JP2008232722A - Contactor mounting method and contactor mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contactor mounting method for sufficiently curing an adhesive in a short time when a contactor is fixed to a substrate. <P>SOLUTION: The contactor mounting method for mounting the silicon finger contactor 50 to the probe substrate 41 includes: an applying step for applying the adhesive to the substrate 41; a positioning step for positioning the silicon finger contactor 50 in a position 43 in which the adhesive is applied on the substrate 41; and an irradiating step for irradiating the adhesive 43 applied on the substrate 41 with a laser light having a wavelength of 1,200 nm or more through a base 51 and a beam 53 in the silicon finger contactor 50 comprising a silicon. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a probe card that establishes an electrical connection with an IC device when testing an electrical component such as a semiconductor integrated circuit (hereinafter also referred to as an IC device), and an input / output terminal of the IC device and an electrical TECHNICAL FIELD The present invention relates to a contactor mounting method and a contactor mounting apparatus for mounting a contactor for contact with a probe on a probe board.

  Many semiconductor integrated circuit elements are fabricated on a silicon wafer or the like, and then completed as electronic components through various processes such as dicing, bonding, and packaging. In such an IC device, an operation test is performed before shipment. This IC test is performed in a finished product state or a wafer state.

  When testing an IC device in a wafer state, as a probe needle for establishing an electrical connection with the IC device, a base portion attached to the probe substrate and a rear end side are provided on the base portion, and a front end side is provided from the base portion. 2. Description of the Related Art Conventionally, a device having a protruding beam portion and a conductive portion formed on the surface of the beam portion and in electrical contact with an input / output terminal of an IC device (hereinafter also simply referred to as “silicon finger contactor”). Known (for example, see Patent Documents 1 to 3).

  When manufacturing a probe card using such a silicon finger contactor, an ultraviolet curable adhesive is applied to a predetermined position of the probe substrate, the base part of the silicon finger contactor is positioned at the application position, and the base part is applied to the application position. In this state, the silicon finger contactor is fixed on the substrate by irradiating ultraviolet rays toward the application position.

  However, since ultraviolet rays hardly pass through silicon, the ultraviolet rays do not reach the shadowed part of the silicon finger contactor in the adhesive applied to the substrate during the above-mentioned ultraviolet irradiation, so that it does not cure sufficiently. In some cases, the mounting position of the silicon finger contactor is displaced, and sufficient mounting accuracy cannot be ensured.

  In particular, in order to prevent damage to the input / output terminals of the IC device at the time of contact with the silicon finger contactor, it is preferable to mount the silicon finger contactor on the substrate in a tilted position as much as possible. The more the silicon finger contactor is tilted, the more the adhesive applied to the substrate enters the shadow of the silicon finger contactor, and the above tendency becomes more prominent.

  For such a problem, after temporarily fixing the silicon finger contactor on the substrate by ultraviolet curing, the silicon finger contactor is fixed on the substrate by putting it in an oven and thermally curing the adhesive, It takes a long time to mount the silicon finger contactor on the substrate.

JP 2000-249722 A JP 2001-159642 A International Publication No. 03/071289 Pamphlet

  The problem to be solved by the present invention is to provide a contactor mounting method and a contactor mounting apparatus capable of sufficiently curing an adhesive in a short time when fixing the contactor to a substrate.

  In order to achieve the above object, according to a first aspect of the present invention, a contactor for mounting a contactor in electrical contact with an input / output terminal of the electronic device under test when testing the electronic device under test is mounted on a substrate. A mounting method, an application step of applying an adhesive to the substrate, a positioning step of positioning the contactor at a position where the adhesive is applied on the substrate, and the adhesive applied to the substrate Irradiating light having a wavelength of 1200 nm or more toward the substrate, wherein the contactor has a transmission portion made of a material that transmits light having a wavelength of 1200 nm or more, and in the irradiation step, There is provided a contactor mounting method in which light having a wavelength of 1200 nm or more is irradiated toward the adhesive through the transmissive portion.

  Although not particularly limited in the above invention, in the irradiation step, it is preferable to irradiate a laser beam having a wavelength of 1200 nm or more toward the adhesive applied to the substrate.

  Although it does not specifically limit in the said invention, It is preferable that the said permeation | transmission part which the said contactor has is comprised from the silicon | silicone.

  Although not particularly limited in the above invention, the substrate is preferably made of a material that does not transmit light having a wavelength of 1200 nm or more. Specifically, the substrate is preferably made of a glass epoxy resin material, a polyimide resin material, or ceramics.

  Although it does not specifically limit in the said invention, It is preferable that the said adhesive agent contains the material which does not permeate | transmit light with a wavelength of 1200 nm or more.

  Although not particularly limited in the above invention, the contactor includes a base part fixed to the substrate by the adhesive, a beam part having a rear end side provided on the base part, and a front end side protruding from the base part, It is preferable that the base portion and the beam portion are made of silicon. The conductive portion is formed on the surface of the beam portion and electrically contacts the input / output terminal of the electronic device under test. .

  (2) In order to achieve the above object, according to the second aspect of the present invention, a contactor that is in electrical contact with the input / output terminals of the electronic device under test is mounted on the substrate when testing the electronic device under test. A contactor mounting apparatus comprising: an applying unit that applies an adhesive to a predetermined position of the substrate; a holding unit that holds the contactor; and the substrate is moved relative to the contactor so that the bonding is performed on the substrate. A moving means for positioning the contactor at a position where an agent is applied, and an irradiating means for irradiating light having a wavelength of 1200 nm or more. The irradiating means has a wavelength in the contactor positioned on the substrate. A contour that irradiates light having a wavelength of 1200 nm or more toward the adhesive through a transmission portion made of a material that transmits light of 1200 nm or more. Data mounting apparatus is provided.

  Although not particularly limited in the above invention, the irradiation unit is preferably a laser irradiation unit that irradiates a laser beam having a wavelength of 1200 nm or more.

  Although it does not specifically limit in the said invention, It is preferable that the said permeation | transmission part which the said contactor has is comprised from the silicon | silicone.

  Although not particularly limited in the above invention, the substrate is preferably made of a material that does not transmit light having a wavelength of 1200 nm or more. Specifically, the substrate is preferably made of a glass epoxy resin material, a polyimide resin material, or ceramics.

  Although it does not specifically limit in the said invention, It is preferable that the said adhesive agent contains the material which does not permeate | transmit light with a wavelength of 1200 nm or more.

  Although not particularly limited in the above invention, the contactor includes a base part fixed to the substrate by the adhesive, a beam part having a rear end side provided on the base part, and a front end side protruding from the base part, It is preferable that the base portion and the beam portion are made of silicon. The conductive portion is formed on the surface of the beam portion and electrically contacts the input / output terminal of the electronic device under test. .

  In this invention, after apply | coating an adhesive agent to a board | substrate and positioning a contactor in the said application | coating position, the wavelength of 1200 nm or more is irradiated to an application | coating position through the transmission part of a contactor. The substrate at the application position is heated by light having a wavelength of 1200 nm or longer to cure the adhesive, or the adhesive itself is cured by light having a wavelength of 1200 nm or longer. Thereby, the part which becomes a shadow of a contactor in an adhesive agent can also be fully hardened. In addition, since a step of putting into an oven after irradiating light having a wavelength of 1200 nm or more is unnecessary, the contactor can be mounted on the substrate in a short time.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic diagram showing an electronic component test apparatus having a contactor manufactured by the manufacturing method according to the present invention, and FIG. 2 is a concept showing a connection relationship between a test head and a probe card used in the electronic component test apparatus of FIG. FIG.

  Before describing a method for manufacturing a contactor according to the present invention, an electronic component testing apparatus using a contactor manufactured by the manufacturing method will be outlined.

  As shown in FIG. 1, the electronic component testing apparatus 1 includes a test head 10, a tester 90 (test apparatus main body), and a prober 100. The tester 90 is electrically connected to the test head 10 via the cable bundle 91 and can input / output DC signals and digital signals to / from an IC device built on the semiconductor wafer 200. ing.

  As shown in FIGS. 1 and 2, a plurality of printed circuit boards 11 are provided in the test head 10, and these printed circuit boards 11 are connected to a tester via a cable bundle 91 having several hundred internal cables. 90. In addition, each printed circuit board 11 is electrically connected to a connector 12 for connecting to the mother board 21, and can be electrically connected to the contact terminal 21 a on the mother board 21 of the interface unit 20. ing.

  The test head 10 and the prober 100 are connected via an interface unit 20, and the interface unit 20 includes a mother board 21, a wafer performance board 22, and a frog ring 23. On the mother board 21, a wiring pattern 21b is formed to electrically connect the contact terminal 21a for electrical connection with the connector 12 on the test head 10 side and the wafer performance board 22. The wafer performance board 22 is electrically connected to the mother board 21 via pogo pins or the like, and converts the pitch of the wiring pattern 21b on the mother board 21 to the pitch on the frog ring 23 side, and the wiring pattern 21b is frog ringed. A wiring pattern 22 a is formed so as to be electrically connected to the flexible substrate 30 provided in the interior 23.

  The frog ring 23 is provided on the wafer performance board 22 in order to accurately determine the contact position with respect to the prober 100. In order to allow a slight alignment between the test head 10 and the prober 100, an internal transmission line is provided. Is formed of a flexible substrate 30. A large number of pogo pins 23 a to which the flexible substrate 30 is electrically connected are mounted on the lower surface of the frog ring 23.

  A probe card 40 having a number of silicon finger contactors 50 as probe needles mounted on the lower surface is attached to the frog ring 23 so that the probe card 40 and the frog ring 23 are electrically connected by a pogo pin 23a. It has become.

  The prober 100 can hold the semiconductor wafer 200 on the chuck 101 and automatically supply the semiconductor wafer 200 to a position facing the probe card 40 mounted on the test head 10.

  In the electronic component testing apparatus 1 configured as described above, the probe card 40 is pressed against the semiconductor wafer 200 held on the chuck 101, and the IC device built on the semiconductor wafer 200 is connected to the input / output terminal 210 (FIG. 3), a DC signal and a digital signal are applied from the tester 90 to the IC device, and an output signal is received from the IC device. The output signal (response signal) from the IC device is compared with an expected value in the tester 90, so that the electrical characteristics of the IC device are evaluated.

  3 is a sectional view showing a probe card used in the electronic component testing apparatus shown in FIG. 1, FIG. 4 is a bottom view of the probe card shown in FIG. 3, and FIG. 5 is a silicon finger contactor mounted on the probe card shown in FIG. FIG. 6 is a plan view of the silicon finger contactor shown in FIG. 5, and FIG. 7 is a graph showing the relationship between the wavelength of electromagnetic waves and the transmittance of silicon.

  As shown in FIGS. 3 and 4, the probe card 40 according to the present embodiment is attached to the probe board 41 formed of, for example, a multilayer wiring board and the upper surface of the probe board 41 to reinforce mechanical strength. It comprises a stiffener 42 and a number of silicon finger contactors 50 mounted on the lower surface of the probe substrate 41.

  The probe substrate 41 is made of a material that does not transmit electromagnetic waves having a wavelength of 1200 nm or more, such as glass epoxy resin, polyimide resin, or ceramics. A through hole 41a is formed in the probe substrate 41 so as to penetrate from the lower surface to the upper surface, and a connection trace 41b connected to the through hole 41a is formed on the lower surface.

  As shown in FIG. 5, the silicon finger contactor 50 includes a base portion 51 fixed to the probe substrate 41, a beam portion 53 provided on the base portion 51 on the rear end side and protruding from the base portion 51 on the front end side, And a conductive layer 54 formed on the surface of the beam portion 53.

  In the present embodiment, the “rear end side” of the silicon finger contactor 50 refers to the side (left side in FIG. 5) fixed to the probe substrate 41. On the other hand, the “tip side” in the silicon finger contactor 50 refers to the side (right side in FIG. 5) that contacts the input / output terminal 210 of the IC device formed on the wafer 200 to be tested.

  The base part 51 and the beam part 53 of the silicon finger contactor 5 are made of silicon, and can transmit electromagnetic waves having a wavelength of 1200 nm or more, as shown in FIG. The base portion 51 and the beam portion 53 are configured on a silicon substrate by using a semiconductor manufacturing technique such as photolithography, and as shown in FIG. A book) beam portion 53 is provided in a finger shape (comb shape). Thus, by manufacturing the contactor 50 using the semiconductor manufacturing technique, the pitch between the plurality of beam portions 53 can be easily adjusted to the narrow pitch between the input / output terminals 210 on the wafer under test 200.

  Further, as shown in FIG. 5, a step 52 is formed in the base portion 51, and the inclination angle β of the contactor 50 with respect to the probe substrate 41 can be arbitrarily set by controlling the ratio of the depth and length of the step. It is possible to set. In addition, this inclination | tilt angle (beta) is so preferable that it is small.

On the upper surface of the beam portion 53, an insulating layer 53a for electrically insulating the conductive layer 54 from other portions of the silicon finger contactor 50 is formed. The insulating layer 53a is composed of, for example, a SiO ₂ layer or a boron doped layer.

  A conductive layer 54 is formed on the surface of the insulating layer 53a. Examples of the material constituting the conductive layer 54 include metal materials such as tungsten, palladium, rhodium, platinum, ruthenium, iridium, and nickel.

  As shown in FIG. 3, the silicon finger contactor 50 having the above configuration is mounted on the probe substrate 41 so as to face the input / output terminal 210 of the IC device built in the wafer 200 to be tested. Although only two silicon finger contactors 50 are shown in FIG. 3, a large number of silicon finger contactors 50 are actually arranged on the probe substrate 41.

  As shown in FIGS. 3 and 5, each silicon finger contactor 50 is fixed to the probe substrate 41 with an adhesive 43 in a state where the step 52 formed on the base portion 51 is in contact with the surface of the probe substrate 41. As shown in FIG. 4, the conductive layer 54 is electrically connected to the connection trace 41b by wire bonding 41c. Examples of the adhesive 43 for mounting the contactor 50 on the probe substrate 41 include an epoxy-based thermosetting adhesive, and an infrared absorber for facilitating absorption of electromagnetic waves having a wavelength of 1200 nm or longer. Is preferably added as a filler, or the adhesive itself is black. Further, instead of the wire bonding 41c, the conductive layer 54 and the connection trace 41b may be electrically connected using a solder ball.

  In the test of the IC device using the probe card 40 having the above configuration, when the wafer under test 200 is pressed against the probe card 40 by the prober 100, the silicon finger contactor 50 on the probe substrate 41 and the wafer under test 200 are The input / output terminal 210 is electrically contacted.

  Next, a contactor mounting apparatus used for mounting the silicon finger contactor 50 on the probe substrate 41 when the probe card 40 is manufactured will be described with reference to FIGS. FIG. 8 is a schematic diagram showing the overall configuration of the embodiment of the contactor mounting apparatus according to the present invention, and FIG. 9 is an enlarged view of a portion IX in FIG.

  The probe card manufacturing apparatus 100 in this embodiment is an apparatus for mounting the above-described silicon finger contactor 50 on the probe substrate 41.

  As shown in FIG. 8, the contactor mounting apparatus 100 includes an adsorption unit 131 that adsorbs and holds the silicon finger contactor 50, an application unit 132 that applies an adhesive 43 to a predetermined position of the probe substrate 41, and a probe substrate 41. An irradiation unit 133 that irradiates laser light toward the adhesive 43 applied to the substrate, a measurement unit 134 that measures the relative height of the silicon finger contactor 50 with respect to the probe substrate 41, and the probe substrate 41 and the silicon finger contactor 50. A camera unit 140 for recognizing the position and posture, and a moving stage 150 for moving the probe substrate 41 relative to the silicon finger contactor 50.

  As shown in FIG. 9, the suction unit 131 has a suction surface 131a for sucking and holding the silicon finger contactor 50 on its upper surface. The suction surface 131a is an inclined surface having an angle substantially the same as the mounting angle β of the silicon finger contactor 50 with respect to the probe substrate 41.

  One end of a passage 131b that penetrates the suction unit 131 is opened on the suction surface 131a. The other end of the passage 131b communicates with the vacuum pump 120 as shown in FIG. Further, as shown in FIGS. 9 and 10B, a stepped portion 131c with which the rear end of the silicon finger contactor 50 engages is formed on the suction surface 131a. It is possible to restrict the silicon finger contactor 50 from moving minutely with respect to the suction surface 131a.

  The application unit 132 has, for example, a syringe filled with a thermosetting adhesive, and can apply a predetermined amount of adhesive to a predetermined position of the probe substrate 41. The irradiation unit 133 includes a laser oscillation device that oscillates a laser beam of 1200 nm or more, and can irradiate the adhesive 43 applied on the probe substrate 41 with the laser beam. As a light source of laser light of 1200 nm or more, for example, a semiconductor laser can be cited.

  The measuring unit 134 has a non-contact distance measuring sensor using, for example, a laser. The distance measuring sensor can measure the distance between the silicon finger unit 50 held by the suction unit 131 and the probe substrate 41, that is, the height of the silicon finger contactor 50 with respect to the probe substrate 41.

  The suction unit 131, the coating unit 132, the irradiation unit 133, and the measurement unit 134 are attached to the lifting head 130. The lifting head 130 is supported by a gantry 110 provided so as to surround the moving stage 150 that holds the probe substrate 41, and can be lifted and lowered in the Z-axis direction with respect to the moving stage 150. Further, the coating unit 132 and the irradiation unit 133 can be rotated around the Y-axis direction in the figure with respect to the lifting head 130 by an actuator not shown.

  The camera unit 140 has, for example, a CCD camera provided so that the lower part can be imaged. The camera unit 140 is attached to the gantry 110 independently of the lifting head 130 and can move along the XY directions.

  The moving stage 150 has a chuck (not shown) that can hold the probe substrate 41, and can move the probe substrate 41 along the X-axis direction and the Y-axis direction. The probe substrate 41 can be rotated in the θ direction about the axis.

  Hereinafter, a method of mounting the silicon finger contactor 50 on the probe substrate 41 using the above-described contactor manufacturing apparatus will be described with reference to FIGS. 10A to 10C. 10A to 10C are views showing first to third steps in the embodiment of the method for manufacturing a contactor according to the present invention.

  First, the camera unit 140 images the probe substrate 41 placed on the moving stage 150 and recognizes the relative position of the probe substrate 41 with respect to the lifting head 130. Then, when the moving stage 150 moves and the discharge port of the coating unit 132 faces a predetermined position of the probe substrate 41, the lifting head 130 is lowered in the Z-axis direction.

  Next, as shown in FIG. 10A, the application unit 132 applies the adhesive 43 to a predetermined position on the probe substrate 41. When the adhesive 43 is applied onto the probe substrate 41, the camera unit 140 images the application position 43 and the silicon finger contactor 50 placed on the moving stage 150, and applies the application position 43 and the silicon finger. The position and orientation of the contactor 50 are recognized.

  Next, the suction unit 141 sucks and holds the silicon finger contactor 50 placed on the moving stage 150. When the moving stage 150 moves and the silicon finger contactor 50 faces the application position 43 on the probe substrate 41, As shown in FIG. 10B, the lifting head 130 is lowered in the Z-axis direction.

  During the lowering, the measurement unit 134 measures the height of the silicon finger contactor 50 with respect to the probe substrate 41. Then, when the height of the silicon finger contactor 50 with respect to the probe substrate 41 becomes zero, the measurement unit 134 stops the descent of the elevating head 130 in the Z-axis direction.

  When the silicon finger contactor 50 is positioned at the application position 43 on the probe substrate 41, the irradiation unit 133 irradiates the application position 43 with laser light as shown in FIG. 10C. At this time, since the base part 51 and the beam part 53 of the silicon finger contactor 50 transmit electromagnetic waves having a wavelength of 1200 nm or more, the laser light emitted from the irradiation unit 133 passes through the silicon finger contactor 50 itself. On the other hand, since the probe substrate 41 does not transmit electromagnetic waves having a wavelength of 1200 nm or more, it is heated by the laser light emitted from the irradiation unit 133. By this heating, the adhesive 43 applied on the substrate 41 is thermally cured, and the silicon finger contactor 50 is mounted on the probe substrate 41.

  When the adhesive 43 itself does not transmit electromagnetic waves having a wavelength of 1200 nm or more, the adhesive 43 itself is heated and thermally cured by the laser light emitted from the irradiation unit 133, so that the silicon finger contactor 50 is probed. Mounted on the substrate 41.

  As described above, in this embodiment, after applying an adhesive to the probe substrate 41 and positioning the silicon finger contactor 50 at the application position 43, the base portion 51 and the beam portion 53 made of silicon in the contactor 50. Then, the application position 43 is irradiated with a laser beam having a wavelength of 1200 nm or more. The substrate 41 at the application position is heated by the laser light having a wavelength of 1200 nm or more, and the adhesive 43 is thermally cured, or the adhesive 43 itself is thermally cured by the laser light having a wavelength of 1200 nm or more. As a result, the portion of the adhesive 43 applied to the substrate 41 that is shaded by the contactor 50 can be sufficiently cured. In addition, since the step of putting into the oven after the laser light irradiation is unnecessary, the contactor 50 can be mounted on the substrate 41 in a short time.

  By the way, when the cured adhesive is heated to the glass transition point or higher, the adhesive can be softened. Therefore, in this embodiment, when repairing or exchanging the silicon finger contactor 50, the adhesive that fixes the target silicon finger contactor 50 is irradiated with a laser beam having a wavelength of 1200 nm or more, thereby the contactor. Only 50 can be removed from the substrate 41.

The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

FIG. 1 is a schematic view showing an electronic component testing apparatus provided with a contactor manufactured by the manufacturing method according to the present invention. FIG. 2 is a conceptual diagram showing a connection relationship between a test head and a probe card used in the electronic component testing apparatus of FIG. FIG. 3 is a sectional view showing a probe card used in the electronic component testing apparatus shown in FIG. FIG. 4 is a bottom view of the probe card shown in FIG. FIG. 5 is a cross-sectional view of the silicon finger contactor mounted on the probe card shown in FIG. 6 is a plan view of the silicon finger contactor shown in FIG. FIG. 7 is a graph showing the relationship between the wavelength of electromagnetic waves and the transmittance of silicon. FIG. 8 is a schematic diagram showing the overall configuration of an embodiment of the contactor mounting apparatus according to the present invention. FIG. 9 is an enlarged view of a part IX in FIG. FIG. 10A is a diagram showing a first step in an embodiment of the contactor manufacturing method according to the present invention. FIG. 10B is a diagram showing a second step in the embodiment of the contactor manufacturing method according to the present invention. FIG. 10C is a diagram showing a third step in the embodiment of the contactor manufacturing method according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 10 ... Test head 40 ... Probe card 41 ... Probe board 43 ... Adhesive 50 ... Silicon finger contactor 51 ... Base part 53 ... Beam part 54 ... Conductive part 100 ... Contactor mounting apparatus 110 ... Mount 120 ... Vacuum Pump 130 ... Lifting head 131 ... Adsorption unit 131a ... Adsorption surface 131b ... Passage 131c ... Stepped portion 132 ... Application unit 133 ... Irradiation unit 134 ... Measurement unit 140 ... Camera unit 150 ... Moving stage

Claims (12)

A contactor mounting method for mounting a contactor in electrical contact with an input / output terminal of the electronic device under test when testing the electronic device under test,
An application step of applying an adhesive to the substrate;
A positioning step of positioning the contactor at a position where the adhesive is applied on the substrate;
An irradiation step of irradiating light having a wavelength of 1200 nm or more toward the adhesive applied to the substrate,
The contactor has a transmission part made of a material that transmits light having a wavelength of 1200 nm or more,
In the irradiation step, a contactor mounting method of irradiating light having a wavelength of 1200 nm or more toward the adhesive through the transmission portion.   The contactor mounting method according to claim 1, wherein, in the irradiation step, laser light having a wavelength of 1200 nm or more is irradiated toward the adhesive applied to the substrate.   The contactor mounting method according to claim 1, wherein the transmission portion of the contactor is made of silicon.   The contactor mounting method according to claim 1, wherein the substrate is made of a material that does not transmit light having a wavelength of 1200 nm or more.   The contactor mounting method according to claim 1, wherein the adhesive contains a material that does not transmit light having a wavelength of 1200 nm or more. The contactor is
A base portion fixed to the substrate by the adhesive;
A rear end side provided on the base portion, and a front end side projecting from the base portion;
A conductive portion formed on the surface of the beam portion and in electrical contact with an input / output terminal of the electronic device under test;
The contactor mounting method according to claim 1, wherein the base part and the beam part are made of silicon. A contactor mounting device for mounting a contactor on a substrate in electrical contact with an input / output terminal of the electronic device under test when testing the electronic device under test,
Application means for applying an adhesive to a predetermined position of the substrate;
Holding means for holding the contactor;
Moving means for positioning the contactor at a position where the adhesive is applied on the substrate by moving the substrate relative to the contactor;
Irradiating means for irradiating light having a wavelength of 1200 nm or more,
The irradiating means irradiates light having a wavelength of 1200 nm or more toward the adhesive through a transmission portion made of a material that transmits light having a wavelength of 1200 nm or more in the contactor positioned on the substrate. Contactor mounting device.   The contactor mounting apparatus according to claim 7, wherein the irradiation unit is a laser irradiation unit that irradiates a laser beam having a wavelength of 1200 nm or more.   The contactor mounting apparatus according to claim 7 or 8, wherein the transmission portion of the contactor is made of silicon.   The contactor mounting apparatus according to claim 7, wherein the substrate is made of a material that does not transmit light having a wavelength of 1200 nm or more.   The contactor mounting apparatus according to claim 7, wherein the adhesive contains a material that does not transmit light having a wavelength of 1200 nm or more. The contactor is
A base portion fixed to the substrate by the adhesive;
A rear end side provided on the base portion, and a front end side projecting from the base portion;
A conductive portion formed on the surface of the beam portion and in electrical contact with an input / output terminal of the electronic device under test;
The contactor mounting apparatus according to claim 7, wherein the base portion and the beam portion are made of silicon.

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