion 43 is formed as the upper surface electrode portion 11 (or the first electrode portion 111). After the ceiling portion 43 is polished, a plating process is performed on the conductive path 13 disposed on the surface. In this case, the lower surface electrode part 12 can be connected to an inspection device (inspection signal processing part), and the upper surface electrode part 11 (or the first electrode part 111) can be plated.
In this way, the connection jig 1 is manufactured.

It is a fragmentary sectional view which shows a mode that the connection jig of one Embodiment which concerns on this invention was used, and the contactor and the electrode part were electrically connected. The connection jig | tool of one Embodiment which concerns on this invention is shown, (a) is sectional drawing, (b) is a top view, (c) is a bottom view. It is a block diagram which shows an example of the manufacturing apparatus for manufacturing the connection jig which concerns on this invention. The mode of one Embodiment which shows the manufacturing process of the connection jig which concerns on this invention is shown. The mode of one Embodiment which shows the manufacturing process of the connection jig which concerns on this invention is shown, (a) shows a mode that the conductive material layer was piled up, (b) is with respect to the conductive material layer of (a). The part irradiated with a laser beam is shown. The mode of one Embodiment which shows the manufacturing process of the connection jig which concerns on this invention is shown, and a mode that several electroconductive material layers were laminated | stacked is shown. The mode of one Embodiment which shows the manufacturing process of the connection jig which concerns on this invention is shown, and the mode that the optical modeling process by a laser beam was complete | finished is shown. The mode of one Embodiment which shows the manufacturing process of the connection jig which concerns on this invention is shown, and a mode that the unsintered conductive material was removed is shown. The mode of one Embodiment which shows the manufacturing process of the connection jig which concerns on this invention is shown, and a mode that the reinforcement member was provided is shown. The mode of one Embodiment which shows the manufacturing process of the connection jig which concerns on this invention is shown, and a mode that the support | pillar and the base part were removed is shown. The mode of one Embodiment which shows the manufacturing process of the connection jig which concerns on this invention is shown, and a mode that the ceiling part was removed is shown. The flowchart in the manufacturing method concerning this invention is shown. 2 shows a multi-needle contact and a connecting jig in a conventional substrate inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Connection jig 11 ... Upper surface electrode part 12 ... Lower surface electrode part 13 ... Conductive path 131 ... Conductive part 2 ... Contact (multi-needle shape) Contact)
3. Inspection signal processing unit (board inspection equipment)

Claims (8)

A multi-needle contact that is press-contacted to a plurality of inspection points set on a wiring pattern of a substrate to be inspected, and an inspection signal processing device that receives an electrical signal detected from the substrate to be inspected and executes an inspection A method of manufacturing a connection jig for electrical connection,
A conductive material layer of a predetermined thickness is formed with a powdered conductive material,
Irradiating a predetermined position in the conductive material layer with laser light to sinter the conductive material at the position to form a conductive portion;
A new conductive material layer is placed on the conductive material layer,
A predetermined position in the new conductive material layer is irradiated with laser light, and the conductive material at the position is sintered to form a conductive portion,
The above steps are repeated until the conductive portion is formed as a conductive path that allows the substrate inspection apparatus and the inspection point to be electrically connected,
A connection jig manufacturing method for manufacturing a connection jig by removing the unsintered conductive material after the conductive path is formed.   The predetermined sintering position of each layer has one end portion arranged so that each of the conductive paths contacts one contact and the other end arranged so as to contact the electrode portion of the inspection signal processing device The connecting jig manufacturing method according to claim 1, wherein the connecting jig is determined so as to be connected in a line.   3. The connection jig manufacturing method according to claim 1, wherein after the conductive substance is removed, a space between the conductive paths is filled with a resin material to form a predetermined block shape. One end is arranged so as to be electrically connected to a multi-needle contact that is pressed against a plurality of inspection points set on the wiring pattern of the board to be inspected, and the other end is detected from the board to be inspected. A connection jig arranged to be electrically connected to an inspection signal processing apparatus for receiving an electrical signal to perform inspection of the inspected substrate,
A connection jig characterized in that a conductive path for electrically connecting the multi-needle contact and the substrate inspection apparatus is made of a linear conductive material formed by sintering a conductive material.   The conductive path is characterized in that one end portion disposed so as to contact one contactor and the other end portion disposed so as to contact an electrode portion of the inspection signal processing device are linearly connected. The connection jig according to claim 4.   The connection jig according to claim 4, wherein the conductive path has a laminated structure of the conductive material.   The connection jig according to any one of claims 4 to 6, wherein the connection jig is formed in a block shape having a predetermined shape by filling a space between the conductive paths with an insulating resin. . A multi-needle contact that is press-contacted to a plurality of inspection points set on a wiring pattern of a substrate to be inspected, and an inspection signal processing device that receives an electrical signal detected from the substrate to be inspected and executes an inspection A connection jig for electrical connection,
A conductive path having one end arranged to contact one contact and the other end arranged to contact the electrode part of the inspection signal processing device;
The conductive path is
A conductive material layer is formed with a powdered conductive material of a predetermined thickness,
Irradiating a predetermined position in the conductive material layer with laser light to sinter the conductive material at the position to form a conductive portion;
A new conductive material layer is placed on the conductive material layer,
A predetermined position in the new conductive material layer is irradiated with laser light, and the conductive material at the position is sintered to form a conductive portion,
The connection jig, wherein the conductive portions are stacked to form a conductive path.

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