JP6520343B2 - Electrode sheet and method of manufacturing electrode sheet - Google Patents

Description

  The present invention is an electrode sheet and an electrode disposed between an object to be connected and a circuit board electrically connected to the object to be connected, for electrically connecting a terminal to be connected and a terminal of the circuit board. The present invention relates to a method of manufacturing a sheet, and more particularly, to an electrode sheet and a method of manufacturing an electrode sheet that can improve conductivity and improve the reliability of electrical connection and can prevent the electrode from falling off.

  2. Description of the Related Art Conventionally, the electrical property inspection of an electronic device such as a semiconductor is performed by connecting the electronic device to a circuit board for inspection. In general, an electronic device has a plurality of terminals, and in order to correspond thereto, a test circuit board also has a plurality of terminals. At the time of the electrical characteristic inspection, the electronic device is pressed against the inspection circuit board to electrically connect corresponding terminals.

  Patent Document 1 discloses a contact sheet which is used by being interposed between an electronic device and a circuit board for inspection in order to electrically connect corresponding terminals more reliably. The contact sheet is provided with a conductive portion penetrating the sheet-like insulating base material, and the conductive portion electrically connects the terminal of the electronic device and the terminal of the test circuit board at the time of the electrical property inspection. doing. The conductive portion is formed by filling a silver paste based on silicone rubber in a hole formed by laser processing in the base material and curing it, and the conductive portion not only has conductivity but also rubber elasticity. I have it. As a result, positional errors (concave and convex) and the like of the terminals are absorbed to improve the reliability of the electrical connection between the terminals of the electronic device and the terminals of the corresponding test circuit board.

Japanese Patent Application Publication No. 2003-255016

  However, the conductive portion shown in Patent Document 1 is formed of silver paste in order to impart rubber elasticity as described above. For this reason, the conductivity of the conductive portion may be reduced, and the reliability of the electrical property inspection may be reduced.

  Moreover, the conduction | electrical_connection part shown to patent document 1 is formed in linear form in the normal line direction of a contact sheet | seat. This may make it difficult to maintain the connection between the conductive portion and the base against the pressing force along the normal direction. For this reason, when such a pressing force is applied, there is a possibility that the conductive portion may come off the base material. In particular, since the contact sheet is repeatedly used for the electrical property inspection of the electronic device, it is considered that the conductive part is likely to be detached by the repeated use.

  The present invention has been made in consideration of these points, and can improve the conductivity to improve the reliability of the electrical connection, and can prevent the electrode from falling off. It aims at providing a manufacturing method of a sheet.

  The present invention is an electrode disposed between a connection target and a circuit board electrically connected to the connection target, for electrically connecting the terminal to be connected and the terminal of the circuit board. A sheet, comprising: a plurality of electrodes separated from one another and formed of a metal material; and an insulating layer connecting the plurality of electrodes, the electrodes having a first connection surface, and the first connection surface Is provided between the second connection surface provided on the opposite side, and between the first connection surface and the second connection surface, and protrudes in the direction orthogonal to the normal direction of the electrode sheet A portion, and the insulating layer is bonded to the protruding portion of the electrode.

  In the electrode sheet described above, the protruding portion of the electrode is a part of a curved surface provided on the side of the first connection surface, which is convex toward the second connection surface in the normal direction. A second defining surface provided on the side of the second connecting surface and forming a part of a curved surface that is convex toward the first connecting surface in the normal direction; It may be defined by.

  In the electrode sheet described above, the insulating layer may be bonded to the first defining surface of the protrusion.

  In the electrode sheet described above, the electrode sheet may further include a second insulating layer joined to the second defining surface of the protrusion and connecting a plurality of the electrodes.

  In the electrode sheet described above, a plating layer may be provided on the first connection surface and the second connection surface of the electrode.

  Further, in the electrode sheet described above, the first connection surface of the electrode may be disposed so as to protrude to the side opposite to the second connection surface with respect to the insulating layer.

  Further, in the above-described electrode sheet, the second connection surfaces of the adjacent electrodes may be integrated as part of the plurality of electrodes.

  In the electrode sheet described above, the electrode sheet may further include a restricting plate that restricts the position of the electrode in a direction orthogonal to the normal direction.

  Further, according to the present invention, the connection target is disposed between the connection target and the circuit board electrically connected to the connection target, and the terminal of the connection target is electrically connected to the terminal of the circuit board. A method of producing an electrode sheet, comprising: preparing a metal substrate having a first surface and a second surface provided on the opposite side to the first surface; In the steps of forming a first recess on the first surface side by etching from the side of the first surface, forming an insulating layer on the wall surface of the first recess, and forming the insulating layer Thereafter, the metal base is etched from the side of the second surface to form a second recess connected to the first recess on the side of the second surface, thereby separating the two from each other and the insulating layer Forming a plurality of electrodes connected by The formed electrode is provided between a first connection surface, a second connection surface provided on the side opposite to the first connection surface, and the first connection surface and the second connection surface. And a protrusion projecting in a direction orthogonal to a normal direction of the electrode sheet, wherein the insulating layer is bonded to the protrusion of the electrode. Provide a way.

  In the method of manufacturing the electrode sheet described above, the wall surface of the first recess formed in the step of forming the first recess is directed toward the second surface of the metal base in the normal direction. The wall surface of the second recess formed in the step of forming the electrode, which is formed in a convex curved surface shape, is a curved surface which is convex toward the first surface of the metal base in the normal direction. , And the protrusion of the electrode is defined by a first defining surface forming a part of a wall surface of the first recess and a second defining surface forming a part of the second recess You may do so.

  In the method of manufacturing an electrode sheet described above, after the step of forming the electrode, a step of forming a second insulating layer which is joined to the second defined surface of the protrusion and connects a plurality of the electrodes. It may further be provided.

  Further, in the method of manufacturing an electrode sheet described above, after the step of forming the first concave portion, before the step of forming the insulating layer, the metal base is etched from the side of the second surface, The method further includes the step of forming a temporary second recess not connected to the first recess on the side of the second surface, and in the step of forming the electrode, the temporary second recess is etched to form the second recess It may be possible to

  In the method of manufacturing an electrode sheet described above, in the step of forming the electrode, the second surface of the metal base may be etched together with the temporary second recess.

  In the method of manufacturing an electrode sheet described above, after the step of forming the electrode, the method further includes the step of forming a plating layer on the first connection surface and the second connection surface of the electrode. May be

  Further, in the method of manufacturing the electrode sheet described above, in the step of forming the insulating layer, the insulating material is applied by applying a liquid insulating material on the first surface of the metal base and the wall surface of the first recess. A layer may be formed, and after the step of forming the insulating layer, a portion of the insulating layer corresponding to the first connection surface of the electrode may be removed.

  In the method of manufacturing an electrode sheet described above, in the step of forming the electrodes, the second connection surfaces of the electrodes which are a part of the plurality of electrodes and are adjacent to each other are integrated. It may be possible to

  According to the present invention, the conductivity can be improved to improve the reliability of the electrical connection, and the electrode can be prevented from coming off.

FIG. 1 is a schematic view showing an inspection apparatus for inspecting the electrical characteristics of an electronic device according to an embodiment of the present invention. FIG. 2 is a plan view showing the contact sheet in the embodiment of the present invention. FIG. 3 is a cross-sectional view taken along line AA of FIG. FIG. 4 is a cross-sectional view taken along line B-B of FIG. FIG. 5 is a cross-sectional view taken along the line C-C of FIG. FIG. 6 is a view for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a view for explaining a step of preparing a metal base. FIG. 7 is a view for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a view for explaining a step of forming a resist layer on a metal base. FIG. 8 is a view for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a view for explaining a process in which the metal base is etched from the side of the first surface. FIG. 9 is a view for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a view for explaining a process in which the metal base is etched from the side of the second surface. FIG. 10 is a view for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a view for explaining a process of removing a resist layer. FIG. 11 is a view for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a view for explaining a step of forming an insulating layer. FIG. 12 is a view for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a view for explaining a process of forming an electrode. FIG. 13 is a diagram for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a diagram for explaining a process of removing the insulating layer on the first connection surface. FIG. 14 is a view for explaining an example of a method of manufacturing the contact sheet of FIG. 2 and a view for explaining a step of forming a plating layer. FIG. 15 is a plan view showing a resist layer formed in the step shown in FIG. FIG. 16 is a plan view showing a modification of the resist layer shown in FIG. FIG. 17 is a cross-sectional view corresponding to FIG. 5 in the process shown in FIG. FIG. 18 is a cross-sectional view showing the contact sheet shown in FIG. 3 connected to an electronic device and a circuit board for inspection. FIG. 19 is a view showing a modification of FIG. FIG. 20 is a view showing a modification of FIG. FIG. 21 is a cross-sectional view showing a modification of the contact sheet shown in FIG. FIG. 22 is a cross-sectional view showing another modification of the contact sheet shown in FIG.

  An electrode sheet and a method of manufacturing the electrode sheet according to the embodiment of the present invention will be described with reference to FIGS. 1 to 22. Here, the electrode sheet is disposed between the connection target and the circuit board electrically connected to the connection target to electrically connect the terminal to be connected to the terminal of the circuit board. It is. In the present embodiment, as an example of the electrode sheet, a contact sheet for electrically connecting the terminals of the electronic device to the terminals of the circuit board for inspection when the electrical characteristics of an electronic device such as a semiconductor are inspected. explain. In the drawings attached to the present specification, for the sake of easy illustration and understanding, the scale, the dimensional ratio in the vertical and horizontal directions, etc. are appropriately changed from those of the actual one and exaggerated.

  First, with reference to FIG. 1, an electrical inspection apparatus 1 for inspecting the electrical characteristics of the electronic device 10 will be described.

  As shown in FIG. 1, the electrical inspection apparatus 1 presses the fixing stand 2, the inspection circuit board 3 provided on the fixing stand 2, and the electronic device 10 as a connection target to the inspection circuit board 3 side. And a pressing tool 4. Among these, the test circuit board 3 is connected to a tester (not shown). A rubber elastic sheet 5 is interposed between the fixing base 2 and the circuit board 3 for inspection.

  At the time of the electrical property inspection of the electronic device 10, the electronic device 10 is disposed between the pressing tool 4 and the circuit board 3 for inspection, and the contact sheet 20 is disposed between the circuit board 3 for inspection and the electronic device 10. Ru. The electronic device 10 has a plurality of terminals 10a, and correspondingly, the contact sheet 20 has a plurality of electrodes 30 (described later), and the inspection circuit board 3 has a plurality of terminals 3a. . When the electronic device 10 is pressed by the pressing tool 4, the terminal 10 a of the electronic device 10 is electrically connected to the first connection surface 31 (see FIG. 3) of the corresponding electrode 30 of the contact sheet 20, and The terminal 3 a of the circuit board 3 is electrically connected to the second connection surface 32 of the corresponding electrode 30 of the contact sheet 20. Thus, the terminal 10 a of the electronic device 10 is electrically connected to the terminal 3 a of the corresponding test circuit board 3 via the electrode 30 of the contact sheet 20. That is, the contact sheet 20 electrically connects the terminal 10 a of the electronic device 10 and the terminal 3 a of the test circuit board 3 on a one-to-one basis. When the pressing tool 4 presses the electronic device 10, as described above, since the rubber elastic sheet 5 is interposed between the fixed base 2 and the circuit board 3 for inspection, the positional error of each terminal 3a, 10a (Concave and convex) and the like are absorbed to improve the reliability of the electrical connection between the terminal 10a of the electronic device 10 and the electrode 30 of the contact 20, and the terminal 3a of the test circuit board 3 and the electrode 30 of the contact sheet 20 To improve the reliability of electrical connection with

  Next, the contact sheet 20 according to the present embodiment will be described.

  An example of the contact sheet 20 is shown in FIG. Here, an example is shown in which the contact sheet 20 is formed in a rectangular shape (in plan view) when viewed from the normal direction (the direction perpendicular to the sheet of FIG. 2, the P direction of FIG. 3). ing. The cross section of each part of such a contact sheet 20 is shown by FIG. 3 to FIG.

  The contact sheet 20 includes a plurality of electrodes 30 formed of a metal material and separated from each other, and an insulating layer 40 connecting the plurality of electrodes 30. The planar shape of each electrode 30 is a rectangular shape or a diamond shape, and more specifically, the edge of the planar shape of the electrode 30 is formed in a curved shape convex toward the planar center of the electrode 30 ing.

  The electrode 30 is disposed corresponding to the position of the terminal 10 a of the electronic device 10, and in the form shown in FIG. 2, corresponds to the typical terminal arrangement in the package of the electronic device 10. More specifically, the electrodes 30 are arranged at predetermined pitches in two directions (X direction, Y direction) orthogonal to each other in plan view, and are arranged in a grid shape as a whole. The pitch of the electrodes 30 is not particularly limited in both the X direction and the Y direction, but it is practical, for example, to be within 2.54 mm which is the maximum pitch between the terminals of the electronic device 10. However, it is desirable that the pitch of the electrodes 30 be miniaturized correspondingly to the electronic device 10 in order to use it for the electrical property inspection of the miniaturized electronic device 10 in recent years. The contact sheet 20 according to the present embodiment is formed by etching from the metal base 50 as described later, so the pitch of the electrodes 30 can be made smaller (miniaturized), and in both the X and Y directions, For example, it can be formed at a pitch of 25 μm to 100 μm.

  As shown in FIG. 3, the electrode 30 has a first connection surface 31, a second connection surface 32 provided on the opposite side to the first connection surface 31, a first connection surface 31, and a second connection surface 32. And a protrusion 33 provided between the two and extending in a direction perpendicular to the normal direction of the contact sheet 20 (in the direction along the plane of the contact sheet 20, in the lateral direction in FIG. 3). Have. In the present embodiment, when testing the electrical characteristics of the electronic device 10, the terminal 10a of the electronic device 10 is electrically connected to the first connection surface 31 and the terminal 3a of the test circuit board 3 is connected to the second connection surface 32. Electrically connected. However, the present invention is not limited thereto. The terminal 3a of the test circuit board 3 is electrically connected to the first connection surface 31 and the terminal 10a of the electronic device 10 is electrically connected to the second connection surface 32. You may do so.

  The material used for the electrode 30 is not particularly limited as long as it is a metal material having good conductivity. In particular, it is preferable that the nonconductive resin is not cured to be in the form of the electrode 30, but is in the form of the electrode 30 by a metallic material. For example, the electrode 30 can be suitably formed of copper, copper alloy, aluminum, nickel, nickel alloy, stainless steel. The thickness of the electrode 30 can be, for example, 12 μm to 50 μm.

  The protrusion 33 is defined by a first defining surface 34 provided on the side of the first connection surface 31 and a second defining surface 35 provided on the side of the second connection surface 32. The electrode 30 according to the present embodiment is formed by etching the plate-like metal base 50 (described later) from both sides, and the first defining surface 34 is formed in the second direction in the normal direction of the contact sheet 20. A part of a curved surface (wall surface 51a of the first recess 51 described later) which is convex toward the side of the connection surface 32 (the lower side in FIG. 3) forms a second defining surface 35 in the normal direction of the contact sheet 20 A part of a curved surface (a wall surface 53a of a second recess 53 described later) which is convex toward the side of the first connection surface 31 (upper side in FIG. 3) is formed.

  That is, the first recess 51 is formed on the side of the first surface 50a by etching from the side of the first surface 50a (see FIG. 6) of the metal base 50, and the wall surface 51a of the first recess 51 is the second It is formed in the curved surface shape which becomes convex toward the connection surface 32 side. The wall surface 51a of the first recess 51 stands up (is formed along the normal direction of the contact sheet 20) in the area on the etching start side, and is an area on the opposite side to the etching start side, that is, the second area In the region on the side of the surface 50 b (see FIG. 8), the contact sheet 20 is inclined relatively largely with respect to the normal direction of the contact sheet 20. The first defining surface 34 is formed by a part of the wall surface 51 a of the first recess 51.

  Similarly, the second concave portion 53 is formed on the second surface 50 b side by etching from the second surface 50 b side of the metal base 50, and the wall surface 53 a of the second concave portion 53 corresponds to that of the first connection surface 31. It is formed in a curved surface shape which is convex toward the side. The wall surface 53a of the second recess 53 stands up in the region on the etching start side, and the method of the contact sheet 20 toward the region on the side opposite to the etching start side, that is, the region on the first surface 50a side. The inclination to the line direction becomes larger. The second defining surface 35 is formed by a part of the wall surface 53 a of the second recess 53. The second recess 53 is formed concentrically with the first recess 51 in a plan view.

  By defining the protrusion 33 by the first defining surface 34 and the second defining surface 35 as described above, the tip of the protrusion 33 is formed in a roughly pointed shape. Further, by connecting the first concave portion 51 to the second concave portion 53 and connecting them, the metal base 50 is divided, and the electrodes 30 separated from each other are formed.

  As shown in FIG. 2, the first recesses 51 are generally formed in a rectangular shape in plan view, and are arranged in the X direction and the Y direction. The first recesses 51 adjacent to each other in the X direction and the Y direction are connected to each other. Although not shown, the second recesses 53 are also formed substantially in a rectangular shape in plan view in the same manner as the first recesses 51, and are arranged in the X direction and the Y direction.

  As shown in FIG. 2, the protrusion 33 of the electrode 30 is formed over the entire circumference of the electrode 30. That is, in the present embodiment, the first concave portions 51 are arranged in a lattice, and one electrode 30 is defined by the wall surfaces 51 a of four first concave portions 51 adjacent to each other. The first defining surface 34 is formed by a part of the wall surface 51 a of the four first recesses 51, and the second defining surface 35 is formed by a part of the wall surfaces 53 a of the four second recesses 53. The protrusion 33 thus defined has a shape similar to the first connection surface 31 or the second connection surface 32 of the electrode 30 in plan view.

  As shown in FIG. 3, the insulating layer 40 is bonded to a portion of the first defining surface 34 of the electrode 30. As described later, the insulating layer 40 is formed on the wall surface 51 a of the first recess 51 formed by etching. As a result, the insulating layer 40 is formed and joined to the first defining surface 34 forming a part of the wall surface 51a.

  Here, FIG. 3 shows a cross section along the diagonal direction (the line AA of FIG. 2) of the electrodes 30 and the first recess 51 arranged in the X direction and the Y direction. The intermediate position between the electrodes 30 adjacent to each other in FIG. 3 corresponds to the center position M1 of the first recess 51. Since the wall surface 51 a of the first recess 51 is formed in a curved shape that is convex toward the second connection surface 32, the thickness of the insulating layer 40 is maximum at the center position M 1 of the first recess 51. The thickness of the insulating layer 40 gradually decreases from this position toward the electrode 30.

  A cross section along the X direction (line B-B in FIG. 2) passing through the electrode 30 is shown in FIG. The intermediate position between the electrodes 30 adjacent to each other in FIG. 4 corresponds to the center position M2 of the edge line of the first recess 51. Since the wall surface 51 a of the first recess 51 is formed in a curved shape that is convex toward the second connection surface 32, the depth of the first recess 51 at the center position M2 of the edge line of the first recess 51 is The depth is shallower than the depth at the center position M1 of the first recess 51. Therefore, the thickness of the insulating layer 40 at the intermediate position between the adjacent electrodes 30 shown in FIG. 4 is smaller than the thickness of the insulating layer 40 at the intermediate position between the adjacent electrodes 30 shown in FIG. There is.

  FIG. 5 shows a cross section along the Y direction (line C-C in FIG. 2) passing through the center position M1 of the first recess 51 and the center position M2 of the edge line of the first recess 51. Thus, the insulating layer 40 is formed so as to gradually decrease in thickness from the position M1 to the position M2. Then, the cut portion 41 is formed in the insulating layer 40 at the position M2. As will be described in detail later, in the process of manufacturing the contact sheet 20, the ridges 54 are formed on the metal base 50 by connecting the first recesses 51 adjacent to each other in the X direction or Y direction by etching erosion. (See FIG. 17) is formed. The insulating layer 40 is formed on the wall surface 51 a of the first recess 51 and the ridge portion 54, and the ridge portion 54 is removed by etching the metal base 50 in the subsequent process. As a result, in the insulating layer 40, as shown in FIG. 5, a cut portion 41 which is recessed toward the first connection surface 31 is formed.

  The material used for the insulating layer 40 is particularly limited as long as it secures insulation between the electrodes 30 adjacent to each other, supports the electrodes 30, and has resistance to the etching solution of the metal base 50. Absent. For example, the insulating layer 40 is preferably formed of polyimide. The thickness of the insulating layer 40 is not particularly limited as long as it can support the electrode 30. For example, the maximum thickness of the insulating layer 40 at the center position M1 of the first recess 51 is 5 μm to 25 μm. Is preferred.

  By the way, as shown in FIG. 3 and FIG. 4, the first connection surface 31 of the electrode 30 is disposed so as to protrude on the opposite side to the second connection surface 32 side (upper than the insulating layer 40) than the insulating layer 40. Is preferred. By this, when pressing the electronic device 10 against the contact sheet 20, the insulating layer 40 is prevented from coming into contact with the electronic device 10 to separate the first connection surface 31 of the electrode 30 and the terminal 10a of the electronic device 10. it can. In the embodiment shown in FIGS. 3 and 4, the insulating layer 40 is not formed on the upper portion of the electrode 30 (including the first connection surface 31 and the upper portion of the first defining surface 34). By this, the insulating layer 40 can be kept away from the first connection surface 31 of the electrode 30, and the insulating layer 40 is more reliably prevented from contacting the electronic device 10. Moreover, in the present embodiment, the insulating layer 40 is not formed on the second connection surface 32 and the second defining surface 35 of the electrode 30.

  In the present embodiment, the plating layer 60 is provided on the first connection surface 31 and the second connection surface 32 of the electrode 30. This can prevent corrosion when the electrode 30 is formed of a material that may cause corrosion, such as copper. Further, the contact resistance between the electrode 30 and the terminal 10 a of the electronic device 10 and the terminal 3 a of the circuit board 3 for inspection can be reduced. The plated layer 60 preferably includes a nickel (Ni) plated layer 61 and a gold (Au) plated layer 62. The nickel plating layer 61 may be formed by electroless nickel plating, and the gold plating layer 62 may be formed by electroless gold plating. In the configurations shown in FIGS. 3 and 4, the plating layer 60 is also formed on the upper portion of the first defining surface 34 of the electrode 30 and the lower portion of the second defining surface 35.

  Next, the operation of the present embodiment having such a configuration will be described. Here, first, a method of manufacturing the contact sheet 20 will be described with reference to FIGS. 6 to 17.

  First, as shown in FIG. 6, a plate-like metal base 50 having a first surface 50a and a second surface 50b opposite to the first surface 50a is prepared (step S1).

  Subsequently, as shown in FIG. 7, the first resist layer 71 is formed on the first surface 50a of the metal base 50, and the second resist layer 72 is formed on the second surface 50b (step S2). ). In this case, first, a dry film resist is laminated as a photosensitive resist material on the first surface 50 a and the second surface 50 b of the metal substrate 50 to obtain the first resist layer 71 and the second resist layer 72 respectively. . The resist layers 71 and 72 may be obtained by applying and drying a liquid photosensitive resist. Thereafter, the first resist layer 71 and the second resist layer 72 are exposed and developed. As a result, the first resist layer 71 and the second resist layer 72 are formed in a desired pattern.

  The planar shape of the first resist layer 71 is designed in consideration of the side etching amount so that the electrode 30 has a desired shape by etching described later. In the present embodiment, as shown in FIG. 15, in the first resist layer 71, a plurality of bands 71x extending in the X direction and a plurality of bands 71y extending in the Y direction are integrated as a whole. Is formed in a mesh shape. By this, peeling of the first resist layer 71 is prevented. A region where the band 71x and the band 71y intersect corresponds to the position where the electrode 30 is formed. Then, a rectangular first resist layer opening 71a is formed in a region surrounded by the bands 71x and 71y. The first resist layer opening 71 a corresponds to the position where the first recess 51 is formed. The first resist layer 71 is not limited to forming the first resist layer opening 71a in a rectangular shape as shown in FIG. 15. For example, the first resist layer 71 may be formed in an octagonal shape as shown in FIG. It is also good. Here, a tapered portion of the resist is provided at the corner of the first resist layer opening 71a. In this case, the planar shape of the electrode 30 can be increased.

  Although not shown, the second resist layer 72 can be formed in the same manner as the first resist layer 71, and a band extending in the X direction and a band extending in the Y direction are made to correspond to the position where the electrode 30 is formed. Cross. A rectangular second resist layer opening 72a is formed in the area surrounded by the bands. The second resist layer opening 72 a corresponds to the position where the second recess 53 is formed. The respective bands of the second resist layer 72 are formed to overlap the respective bands 71x and 71y of the first resist layer 71 in plan view, but depending on the shape of the second recess 53, etc., the second resist The width of each band of the layer 72 may be different from the width of each band 71x, 71y of the first resist layer 71.

  After step S2, as shown in FIG. 8, the metal base 50 is etched from the side of the first surface 50a to form the first recess 51 on the side of the first surface 50a (step S3). In this case, the metal base 50 is etched from the side of the first surface 50 a of the metal base 50 by the jetted etchant (for example, a ferric chloride solution) using the first resist layer 71 as a mask. As a result, the metal base 50 is etched through the first resist layer opening 71 a, and the plurality of first recesses 51 are formed on the side of the first surface 50 a of the metal base 50. At this time, it is preferable to prevent the etching from the side of the second surface 50 b by providing a protective film or the like on the second surface 50 b of the metal base 50.

  In step S3, in the area corresponding to the first resist layer opening 71a in the metal base 50, the erosion by the etching solution proceeds, and the metal base 50 in the area is etched. Erosion by the etchant proceeds not only in the normal direction (thickness direction) of the metal substrate 50 but also in the direction along the plane (horizontal direction in FIG. 8) from the first resist layer opening 71a. The phenomenon in which the erosion by the etchant proceeds in the lateral direction is called side etching. As the metal base 50 is corroded in this manner, the outline of the first recess 51 on the first surface 50a of the metal base 50 in plan view becomes larger than the outline of the first resist layer opening 71a. As a result of such erosion by the etchant, as shown in FIG. 8, the first recess 51 is convex toward the side of the second surface 50b of the metal base 50 (the lower side in FIG. 8). It is formed in the shape of a curved surface. Further, as the erosion of the etching solution also proceeds in the direction along the plane, the wall surfaces 51a of the first recesses 51 adjacent to each other are connected to each other as shown in FIG. A mountain shaped ridge portion 54 is formed so as to protrude toward the side of the first surface 50a (upper side in FIG. 17).

  After step S3, as shown in FIG. 9, the metal base 50 is etched from the side of the second surface 50b to form a temporary second recess 52 on the side of the second surface 50b (step S4). In this case, the metal base 50 is etched from the side of the second surface 50 b of the metal base 50 by the jetted etchant (for example, ferric chloride solution) using the second resist layer 72 as a mask. As a result, the metal base 50 is etched through the second resist layer opening 72a, and a plurality of temporary second recesses 52 are formed on the side of the second surface 50b of the metal base 50. The temporary second recess 52 is formed concentrically with the first recess 51 in plan view, but is not connected to the first recess 51. As a result, the entire wall surface 51 a of the first recess 51 is left. At this time, by providing a protective film or the like on the first surface 50a of the metal base 50, etching from the side of the first surface 50a is prevented, and the shape of the first recess 51 is impaired. It is preferable to prevent this.

  In step S4, the erosion by the etching solution proceeds in the same manner as in step S3, but the etching time is shorter than in step S3 or the rate of the erosion by the etching solution is reduced, so that the metal substrate 50 is formed. The amount of erosion is smaller than in step S3. As a result, the temporary second recess 52 is convex toward the side of the first surface 50a of the metal base 50 (upper side in FIG. 9), but the upper portion is formed flat.

  After step S4, as shown in FIG. 10, the first resist layer 71 is removed from the first surface 50a of the metal base 50, and the second resist layer 72 is removed from the second surface 50b (step S5). ).

  After step S5, as shown in FIG. 11, the insulating layer 40 is formed on the first surface 50a of the metal base 50 and the wall surface 51a of the first recess 51 (step S6). In this case, first, a liquid insulating material is applied on the first surface 50 a of the metal base 50 and the wall surface 51 a of the first recess 51. Subsequently, the applied insulating material is cured. Thus, the insulating layer 40 bonded to the wall surface 51 a of the first recess 51 is obtained.

  The liquid insulating material is applied thickest at the deepest center position M1 (see FIG. 3) of the first recess 51 due to the shape of the first recess 51, and is separated from the center position M1 of the first recess 51. Thinly applied. For this reason, the insulating layer 40 is formed thickest at the central position M1 of the first concave portion 51, formed thinner as it goes away from the central position M1, and a relatively thin insulating layer 40 is formed on the first surface 50a. Be done. In this step S6, as shown in FIG. 17, the insulating layer 40 is also formed on the ridge portion 54 of the metal base 50, and the cut portion 41 having a shape following the shape of the ridge portion 54 is formed. .

  The insulating layer 40 is not limited to the use of a liquid insulating material. For example, the insulating film 40 may be obtained by laminating a dry film on the first surface 50 a of the metal base 50 and the wall surface 51 a of the first recess 51.

  After step S6, as shown in FIG. 12, the metal base 50 is etched again from the side of the second surface 50b, and the second recess 53 is formed on the side of the second surface 50b (step S7). In this case, the second surface 50 b of the metal base 50 is also etched together with the temporary second recess 52. That is, the entire surface (the second surface 50 b and the temporary second recess 52) on the second surface 50 b side is etched without providing a resist layer, a protective film, etc. on the second surface 50 b of the metal base 50. Thereby, in the second surface 50b, the erosion by the etching solution proceeds in a direction substantially perpendicular to the second surface 50b, and in the temporary second recess 52, the etching solution in a direction substantially perpendicular to the wall surface 52a of the temporary second recess 52 Erosion progresses. The second connection surface 32 of the electrode 30 substantially parallel to the second surface 50b of the metal base 50 is formed by the erosion of the second surface 50b. The amount of erosion in the second surface 50 b is equal to the amount of erosion in the temporary second recess 52. In step S7, by providing a protective film or the like on the first surface 50a of the metal base 50, etching from the side of the first surface 50a is prevented, and the first surface 50a is the first surface of the electrode 30. 1 Make the connection surface 31.

  By etching the temporary second recess 52, a second recess 53 which is deeper than the temporary second recess 52 and has a large planar shape is formed. By this, as shown in FIG. 12, the 2nd recessed part 53 is connected and connected with the 1st recessed part 51, and the some electrode 30 mutually spaced apart is formed. That is, while being separated in the diagonal direction of FIG. 2 (direction of line A-A in FIG. 2) by etching, a plurality of elements separated in X direction (direction of line B-B in FIG. 2) and Y direction of FIG. An electrode 30 is formed. As a result, the electrode 30 has a protrusion defined by the first defining surface 34 forming a part of the wall surface 51 a of the first recess 51 and the second defining surface 35 forming a part of the wall surface 53 a of the second recess 53. The portion 33 is formed. The insulating layer 40 is bonded on the first defining surface 34, and the electrodes 30 separated from each other are connected by the insulating layer 40. A part of the insulating layer 40 on the side of the second connection surface 32 is exposed to the side of the second connection surface 32 by the communication between the first recess 51 and the second recess 53. Further, the ridge portion 54 (see FIG. 17) of the metal base 50 is removed by the etching in this step S7, and the cut portion 41 of the insulating layer 40 is exposed on the second connection surface 32 side (see FIG. 5). ).

  After step S7, as shown in FIG. 13, a portion of the insulating layer 40 formed on the first connection surface 31 of the electrode 30 (a portion corresponding to the first connection surface 31) is removed (step S8). Here, the portion of the insulating layer 40 formed on the top of the first defining surface 34 of the electrode 30 is also removed. In this case, the insulating layer 40 can be suitably removed by wet etching or dry etching. Specifically, first, a resist (not shown) is formed on the insulating layer 40. Subsequently, in the resist, an opening is formed in a region corresponding to the first connection surface 31 in a region on the first connection surface 31 by a photofabrication method. Thereafter, the portion exposed from the opening is etched to remove the insulating layer 40 on the first connection surface 31. As described above, when the insulating layer 40 is formed of a liquid insulating material, the insulating layer 40 on the first surface 50a can be formed relatively thin. Layer 40 can be easily removed. When the insulating layer 40 is formed of polyimide, it is preferable to use wet etching with an alkaline etching solution such as an organic alkaline etching solution or dry etching using oxygen plasma. After the etching is performed, the resist is removed.

  After step S8, as shown in FIG. 14, the plating layer 60 is formed on the first connection surface 31 and the second connection surface 32 of the electrode 30 (step S9). Here, in the portion of the electrode 30 which is exposed without being covered by the insulating layer 40, that is, the first connection surface 31, the second connection surface 32, the upper portion of the first defining surface 34 and the second defining surface 35. The plating layer 60 is formed in the lower part. By this, the mask for forming the plating layer 60 can be omitted, and the process can be simplified. In addition, in the case of formation of the plating layer 60, after the nickel plating layer 61 is formed by electroless nickel plating, it is suitable for the gold plating layer 62 to be formed by electroless gold plating.

  Thus, the contact sheet 20 according to the present embodiment can be obtained.

  Next, a method of inspecting the electrical characteristics of the electronic device 10 using the contact sheet obtained as described above will be described with reference to FIG.

  First, as shown in FIG. 18, the contact sheet 20 is placed on the inspection circuit board 3 of the electrical inspection apparatus 1. At this time, the second connection surface 32 of the corresponding electrode 30 of the contact sheet 20 is aligned with the terminal 3 a of the circuit board 3 for inspection.

  Subsequently, the electronic device 10 is placed on the contact sheet 20. At this time, the terminal 10 a of the electronic device 10 is aligned on the first connection surface 31 of the electrode 30 of the contact sheet 20. Thus, the contact sheet 20 is interposed between the electronic device 10 and the circuit board 3 for inspection.

  Next, the electronic device 10 is pressed against the circuit board 3 for inspection by the pressing tool 4 of the electrical inspection apparatus 1. As a result, the terminal 10 a of the electronic device 10 is electrically connected to the first connection surface 31 of the electrode 30 of the contact sheet 20, and the terminal 3 a of the circuit board 3 for inspection is the second of the electrode 30 of the contact sheet 20. The second connection surface 32 is electrically connected. That is, the terminals 10 a of the electronic device 10 and the terminals 3 a of the test circuit board 3 are electrically connected in a one-to-one manner via the electrodes 30 of the contact sheet 20. In addition, when the circuit board 3 for inspection is configured by a flexible substrate and the rubber elastic sheet 5 (see FIG. 1) is provided between the fixing base 2 and the circuit board 3 for inspection, the electronic device 10 is pressed. At the same time, positional errors (concave and convex) and the like in the vertical direction of the electrodes 30 and the terminals 3a and 10a can be absorbed, and the respective electrodes 30 and the corresponding terminals 3a and 10a are more reliably electrically connected. , Improve the reliability. When the solder resist film (not shown) is formed on the surface of the circuit board 3 for inspection, the surface of the terminal 3a is the surface of the circuit board 3 for inspection according to the thickness of the solder resist film It is disposed at a position recessed from the surface of the resist film. However, by using the contact sheet 20 according to the present embodiment, the electrode 30 can be connected to the terminal 3a of the circuit board 3 for inspection, and the terminal 3a and the terminal 10a of the electronic device 10 can be electrically connected reliably. be able to.

  Thereafter, in the state where the electronic device 10 is pressed to the side of the circuit board 3 for inspection, the electrical characteristic inspection of the electronic device 10 is performed. A tester (not shown) is connected to the circuit board 3 for inspection, from which the electrical characteristics of the electronic device 10 are inspected through the circuit board 3 for inspection and the electrodes 30 of the contact sheet 20.

  As described above, according to the present embodiment, the electrode 30 for electrically connecting the terminal 10 a of the electronic device 10 and the terminal 3 a of the inspection circuit board 3 is formed of a metal material. By this, the conductivity of the electrode 30 can be improved. Therefore, the electrical resistance between the terminal 10a of the electronic device 10 and the corresponding terminal 3a of the inspection circuit board 3 can be reduced to improve the reliability of the electrical connection, and the reliability of the electrical characteristic inspection can be improved. Can be improved.

  Further, according to the present embodiment, the first connection surface 31 of the electrode 30 electrically connected to the terminal 10 a of the electronic device 10 and the electrode 30 electrically connected to the terminal 3 a of the circuit board 3 for inspection. Between the first connection surface 32 and the second connection surface 32. A protrusion 33 protruding in a direction orthogonal to the normal direction of the contact sheet 20 is provided, and insulating is made on the first defining surface 34 defining the protrusion 33. Layers 40 are bonded. As a result, the strength against the pressing force along the normal direction of the contact sheet 20 can be improved. Therefore, the electrode 30 can be prevented from coming off the insulating layer 40, and the mechanical reliability of the contact sheet 20 can be improved.

  Further, according to the present embodiment, etching the plate-like metal base member 50 forms a part of a curved surface that is convex toward the second connection surface 32 in the normal direction of the contact sheet 20. The protrusion 33 is defined by the first defining surface 34 and the second defining surface 35 that is a part of a curved surface that is convex toward the first connection surface 31 in the normal direction of the contact sheet 20. it can. By this, the contact sheet 20 which can prevent drop-off | omission of the electrode 30 can be easily obtained by an etching. Further, since the electrode 30 is formed by etching, the planar shapes of the first connection surface 31 and the second connection surface 32 of the electrode 30 can be miniaturized, and the electricity of the electronic device 10 in which the terminal 10 a is miniaturized It can be suitably used for characteristic inspection. In this case, when pressing the electronic device 10, the pressure received by the first connection surface 31 of the electrode 30 from the terminal 10a of the electronic device 10 can be increased, and the test circuit board from the second connection surface 32 of the electrode 30 The pressure received by the three terminals 3a can be increased, and the reliability of the electrical connection can be improved. In addition, the shape accuracy and position accuracy of the electrode 30 can be improved by etching, and it can be easily aligned with the terminal 10a of the miniaturized electronic device 10, which also contributes to the reliability of the electrical connection. It is possible to improve the quality. Furthermore, the electronic device 10 has been miniaturized and the number of pins increased, and the densification of the terminals 10a has progressed, but according to the contact sheet 20 according to the present embodiment, such a densified electronic device 10 Accordingly, the electrical test can be performed by electrically connecting the terminal 10a to the terminal 3a of the test circuit board 3.

  Further, according to the present embodiment, the plating layer 60 is provided on the first connection surface 31 and the second connection surface 32 of the electrode 30. This can prevent the electrode 30 from being corroded. Further, the contact resistance between the first connection surface 31 of the electrode 30 and the terminal 10a of the corresponding electronic device 10 can be reduced, and the second connection surface 32 of the electrode 30 and the terminal 3a of the corresponding test circuit board 3 Contact resistance can be reduced.

  Further, according to the present embodiment, the first connection surface 31 of the electrode 30 is disposed so as to protrude to the side opposite to the second connection surface 32 with respect to the insulating layer 40. Thereby, when the electronic device 10 is pressed against the circuit board 3 for inspection, the insulating layer 40 contacts the electronic device 10 and the first connection surface 31 of the electrode 30 and the terminal 10 a of the corresponding electronic device 10 Spacing can be avoided. Therefore, the reliability of the electrical connection between the first connection surface 31 of the electrode 30 and the terminal 10 a of the corresponding electronic device 10 can be improved. Further, according to the present embodiment, the insulating layer 40 is not bonded to the second defining surface 35 of the electrode 30. By this, when pressing the electronic device 10 against the circuit board 3 for inspection, separation of the second connection surface 32 of the electrode 30 and the terminal 3a of the corresponding circuit 3 for inspection can be avoided. .

  Further, according to the present embodiment, after the first recess 51 is formed on the side of the first surface 50a of the metal base 50, the temporary second recess 52 is formed on the side of the second surface 50b. As a result, when forming the second recess 53 by etching the temporary second recess 52, the second recess 53 can be formed so as to expand the temporary second recess 52. For this reason, when forming the 2nd recessed part 53 from the temporary 2nd recessed part 52, the resist layer for forming the 2nd recessed part 53 can be made unnecessary, and simplification of a manufacturing process can be achieved. In particular, according to the present embodiment, when the temporary second recess 52 is etched, the second surface 50 b of the metal base 50 is also etched. By this, since the erosion by the etching solution proceeds in a direction substantially perpendicular to the second surface 50b, the second connection surface 32 of the electrode 30 obtained after the etching can be made substantially parallel to the second surface 50b. As a result, the first connection surface 31 can also be made substantially parallel. For this reason, when forming the 2nd recessed part 53 from the temporary 2nd recessed part 52, it can become unnecessary to provide a resist layer in the 2nd surface 50b, and simplification of a manufacturing process can be achieved.

  In the above-described embodiment, an example in which the contact sheet is used in the electrical inspection apparatus 1 has been described. In this example, for the electrical inspection of the electronic device 10, the contact sheet 20 temporarily electrically connects the terminal 10a of the electronic device 10 and the terminal 3a of the circuit board 3 for inspection, and after the electrical inspection is completed As a result, the electronic device 10 is removed from the circuit board 3 for inspection. That is, the example in which the contact sheet 20 electrically connects the electronic device 10 and the circuit board 3 for inspection temporarily has been described. However, the present invention is not limited to this, and the contact sheet 20 can also be used for permanent electrical connection. For example, the electrodes 30 of the contact sheet 20 may be soldered to the terminals 3 a ′ of the circuit board 3 ′ for an arbitrary application and to the terminals 10 a of the electronic device 10.

  When the terminal 10a of the electronic device 10 is connected to the terminal 3a 'of the circuit board 3' via the contact sheet 20, first, as shown in FIG. 19, the solder ball 80 is placed on the terminal 3a 'of the circuit board 3'. Is placed. In place of the solder balls 80, solder paste may be applied on the terminals 3a 'by screen printing.

  Subsequently, the contact sheet 20 is placed on the circuit board 3 ′. At this time, the second connection surface 32 of the corresponding electrode 30 of the contact sheet 20 is aligned with the solder ball 80 provided on the terminal 3a 'of the circuit board 3'.

  Next, on the first connection surface 31 of the electrode 30 of the contact sheet 20, the electronic device 10 in which the solder ball 81 is provided on the terminal is placed. At this time, the solder balls 81 provided on the terminals 10 a of the electronic device 10 are aligned with the first connection surfaces 31 of the electrodes 30 of the contact sheet 20. Thus, the contact sheet 20 is interposed between the electronic device 10 and the circuit board 3 '.

  Next, the solder balls 80 and 81 are heated in a state where the electronic device 10 is fixed to the side of the circuit board 3 ′ with an adhesive or the like. As a result, the heated solder balls 80 and 81 melt and are welded and permanently fixed and electrically connected to the adjacent electrodes 30 and the terminals 3a 'and 10a.

  Here, when the solder resist film (not shown) is formed on the surface of the circuit board 3 ', the surface of the terminal 3a' is the surface of the circuit board 3 '(that is, the solder resist film) according to the thickness of the solder resist film. It is disposed at a position recessed from the surface of the resist film. However, by using the contact sheet 20 according to the present embodiment, the electrode 30 can be connected to the terminal 3a 'of the circuit board 3', and the terminal 3a 'and the terminal 10a of the electronic device 10 can be electrically connected reliably. can do.

  Further, in the embodiment shown in FIG. 19, an example in which the terminal 10 a of the electronic device 10 and the terminal 3 a ′ of the circuit board 3 ′ are electrically connected one to one by the contact sheet 20 has been described. However, the present invention is not limited thereto. For example, as shown in FIG. 20, a plurality of terminals 10a of the electronic device 10 are electrically connected to the common terminal 3a 'of the circuit board 3'. It is also good. For example, the power supply terminal and the ground terminal of the electronic device 10 may be configured by a plurality of terminals 10 a in order to satisfy a desired current capacity. Therefore, FIG. 20 shows an example in which the power supply terminal and the ground terminal are constituted by four terminals 10a, and the four terminals 10a are electrically connected to one terminal 3a 'of the circuit board 3'. There is. In this case, the second connection surfaces 32 of the adjacent electrodes 30 which are a part of the plurality of electrodes 30 present in the contact sheet 20 are mutually connected and integrated. Such a contact sheet 20 does not form the temporary second recess 52 between the electrodes 30 adjacent to each other in step S4, that is, in step S2, a second resist is formed on the target portion of the second resist layer 72. It can be obtained by not forming the layer opening 72a. In this case, the second recess 53 is not formed in the target portion even by the etching in step S7, and the second connection surface 32 shown in FIG. 20 substantially parallel to the second surface 50b of the metal base 50 is formed. be able to.

  In the embodiment shown in FIG. 20, solder balls 81 are placed on the respective first connection surfaces 31 of the electrodes 30, and the terminals 10a of the electronic device 10 and the electrodes 30 of the contact sheet 20 are electrically connected. Good. However, it is not limited to this. For example, by placing one solder ball 81 at an intermediate position of the four first connection surfaces 31 (that is, the first recess 51 located between the four electrodes 30), the four first connection surfaces 31 can be obtained. It also becomes possible to electrically connect to the terminals 10 a of the corresponding electronic devices 10 respectively. In this case, since the solder ball 81 is disposed in the first recess 51 between the four electrodes 30, the solder ball 81 can be stably held, and the handleability can be improved. The form in which the plurality of terminals 10a of the electronic device 10 are electrically connected to the common terminal 3a 'of the circuit board 3' is applied to the form of permanent connection using solder as shown in FIG. The present invention is not limited to the case described above, and can be applied to a mode in which the test circuit board 3 is temporarily connected to the test circuit board 3 without using solder as shown in FIG.

  Further, in the above-described embodiment, as shown in FIG. 21, in the contact sheet 20, the position of each electrode 30 is perpendicular to the normal direction of the contact sheet 20 (in the plane of the contact sheet 20). A regulating plate 90 may be further provided which regulates in the direction along (lateral direction in FIG. 21). Such a regulation plate 90 can be formed, for example, by providing a through hole 91 which allows the electrode 30 to penetrate through the insulating plate. Therefore, the electrode 30 can be easily aligned with the terminal 10a of the electronic device 10 or the terminal 3a of the circuit board 3 for inspection, and the reliability of the electrical connection can be improved.

  Further, in the above-described embodiment, the example in which the insulating layer is not formed on the second defining surface 35 has been described. However, this is not restrictive. For example, as shown in FIG. 22, the contact sheet 20 may further include a second insulating layer 100 joined to the second defining surface 35 and connecting the plurality of electrodes 30. In the embodiment shown in FIG. 22, the second insulating layer 100 is formed on the second defining surface 35 and the surface on the side of the second connection surface 32 of the insulating layer 40. Such a second insulating layer 100 can further improve the strength against the pressing force along the normal direction of the contact sheet 20. Therefore, the electrode 30 can be further prevented from falling off the insulating layer 40. Such a second insulating layer 100 can be formed, for example, of polyimide in the same manner as the insulating layer 40, and, for example, after the step (step S7) in which the second recess 53 shown in FIG. It is preferable to form before the process (step S8) of removing the insulating layer 40 on the 1st connection surface 31 shown in FIG. When the second insulating layer 100 is also formed on the second connection surface 32, it is preferable to remove the second insulating layer 100 on the second connection surface 32 in step S8.

  As mentioned above, although the embodiment of the present invention has been described in detail, the manufacturing method of the electrode sheet and the electrode sheet according to the present invention is not limited to the above embodiment at all, and the scope without departing from the spirit of the present invention Various changes are possible in.

DESCRIPTION OF SYMBOLS 1 electrical inspection apparatus 2 fixing stand 3 circuit board 3a for inspection 3 terminal 4 pressing tool 5 rubber elastic sheet 10 electronic device 10a terminal 20 contact sheet 30 electrode 31 1st connection surface 32 2nd connection surface 33 protrusion 34 1st definition surface 35 Second demarcation surface 40 Insulating layer 41 notched portion 50 metal base 50a first surface 50b second surface 51 first recess 51a wall surface 52 provisional second recess 53 second recess 53a wall surface 54 ridge portion 60 plating layer 61 nickel plating layer 62 Gold-Plated Layer 71 First Resist Layer 71a First Resist Layer Opening 72 Second Resist Layer 72a Second Resist Layer Opening 80, 81 Solder Ball 90 Regulating Plate 91 Through Hole 100 Second Insulating Layer

Claims (16)

An electrode sheet disposed between a connection target and a circuit board electrically connected to the connection target, for electrically connecting the terminal to be connected and the terminal of the circuit board ,
A plurality of electrodes formed of a metallic material, spaced apart from one another;
An insulating layer connecting a plurality of the electrodes;
The electrode is provided between a first connection surface, a second connection surface provided on the side opposite to the first connection surface, and the first connection surface and the second connection surface, and the electrode sheet And a projection projecting in a direction orthogonal to the normal direction of the
The insulating layer is bonded to the protrusion of the electrode ;
The protrusion of the electrode is a first defining surface provided on the side of the first connection surface, the first defining surface being a part of a curved surface that is convex toward the second connection surface in the normal direction; A second defining surface provided on the side of the second connecting surface, which is a part of a curved surface that is convex toward the first connecting surface in the normal direction, is defined. Electrode sheet. The electrode sheet according to claim 1 , wherein the insulating layer is bonded to the first defining surface of the protrusion. The electrode sheet according to claim 2 , further comprising a second insulating layer joined to the second defined surface of the protrusion and connecting a plurality of the electrodes. The electrode sheet according to any one of claims 1 to 3 , wherein a plating layer is provided on the first connection surface and the second connection surface of the electrode. The said 1st connection surface of the said electrode is protruded and arrange | positioned on the opposite side to the side of the said 2nd connection surface rather than the said insulating layer, It is arrange | positioned in any one of the Claims 1 thru | or 4 characterized by the above-mentioned. The electrode sheet of description. The electrode according to any one of claims 1 to 5 , wherein the second connection surfaces of the adjacent electrodes, which are a part of the plurality of electrodes, are adjacent to each other. Electrode sheet. The electrode sheet according to any one of claims 1 to 6 , further comprising a restricting plate which restricts the position of the electrode in a direction orthogonal to the normal direction. A method of manufacturing an electrode sheet disposed between an inspection object and a circuit board electrically connected to the inspection object, for electrically connecting the terminal to be inspected and the terminals of the circuit board And
Preparing a metal substrate having a first surface and a second surface provided opposite to the first surface;
Etching the metal substrate from the side of the first surface to form a first recess on the side of the first surface;
Forming an insulating layer on the wall surface of the first recess;
After the step of forming the insulating layer, the metal base is etched from the side of the second surface to form a second recess connected to the first recess on the side of the second surface, Forming a plurality of electrodes spaced apart from one another and connected by the insulating layer,
The electrode formed in the step of forming the electrode includes a first connection surface, a second connection surface provided on the opposite side to the first connection surface, the first connection surface, and the second connection surface. And a protruding portion provided in the direction perpendicular to the normal direction of the electrode sheet, and the insulating layer is bonded to the protruding portion of the electrode. The manufacturing method of the electrode sheet characterized by the above. The wall surface of the first concave portion formed in the step of forming the first concave portion is formed in a curved shape which is convex toward the second surface side of the metal base in the normal direction,
The wall surface of the second recess formed in the step of forming the electrode is formed in a curved shape that is convex toward the first surface side of the metal base in the normal direction,
The projection of the electrode is defined by a first defining surface forming a part of a wall surface of the first recess and a second defining surface forming a part of the second recess. The manufacturing method of the electrode sheet of Claim 8 . 10. The method according to claim 9 , further comprising the step of forming a second insulating layer joined to the second defining surface of the protrusion and connecting a plurality of the electrodes after the step of forming the electrode. The manufacturing method of the electrode sheet as described in-. After the step of forming the first recess, before the step of forming the insulating layer, the metal base material is etched from the side of the second surface, and the first recess is formed on the side of the second surface. Further comprising the step of forming a temporary second recess not connected to the
The method of manufacturing an electrode sheet according to any one of claims 8 to 10 , wherein the temporary second recess is etched to form the second recess in the step of forming the electrode. The method according to claim 11 , wherein the second surface of the metal base is etched together with the temporary second recess in the step of forming the electrode. After the step of forming the electrode, the first connection surface and on the second connecting plane of the electrode, further any one of claims 8 to 12, characterized in that it comprises a step of forming a plating layer The manufacturing method of the electrode sheet as described in one term. In the step of forming the insulating layer, the insulating layer is formed by applying a liquid insulating material on the first surface of the metal base and the wall surface of the first recess,
The electrode according to any one of claims 8 to 13 , wherein after the step of forming the insulating layer, a portion of the insulating layer corresponding to the first connection surface of the electrode is removed. Sheet manufacturing method. The method according to any one of claims 8 to 14 , wherein, in the step of forming the electrodes, the second connection surfaces of the adjacent electrodes which are a part of the plurality of electrodes and are adjacent to each other are integrated. The manufacturing method of the electrode sheet as described in any one of these. The electrode sheet according to any one of claims 8 to 15 , further comprising the step of attaching a restricting plate for restricting the position of the electrode in a direction orthogonal to the normal direction to the electrode. Manufacturing method.

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