CN113341360B - Radio frequency calibration device for chip test and calibration method thereof - Google Patents
Radio frequency calibration device for chip test and calibration method thereof Download PDFInfo
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- CN113341360B CN113341360B CN202110597170.2A CN202110597170A CN113341360B CN 113341360 B CN113341360 B CN 113341360B CN 202110597170 A CN202110597170 A CN 202110597170A CN 113341360 B CN113341360 B CN 113341360B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses a radio frequency calibration device and a calibration method thereof for chip testing, which are used for measuring a calibration value between a tester and a probe, wherein the radio frequency calibration device comprises a first substrate and a first circuit board. The first substrate includes a plurality of first lower contact pads and a plurality of first upper contact pads correspondingly conducted with the plurality of first lower contact pads, the plurality of first lower contact pads being configured to correspondingly contact the probes. The first upper contact plates are welded on the first circuit board, the first circuit board is provided with a plurality of first test interfaces, the first test interfaces are respectively and electrically connected with the first upper contact plates, and the first test interfaces are configured to be connected with a testing machine or a testing instrument. The radio frequency calibration device can complete measurement by adopting a simple structure, effectively reduces manufacturing cost and can also reduce system errors.
Description
Technical Field
The invention relates to the technical field of radio frequency measurement, in particular to a radio frequency calibration device for chip test and a calibration method thereof.
Background
The radio frequency path typically needs to be calibrated prior to testing of the radio frequency chip. However, in the existing calibration method, the external cables of the instrument are coaxial cables, so that the level of calibration can only reach the level of the interface of the tester to the Load Board (Load Board). The influence of the performance of the radio frequency wiring, the clamp and the probe thereof in the bearing plate on the radio frequency channel is not considered, and particularly, the great difference of standing wave ratios of the probe at different frequency points has great influence on the accuracy of the test. In this regard, in some high-end rf chip tests, it is often necessary to use a supporting carrier plate and probes at a higher end to reduce the influence, but the effect is not ideal, the system error caused by the system is large and cannot be estimated, and the test cost caused by replacing the high-end test tool is still large.
Disclosure of Invention
The invention aims to provide a radio frequency calibration device for chip test, which has low manufacturing cost and can reduce system errors.
Another object of the present invention is to provide a calibration method of a radio frequency calibration device, which can reduce system errors.
To achieve the above object, the present invention provides a radio frequency calibration device for chip testing, for measuring calibration values between a tester and a probe, comprising:
a first substrate including a plurality of first lower contact pads and a plurality of first upper contact pads correspondingly conducted with the plurality of first lower contact pads, the plurality of first lower contact pads being configured to correspondingly contact the probes;
the first circuit board is provided with a plurality of first test interfaces, the first test interfaces are respectively and electrically connected with the first upper contact plates, and the first test interfaces are configured to be connected with a tester or a testing instrument.
Preferably, the first substrate is a ceramic substrate, the ceramic substrate is formed by manufacturing via holes, polishing and thinning, double-sided copper coating and etching, and the first upper contact disc and the first lower contact disc are correspondingly formed at a plurality of via holes on the ceramic substrate.
Preferably, the size of the first substrate is equivalent to the size of the chip to be tested.
Preferably, the first test interface is an RF cable interface.
Preferably, the radio frequency calibration device further comprises a second substrate, the second substrate comprises a second lower contact disc and a second upper contact disc correspondingly conducted with the second lower contact disc, the second lower contact disc is connected with a second test interface, and the second upper contact disc is welded on the first circuit board;
the first circuit board is also provided with a third test interface, and the third test interface is electrically connected with the second upper contact disc;
the second test interface and the third test interface are configured to connect with a tester or meter instrument.
Preferably, the radio frequency calibration device further comprises a second substrate and a second circuit board;
the second substrate comprises a second lower contact disc and a second upper contact disc which is correspondingly conducted with the second lower contact disc, the second lower contact disc is connected with a second test interface, and the second upper contact disc is welded on the second circuit board;
the second circuit board is provided with a third test interface, and the third test interface is electrically connected with the second upper contact disc;
the second test interface and the third test interface are configured to connect with a tester or meter instrument.
Preferably, the second test interface and the third test interface are RF cable interfaces.
Preferably, the first test interface, the second test interface, the third test interface, and the test interface of the tester are identical or cause substantially identical test errors.
In order to achieve the above another object, the present invention provides a calibration method of the radio frequency calibration device as described above, comprising:
connecting the radio frequency calibration device to a probe, and connecting a plurality of the first test interfaces, the second test interfaces and the third test interfaces to a tester or a test instrument respectively;
the testing machine sends excitation to each probe, and the output signal of the first testing interface is measured to obtain an initial calibration value;
the testing machine sends excitation to one of the second testing interface and the third testing interface, and the output signal size of the other of the second testing interface and the third testing interface is measured to obtain a compensation value;
and compensating the post-compensation calibration value according to the initial calibration value and the compensation value.
Preferably, the calibration method further comprises simulating an environment of real chip testing by using a classifier to press the radio frequency calibration device.
Compared with the prior art, the radio frequency calibration device integrates a plurality of first lower contact plates which are correspondingly contacted with the probes on the same first substrate, the first substrate is connected with the first circuit board through a plurality of first upper contact plates, and a plurality of first test interfaces are respectively and electrically connected with the corresponding first upper contact plates to form a plurality of test passages. When radio frequency calibration is carried out, the radio frequency calibration device is arranged on the base (Socket), each first lower contact disc can be correspondingly contacted with each probe, meanwhile, a plurality of first test interfaces are respectively connected with the tester or the test instrument, and when the tester sends excitation to each probe, the tester or the test instrument connected with each first test interface can be used for measuring and outputting a numerical value. Therefore, the radio frequency calibration device can complete measurement by adopting a simple structure, effectively reduces manufacturing cost and reduces system errors.
Drawings
Fig. 1 is a schematic structural diagram of a radio frequency calibration apparatus according to an embodiment of the present invention.
Fig. 2 is a side view of a radio frequency calibration apparatus according to an embodiment of the present invention.
Fig. 3 is a side view of another embodiment of the present invention.
Fig. 4 is a flowchart of a calibration method of the rf calibration device according to an embodiment of the invention.
Detailed Description
In order to describe the technical content and constructional features of the present invention in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present invention and for simplification of description, and thus should not be construed as limitations of the protection content of the present invention.
Referring to fig. 1 and 2, the present invention provides a radio frequency calibration device for chip testing, which is used for measuring calibration values between a tester and probes, and comprises a first substrate 1 and a first circuit board 2. The first substrate 1 includes a plurality of first lower contact pads 11 and a plurality of first upper contact pads 12 that are correspondingly conducted to the plurality of first lower contact pads 11, the plurality of first lower contact pads 11 being configured to be correspondingly contacted to the respective probes. The plurality of first upper contact pads 12 are soldered on the first circuit board 2, the first circuit board 2 is provided with a plurality of first test interfaces 21, the plurality of first test interfaces 21 are respectively electrically connected with the plurality of first upper contact pads 12, and the plurality of first test interfaces 21 are configured to be connected with a tester or a testing instrument.
The radio frequency calibration device integrates a plurality of first lower contact plates 11 correspondingly contacted with the probes on the same first substrate 1, and connects the first substrate 1 with the first circuit board 2 through a plurality of first upper contact plates 12, and a plurality of first test interfaces 21 are respectively and electrically connected with the corresponding first upper contact plates 12 to form a plurality of test paths. When the radio frequency calibration device is installed on a base (Socket), each first lower contact disc 11 can be correspondingly contacted with each probe, and meanwhile, a plurality of first test interfaces 21 are respectively connected with a tester or a test instrument, and when the tester sends excitation to each probe, output values can be measured from the first test interfaces 21. Therefore, the radio frequency calibration device can complete measurement by adopting a simple structure, effectively reduces manufacturing cost and reduces system errors.
Specifically, each probe is arranged on a base (Socket), the bottom of the base is connected with a bearing plate (Load Board), the bearing plate is communicated with each probe, and the bearing plate is provided with a test interface connected with a tester or a test instrument. When the tester sends excitation to each probe, the output values measured from the first test interface 21 cover the errors caused by the radio frequency traces, the base and the probes thereof in the carrier board to the radio frequency path.
The following describes the rf calibration device according to the present invention in detail by taking specific embodiments as examples and referring to the accompanying drawings.
Referring to fig. 1 and 2, in some embodiments, the first substrate 1 is a ceramic substrate, which is formed by via holes, polishing and thinning, double-sided copper coating, and etching, and the first upper contact pads 12 and the first lower contact pads 11 are correspondingly formed at a plurality of via holes 13 on the ceramic substrate.
By adopting the technical means and adopting an advanced industrial process, the first upper contact plate 12 and the first lower contact plate 11 are better configured on the first substrate 1, so that the loss between elements can be reduced, and the measurement is more accurate.
In some embodiments, the size of the first substrate 1 is comparable to the size of the chip to be tested. Through the technical means, the first substrate 1 is favorably fixed in the test area of the base, so that each first lower contact disc 11 is better contacted with the corresponding probe, and the effect of simulating the chip to be tested is better achieved.
In some embodiments, the first test interface 21 is an RF cable interface. Through the technical means, errors caused by wires are reduced, the practicability of the device is improved, and the device can be connected with more testing machines or testing instruments in the market.
In some embodiments, the rf calibration device further includes a second substrate 3, where the second substrate 3 includes a second lower contact pad 31 and a second upper contact pad 32 that is correspondingly conductive to the second lower contact pad 31, and the second lower contact pad 31 is connected to a second test interface 33, and the second upper contact pad 32 is soldered to the first circuit board 2. The first circuit board 2 is further provided with a third test interface 22, and the third test interface 22 is electrically connected to the second upper contact pad 32. The second test interface 33 and the third test interface 22 are configured to interface with a tester or tester instrument.
In the use process, the testing machine or the testing instrument is respectively connected with the second testing interface 33 and the third testing interface 22, when the testing machine sends excitation to one of the second testing interface 33 and the third testing interface 22, the output signal of the other of the second testing interface 33 and the third testing interface 22 can be measured, and the compensation value of the device can be measured.
Through the technical means, a path for measuring the compensation value of the device is constructed between the second test interface 33 and the third test interface 22, and the device can be directly measured by being connected with a testing machine or a testing instrument, so that the device is simple and convenient, and the testing efficiency is improved.
The second substrate 3 may be a substrate similar in shape, material and size to the first substrate 1, and the second substrate 3 may be a substrate not identical in structure to the first substrate 1, and is not limited thereto.
Referring to fig. 1 and 3, in some embodiments, the rf calibration apparatus further includes a second substrate 3 and a second circuit board 4. The second substrate 3 includes a second lower contact pad 31 and a second upper contact pad 32 correspondingly conducted with the second lower contact pad 31, the second lower contact pad 31 is connected with a second test interface 33, and the second upper contact pad 32 is soldered on the second circuit board 4. The second circuit board 4 is provided with a third test interface 22, and the third test interface 22 is electrically connected to the second upper contact pad 32. The second test interface 33 and the third test interface 22 are configured to interface with a tester or tester instrument.
Further, the second test interface 33 and the third test interface 22 are RF cable interfaces. Through the technical means, errors caused by wires are reduced, the practicability of the device is improved, and the device can be connected with more testing machines or testing instruments in the market.
Further, the first test interface 21, the second test interface 33, and the third test interface 22 are identical or cause substantially identical test errors. By the above technical means, the second test interface 33, the third test interface 22, the second substrate 3, and the like are advantageously used to obtain the compensation value more accurately so as to compensate the system error caused by the radio frequency calibration device.
Referring to fig. 4, the present invention further provides a calibration method of the above-mentioned radio frequency calibration device, which includes the following steps:
s1, connecting the radio frequency calibration device to a probe, and respectively connecting a plurality of first test interfaces 21, second test interfaces 33 and third test interfaces 22 to a tester or a testing instrument.
Specifically, the probe is arranged in a test area of a base (Socket), and the radio frequency calibration device is connected with the test area. The bottom of the base is connected with a bearing plate (Load Board), the bearing plate is communicated with each probe, and the bearing plate is provided with a test interface connected with a tester or a test instrument, and the tester or the test instrument is connected with the test interface of the bearing plate to send excitation.
S2, the tester sends excitation to each probe, and the output signal of the first test interface 21 is measured to obtain an initial calibration value.
S3, the tester sends stimulus to one of the second test interface 33 and the third test interface 22, and the output signal size of the other of the second test interface 33 and the third test interface 22 is measured to obtain the compensation value.
Specifically, the compensation value is to compensate for a systematic error caused by the device itself.
And S4, obtaining a compensated calibration value according to the initial calibration value and the compensation value.
Specifically, the compensated calibration value is the difference between the initial calibration value and the compensation value.
By the method, the calibration value between the tester and the probe can be obtained quickly, and the self error of the radio frequency calibration device can be corrected by using the compensation value, so that the calibration of the radio frequency product during testing is improved greatly at low cost.
Further, the calibration method further comprises using a classifier (Handler) to simulate the environment of real chip testing to hold down the radio frequency calibration device.
By the method, the effect of better simulating the chip to be tested can be achieved, and the reliability of testing is improved.
The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.
Claims (10)
1. A radio frequency calibration device for chip testing for measuring calibration values from a tester to a probe, comprising:
a first substrate including a plurality of first lower contact pads and a plurality of first upper contact pads correspondingly conducted with the plurality of first lower contact pads, the plurality of first lower contact pads being configured to correspondingly contact the probes;
the first circuit board is provided with a plurality of first test interfaces, the first test interfaces are respectively and electrically connected with the first upper contact plates, and the first test interfaces are configured to be connected with a tester or a testing instrument;
the probe is arranged in a test area of the base, the radio frequency calibration device is connected with the test area, the bottom of the base is connected with a bearing plate, the bearing plate is communicated with each probe, the bearing plate is provided with a test interface connected with the tester or the test instrument, and the tester or the test instrument is connected with the test interface of the bearing plate to send excitation.
2. The rf calibration apparatus of claim 1, wherein the first substrate is a ceramic substrate formed by fabricating vias, polishing to thin, double-sided copper coating, etching, and the first upper contact pad and the first lower contact pad are formed at a plurality of vias on the ceramic substrate, respectively.
3. The radio frequency calibration device of claim 1, wherein the first substrate has a size comparable to a size of a chip under test.
4. The radio frequency calibration device of claim 1, wherein the first test interface is an RF cable interface.
5. The RF calibration apparatus of claim 1,
the second substrate comprises a second lower contact disc and a second upper contact disc which is correspondingly conducted with the second lower contact disc, the second lower contact disc is connected with a second test interface, and the second upper contact disc is welded on the first circuit board;
the first circuit board is also provided with a third test interface, and the third test interface is electrically connected with the second upper contact disc;
the second test interface and the third test interface are configured to connect with a tester or meter instrument.
6. The RF calibration apparatus of claim 1,
the device also comprises a second substrate and a second circuit board;
the second substrate comprises a second lower contact disc and a second upper contact disc which is correspondingly conducted with the second lower contact disc, the second lower contact disc is connected with a second test interface, and the second upper contact disc is welded on the second circuit board;
the second circuit board is provided with a third test interface, and the third test interface is electrically connected with the second upper contact disc;
the second test interface and the third test interface are configured to connect with a tester or meter instrument.
7. The radio frequency calibration apparatus of claim 5 or 6, wherein the second test interface and the third test interface are RF cable interfaces.
8. The radio frequency calibration apparatus of claim 5 or 6, wherein the first test interface, the second test interface, the third test interface, and the test interface of the tester are identical or cause identical test errors.
9. A method of calibrating a radio frequency calibration apparatus according to claim 5 or 6, comprising:
connecting the radio frequency calibration device to a probe, and connecting a plurality of the first test interfaces, the second test interfaces and the third test interfaces to a tester or a test instrument respectively;
the testing machine sends excitation to each probe, and the output signal of the first testing interface is measured to obtain an initial calibration value;
the testing machine sends excitation to one of the second testing interface and the third testing interface, and the output signal size of the other of the second testing interface and the third testing interface is measured to obtain a compensation value;
and compensating the post-compensation calibration value according to the initial calibration value and the compensation value.
10. The method of calibrating a radio frequency calibration apparatus according to claim 9, further comprising:
and simulating the environment of the real chip test by using a classifier to press the radio frequency calibration device.
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| CN202110597170.2A CN113341360B (en) | 2021-05-28 | 2021-05-28 | Radio frequency calibration device for chip test and calibration method thereof |
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| CN202110597170.2A CN113341360B (en) | 2021-05-28 | 2021-05-28 | Radio frequency calibration device for chip test and calibration method thereof |
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| CN113341360B true CN113341360B (en) | 2023-05-30 |
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Citations (2)
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| CN101266267A (en) * | 2007-03-16 | 2008-09-17 | 联发科技股份有限公司 | Method for confirming input voltage value output to comparator and light drive circuit |
| CN110572223A (en) * | 2019-10-12 | 2019-12-13 | 成都华兴汇明科技有限公司 | Calibration method of radio frequency baseband integrated terminal automatic test system |
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| US7532014B2 (en) * | 2006-08-08 | 2009-05-12 | Credence Systems Corporation | LRL vector calibration to the end of the probe needles for non-standard probe cards for ATE RF testers |
| CN103809100B (en) * | 2014-03-07 | 2016-03-09 | 上海华虹宏力半导体制造有限公司 | Wafer Auto-Test System |
| US10345418B2 (en) * | 2015-11-20 | 2019-07-09 | Teradyne, Inc. | Calibration device for automatic test equipment |
| CN110299950B (en) * | 2018-03-22 | 2022-05-06 | 中兴通讯股份有限公司 | Radio frequency channel correction method and device |
| CN111162154B (en) * | 2020-03-05 | 2020-12-04 | 华引芯（武汉）科技有限公司 | Ultraviolet light-emitting element and all-inorganic packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101266267A (en) * | 2007-03-16 | 2008-09-17 | 联发科技股份有限公司 | Method for confirming input voltage value output to comparator and light drive circuit |
| CN110572223A (en) * | 2019-10-12 | 2019-12-13 | 成都华兴汇明科技有限公司 | Calibration method of radio frequency baseband integrated terminal automatic test system |
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