JP2020027859A - Manufacturing method of electrical connector - Google Patents

Abstract

To provide a manufacturing method of an electrical connector, capable of reducing the pitch between adjacent wires in an electrical connector.SOLUTION: A manufacturing method of an electrical connector that is disposed between a connection terminal of a first electronic device and a connection terminal of a second electronic device to electrically connect the connection terminals includes the steps of: introducing a resin material L including a resin or a resin precursor into a molding die K having a plurality of projections M formed therein and curing the resin material to prepare a substrate sheet 1 having a first surface in which through or non-through holes corresponding to respective projections of the molding die are formed; in the case of the non-through holes, removing the bottom of the holes so that the holes become though holes that open also to a second surface; and forming a metal thin film on a wall face of each hole by electric plating thereby to form through wiring 5 formed of the metal thin film in each hole.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing an electrical connector.

2. Description of the Related Art Conventionally, in order to connect electronic devices, a connector (hereinafter, referred to as an electrical connector) for connecting fine electrodes by pressure welding has been used. A normal electrical connector is sheet-shaped, has a plurality of conductive portions and an insulating portion that insulates them from each other, and is disposed between a connection terminal of the first device and a connection terminal of the second device. Make an electrical connection.
As a method for manufacturing such an electrical connector, Patent Document 1 discloses a method in which a plurality of sheets arranged in a direction in which a plurality of conductive wires are aligned and insulated from each other are laminated while keeping the direction of the conductive wires constant. A plurality of the laminated products are arranged in a stepwise manner at a certain angle, with the directions of the conductive wires aligned, laminated and integrated to form a block body, and the obtained block body is adhered to a slicing substrate surface, and the obtained block body is adhered to the slicing substrate surface. There is disclosed a method of obtaining an intended electrical connector by cutting at two parallel planes which are parallel and cross the conductive wire.

Japanese Patent No. 2787032

  In recent years, the pitch between connection terminals has become extremely narrow due to miniaturization of electronic devices. For this reason, the electrical connector is required to reduce the pitch between adjacent wires. In order to reduce the pitch in the manufacturing method of Patent Document 1, it is required to make conductive wires arranged on a sheet thin. However, when arranging the conductive wires on the sheet, it is necessary to continuously apply a tensile force so as not to loosen the conductive wires. When the conductive wires become thin, there is a problem that the conductive wires are disconnected by the pull.

  The present invention has been made in view of the above circumstances, and provides a method of manufacturing an electrical connector capable of reducing a pitch between adjacent wires in the electrical connector.

[1] A method for manufacturing an electrical connector arranged between a connection terminal of a first electronic device and a connection terminal of a second electronic device for electrically connecting them, wherein a plurality of protrusions are formed. A resin material containing a resin or a resin precursor is introduced into the formed mold, and the resin material is cured, and a through or non-through hole corresponding to each convex portion of the mold is formed on the first surface, respectively. (A1-1) preparing a base sheet that has been cut and, if the hole is non-penetrating, removing the bottom of the hole so that the hole is also opened to the second surface. A step (A1-2) of forming a hole and a step (B) of forming a metal thin film on each wall surface of the hole by electroplating and forming a through wiring made of the metal thin film in the hole. A method for manufacturing an electrical connector.
[2] A method of manufacturing an electrical connector disposed between a connection terminal of a first electronic device and a connection terminal of a second electronic device and electrically connecting the connection terminals, wherein a resin or a resin A step of introducing a resin material containing a precursor, curing the resin material to form a sheet, forming a plurality of holes penetrating from the first surface to the second surface of the sheet, and obtaining a substrate sheet ( A2) and a step (B) of forming a metal thin film on each wall surface of the hole by electroplating and forming a through wiring made of the metal thin film in the hole. .
[3] A method for manufacturing an electrical connector arranged between a connection terminal of a first electronic device and a connection terminal of a second electronic device to electrically connect them, the method comprising: Prepare a base sheet in which a plurality of holes penetrating from one surface to the second surface is formed, a metal thin film is formed on each wall surface of the hole by electroplating, and the metal thin film is formed in the hole. And (B) forming a through wiring.
[4] The method for manufacturing an electrical connector according to any one of [1] to [3], wherein in the step (B), electroplating is performed with an electrode for electroplating arranged on the second surface.
[5] The method for producing an electrical connector according to any one of [1] to [4], wherein the resin constituting the base sheet is an elastomer.
[6] The method for manufacturing an electrical connector according to any one of [1] to [5], wherein the metal forming the metal thin film is at least one selected from gold, silver, copper, nickel, and chromium. .
[7] A step in which a residual film is formed on the second surface of the substrate sheet, and before or after the step (B), removing the residual film and flattening the second surface of the substrate sheet. The method for producing an electrical connector according to [1] or [2], further comprising (C).
[8] The method according to [7], further including a step (D) of flattening the base sheet having the second surface flattened in the step (C) such that the first surface of the base sheet is parallel to the second surface. A method for manufacturing the electrical connector according to the above.
[9] After the step (B), the step (C) or the step (D), plating is performed on at least one of the holes on the first surface or the second surface of the base sheet. The electrical connector according to any one of [1] to [8], further comprising a step (E) of forming a conductive portion connected to the metal thin film in the hole and protruding above the hole. Production method.

  According to the method for manufacturing an electrical connector of the present invention, it is not necessary to use a conductive wire that is easily broken, and a wiring that penetrates the base sheet can be formed by electroplating. Therefore, the pitch can be easily reduced.

It is sectional drawing which shows a mode that the electric connector 10 is manufactured in the manufacturing method of 1st embodiment of this invention. It is sectional drawing which shows a mode that the electric connector 10 is manufactured in the manufacturing method of 2nd Embodiment of this invention. FIG. 4 is a cross-sectional view illustrating an example of a method of shaping both main surfaces of the electrical connector 10. It is sectional drawing to which the cross section which cut | disconnected the electric connector 10 along the thickness direction was expanded. FIG. 2 is a perspective view of the electrical connector 10. (A) It is the upper surface figure which looked at the 1st surface of the modification of electric connector 10. (B) It is the upper surface figure which looked at the 1st surface of other modifications of electric connector 10 from the upper part. FIG. 3 is a cross-sectional view when a first surface of the electrical connector has a convex portion. It is sectional drawing which expanded the cross section which cut | disconnected the electric connector 10 of another form along the thickness direction. It is a perspective view of the electric connector 10 of another form. FIG. 2 is a cross-sectional view showing a state in which each electronic device is connected to each surface of the electrical connector 10 in a state where one electronic device is pressed against the other.

<First embodiment>
The first embodiment of the method for manufacturing an electrical connector according to the present invention is a method of manufacturing an electrical connector which is disposed between a connection terminal of a first electronic device and a connection terminal of a second electronic device, and electrically connects these. It is a manufacturing method and has at least the following steps (A1-1) and (B).
In the step (A1-1), a resin material containing a resin or a resin precursor is introduced into a molding die having a plurality of projections formed thereon, the resin material is cured, and a through hole corresponding to each projection of the molding die is formed. Alternatively, this is a step of producing a base material sheet in which non-through holes are respectively formed on the first surface.
The step (A1-2) is an optional step performed as necessary, and when the hole of the obtained base sheet is non-penetrating, removing the bottom of the hole. In this way, the hole portion is a through hole that also opens on the second surface.
The step (B) is a step of forming a metal thin film on each wall surface of the hole by electroplating, and forming a through wiring made of the metal thin film in the hole.
Hereinafter, an example of an embodiment will be described with reference to the drawings.

[Mold K]
A mold K shown in FIG. 1A is prepared. On the surface of the molding die K, a concave portion N and a plurality of columnar convex portions M arranged in the concave portion N are formed.
The shape of the periphery of the concave portion N roughly corresponds to the outer shape of the electrical connector 10. In the illustrated example, a concave portion N, which is a flat rectangular parallelepiped space opened upward, is formed on the surface inside the molding die K. The concave portion N is a space where the insulating portion 6 of the electric connector 10 is formed, and the electric connector 10 having the base sheet 1 reflecting the shape of the concave portion N can be formed.
Each cross-sectional shape and arrangement of the convex portion M corresponds to each cross-sectional shape and arrangement of the conductive portion 5 that is the through wiring 3 included in the electrical connector 10.
The height of each protrusion M may be the same as the depth of the recess N, or may be different. That is, the position of the tip of the convex portion M may be flush with the surface Ka of the molding die K, may be at a position lower than the surface Ka (that is, inside the concave portion N), or may be the surface Ka. It may be at a higher position (that is, outside and above the concave portion N). In the illustrated example, the height position of each protrusion M is flush with the surface Ka of the molding die K.

[Step (A1-1)]
First, a liquid resin material L containing a resin or a resin precursor is applied to the surface Ka of the mold K. The resin material L is an insulating material forming the insulating portion 6. The resin material L is introduced into the recess N by application. At this time, the surplus resin material L that does not completely enter the concave portion N overflows to the surface Ka of the molding die K. In order to promote the introduction of the resin material L into the concave portion N, vacuum treatment, pushing with a squeegee, or the like may be performed.

Next, as shown in FIG. 1B, the resin material L filled in each concave portion N of the molding die K is cured to form the base sheet 1 in the molding die K. At this time, the resin material L overflowing without entering the concave portion N becomes a residual film R covering one main surface (second surface) of the base sheet 1.
As shown in FIG. 1C, a plurality of holes 2 corresponding to the protrusions M of the molding die K are formed on the first surface 1 a of the base sheet 1 released from the molding die K.

  In the illustrated example, the hole 2 is a non-through hole, but the hole 2 may be formed as a through hole. For example, when the height of the convex portion M of the molding die K is sufficiently higher than the depth of the concave portion N and the tip of the convex portion M protrudes from the surface of the resin material L applied to the surface of the molding die K, The first hole 2 becomes a through hole. When the hole 2 of the demolded base material sheet 1 is a through hole, the process may skip to the next step (A1-2) and proceed to the step (B).

[Step (A1-2)]
The remaining film R covering the second surface 1b of the base sheet 1 forms the bottom of the non-through hole 2. By removing the residual film R, the hole 2 can be made into a through hole.
As a method for removing the residual film R, for example, a known contact-type method for cutting or polishing the surface of a general substrate, a non-contact-type known method such as laser processing, plasma processing, and the like are exemplified. It is also preferable that the first surface 1a and the second surface 1b are flattened by using a method using a support, which will be described later, and that both surfaces are parallelized.

[Step (B)]
Next, as shown in FIGS. 1D to 1E, in a state where the flat electrode E for electroplating is adhered to the second surface 1 b of the base sheet 1, the base sheet is placed in an electroplating tank (not shown). 1 and the plate electrode E are immersed and electroplated by a conventional method. A metal thin film having a desired thickness is formed on the wall surface of the hole 2 penetrating the base sheet 1, and the metal thin film forms the through wiring 3 penetrating the base sheet 1 in the hole 2, followed by electroplating. To end. By removing the plate electrode E from the second surface 1b, an intended electrical connector 10 in which the through wiring 3 forms the conductive portion 5 is obtained (FIG. 1 (f)).
In the obtained electrical connector 10, one end of each conductive portion 5 is exposed on the first surface 1a, and the other end of each conductive portion 5 is exposed on the second surface 1b. Form a through wiring 3 penetrating in the thickness direction of the electrical connector 10.

<Second embodiment>
The second embodiment of the method for manufacturing an electrical connector according to the present invention is a method for manufacturing an electrical connector, which is disposed between a connection terminal of a first electronic device and a connection terminal of a second electronic device, and electrically connects these. It is a manufacturing method and has at least the following steps (A2) and (B).
In the step (A2), a resin material containing a resin or a resin precursor is introduced into a mold, the resin material is cured to form a sheet, and a plurality of holes penetrating from the first surface to the second surface of the sheet. This is a step of forming a part and obtaining a base sheet.
The step (B) is a step of forming a metal thin film on each wall surface of the hole by electroplating, and forming a through wiring made of the metal thin film in the hole.
Hereinafter, an example of an embodiment will be described with reference to the drawings.

[Step (A2)]
First, as shown in FIG. 2A, a liquid resin material L containing a resin or a resin precursor is applied to the surface of a molding die W in which a concave portion U corresponding to the outer shape of the electrical connector 10 to be manufactured is formed. . At this time, the surplus resin material L that does not completely enter the concave portion U overflows the surface of the molding die W.

Next, as shown in FIG. 2B, the resin material L filled in the concave portion U of the molding die W is cured to form the sheet α in the molding die W. At this time, the resin material L overflowing without entering the concave portion U becomes a residual film R covering one main surface (second surface) of the sheet α.
Subsequently, as shown in FIG. 2C, the base sheet 1 is obtained by forming a plurality of holes 2 penetrating in the thickness direction of the sheet α released from the molding die W. The arrangement of the holes 2 in the base sheet 1 corresponds to the arrangement of the conductive portions 5 of the electrical connector 10 to be manufactured. The method of forming the hole 2 is not particularly limited, and for example, a known method of forming a through hole in a resin sheet such as drilling or laser processing is applied.

[Step (B)]
Next, as shown in FIG. 2 (d), in a state where the flat electrode E for electroplating is adhered to the second surface 1 b of the base sheet 1, the base sheet 1 and the flat electrode are placed in an electroplating tank (not shown). E is immersed and electroplated by a conventional method. A metal thin film having a desired thickness is formed on the wall surface of the hole 2 penetrating the base sheet 1, and the metal thin film forms the through wiring 3 penetrating the base sheet 1 in the hole 2, followed by electroplating. To end.

Subsequently, as shown in FIG. 2E, after the plate electrode E is removed from the second surface 1b, the remaining film R remaining on the second surface 1b of the base sheet 1 is removed. The method of removing the residual film R can be performed in the same manner as in the first embodiment.
In the present embodiment, the removal of the residual film R is performed after the formation of the through wiring 3. However, the timing of the removal of the residual film R is not limited to this. It is good also as completion without removing.

  Through the above steps, the intended electrical connector 10 in which the through wiring 3 forms the conductive portion 5 is obtained (FIG. 2 (f)).

[Step (C), Step (D); Shaping of Main Surface of Electrical Connector]
With respect to the base sheet 1 immediately after being removed from the mold of each embodiment or the base sheet 1 after forming the conductive portion 5, the remaining film R remaining on the second surface 1b of the base sheet 1 is removed, As a suitable method for making the first surface 1a parallel to the second surface 1b, there is a method exemplified below. The following figures show a case where the residual film R of the base material sheet 1 after the formation of the conductive part 5 is removed, but the same applies to the base material sheet 1 on which the conductive part 5 is not formed immediately after the mold release. be able to.

First, as shown in FIG. 3A, the remaining film R remaining on the second surface 1b of the base sheet 1 is fixed in close contact with a flat support surface S of a support base. The thickness of the remaining film R may be non-uniform, and the drawing emphasizes that the remaining film R becomes thicker toward the right side of the drawing.
Next, a cutting blade or a laser is moved in parallel with the support surface S so as not to include the residual film R and at a position as close as possible to the boundary between the residual film R and the second surface 1b (for example, a broken line C1 in the figure). The substrate sheet 1 is cut at a position (indicated by) to form a new flattened second surface 1b.

Here, as shown in FIG. 3B, the first surface 1a and the second surface 1b of the cut out electrical connector 10 may be non-parallel at this stage.
Further, as shown in FIG. 3 (c), a new second surface 1b of the electrical connector 10 is fixed to the flat support surface S of the support table in close contact. Again, the cutting blade or the laser is moved in parallel with the support surface S so as not to leave the original first surface 1a and at a position as close as possible to the original first surface 1a (for example, as indicated by a broken line C2 in the figure). The electrical connector 10 is cut at (position) to form a new flattened first surface 1a.

  As shown in FIG. 3D, the first surface 1a and the second surface 1b of the cut-out electrical connector 10 are parallel at this stage. In addition, the angle formed by the straight line connecting the first end and the second end of each conductive portion 5 with respect to the first surface 1a and the second surface 1b is due to the non-uniform thickness of the remaining film R. It changes before and after ablation of the membrane R. In the illustrated example, the conductive portion 5 is perpendicular to the original first surface 1a, but is inclined with respect to the new first surface 1a. The inclination of the conductive part 5 does not matter in ordinary use.

  According to the method of shaping each surface of the electrical connector 10 described above, the remaining film R can be easily cut off, and the first surface 1a and the second surface 1b that are smooth and parallel to each other are formed. It is possible to easily obtain a thin electrical connector 10 whose end and second end are exposed on the first surface 1a and the second surface 1b, respectively.

<Third embodiment>
In the first embodiment and the second embodiment described above, the base sheet 1 was manufactured using a mold. In the manufacturing method of the present invention, the step of preparing the base sheet 1 is not necessarily essential, and the base sheet 1 in which the holes 2 are formed is prepared by any method (for example, a method of purchasing from a third party) or the like. The electrical connector 10 may be manufactured by performing the steps after the step (B) in the same manner as in the first embodiment and the second embodiment.

[Step (E)]
In the first to third embodiments described above, the conductive portion 5 is formed after the step (B), the step (C), or the step (D), that is, in the hole 2 of the base sheet 1. After that, step (E) may be provided.
In the step (E), at least one of the holes 2 in the first surface 1a or the second surface 1b of the base sheet 1 is plated, and is connected to the conductive portion 5 in the hole 2; This is a step of forming a conductive portion (conductive protrusion) projecting above the substrate.

The method of plating the end of the conductive portion 5 in the hole 2 exposed on at least one of the first surface 1a and the second surface 1b of the base sheet 1 is not particularly limited, and a known electrolytic plating method, An electrolytic plating method can be applied. As the metal forming the plating, for example, one or more arbitrarily selected from gold, silver, copper, nickel and chromium are preferable.
By shaping the plated portion formed at the end of the conductive portion 5 by laser processing, cutting, chemical etching, or the like, as necessary, a conductive protrusion having a desired shape can be formed.

[Step (F)]
In the first to third embodiments described above, the conductive portion 5 is formed after the step (B), the step (C), or the step (D), that is, in the hole 2 of the base sheet 1. After that, the method may have the step (F).
In the step (F), a conductive resin material containing conductive particles and a resin or a resin precursor is coated so as to cover at least one of the holes 2 in the first surface 1a or the second surface 1b of the base sheet 1. And forming a conductive portion (conductive protrusion) that is connected to the conductive portion 5 in the hole 2 and protrudes above the hole 2. The conductive particles may include a ferromagnetic material or may not include a ferromagnetic material. When the conductive particles of the conductive resin material include a ferromagnetic material, a process of applying a magnetic field before curing the conductive resin material to arrange the conductive particles in the surface direction or the thickness direction of the base sheet 1. May be performed.

As the conductive resin material, a known resin composition containing conductive particles is applied. For example, a resin composition described in JP-A-11-154550 can be mentioned. It is preferable to apply an elastomer such as silicone rubber or urethane rubber to the resin constituting the conductive resin material. Since the conductive protrusions including the elastomer have flexibility, they are excellent in connectivity to electronic devices and also excellent in durability against repeated use.
As a method of applying the conductive resin material to the first surface 1a or the second surface 1b of the base material sheet 1, screen printing, gravure printing, flexo printing, Printing methods such as offset printing are preferred. If the printing method is used, the conductive protrusions arranged in an arbitrary pattern shape can be easily formed.
The applied conductive resin material is cured by a known method such as drying, heating or light irradiation, and is shaped by laser processing, cutting, chemical etching or the like as necessary, thereby forming a conductive projection having a desired shape. can do.

[Method of electroplating]
In the manufacturing method of each embodiment, as a method of forming a metal thin film on the wall surface of the hole 2 of the base sheet 1 by electroplating and further forming a through wiring, a known electroplating method for resin is applied. As a suitable method, for example, the following method can be mentioned. That is, first, a metal ion serving as a catalyst for electroless plating is previously supported on the wall surface of the hole portion 2, and then a plating film is formed by electroless plating, and then a metal thin film having a desired thickness is formed by electroplating. It is. By forming the underlying metal thin film by electroless plating and then forming the metal thin film by electroplating, a through wiring with high adhesion to the wall surface of the hole 2 can be formed. The through wiring formed in the hole 2 may be solid or hollow. When the through wiring is hollow, the thickness of the metal thin film formed on the wall surface of the hole 2 is, for example, 0.1 μm to 10 μm.

  As a method of supporting the metal ions on the wall surfaces of the holes 2, for example, the base sheet 1 is immersed in a solution containing the metal ions, and the solution is caused to flow into the holes 2 so that the metal ions are There is a method of contacting with a wall surface. The wall surface of the hole 2 may be roughened with an alkali solution or the like, or an organic layer that adsorbs metal ions or contains an organic layer containing metal ions may be formed on the wall surface so that metal ions are easily adsorbed on the wall surface.

As a specific electroplating method, for example, an electroplating method for a resin disclosed in Japanese Patent No. 6011841 is exemplified. In this publication, (1) a metal colloid formed by reducing a metal salt in the presence of sucrose is adsorbed on a resin substrate, whereby metal fine particles coated with a sucrose-derived compound are adsorbed on the substrate. And (2) treating the sucrose-derived compound layer covering the metal fine particles adsorbed on the resin surface with ozone, hydrogen peroxide, or an aqueous alkali solution, and then treating with a silane coupling agent to obtain a resin surface. (3) forming a base metal thin film on the surface of the adhesion promoting layer provided on the resin surface by electroless plating, and then (4) producing a copper thin film by electroplating. ing.
Such an electroplating method can be applied to the present invention.

  The type of the metal constituting the metal thin film is not particularly limited as long as the metal can form a metal thin film by electroplating. For example, one or more arbitrarily selected from gold, silver, copper, nickel and chromium preferable.

  When a metal thin film is formed not only on the holes 2 but also on the first surface 1a and the second surface 1b of the base sheet 1 by electroplating, the insulation between the through wirings in each hole 2 is maintained. Therefore, it is preferable to remove the metal thin film formed on the first surface 1a and the second surface 1b after the electroplating. Specific examples of the removing method include a contact-type known method of cutting or polishing the surface of a general substrate, and a non-contact-type known method such as laser processing and plasma processing. Further, after providing a protective mask so that the through wiring in the hole 2 is not eroded, the metal thin film on the first surface 1a and the second surface 1b may be removed by chemical etching. Further, the metal thin film may be removed by the above-described method of shaping the main surface.

[Resin or resin precursor]
The resin or the resin precursor contained in the resin material L is a main material constituting the insulating portion 6 of the base sheet 1. The resin precursor is a compound that forms a resin, and includes, for example, a monomer that forms a resin by a polymerization reaction.
Examples of the resin include known curable resins such as a photopolymerizable resin, a thermopolymerizable resin, an active energy ray polymerizable resin, and a catalyst polymerizable resin.

From the viewpoint of manufacturing the electrical connector 10 having flexibility, the resin of the resin material L is preferably an elastomer.
Examples of the elastomer include urethane rubber, isoprene rubber, ethylene propylene rubber, natural rubber, ethylene propylene diene rubber, styrene butadiene rubber, and silicone rubber. Among them, silicone rubber, which has a small dimensional change after being removed from the mold, hardly generates warpage after being removed from the mold, has a small compression set, and has high heat resistance, is preferred. The silicone rubber may be either a condensation type or an addition type.

  In the resin material used in each embodiment, in addition to the resin or the resin precursor described above, any substance added to the base material of the conventional electrical connector, for example, a catalyst that promotes polymerization of the resin precursor, A crosslinking agent that promotes crosslinking, an antioxidant, a dye, a pigment, a filler, a leveling agent, and the like may be added. These additives may be contained, for example, at about 0 to 5% by mass based on the total mass of the resin material. Further, a diluting solvent may be added to the resin material in order to improve the coating property of the resin material on the molding die.

<Form of electrical connector (1)>
An example of the electrical connector 10 manufactured according to the present invention includes a base sheet 1 as shown in FIGS. 4 and 5. The base sheet 1 has a first surface 1a and a second surface 1b opposed thereto. The base sheet 1 includes a plurality of conductive portions 5 and insulating portions 6, and forms a sea-island structure in which the conductive portions 5 are island portions and the insulating portions 6 are sea portions. Each conductive portion 5 forms a wiring penetrating from the first surface 1a to the second surface 1b, and includes a first end portion 5a exposed on the first surface 1a and a second end portion 5b exposed on the second surface 1b. Have. The conductive portions 5 are independent of each other, and the insulating portions 6 maintain their mutual insulation. When importance is placed on the flexibility of the electrical connector 10, it is preferable that at least 70% by mass of the entire mass of the insulating portion 6 is formed of an elastomer.

The electrical connector 10 has a rectangular sheet shape. The longitudinal direction is the X direction, the short direction is the Y direction, and the direction perpendicular to the first surface 1a (that is, the thickness direction of the sheet) is the Z direction.
The shape of the electrical connector 10 in plan view is not limited to a rectangle, and may be a circle, an ellipse, a polygon, or any other shape.
The length × width size of the electrical connector 10 is not particularly limited, and may be, for example, 1 mm × 1 mm to 10 cm × 10 cm.
The thickness of the electrical connector 10 can be, for example, not less than 50 μm and not more than 500 μm.
The form, size, thickness, and the like of the electrical connector 10 are appropriately set according to the shape of the electronic device connected to the first surface 1a and the second surface 1b and the arrangement of the terminals.

(Conductive part 5)
The conductive portion 5 of the electrical connector 10 is an island portion of the sea-island structure, and is a plurality of columnar conductive portions that are independent from each other by the sea portion. Since each conductive part 5 penetrates the base sheet 1 of the electrical connector 10, the first end of each conductive part 5 is exposed on the first surface 1a of the electrical connector 10 and the second end on the opposite side. Are exposed on the second surface 1b. Each conductive part 5 is arranged at a constant pitch along the X direction and the Y direction.
In the illustrated example, the case where the through wiring forming the conductive portion 5 is a solid columnar shape is illustrated, but the through wiring may be a hollow cylindrical shape. In the case where the conductive portion 5 has a hollow cylindrical shape, a flexible resin or a resin precursor may be embedded in the hollow portion. The resin or resin precursor preferably has conductivity.

  The shape of the hole 2 which is the outer frame of the conductive portion 5 is preferably a columnar shape. The cross-sectional shape obtained by cutting the hole 2 along the XY plane includes, for example, a circle, an ellipse, a square, and other polygons. The cross-sectional shape of the first end exposed on the first surface 1a of the hole 2 and the cross-sectional shape of the second end exposed on the second surface 1b may be the same or different. The same is preferable from the viewpoint of connection stability to the device.

  The axis of the central axis of the columnar hole 2 may be perpendicular or inclined with respect to the first surface 1a and the second surface 1b.

The size Q of the end exposed on each surface of the individual hole 2 is the diameter of the smallest circle including the end. The diameter is preferably, for example, 1 μm to 100 μm, more preferably 3 μm to 50 μm, and more preferably 5 μm to 25 μm, from the viewpoint of reducing the resistance of the conductive portion 5 and the viewpoint corresponding to the narrow pitch of the terminals in the electronic device to be connected. More preferred. The size Q of the two end portions exposed on each surface of the single hole 2 may be the same or different.
The diameter can be measured by a known microstructure observation means such as a measuring microscope.

The aspect ratio represented by (size Q: height H) of the columnar hole 2 is preferably 1: 5 to 1:30, and more preferably 1: 8.5 to 1: 25.5.
When it is equal to or more than the lower limit of the above range, the pitch between the adjacent conductive portions 5 can be narrowed.
When the value is equal to or less than the upper limit of the above range, the mechanical strength of the conductive portion 5 can be increased, the disconnection can be prevented when an external stress is applied, and the resistance value can be reduced.
The individual size Q and height H (the length of the electrical connector 10 in the thickness direction) can be measured using a known microstructure observation means such as a measuring microscope.

  The pitch P between the adjacent ends of the hole 2 exposed on each of the first surface 1a and the second surface 1b is the center-to-center distance between the smallest circles including the individual ends. This pitch P is set arbitrarily according to the arrangement of the terminals of the electronic device to be connected. The arrangement of the conductive portions 5 corresponds to the arrangement of the holes 2 which can be formed at any position when the electrical connector 10 is manufactured.

  The arrangement of the holes 2 on the first surface 1a and the second surface 1b of the electrical connector 10 is a two-dimensional array of X columns × Y rows. The arrangement of the holes 2 is not limited to this example, and an arbitrary arrangement pattern is adopted. In X columns × Y rows, for example, X and Y can each independently be any integer from 10 to 1000. The arrangement pattern may be a two-dimensional array form, a zigzag form, any other pattern, or a random arrangement.

  As another example of the arrangement of the conductive portion 5 formed solidly in the hole portion 2, in a rectangular electric connector viewed from the top, as shown in FIG. 6, (a) a two-dimensional array of X columns × Y rows is used. Furthermore, an arrangement in which an arbitrary conductive portion 5 is filled with an insulating portion 6, (b) two types of conductive portions 5 having different end portions Q are provided, and the large conductive portion 5 is located at three corners and remains. An arrangement in which a plurality of small conductive portions 5 are arranged in a region is exemplified.

(Insulating part 6)
The insulating part 6 of the electrical connector 10 is a sea part of the sea-island structure and is an insulating part.
The length of the insulating portion 6 in the Z direction is the same as the thickness of the base sheet 1 and is preferably 25 μm or more and 750 μm or less, more preferably 50 μm or more and 500 μm or less.
When the length is equal to or more than the lower limit, the mechanical strength of the electrical connector 10 increases. When the length is equal to or less than the upper limit, the flexibility of the electrical connector 10 is further increased, and the electrical connector 10 can be easily mounted inside an electronic device that needs to be thin.

The content of the elastomer with respect to the total mass of the insulating portion 6 is preferably 70 to 100% by mass, more preferably 80 to 100% by mass, and still more preferably 90 to 100% by mass.
When the content is 70% by mass or more, the flexibility of the electrical connector 10 is sufficiently increased.

  The thickness of the electrical connector 10 does not necessarily have to be constant. For example, as shown in FIG. 7, at least one part of the conductive part 5 and the insulating part 6 may be formed thicker than the other part. With such a projection, the projection of the electrical connector 10 can be fitted and connected to the depressed electrode on the electronic device side. Conversely, at least one part of the conductive part 5 and the insulating part 6 may be formed thinner than the other part. With such a concave portion, the concave portion of the electrical connector 10 can be fitted and connected to the protruding electrode on the electronic device side.

<Form of electrical connector (2)>
In addition to the mode (1) described above, there is also a mode (2) including a conductive protrusion formed in the step (E) or the step (F). The form (2) is shown in FIGS.
The shape of the individual conductive protrusions 8 of the electric connector 10 in plan view is not particularly limited, and any shape can be applied. For example, a square, a circle, an ellipse, other polygons, and the like can be given. The shape of each conductive protrusion 8 in plan view may be the same or different. The conductive protrusion 8 in the illustrated example has a rectangular parallelepiped shape having a square shape in plan view.
The single conductive protrusion 8 of the electrical connector 10 may be connected to a single conductive part 5 in the base sheet 1 or may be connected to a plurality of conductive parts 5. The single conductive protrusion 8 in the illustrated example is connected to the single conductive part 5.

The size Q in plan view of each of the conductive protrusions 8 included in the electrical connector 10 is not particularly limited, and can be appropriately set according to the shape of the electrodes of the electronic device to be connected. Here, the size Q is the diameter of the smallest circle including the shape of the single conductive protrusion 8 in plan view. The diameter is preferably, for example, 1 μm to 100 μm, more preferably 3 μm to 50 μm, and more preferably 5 μm to 5 μm, from the viewpoint of reducing the resistance of the conductive protrusion 8 and the viewpoint of corresponding to the narrow pitch of terminals in the electronic device to be connected. 25 μm is more preferred.
The diameter can be measured by a known microstructure observation means such as a measuring microscope.
From the viewpoint of further improving the connectivity to the electronic device, the size Q in plan view of the conductive protrusion 8 is preferably larger than the size of the end of the conductive portion 5 connected to the conductive protrusion 8. .

The height h of the conductive protrusion 8 from the first surface 1a is not particularly limited, and may be, for example, 1 μm to 50 μm. The height h of each conductive protrusion 8 may be the same or different.
As shown in FIG. 8, the height h of the conductive protrusion 8 is obtained from an image obtained by capturing a cross section of the electrical connector 10 in the thickness direction by a known method. The height h of the conductive protrusions 8 described above is, for example, 5 or more, preferably 10 selected at random from an image of a cross section in which 10 or more, preferably 30 or more conductive protrusions 8 are reflected. It is preferable that the average value is obtained by calculating the height of the conductive protrusions 8 or more by image processing.

  Since the electrical connector 10 of this embodiment (2) has the conductive protrusion 8 protruding on at least one of the first surface 1a side and the second surface 1b side, the connectivity to the electrodes of the electronic device is improved. When the conductive projection 8 contains an elastomer, it has flexibility, so that the connectivity to the electrode of the electronic device and the conductive part 5 is enhanced, and the durability in repeated use is excellent.

[How to use electrical connector]
Applications of the electrical connector 10 manufactured according to the present invention include the same applications as known electrical connectors. The present invention can be applied to so-called mounting applications such as connecting a plurality of electronic devices (for example, circuit boards) provided in an electronic device, in addition to inspection applications for conducting a continuity test of terminals of an electronic device.
FIG. 8 shows an example of a state in which a plurality of electronic devices are connected via the electric connector 10. Each electronic device is pressed against the electrical connector 10. In this example, the plurality of terminals T1 of the first electronic device D1 are in contact with any of the conductive portions 5 exposed on the first surface 1a of the electrical connector 10. The plurality of terminals T2 of the second electronic device D2 are in contact with any of the conductive portions 5 exposed on the second surface 1b of the electrical connector 10. As long as the target terminal of each electronic device is connected, it is not necessary that all of the conductive portions 5 of the electrical connector 10 be in contact with the terminal of each electronic device.

  When the base sheet 1 of the electrical connector 10 contains an elastomer, the electrical connector 10 has flexibility and elastic deformation, so that the electrical connector 10 can be relatively easily installed and removed from the electronic device, and the terminal of the electronic device can be easily removed. Can be prevented from being damaged.

DESCRIPTION OF SYMBOLS 1 ... Base sheet, 2 ... Hole part, 5 ... Conductive part, 6 ... Insulating part, 8 ... Conductive protrusion, 10 ... Electrical connector, D1 ... First electronic device, D2 ... Second electronic device, K ... Molding Mold, M: convex, N: concave, L: resin material, R: residual film, S: support surface, T1: terminal, T2: terminal, U: concave, W: molding die

Claims (9)

A connection terminal of the first electronic device, disposed between the connection terminal of the second electronic device, a method of manufacturing an electrical connector for electrically connecting them,
A resin material containing a resin or a resin precursor is introduced into a molding die on which a plurality of convex portions are formed, and the resin material is cured, and a penetrating or non-penetrating hole corresponding to each convex portion of the molding die is formed. A step (A1-1) of producing a base sheet formed on one surface,
When the hole is non-penetrating, a step (A1-2) of removing the bottom of the hole to make the hole a through hole that also opens on the second surface;
Forming a metal thin film on each wall surface of the hole by electroplating, and forming a through wiring made of the metal thin film in the hole (B). A connection terminal of the first electronic device, disposed between the connection terminal of the second electronic device, a method of manufacturing an electrical connector for electrically connecting them,
A resin material containing a resin or a resin precursor is introduced into a molding die, the resin material is cured to form a sheet, and a plurality of holes penetrating from the first surface to the second surface of the sheet are formed. Obtaining a material sheet (A2);
Forming a metal thin film on each wall surface of the hole by electroplating, and forming a through wiring made of the metal thin film in the hole (B). A connection terminal of the first electronic device, disposed between the connection terminal of the second electronic device, a method of manufacturing an electrical connector for electrically connecting them,
Prepare a base material sheet formed of a resin, and formed with a plurality of holes penetrating from the first surface to the second surface,
Forming a metal thin film on each wall surface of the hole by electroplating, and forming a through wiring made of the metal thin film in the hole (B).   The method of manufacturing an electrical connector according to any one of claims 1 to 3, wherein in the step (B), electroplating is performed with an electrode for electroplating arranged on the second surface.   The method for manufacturing an electrical connector according to any one of claims 1 to 4, wherein a resin constituting the base sheet is an elastomer.   The method for manufacturing an electrical connector according to any one of claims 1 to 5, wherein the metal forming the metal thin film is at least one selected from gold, silver, copper, nickel, and chromium.   A step (C) in which a residual film is formed on the second surface of the substrate sheet, and before or after the step (B), the residual film is removed and the second surface of the substrate sheet is planarized. The method for manufacturing an electrical connector according to claim 1, further comprising:   The electricity according to claim 7, further comprising a step (D) of flattening the base sheet having the second surface flattened in the step (C) such that the first surface is parallel to the second surface. Manufacturing method of connector.   After the step (B), the step (C) or the step (D), plating is performed on at least one of the holes on the first surface or the second surface of the base sheet, and the plating is performed. The method of manufacturing an electrical connector according to any one of claims 1 to 8, further comprising a step (E) of forming a conductive portion connected to a metal thin film in the portion and protruding above the hole.

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