CN101009268A - Base board and its electric test method - Google Patents
Base board and its electric test method Download PDFInfo
- Publication number
- CN101009268A CN101009268A CNA2006100029166A CN200610002916A CN101009268A CN 101009268 A CN101009268 A CN 101009268A CN A2006100029166 A CNA2006100029166 A CN A2006100029166A CN 200610002916 A CN200610002916 A CN 200610002916A CN 101009268 A CN101009268 A CN 101009268A
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- CN
- China
- Prior art keywords
- substrate
- testing cushion
- test
- test probe
- measuring method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Measurement Of Resistance Or Impedance (AREA)
Abstract
The invention relates to a base plate and its measuring method. The measuring method of said base plate includes: providing a base plate, the base plate possesses a first surface and a second surface, the first surface possesses several first test cushions, the second surface possesses several second test cushions; a conducting material is formed on the first surface to electric connected with at least two first teat cushions; a test tool is used to test the base plate, the test tool possesses at least one first test probe and many the second test probes. So, the first test probe and the second test probe are easy to test the base plate, and the test flow can be simple to save test time.
Description
Technical field
The present invention relates to a kind of substrate and electric measuring method thereof, particularly relate to a kind of board structure and electric measuring method thereof that the testing cushion of substrate is electrically conducted.
Background technology
Please refer to Fig. 1, it is the schematic diagram of existing substrate electric measuring method.At first, provide a substrate 10, this substrate 10 has a first surface 101 and a second surface 102, and this first surface 101 has a plurality of first testing cushion 103, and this second surface 102 has a plurality of second testing cushion 104.First testing cushion 103 and second testing cushion 104 are electrically connected and form a plurality of circuit 105.Then, with a measurement jig 11 these substrates 10 of test, this measurement jig 11 has one first test probe 12 and a plurality of second test probe 13.This first test probe 12 has two test probes 121,122.Each second test probe 13 has two test probes 131,132.This first test probe 12 is electrically connected with this first testing cushion 103, and each second test probe 13 is electrically connected with each second testing cushion 104.
Because existing substrate electric measuring method must be tested seriatim to first testing cushion 103 of this first surface 101, and the test probe 121,122 of this first test probe 12 must be on same first testing cushion 103, and these first testing cushion, 103 sizes are minimum, so the test probe 121,122 of this first test probe 12 is not easy to place on same first testing cushion 103, therefore, can produce the problem of test leakage, and must the wasteful measurement examination time.
Therefore, be necessary to provide a kind of substrate and electric measuring method thereof, to address the above problem.
Summary of the invention
The object of the present invention is to provide a kind of substrate electric measuring method, this substrate electric measuring method comprises: a substrate (a) is provided, this substrate has a first surface and a second surface, and this first surface has a plurality of first testing cushion, and this second surface has a plurality of second testing cushion; (b) form an electric conducting material on this first surface, to be electrically connected at least two first testing cushion; (c) test this substrate with a measurement jig, this measurement jig has at least one first test probe and a plurality of second test probe.
Another object of the present invention is to provide a kind of substrate, this substrate has a first surface, a second surface and an electric conducting material.This first surface has a plurality of first testing cushion.This second surface has a plurality of second testing cushion, and this first testing cushion and this second testing cushion are electrically connected and form a plurality of circuit.This electric conducting material is formed on this first surface, to be electrically connected at least two first testing cushion.
Substrate provided by the present invention and substrate electric measuring method are to utilize this electric conducting material this first testing cushion of conducting on this first surface, make this first test probe and second test probe can easily measure the electrical characteristic of this substrate, and can simplify testing process and save the testing time, and can judge whether this substrate is good.
Description of drawings
Fig. 1 is the schematic diagram of existing substrate electric measuring method;
Fig. 2 to Fig. 4 is the schematic diagram of first embodiment of substrate electric measuring method of the present invention;
Fig. 5 is the schematic diagram of second embodiment of substrate electric measuring method of the present invention;
Fig. 6 is the schematic diagram of first embodiment of substrate of the present invention;
Fig. 7 A is the end view of second embodiment of substrate of the present invention;
Fig. 7 B is the vertical view of second embodiment of substrate of the present invention;
Fig. 8 is the schematic diagram of the 3rd embodiment of substrate of the present invention.
Wherein, Reference numeral:
10 existing substrate 101 first surfaces
102 second surfaces, 103 first testing cushion
104 second testing cushion, 105 circuit
11 measurement jigs, 12 first test probes
121 probes, 122 probes
13 second test probes, 131 probes
132 probes, 20 substrates of the present invention
201 first surfaces, 202 second surfaces
203 first testing cushion, 204 second testing cushion
205 circuit, 21 electric conducting materials
22 measurement jigs, 23 first test probes
231 probes, 232 probes
24 second test probes, 241 probes
242 probes, 30 substrates of the present invention
301 first surfaces, 303 first testing cushion
304 second testing cushion, 31 electric conducting materials
40 substrate 401 first surfaces of the present invention
403 first testing cushion, 404 second testing cushion
405 circuit, 41 electric conducting materials
50 substrate 501 first surfaces of the present invention
503 first testing cushion, 51 electric conducting materials
60 substrate 601 first surfaces of the present invention
603 first testing cushion, 61 electric conducting materials
Embodiment
Please refer to Fig. 2 to Fig. 4, it is the schematic diagram of first embodiment of substrate electric measuring method of the present invention.As shown in Figure 2, at first, provide a substrate 20, this substrate 20 has a first surface 201 and a second surface 202.This first surface 201 has a plurality of first testing cushion 203, and this second surface 202 has a plurality of second testing cushion 204.This first testing cushion 203 and this second testing cushion 204 are electrically connected and form a plurality of circuit 205.As shown in Figure 3, with an electric conducting material 21 in two first testing cushion 203 of these first surface 201 conductings.This electric conducting material is to be electrically connected at least two first testing cushion 203 with wire form.
As shown in Figure 4, with a measurement jig 22 test bases 20, this measurement jig 22 has at least one first test probe 23 and a plurality of second test probe 24.This first test probe 23 has two test probes 231,232.Each second test probe 24 has two test probes 241,242.This first test probe 23 is electrically connected with this first testing cushion 203, and this second test probe 24 is electrically connected with this second testing cushion 204, to measure the electrical characteristic of this substrate 20.In the present embodiment, the spacing of two of this first test probe 23 test probes 231,232 must be adjusted according to the spacing of two first testing cushion 203.
The substrate electric measuring method of first embodiment of the invention is to utilize this electric conducting material 21 this first testing cushion 203 of conducting on this first surface 201, make that the test probe 231,232 of this first test probe 23 is easier to be electrically connected with this first testing cushion 203, and the electrical characteristic of this substrate 20 of easier measurement, and can simplify testing process and save the testing time, and can judge whether this substrate 20 is good.
Please refer to Fig. 5, it is the schematic diagram of second embodiment of substrate electric measuring method of the present invention.The substrate electric measuring method of this second embodiment and the substrate electric measuring method of above-mentioned first embodiment, difference are that this electric conducting material 31 is to cover this first testing cushion 303 with plating mode fully in this first surface 301.This first test probe 23 can be electrically connected with this electric conducting material 31 at arbitrary position, and this second test probe 24 is to be electrically connected with this second testing cushion 304, to measure the electrical characteristic of this substrate 30.
The substrate electric measuring method of second embodiment of the invention, this electric conducting material 31 is to utilize plating mode to be formed on this first surface 301, cover all these first testing cushion 303, in order to be electrically connected this first testing cushion 303, make the test probe 231,232 of this first test probe 23, can be on electric conducting material 31 electrical characteristic of this substrate 30 of arbitrary position measurement, and can simplify testing process and save the testing time, and can judge whether this substrate 30 good.
Please refer to Fig. 6, it is the schematic diagram of first embodiment of substrate of the present invention.This substrate 40 has a first surface 401 and a second surface 402, this first surface 401 has a plurality of first testing cushion 403, this second surface 402 has a plurality of second testing cushion 404, and this first testing cushion 403 and this second testing cushion 404 are electrically connected and form a plurality of circuit 405.With an electric conducting material 41 two first testing cushion 403 of conducting on this first surface 401, this electric conducting material 41 is an elargol.This electric conducting material 41 is to be electrically connected at least two first testing cushion 403 with wire form.In other application, also can be by the conducting of two first testing cushion 403, in order to the circuit 405 that is electrically connected this substrate 40.
This substrate 40 is to utilize this electric conducting material 41 two first testing cushion 403 of conducting on this first surface 401, make measurement jig can easily measure the electrical characteristic of this substrate 40, and can simplify testing process and save the testing time, whether good to judge this substrate 40.
Please refer to Fig. 7 A and Fig. 7 B, it is the schematic diagram of second embodiment of substrate of the present invention.The substrate 50 of this second embodiment and the structure of the substrate 40 of above-mentioned first embodiment, difference is among this second embodiment it is to utilize an electric conducting material 51 all first testing cushion 503 of conducting on this first surface 501.
This substrate 50 is to utilize this electric conducting material 51 all these first testing cushion 503 of conducting on this first surface 501, to form a test surfaces, make measurement jig more easily measure the electrical characteristic of this substrate 50 via this test surfaces, and can simplify testing process and save the testing time, whether good to judge this substrate 60.
Please refer to Fig. 8, it is the schematic diagram of the 3rd embodiment of substrate of the present invention.The substrate 60 of the 3rd embodiment and the structure of the substrate 40 of above-mentioned first embodiment, difference is among this embodiment it is to utilize an electric conducting material 61 to cover this first testing cushion 603 with plating mode fully in this first surface 601, this electric conducting material 61 is a copper.
This substrate 60 is to utilize this electric conducting material 61 to cover this first testing cushion 603 on this first surface 601, to form a test surfaces, make measurement jig more easily measure the electrical characteristic of this substrate 60 via this test surfaces, and can simplify testing process and save the testing time, whether good to judge this substrate 60.
The above only is the present invention's preferred embodiment wherein, is not to be used for limiting practical range of the present invention; Be that all equalizations of doing according to claim of the present invention change and modification, be all claim of the present invention and contain.
Claims (10)
1, a kind of substrate is characterized in that, this substrate comprises:
One first surface, this first surface have a plurality of first testing cushion;
One second surface, this second surface have a plurality of second testing cushion, and this first testing cushion and this second testing cushion are electrically connected and form a plurality of circuit; And
One electric conducting material, it is formed on this first surface, to be electrically connected at least two first testing cushion.
2, substrate as claimed in claim 1 is characterized in that, this electric conducting material is to be electrically connected at least two first testing cushion with wire form.
3, substrate as claimed in claim 1 is characterized in that, this electric conducting material covers all first testing cushion.
4, a kind of substrate electric measuring method is characterized in that, this method may further comprise the steps:
(a) provide a substrate, this substrate has a first surface and a second surface, and this first surface has a plurality of first testing cushion, and this second surface has a plurality of second testing cushion;
(b) form an electric conducting material on this first surface, to be electrically connected at least two first testing cushion; And
(c) test this substrate with a measurement jig, this measurement jig has at least one first test probe and a plurality of second test probe.
5, electric measuring method as claimed in claim 4 is characterized in that, this first test probe or this second test probe or this first test probe and this second test probe are to have two test probes.
6, electric measuring method as claimed in claim 4 is characterized in that, this electric conducting material is to be electrically connected at least two first testing cushion with wire form in step (b).
7, electric measuring method as claimed in claim 6 is characterized in that, this first test probe is to be electrically connected with this first testing cushion in step (c), and this second test probe is to be electrically connected with this second testing cushion.
8, electric measuring method as claimed in claim 4 is characterized in that, is to cover this first testing cushion with this electric conducting material in this first surface in step (b).
9, electric measuring method as claimed in claim 8 is characterized in that, this electric conducting material is to be formed at this first surface with plating mode.
10, electric measuring method as claimed in claim 8 is characterized in that, this first test probe is to be electrically connected with this electric conducting material in step (c), and this second test probe is to be electrically connected with this second testing cushion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100029166A CN100474577C (en) | 2006-01-27 | 2006-01-27 | Base board and electric test method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100029166A CN100474577C (en) | 2006-01-27 | 2006-01-27 | Base board and electric test method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101009268A true CN101009268A (en) | 2007-08-01 |
| CN100474577C CN100474577C (en) | 2009-04-01 |
Family
ID=38697575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100029166A Active CN100474577C (en) | 2006-01-27 | 2006-01-27 | Base board and electric test method therefor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100474577C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101499458B (en) * | 2008-02-02 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | Test structure and method for detecting disc trap and corrosion caused by CMP |
| CN102472792A (en) * | 2010-05-19 | 2012-05-23 | 松下电器产业株式会社 | Ic current measurement device and ic current measurement adapter |
| CN102956520A (en) * | 2011-08-25 | 2013-03-06 | 南茂科技股份有限公司 | Method for testing stack structure of semiconductor device |
| CN107656183A (en) * | 2016-07-25 | 2018-02-02 | 日月光半导体制造股份有限公司 | Testing device |
| CN109564254A (en) * | 2016-08-01 | 2019-04-02 | 恩德斯+豪斯流量技术股份有限公司 | Circuit board with contact structures |
| WO2023214784A1 (en) * | 2022-05-03 | 2023-11-09 | 주식회사 나노엑스 | Probe-head for electrical device inspection and manufacturing method therefor |
-
2006
- 2006-01-27 CN CNB2006100029166A patent/CN100474577C/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101499458B (en) * | 2008-02-02 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | Test structure and method for detecting disc trap and corrosion caused by CMP |
| CN102472792A (en) * | 2010-05-19 | 2012-05-23 | 松下电器产业株式会社 | Ic current measurement device and ic current measurement adapter |
| US8878559B2 (en) | 2010-05-19 | 2014-11-04 | Panasonic Corporation | IC current measuring apparatus and IC current measuring adapter |
| CN102472792B (en) * | 2010-05-19 | 2014-11-12 | 松下电器产业株式会社 | Ic current measurement device and ic current measurement adapter |
| CN102956520A (en) * | 2011-08-25 | 2013-03-06 | 南茂科技股份有限公司 | Method for testing stack structure of semiconductor device |
| CN107656183A (en) * | 2016-07-25 | 2018-02-02 | 日月光半导体制造股份有限公司 | Testing device |
| CN109564254A (en) * | 2016-08-01 | 2019-04-02 | 恩德斯+豪斯流量技术股份有限公司 | Circuit board with contact structures |
| US11002785B2 (en) | 2016-08-01 | 2021-05-11 | Endress+Hauser Flowtec Ag | Printed circuit board with contacting arrangement |
| WO2023214784A1 (en) * | 2022-05-03 | 2023-11-09 | 주식회사 나노엑스 | Probe-head for electrical device inspection and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100474577C (en) | 2009-04-01 |
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| C14 | Grant of patent or utility model | ||
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