JP2019211357A - Method for producing probe pin support - Google Patents

Abstract

To provide a method for producing a probe pin support in which the probe pin housing hole is not blocked by the excess cured product even if shaped using a three-dimensional CAD data of the probe pin support having a probe pin housing hole (three-dimensional structure) as it is.SOLUTION: The probe pin support 1b having a probe pin housing hole 4 formed for accommodating the probe pin 5 is formed by stacking the cured resin layer 8 by irradiating light to the photocurable resin of a liquid. Then, in the probe pin housing hole 4, a rib 12 supporting the probe pin 5 is formed. The rib 12 has a pin support portion 13 with which the probe pin 5 is in contact. Then, around the pin support portion 13, a space that allows the liquid flow of the photocurable resin owing to the fall of its own weight is formed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of manufacturing a probe pin support that supports a probe pin that contacts a terminal of an electronic component during an electrical test of the electronic component.

  For example, QFP (Quad Flat Package), which is a kind of semiconductor package for electronic components, has a quadrangular outer shape, and a plurality of connection terminals protrude from the four sides, and the arrangement interval between the connection terminals is narrowed. Has been.

  FIG. 12A is a diagram showing a simplified relationship between the IC socket 101 used for the electrical test of the electronic component 100 and the electronic component 100. As shown in FIG. 12A, the IC socket 101 accommodates the probe pin 103 that contacts the terminal 102 of the electronic component 100 in the probe pin accommodation hole 105 of the probe pin support 104 made of an insulating resin material. (See Patent Document 1).

  In such an IC socket 101 used for the electrical test of the electronic component 100, the arrangement interval of the probe pins 103 contacting the terminals 102 of the electronic component 100 during the electrical test of the electronic component 100 is reduced, and the probe The pin 103 itself is thin, and it is difficult to process the socket body 104 that accommodates and supports the probe pin 103. In order to solve such a problem in manufacturing the IC socket 101, it is conceivable to manufacture the socket body 104 by an optical modeling method which is one of the layered modeling methods.

  An optical modeling method, which is one of the conventionally known layered modeling methods, is a modeling table in which light (for example, laser light) is applied to a liquid photocurable resin in a container in a curing process, and light is applied. The lower layer of the photo-curable resin is cured, and then the second-layer liquid photo-curable resin is supplied under the first layer of the photo-curable resin that is moved by moving the modeling table. Light is applied to the liquid photocurable resin of the second layer, the photocurable resin of the second layer exposed to light is cured, and such an operation is repeated up to the N layer to obtain a desired optically shaped article ( A three-dimensional structure) is formed.

  FIG. 12 (b) is a diagram illustrating a problem occurrence state when the second probe pin support body 104b of the socket body 104 having the first to third probe pin support bodies 104a to 104c is manufactured by an optical modeling method. is there. As shown in FIG. 12B, when the second probe pin support 104b is manufactured by an optical modeling method, the probe pin accommodation hole 105 is a fine hole (for example, a round hole having a diameter of 0.1 mm). The liquid photocurable resin adhering in the probe pin accommodation hole 105 is cured by light irradiation, and an excessively cured product 106 is formed in the probe pin accommodation hole 105, and the probe pin accommodation hole 105 is closed with the excess cured product 106. May occur.

  Therefore, as a technique for preventing the occurrence of such a problem that such a fine hole (probe pin accommodation hole 105) is blocked by the excessively cured product 106, the light of the stereolithography product 200 having the fine hole 201 as shown in FIG. A modeling method was developed. In the stereolithography shown in FIG. 13, the contour data for stereolithography (first contour) obtained by rotating the three-dimensional CAD data of the stereolithography object 200 by 90 ° so that the extending direction of the fine holes 201 is parallel to the laminated surface. Layer to n-th slice data), and modeling proceeds sequentially from the first layer to the n-th layer based on the contour data (see Patent Document 2).

Japanese Patent No. 5597108 JP 2003-245982 A

  However, when the second probe pin support 104b is manufactured by applying the stereolithography shown in FIG. 13, it is suppressed that the probe pin accommodation hole 105 as the fine hole 201 is blocked by the excessively hardened material. Since the excessively hardened material tends to accumulate in the stacking direction, there is a problem that the roundness of the probe pin housing hole 105 is lowered.

  Therefore, according to the present invention, even if the 3D CAD data of the probe pin support (3D structure) having the probe pin accommodation hole is used as it is, the probe pin accommodation hole is blocked with an excessively hardened material. It is an object of the present invention to provide a method for producing a probe pin support having no gap.

  The present invention relates to a method of manufacturing a probe pin support 1b in which a probe pin housing hole 4 for housing a probe pin 5 that contacts a terminal 7 of an electronic component 6 during an electrical test of the electronic component 6 is formed. In the present invention, the probe pin support 1b is formed by stacking the resin layers 8 cured by irradiating the liquid photocurable resin 16 with light 27. Further, ribs 12, 28, 35, 37, 41, 43 for supporting the probe pin 5 are formed in the probe pin accommodation hole 4. The ribs 12, 28, 35, 37, 41, and 43 have pin support portions 11, 13, 34, 38, and 44 with which the probe pin 5 abuts. Spaces 14, 32, 40, 42, 45 are formed around the pin support portions 11, 13, 34, 38, 44 to allow the liquid photocurable resin 16 to flow due to its own weight drop. The

  According to the method for manufacturing a probe pin support according to the present invention, even if the three-dimensional CAD data of the probe pin support having a probe pin accommodation hole is used as it is, the probe pin accommodation hole is blocked with an excessively hardened material. Therefore, it is possible to easily create a probe pin support body having a highly accurate probe pin housing hole.

It is a figure of IC socket which has the probe pin support formed by the manufacturing method of the probe pin support concerning a 1st embodiment of the present invention. It is a figure explaining the probe pin support body formed by the manufacturing method of the probe pin support body which concerns on 1st Embodiment of this invention, Fig.2 (a) is a partial top view of a probe pin support body, FIG. FIG. 2B is a cross-sectional view of the probe pin support shown cut along the line A1-A1 in FIG. 2A, and FIG. 2C is a partial back view of the probe pin support. It is a figure which shows the hardening process of the optical modeling method which is a manufacturing method of the probe pin support body which concerns on 1st Embodiment of this invention. It is a figure for demonstrating the 1st modification of the probe pin support body formed by the manufacturing method of the probe pin support body which concerns on 1st Embodiment of this invention. It is a figure for demonstrating the 2nd modification of the probe pin support body formed by the manufacturing method of the probe pin support body which concerns on 1st Embodiment of this invention. It is a figure for demonstrating the 3rd modification of the probe pin support body formed by the manufacturing method of the probe pin support body which concerns on 1st Embodiment of this invention. It is a figure for demonstrating the probe pin support formed by the manufacturing method of the probe pin support which concerns on 2nd Embodiment of this invention. It is a figure for demonstrating the 1st modification of the probe pin support body formed by the manufacturing method of the probe pin support body which concerns on 2nd Embodiment of this invention. It is a figure for demonstrating the 2nd modification of the probe pin support body formed by the manufacturing method of the probe pin support body which concerns on 2nd Embodiment of this invention. It is a figure for demonstrating the probe pin support formed by the manufacturing method of the probe pin support which concerns on 3rd Embodiment of this invention. It is a figure for demonstrating the probe pin support formed by the manufacturing method of the probe pin support which concerns on 4th Embodiment of this invention. FIG. 12A is a diagram showing a simplified relationship between a conventional IC socket and an electronic component, and FIG. 12B is a problem occurrence state when the probe pin support body of the socket body is manufactured by an optical modeling method. FIG. It is a figure explaining the modeling method of the optical modeling thing which has the conventional fine hole.

[First Embodiment]
Hereinafter, a method for producing a probe pin support according to the present invention will be described in detail with reference to the drawings.

(IC socket)
FIG. 1 is a diagram of an IC socket 2 having a probe pin support 1 formed by the method for manufacturing a probe pin support 1 according to the first embodiment of the present invention (a cross-sectional view showing the IC socket 2 in a simplified manner). is there.

  As shown in FIG. 1, in the IC socket 2, a probe pin accommodation hole 4 is formed in the probe pin support 1 of the socket body 3 made of an insulating resin material, and the probe pin 5 is accommodated in the probe pin accommodation hole 4. Then, the probe pin 5 is brought into contact with the terminal 7 of the electronic component 6 to perform an electrical test of the electronic component 6. The socket body 3 includes first to third probe pin supports 1a to 1c. And the manufacturing method of the probe pin support body 1 which concerns on this embodiment demonstrates the manufacturing method for the 2nd probe pin support body 1b as an example. The method for manufacturing the second probe pin support 1b can be applied to the formation of the first probe pin support 1a and the third probe pin support 1c. Further, in the present embodiment, the socket body 3 is configured by three blocks of the first to third probe pin supports 1a to 1c, but is not limited to this, and is independent (one block) ) Or a plurality of blocks (2 blocks, 4 blocks, 5 blocks, etc.). In the following description, the second probe pin support 1b is simply referred to as a probe pin support 1b.

(Probe pin support)
FIG. 2 is a diagram illustrating the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the first embodiment of the present invention. FIG. 2A is a partial plan view of the probe pin support 1b. FIG. 2B is a cross-sectional view of the probe pin support 1b shown cut along the line A1-A1 in FIG. FIG. 2C is a partial rear view of the probe pin support 1b.

  As shown in FIG. 2, the probe pin support 1b is formed by stacking a plurality of layers (from the first layer to the nth layer) of resin layers 8 cured by light irradiation, and used in a state where the front and back sides are reversed (FIG. 2). 1). In the probe pin support 1b, probe pin accommodation holes 4 are formed from the first layer to the n-th layer. The probe pin accommodation hole 4 includes a probe pin accommodation space 10 formed from the first layer to the (n-1) th layer, and a guide hole 11 formed in the nth layer. The probe pin accommodating space 10 is a cylindrical space having a hole diameter for accommodating the probe pins 5 with a sufficient gap, and a plurality of ribs 12 are arranged at equal intervals around the center CL of the probe pin accommodating hole 4 (90 4 places are arranged at intervals of °). The rib 12 extends from the inner peripheral surface 10a of the probe pin housing space 10 toward the center CL of the probe pin housing hole 4, and along the stacking direction of the resin layer 8 (the -Z direction in FIG. 2B). The first layer to the (n-1) th layer are formed to extend. The tip of the rib 12 (tip on the center CL side of the probe pin housing hole 4) has an arc shape so that the shape in plan view comes into contact with the outer peripheral surface of the probe pin 5, and the probe pin 5 is in the correct posture. It becomes the pin support part 13 supported by. And the circumference | surroundings of the pin support part 13 are the some fan-shaped spaces 14 located between the adjacent ribs 12 and 12, and these several spaces 14 are at the time of optical modeling (at the time of implementation of the manufacturing method of the probe pin support body 1b). ) Allows the liquid photocurable resin to flow due to its own weight drop. The guide hole 11 is a round hole fitted with the probe pin 5 with a slight gap. In addition, although this embodiment illustrated the structure which forms the rib 12 in four places around the center CL of the probe pin accommodation hole 4 at equal intervals, it is not restricted to this, In two places or multiple places, such as three places, The structure to form may be sufficient. Further, the tip of the rib 12 is not limited to the shape in plan view that is arcuate, and may be any shape that can support the probe pin 5. For example, the shape in plan view may be linear. The shapes of the probe pin housing space 10 and the guide hole 11 may be changed according to the shape of the probe pin 5 and the like.

  For example, when the diameter d1 of the probe pin housing space 10 in the resin layer 8 of the first layer to the (n−1) th layer is 0.30 mm, the probe pin support 1b having the above structure is The hole diameter d2 of the guide hole 11 in the resin layer 8 is 0.1 mm. In the probe pin support 1b, the thickness t of each resin layer 8 from the first layer to the n-th layer is 0.05 mm. In addition, the dimension of each part of such a probe pin support body 1b is for facilitating understanding of the manufacturing method of the probe pin support body 1b according to the present embodiment and the probe pin support body 1b manufactured by this manufacturing method. It is an illustration and does not limit the manufacturing method of the probe pin support 1b which concerns on this invention at all.

(Curing process of stereolithography)
FIG. 3 is a diagram illustrating a curing process of an optical modeling method that is a method for manufacturing the probe pin support 1b according to the first embodiment of the present invention. As shown in FIG. 3, in the method for manufacturing the probe pin support 1b according to the present embodiment, a photo-curing resin 16 having a liquid insulating property in the container 15 (for example, SCR712X, SCR735, SCR737 manufactured by DEMEC). SCR780, SCR785, SCR955, KC1281, DL360 which is a DWS resin from Seaforce, TSR-883W, TSR-884B, TSR-832 from Seamet, Somos NanoTool from DMS, etc.) The liquid photocurable resin layer 16 for one layer is positioned under the support 18 of the modeling table 17 (FIG. 3A). In FIG. 3, the 3D printer (layered manufacturing apparatus) 20 used in the method for manufacturing the probe pin support 1 b has 3D data (three-dimensional CAD data) 21 corresponding to the probe pin support 1 b as a control controller (CPU). When the data is input to 22, the input 3D data 21 is processed by the operation control software in the controller 22, and a control signal is output from the controller 22 to the first stepping motor 23 for raising and lowering the modeling table 17. At the same time, a control signal is output from the controller 22 to the second stepping motor 26 serving as a drive unit for the movement guide means 25 of the light irradiation means 24, and light 27 (for example, laser light) is sent from the controller 22 to the light irradiation means 24. ) Is output to control the irradiation.

  Next, in the method of manufacturing the probe pin support 1b according to the present embodiment, the light 27 is irradiated from the light irradiation means 24 onto the liquid photocurable resin 16 located under the support 18 of the modeling table 17, and the light 27 The photo-curable resin layer 16a1 corresponding to one layer is cured (FIG. 3B). Thereby, the first resin layer 8 having the probe pin accommodating space 10 and the plurality of ribs 12 is formed.

  Next, in the method for manufacturing the probe pin support 1b according to the present embodiment, the modeling table 17 is raised, and a second layer of liquid photocurable resin is formed under the cured first photocurable resin layer 16a1. 116 is supplied, and light 27 is irradiated to the liquid photocurable resin 16 of the second layer, and the second photocurable resin layer 16a2 irradiated with the light 27 is cured (FIG. 3C). Thereby, the second resin layer 8 having the probe pin accommodating space 10 and the plurality of ribs 12 is formed. Such an operation is repeated up to n-1 layers.

  Next, in the method for manufacturing the probe pin support 1b according to the present embodiment, the modeling table 17 is raised, and the nth layer is formed under the cured n−1th photocurable resin layer 16a (n−1). The liquid photocurable resin 16 is supplied, and the n-th layer liquid photocurable resin 16 is irradiated with light 27 to cure the nth photocurable resin layer 16an irradiated with the light 27 ( FIG. 3 (c)). Thereby, the nth resin layer 8 having the guide holes 11 is formed.

  In the method of manufacturing the probe pin support 1b according to the present embodiment as described above, in the step of forming the first layer to the (n-1) th resin layer 8, the periphery of the pin support portion 13 positioned at the tip of the rib 12 is used. Since the space 14 allows the liquid photo-curing resin 16 to flow due to its own weight drop, the excessively hardened material does not easily accumulate in the stacking direction, and the probe pin accommodation hole 4 is not blocked by the excessively hardened material.

  As described above, in the method for manufacturing the probe pin support 1b according to the present embodiment, the probe pin support 1b shown in FIG. 2 is formed by sequentially stacking the first to nth resin layers 8. To do. In the curing step of the manufacturing method of the probe pin support 1b, the irradiation range (photocuring range) of the light 27 with respect to the liquid photocurable resin 16 is the 3D data 21 of the probe pin support 1b shown in FIG. 3D data that is not corrected as in the conventional example).

(Effect of this embodiment)
As described above, according to the method of manufacturing the probe pin support 1b according to the present embodiment, the pin support portion 13 located at the tip of the rib 12 in the formation process of the resin layer 8 of the first layer to the (n-1) th layer. A plurality of spaces 14 are formed around the outer periphery of the substrate, and the plurality of spaces 14 enable the liquid photocurable resin 16 to flow due to its own weight drop. It is difficult to collect around the support portion 13. As a result, in the method for manufacturing the probe pin support 1b according to the present embodiment, the periphery of the probe pin accommodation hole 4 and the pin support portion 13 of the rib 12 is not blocked by the excessively hardened material during the optical modeling ( First effect).

  Further, according to the method for manufacturing the probe pin support 1b according to the present embodiment, the 3D data (three-dimensional CAD data) 21 of the probe pin support 1b having the probe pin accommodating hole 4 is used as it is (the conventional example). Even if modeling without converting such three-dimensional CAD data into contour data for modeling), the periphery of the pin support portion 13 of the probe pin housing hole 4 and the rib 12 is not clogged with surplus hardened material, The probe pin support 1b having the high-precision probe pin accommodation hole 4 and the high-precision rib 12 can be easily produced (second effect).

  Further, according to the method for manufacturing the probe pin support 1 b according to the present embodiment, the nth resin layer 8 in which the guide hole 11 is formed can be reinforced by the plurality of ribs 12 in the probe pin housing space 10. Yes (third effect).

(First modification of the first embodiment)
FIG. 4 is a view for explaining a first modification of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the first embodiment. FIG. 4A is a partial plan view of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the first modification. FIG. 4B is a sectional view of the probe pin support 1b shown cut along the line A2-A2 of FIG.

  As shown in FIG. 4, the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the first modification has the first to n-3th resin layers 8 shown in FIG. The probe pin support 1b has the same structure as the first to (n-1) th resin layers 8, and a plurality of ribs 12 are formed in the probe pin housing space 10, and the tips of the ribs 12 are connected to the probe pins. 5 is a pin support portion 13 that comes into contact with 5. A space 14 is formed around the pin support portion 13 to allow the liquid photocurable resin to flow due to its own weight drop.

  In the probe pin support 1b according to this modification, a guide hole 11 is formed in the (n-2) th resin layer 8, and a probe pin accommodating space 10 is formed in the (n-1) th layer and the nth resin layer 8. Is formed. The probe pin accommodation hole is composed of two probe pin accommodation spaces 10 and 10 and a guide hole 11.

  The manufacturing method of the probe pin support 1b according to the present modification can obtain the same effects as those of the probe pin 1b according to the first embodiment.

(Second modification of the first embodiment)
FIG. 5 is a view for explaining a second modification of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the first embodiment. FIG. 5A is a partial plan view of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the second modification. FIG. 5B is a cross-sectional view of the probe pin support 1b shown cut along the line A3-A3 in FIG.

  As shown in FIG. 5, the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the second modification is the n-1th layer of the probe pin support 1b according to the first modification. In the probe pin housing space 10 of the n-th resin layer 8 and in the probe pin housing space 10 of the first to n-3th resin layers 8 of the probe pin support 1b according to the first modification. The structure in which the rib 12 similar to the formed rib 12 is formed is different from the probe pin support 1b according to the first modification, but the other structure is the same as the probe pin support 1b according to the first modification. is there. In the probe pin support 1b shown in FIG. 5, the same components as those of the probe pin support 1b shown in FIG.

  The method for manufacturing the probe pin support 1b according to the second modified example can obtain the same effect as the method for manufacturing the probe pin support 1b according to the first modified example. The strength of the (n-2) th layer resin layer 8 formed with can be further enhanced, and the durability of the probe pin support 1b can be further improved.

(Third Modification of First Embodiment)
FIG. 6 is a view for explaining a third modification of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the first embodiment. FIG. 6A is a partial plan view of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the third modification. FIG. 6B is a cross-sectional view of the probe pin support 1b shown cut along the line A4-A4 of FIG.

  As shown in FIG. 6, the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the third modification is the same as the probe pin support 1b according to the first embodiment shown in FIG. The probe pin support according to the first embodiment in that the structure of the first layer to the (n-1) th layer extends to the nth resin layer 8, and no guide hole 11 is formed in the nth resin layer 8. Although different from 1b, other configurations are the same as the probe pin support 1b according to the first embodiment. And the probe pin support body 1b which concerns on a 3rd modification has the probe pin accommodation hole 4 comprised only by the probe pin accommodation space 10. FIG. In the probe pin support 1b shown in FIG. 6, the same components as those of the probe pin support 1b shown in FIG.

  The method for manufacturing the probe pin support 1b according to the third modification can obtain the same effects as the first and second effects in the method for manufacturing the probe pin support 1b according to the first embodiment. .

[Second Embodiment]
FIG. 7 is a view for explaining the probe pin support 1 formed by the method for manufacturing the probe pin support 1 according to the second embodiment of the present invention. FIG. 7A is a partial plan view of the probe pin support 1b. Moreover, FIG.7 (b) is sectional drawing of the probe pin support body 1b shown cut | disconnected along the A5-A5 line | wire of Fig.7 (a). FIG. 7C is a partial rear view of the probe support 1b.

  As shown in FIG. 7, the probe pin support 1b is formed by stacking a plurality of resin layers 8 (from the first layer to the n-th layer) that are cured by light irradiation, and the first to n-th resin layers are stacked. 8, a probe pin housing space 10 is formed. A pair of ribs 28 and 28 are formed on the inner peripheral surface 10a of the probe pin housing space 10 of the third layer and the (n-2) th layer formed at intervals in the stacking direction of the resin layer 8, respectively. Yes. As shown in FIG. 7A, the pair of ribs 28 has a distal end surface 31 that extends along a center line 30 that passes through the center CL of the probe housing space 10 and is parallel to the X axis. The interval between 31 is formed to be the same as the outer diameter of the probe pin 5. Thereby, a space 32 having a groove width equal to the outer diameter of the probe pin 5 is formed between the pair of ribs 28, 28 from the center CL of the probe pin housing space 10 to the inner peripheral surface 10a of the probe pin housing space 10. It extends along the center line 30. The space 32 between the pair of ribs 28 and 28 in the third resin layer 8 and the space 32 between the pair of ribs 28 and 28 in the n-2th resin layer 8 are the probe pin accommodating space 10. It is formed so as to intersect at right angles to the center CL of. As a result, when the probe pin support 1b is viewed in plan as shown in FIG. 7A, the space 32 in the third resin layer 8 and the space 32 in the n-2th resin layer 8 intersect. The portion becomes a quadrangular shape circumscribing the probe pin 5, and the probe pin 5 can be supported in a correct posture.

  As shown in FIG. 7A, the pair of ribs 28, 28 in the third resin layer 8 pass through the center CL of the probe pin housing space 10 and parallel to the Y axis in the tip surface 31. A portion located on the center line 33 extending in the direction becomes a pin support portion 34 that comes into contact with the probe pin 5, and this pin support portion 34 becomes the tip on the center CL side of the probe pin accommodation space 10 (tip of the rib 28). Further, as shown in FIG. 7B, the pair of ribs 28 and 28 in the (n−2) -th layer resin layer 8 pass through the center CL of the probe pin housing space 10 in the tip surface 31 and the X-axis. A portion located on the center line 30 extending in parallel is a pin support portion 34 that abuts on the probe pin 5, and this pin support portion 34 is a tip on the center CL side of the probe pin accommodation space 10 (tip of a rib). A space 32 is formed around the pin support portion 34 of the pair of ribs 28 and 28 in the resin layer 8 of the third layer and the (n−2) -th layer to allow the liquid photocurable resin to flow due to its own weight drop. Is formed. The probe pin support 1b according to the present embodiment having such a configuration is formed in the same manner as the curing process of the optical modeling method shown in FIG. In the probe pin support 1b according to this embodiment, since the guide hole 11 of the probe pin support 1b according to the first embodiment is not formed, the probe pin accommodation hole 4 is configured only by the probe pin accommodation space 10. . In addition, the probe pin support 1b according to the present embodiment exemplifies a configuration in which the pair of ribs 28 and 28 are formed in the third layer and the (n-2) th layer. A pair of ribs 28 may be formed on each of the plurality of resin layers 8.

  As described above, according to the method for manufacturing the probe pin support 1b according to the present embodiment, the space around the pin support portion 34 of the pair of ribs 28 and 28 in the resin layer 8 of the third layer and the (n-2) th layer. 32 is formed, and this space 32 allows the liquid photo-curing resin to flow due to its own weight drop, so that the excessively hardened material is not easily accumulated in the probe pin housing space 10 and the space 32. As a result, in the method for manufacturing the probe pin support 1b according to the present embodiment, the probe pin housing space 10 and the space 32 are not blocked by the excessively hardened material during the optical modeling (first effect).

  Further, according to the method for manufacturing the probe pin support 1b according to the present embodiment, the 3D data (three-dimensional CAD data) 21 of the probe pin support 1b having the probe pin accommodating space 10 is used as it is (the conventional example). Even if modeling is performed (without converting such three-dimensional CAD data into contour data for modeling), the space 32 around the probe pin housing space 10 and the pin support portion 34 is not blocked by the excessively cured product, The probe pin support 1b having the high-precision probe pin housing space 10 and the pair of high-precision ribs 28 and 28 can be easily produced (second effect).

(First Modification of Second Embodiment)
FIG. 8 is a view for explaining a first modification of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the second embodiment. FIG. 8A is a partial plan view of the probe pin support 1b according to the first modification. FIG. 8B is a cross-sectional view of the probe pin support 1b shown cut along the line A6-A6 in FIG. FIG. 8C is a partial rear view of the probe pin support 1b according to the first modification.

  As shown in FIG. 8, the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the present modification includes the first layer and the second layer of the probe pin support 1b according to the second embodiment. Lamination direction ribs 35 extending along the center line 33 from the inner peripheral surface 10 a of the probe pin accommodation space 10 to the pin support portion 34 of the rib 28 are formed in the probe pin accommodation space 10 in the resin layer 8 of the layer. Further, the probe pin support 1b according to the present modification is provided in the probe pin housing space 10 in the n-1th layer and the nth resin layer 8 of the probe pin support 1b according to the second embodiment. Lamination direction ribs 35 extending along the center line 30 from the inner peripheral surface 10a of the probe pin accommodating space 10 to the pin support portions 34 of the ribs 28 are formed. In the stacking direction ribs 35, the tip on the center CL side of the probe pin accommodating space 10 is a pin support portion 36, and this pin support portion 36 is in contact with the probe pin 5 together with the pin support portion 34 of the rib 28. To do. In addition, the probe pin support 1b which concerns on this modification attaches | subjects the same code | symbol to the same component as the probe pin support 1b which concerns on the said 2nd Embodiment, and overlaps with the probe pin which concerns on the said 2nd Embodiment. Is omitted.

  The manufacturing method of the probe pin support 1b according to this modification example can obtain the same effect as the manufacturing method of the probe pin support 1b according to the second embodiment. , 28 can be strengthened by the lamination direction ribs 35, 35, and the durability of the probe pin support 1b can be further improved.

(Second Modification of Second Embodiment)
FIG. 9 is a view for explaining a second modification of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the second embodiment of the present invention. FIG. 9A is a partial plan view of the probe pin support 1b of the present modification. FIG. 9B is a cross-sectional view of the probe pin support 1b shown cut along the line A7-A7 in FIG. FIG. 9C is a cross-sectional view of the probe pin support 1b cut along the line A8-A8 in FIG. 9B. FIG. 9D is a cross-sectional view of the probe pin support 1b shown cut along the line A9-A9 in FIG. 9B. FIG. 9E is a cross-sectional view of the probe pin support 1b shown cut along the line A10-A10 in FIG. 9B.

  As shown in FIG. 9, the probe pin support 1b according to the present modification is formed by stacking first to n-th resin layers 8 cured by light irradiation. The second layer, the fifth layer The rib 37 is formed in the layer and the (n-2) th resin layer 8. These ribs 37 are formed at intervals in the laminating direction of the resin layer 8, extend from the inner peripheral surface 10 a of the probe pin housing space 10 toward the center CL of the probe pin housing space 10, and the tip surface 38 has a probe surface 38. The arc surface is in contact with the outer periphery of the pin 5, and a part thereof is notched by the fan-shaped notch 40. Further, the ribs 37 of the second layer, the fifth layer, and the n-2th layer have the notch portions 40 that are shifted every 120 ° around the center CL of the probe pin accommodating space 10 to support the pins. The tip end surface 38 as a part is positioned around the center CL of the probe pin accommodating space 10. The tip surfaces 38 of the ribs 37 in the second layer, the fifth layer, and the (n−2) th layer resin layer 8 are overlapped along the stacking direction of the resin layer 8 as shown in FIG. If it is, it becomes a round hole, and it becomes possible to support the probe pin 5 in a correct posture. The probe pin accommodation hole 4 is composed of only the probe pin accommodation space 12. In the probe pin support 1b according to this modification, the rib 37 is formed on the second layer, the fifth layer, and the n-2th resin layer 8, but the present invention is not limited to this. Instead, the rib 37 may be formed on any resin layer 8 from the first layer to the n-th layer.

  As described above, according to the probe pin support 1b according to the present modification, the tip surface 38 of the rib 37 is a pin support portion that comes into contact with the probe pin 5, and a notch (space) is formed around the tip surface 38. 40 is formed, and the notch 40 enables the liquid photo-curing resin to flow due to its own weight drop, so that the excessively cured product is notched 40 (space) in the probe pin accommodating space 10 and around the distal end surface 38. ). As a result, in the method for manufacturing the probe pin support 1b according to the present embodiment, the notch 40 (space) around the probe pin housing space 10 and the distal end surface 38 is closed by surplus hardened material at the time of optical modeling. There is nothing.

  Further, according to the method for manufacturing the probe pin support 1b according to the present modification, the 3D data (three-dimensional CAD data) 21 of the probe pin support 1b having the probe pin accommodating space 10 is used as it is (the conventional example). Even if modeling is performed without converting such three-dimensional CAD data into modeling contour data, the notch 40 (space) around the probe pin housing space 10 and the distal end surface 38 is blocked with surplus cured material. Therefore, the probe pin support 1b having the high-accuracy probe pin housing space 10 and the high-accuracy rib 37 can be easily produced.

[Third Embodiment]
FIG. 10 is a view for explaining the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the third embodiment of the present invention. FIG. 10A is a partial plan view of the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the present embodiment. FIG. 10B is a cross-sectional view of the probe pin support 1b shown cut along the line A11-A11 in FIG. FIG. 10C is a partial rear view of the probe pin support 1b according to the present embodiment. FIG. 10D is a cross-sectional view showing a modification of the probe pin support 1b according to the present embodiment.

  As shown in FIGS. 10A to 10C, the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the present embodiment includes a first layer to an nth layer cured by light irradiation. The resin layers 8 are stacked and a probe pin housing space 10 is formed in the first to nth resin layers 8. The third to n-th resin layers 8 are formed with cross-shaped ribs 41 extending from the inner peripheral surface 10a of the probe pin housing space 10 toward the center CL of the probe pin housing space 10. A guide hole 11 having the same diameter as the probe pin 5 is formed at the center of the cross-shaped rib 41. The guide hole 11 serves as a pin support portion with which the probe pin 5 abuts. Further, four fan-shaped spaces 42 are formed between the cross-shaped rib 41 and the inner peripheral surface 10 a of the probe pin accommodating space 10. The four spaces 42 are located around the guide hole 11 and allow the liquid photocurable resin 16 to flow due to its own weight drop in the curing process of the optical modeling method shown in FIG. In the probe pin support 1b, a cross-shaped rib 41 is formed in the probe pin housing space 10 in the first to n-th resin layers 8, and the first layer to the first layer are formed at the center of the cross-shaped rib 41. A guide hole 11 penetrating up to the n layer may be formed, and a space 42 penetrating from the first layer to the n th may be formed around the guide hole 11. In the probe pin support 1b, a cross-shaped rib 41 may be provided on any resin layer 8 from the first layer to the n-th layer. For example, as shown in FIG. 10 (d), the probe pin support 1b is formed with a cross-shaped rib 41 in the probe pin housing space 10 of the third and fourth resin layers 8, and the nth- You may form the cross-shaped rib 41 in the probe pin accommodation space 10 of the resin layer 8 of the 1st layer and the n-th layer. The probe pin accommodation hole 4 is composed of a probe pin accommodation space 10 and a guide hole 11.

  According to the method for manufacturing the probe pin support 1b according to the present embodiment as described above, since the four spaces 42 are formed around the guide hole 11 of the cross-shaped rib 41, the light shown in FIG. In the molding process, the liquid photocurable resin 14 flows due to its own weight falling in the space 42, and the liquid photocurable resin 16 is unlikely to stay in the vicinity of the guide hole 11. As a result, the guide hole 11 and the probe pin housing space 10 of the cross-shaped rib 41 are not blocked by the excessively hardened material.

  Further, according to the method for manufacturing the probe pin support 1b according to this embodiment, the 3D data (three-dimensional CAD data) 21 of the probe pin support 1b having the guide hole 11 is used as it is (as in the conventional example). Even if the modeling is performed (without converting the three-dimensional CAD data into the contour line data for modeling), the probe hole support 1b having the highly accurate guide hole 11 is not blocked by the excessively hardened material. Easy to create.

[Fourth Embodiment]
FIG. 11 is a view for explaining the probe pin support 1b formed by the method for manufacturing the probe pin support 1b according to the fourth embodiment of the present invention. In addition, Fig.11 (a) is a partial top view of the probe pin support body 1b formed by the manufacturing method of the probe pin support body 1b which concerns on this modification. Moreover, FIG.11 (b) is sectional drawing of the probe pin support body 1b shown cut | disconnected along the A12-A12 line | wire of Fig.11 (a). FIG. 11C is a partial rear view of the probe pin support 1b.

  As shown in FIG. 11, in the probe pin support 1b according to the present embodiment, the probe pin housing hole 11 is formed in the seventh resin layer 8, and the probe pin housing space 10 of the fourth resin layer 8 is formed. Four oblique ribs 43 extending from the inner peripheral surface 10a to the opening edge of the guide hole 11 of the seventh resin layer 8 are formed around the center CL of the probe receiving hole 4 at equal intervals. The oblique rib 43 is a pin support portion 44 whose end on the resin layer 8 side of the seventh layer is in contact with the probe pin 5, supports the probe pin 5 together with the guide hole 11, and is formed with the guide hole 11. The seventh resin layer 8 is reinforced. The inclined rib 43 is provided with a space 45 between another adjacent oblique rib 43 and the inner peripheral surface 10 a of the probe pin accommodating space 10, and the space 45 is positioned around the pin support portion 44. The space 45 located around the pin support portion 44 enables the liquid photocurable resin 16 to flow due to its own weight drop in the curing process of the optical modeling method shown in FIG.

  According to the method for manufacturing the probe pin support 1b according to the present embodiment, the same effects as the first and second curing of the method for manufacturing the probe pin support 1b according to the first embodiment can be obtained. it can. In the probe pin support 1b according to the present embodiment, the guide hole 11 is formed in the seventh resin layer 8. However, the present invention is not limited to this. It is only necessary that the oblique ribs 43 are provided above the guide holes 11 so that the liquid photocurable resin 16 does not stay in the guide holes 11 and the vicinity thereof.

[Other Embodiments]
Further, in the description of the probe pin support 1b according to each of the above embodiments and modifications, the guide hole 11 is exemplified as having a circular planar shape, but is not limited thereto, and the cross-sectional shape of the probe pin 5 is not limited thereto. You may make it the planar shape of the shape (for example, square shape, elliptical shape, D cut shape, hexagonal shape etc.) according to. In addition, the probe pin accommodating space 10 has a circular or quadrangular planar shape, but is not limited thereto, and may be an arbitrary planar shape such as an elliptical shape or a hexagonal shape.

  1b (1): Probe pin support, 4: Probe pin receiving hole, 5: Probe pin, 6: Electronic component, 7: Terminal, 8 ... Resin layer, 12, 28, 35, 37, 41, 43 ... rib, 11, 13, 34, 38, 44 ... pin support, 14, 32, 40, 42, 45 ... space, 16 ... photo-curable resin, 27 ... light

Claims (5)

In the manufacturing method of the probe pin support body in which the probe pin accommodation hole for accommodating the probe pin that contacts the terminal of the electronic component during the electrical test of the electronic component is formed,
The probe pin support is formed by stacking resin layers cured by irradiating light to a liquid photocurable resin,
The probe pin housing hole is formed with a rib for supporting the probe pin,
The rib has a pin support portion with which the probe pin abuts,
Around the pin support portion, a space was formed that allowed the liquid photocurable resin to flow due to its own weight drop,
A method for manufacturing a probe pin support. A plurality of the ribs are formed around the center of the probe pin accommodation hole, and the tip on the center side of the probe pin accommodation hole is the pin support portion.
The method for producing a probe pin support according to claim 1. A plurality of the ribs are formed at intervals in the laminating direction of the resin layer, and the tip on the center side of the probe pin accommodation hole is the pin support portion.
The method for producing a probe pin support according to claim 1 or 2. The rib is formed so as to extend from the inner peripheral surface of the probe pin accommodation hole toward the center of the probe pin accommodation hole and along the lamination direction of the resin layer.
The method for producing a probe pin support according to claim 2. The pin support portions of the plurality of ribs are shifted around the center of the probe pin accommodation hole,
The method for manufacturing a probe pin support according to any one of claims 1 to 4.

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