CN115825835B - Low leakage current calibration system - Google Patents

Low leakage current calibration system Download PDF

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Publication number
CN115825835B
CN115825835B CN202310090261.6A CN202310090261A CN115825835B CN 115825835 B CN115825835 B CN 115825835B CN 202310090261 A CN202310090261 A CN 202310090261A CN 115825835 B CN115825835 B CN 115825835B
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China
Prior art keywords
chip
leakage current
chip test
test head
electric signal
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CN202310090261.6A
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Chinese (zh)
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CN115825835A (en
Inventor
廉哲
罗跃浩
黄建军
胡海洋
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Suzhou Lianxun Instrument Co ltd
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Suzhou Lianxun Instrument Co ltd
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Priority to CN202310090261.6A priority Critical patent/CN115825835B/en
Priority to CN202310472020.8A priority patent/CN116466286A/en
Publication of CN115825835A publication Critical patent/CN115825835A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

Abstract

The invention provides a low leakage current calibration system, and belongs to the technical field of chip test head calibration. The system comprises: the fixing device is provided with a plurality of clamping parts which are sequentially arranged along the same preset circumference, and each clamping part is used for fixing one chip test head; the switching testing mechanism comprises a switching arm, the switching arm is configured to rotate around the circle center of the preset circumference, the switching arm is provided with a connecting wire, and one end of the connecting wire is sequentially in butt joint with the output probes of each chip testing head when the switching arm rotates; the voltmeter is used for detecting a first electric signal at an output probe of the chip test head when the chip test head receives the test signal; and the calibration source meter is connected with the connecting wire and is used for receiving a second electric signal transmitted by the connecting wire when the chip test head receives the test signal and obtaining an electric signal compensation value according to the first electric signal and the second electric signal. The system of the invention has simple connection, no redundant components and small occupied volume of the connecting wire mechanism.

Description

Low leakage current calibration system
Technical Field
The invention relates to the technical field of chip test head calibration, in particular to a low leakage current calibration system.
Background
The chip test head can be used for testing the chip, and the test probes on the chip test head can be connected to the test points of the chip through the probe card so as to acquire the electric signals on the chip.
To reduce the impact of the chip test head on the test accuracy, it is often necessary to calibrate it. In calibration, the probes of the chip test head need to be connected to a calibration source table through a control circuit. In order to improve calibration efficiency, in the prior art, a batch of chip test heads are arranged on a fixed seat, and probes of each chip test head are connected with a calibration source table through respective leads. Because each chip test head needs to be connected one by one during calibration, each lead wire of each chip test head needs to be controlled to be communicated in sequence, corresponding switch components and control circuits are inevitably needed to be arranged, the connection of the whole calibration system is complex, the components are more, and the occupied volume is larger.
Disclosure of Invention
The invention aims to provide a low leakage current calibration system which is simple to connect, free of redundant components and small in occupied volume of a connecting wire mechanism.
A further object of the invention is to achieve that the connecting wire is not affected during rotation of the adapter arm.
It is a further object of the present invention to improve the accuracy of the mounting of a chip test head.
In particular, the present invention provides a low leakage current calibration system comprising:
the fixing device is provided with a plurality of clamping parts which are sequentially arranged along the same preset circumference, and each clamping part is used for fixing one chip test head;
the switching testing mechanism comprises a switching arm, wherein the switching arm is configured to rotate around the circle center of the preset circumference, the switching arm is provided with a connecting wire, and one end of the connecting wire is sequentially in butt joint with the output probes of each chip testing head when the switching arm rotates;
the voltmeter is used for detecting a first electric signal at an output probe of the chip test head when the chip test head receives a test signal; and
and the calibration source table is connected with one end, away from the butt joint end of the output probe of the chip testing head, of the connecting wire and is used for receiving a second electric signal transmitted by the connecting wire when the chip testing head receives the testing signal, and obtaining an electric signal compensation value according to the first electric signal and the second electric signal.
Optionally, the calibration source table is configured to obtain the electrical signal compensation value corresponding to the test signal in different numerical ranges according to the first electrical signal and the second electrical signal under the test signal with different numerical values.
Optionally, the transfer arm is further configured to move downward a preset distance when the connection wires are aligned with the output probes of the chip test head so as to be crimped with the output probes of the chip test head.
Optionally, the switching test mechanism further includes:
the motor comprises a body and an output shaft, wherein the output shaft is fixedly connected with the switching arm and is used for driving the switching arm to rotate around the circle center of the preset circumference.
Optionally, a through hole is formed in the middle of the output shaft, the output shaft penetrates through the body, and the through hole is used for penetrating the connecting wire, so that the connecting wire penetrates through the through hole and then is connected with the calibration source meter.
Optionally, the switching test mechanism further includes:
and the pushing-down driving piece is connected with the switching arm and used for driving the switching arm to move up and down.
Optionally, the low leakage current calibration system further comprises:
the cover body is fixedly arranged above the fixing device and is provided with a containing cavity with an opening at the bottom; and
the sliding plate is used for fixing the downward-pressing driving piece and the motor, is arranged in the containing cavity and can slide up and down relative to the cover body.
Optionally, the fixing device includes:
a base; and
and the limiting assembly is fixedly arranged above the base and used for forming a plurality of clamping parts.
Optionally, the limiting assembly includes:
the bottom plate is provided with clamping holes for penetrating the input cables of the chip test heads;
the bottom of the inner ring piece is fixedly connected with the bottom plate, the top of the inner ring piece is used for lap joint of each chip test head, and the outer wall of the inner ring piece is used for abutting against each chip test head;
the outer clamping ring is concentrically arranged with the inner circular ring piece, and the inner wall of the outer clamping ring is provided with a plurality of clamping grooves recessed along the radial direction of the outer clamping ring and used for clamping each chip testing head one by one; and
the inner wall of the compression ring is provided with a raised limit ring, and the bottom surface of the limit ring is used for compressing each chip testing head on the top surface of the bottom plate.
Optionally, the bottom plate is further provided with a first positioning hole matched with the first positioning pin of each chip test head;
and a second positioning hole matched with the second positioning pin of each chip testing head is formed in the top surface of the inner circular ring piece.
According to one embodiment of the invention, the chip test heads are arranged along the preset circumference by arranging a special fixing device, then, a switching arm capable of rotating around the circle center of the preset circumference is provided, connecting wires arranged on the switching arm are used for connecting output probes of the chip test heads with the calibration source meter, the connecting wires on the switching arm can be sequentially connected with the chip test heads by controlling the rotation of the switching arm, and electric signals of the chip test heads are sequentially transmitted to the calibration source meter. And then the electric signal compensation value of each chip test head can be obtained according to the second electric signal received by the calibration source meter through the connecting wire and the first electric signal directly measured at the output probe. The system for sequentially connecting the chip test heads through rotation can realize the calibration of batch chip test heads through simple connection, has simple system connection, no redundant components and small occupied volume of the connecting wire mechanism.
According to the embodiment of the invention, the through hole is arranged in the middle of the output shaft of the motor, and the connecting wire can be penetrated, so that the connecting wire can be conveniently guided from the switching arm to the calibration source meter, and the connecting wire cannot be influenced in the rotating process of the switching arm.
According to one embodiment of the invention, a specific limiting structure of the chip testing head is provided, and the chip testing head can be fixed on a preset circumference through the cooperation of the bottom plate, the inner circular ring piece, the outer clamping ring and the pressing ring.
According to one embodiment of the invention, the chip test head can be positioned at the limiting assembly through the positioning holes which are respectively arranged on the bottom plate and the inner circular ring piece and matched with the positioning pins of the chip test head, so that the mounting precision of the chip test head is improved.
The above, as well as additional objectives, advantages, and features of the present invention will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present invention when read in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the invention will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:
FIG. 1 is a schematic diagram of the connection of a low leakage current calibration system according to one embodiment of the present invention;
FIG. 2 is an exploded schematic view of a low leakage current calibration system according to one embodiment of the present invention;
FIG. 3 is a schematic diagram of a transit testing mechanism of a low leakage current calibration system according to one embodiment of the present invention;
FIG. 4 is an exploded schematic view of a transit test mechanism, sled, and cover plate of a low leakage current calibration system according to one embodiment of the present invention;
FIG. 5 is a schematic diagram of an assembly structure of a transfer test mechanism, a cover, and a sled of a low leakage current calibration system according to one embodiment of the present invention;
FIG. 6 is a schematic diagram of a fixture of a low leakage current calibration system according to one embodiment of the present invention;
FIG. 7 is a schematic diagram of the assembly structure of the fixture (the shadow mount and the clamping ring) and the chip test head of the low leakage current calibration system according to one embodiment of the present invention;
FIG. 8 is a schematic diagram of the structure of the fixing device (the fixing base and the pressing ring) of the low leakage current calibration system according to one embodiment of the present invention;
FIG. 9 is an exploded view of the fixture (the shadow mount and the clamping ring) of the low leakage current calibration system according to one embodiment of the present invention;
fig. 10 is a partial cross-sectional view of a fixture of a low leakage current calibration system according to one embodiment of the present invention.
Reference numerals:
100-low leakage current calibration system, 10-fixing device, 11-base, 12-limit component, 121-bottom plate, 1211-clamping hole, 1212-first positioning hole, 122-inner ring piece, 1221-second positioning hole, 123-outer clamping ring, 1231-clamping groove, 124-compression ring, 1241-limit ring, 20-switching test mechanism, 21-switching arm, 22-connecting wire, 23-motor, 231-body, 232-output shaft, 2321-through hole, 24-pressing driving piece, 30-voltmeter, 40-calibration source meter, 51-cover, 511-holding cavity, 52-slide plate;
200-chip test head, 210-output probes, 220-input cable, 230-first positioning pins, 240-second positioning pins.
Description of the embodiments
Fig. 1 is a schematic diagram of the connection of a low leakage current calibration system 100 according to one embodiment of the present invention, only one connection of a chip test head 200 to a voltmeter 30 being schematically shown in fig. 1. Fig. 2 is an exploded schematic view of a low leakage current calibration system 100 according to one embodiment of the present invention. Fig. 3 is a schematic structural diagram of the transit testing mechanism 20 of the low leakage current calibration system 100 according to an embodiment of the present invention. In one embodiment, as shown in FIG. 1, a low leakage current calibration system 100 includes fixture 10, a transition testing mechanism 20, voltmeter 30, and calibration source table 40. The fixing device 10 is formed with a plurality of clamping parts sequentially arranged along the same preset circumference, each clamping part is used for fixing one chip testing head 200, the output end of the chip testing head 200 is generally presented in the form of an output probe 210, and the input end of the chip testing head 200 is used for connecting with a testing source meter and receiving a testing signal, for example, a testing voltage. As shown in fig. 2, the adaptor testing mechanism 20 includes an adaptor arm 21, where the adaptor arm 21 is configured to rotate around a center of a preset circumference, for example, by a motor 23 to rotate the adaptor arm 21. As shown in fig. 3, the transfer arm 21 is provided with connection wires 22, and one end of the connection wires 22 is sequentially docked with the output probes 210 of the respective chip test heads 200 when the transfer arm 21 rotates. Voltmeter 30 is used to detect a first electrical signal at output probes 210 of chip test head 200 when chip test head 200 receives a test signal. The calibration source meter 40 is connected to an end of the connection wire 22, which is far away from the output probe 210 of the chip test head 200, and is configured to receive a second electrical signal transmitted by the connection wire 22 when the chip test head 200 receives the test signal, and obtain an electrical signal compensation value according to the first electrical signal and the second electrical signal, where the second electrical signal may be a current value or a voltage value, and the first signal value is measured by the voltmeter 30, and is a voltage value, and the electrical signal compensation value may be obtained according to a difference value between the first electrical signal and the second electrical signal after the second electrical signal is processed into a value similar to the first electrical signal.
In this embodiment, the special fixing device 10 is provided to arrange each chip testing head 200 along the preset circumference, and then an adapter arm 21 capable of rotating around the center of the preset circumference is provided, the connecting wire 22 provided on the adapter arm 21 is used for connecting the output probe 210 of the chip testing head 200 with the calibration source meter 40, and the connecting wire 22 on the adapter arm 21 can be sequentially connected with each chip testing head 200 by controlling the rotation of the adapter arm 21, so that the electric signals of each chip testing head 200 are sequentially transmitted to the calibration source meter 40. The compensation value of the electrical signal of each chip test head 200 can be obtained according to the second electrical signal received by the calibration source table 40 through the connection line 22 and the first electrical signal directly measured at the output probe 210. The system for sequentially connecting the chip test heads 200 through rotation can realize the calibration of the batch chip test heads 200 through simple connection, has simple system connection, no redundant components and small occupied volume of the connection wire 22 mechanism.
Further, the above manner of directly connecting the output probe 210 of the chip test head 200 and the calibration source table 40 through the connection line 22 can minimize the connection device, and can minimize the extra leakage current caused by the connection device, thereby ensuring the accuracy of calibration.
In one embodiment, the calibration source table 40 is configured to derive the electrical signal compensation values corresponding to the test signals in different numerical ranges according to the first electrical signal and the second electrical signal under the test signals with different numerical magnitudes.
That is, after the test signals with different values are given to the input end of the chip test head 200, the corresponding first electrical signal and the second electrical signal are recorded respectively, and the corresponding electrical signal compensation value is obtained. Different electrical signal compensation values corresponding to the different ranges of test signals may then be recorded and may be stored or derived for later use.
In a further embodiment, the transfer arm 21 is further configured to move downward a predetermined distance when the connection wires 22 are aligned with the output probes 210 of the chip test head 200 so as to be crimped with the output probes 210 of the chip test head 200. Of course, after the test of the current chip test head 200 is completed, the transfer arm 21 also drives the connection wire 22 to move up together by a preset distance for resetting.
As shown in fig. 3, in one embodiment, the switching test mechanism 20 further includes a motor 23, including a body 231 and an output shaft 232, where the output shaft 232 is fixedly connected to the switching arm 21, and is used to drive the switching arm 21 to rotate around the center of the preset circumference.
In a further embodiment, as shown in fig. 3, a through hole 2321 is disposed in a middle portion of the output shaft 232, the output shaft 232 penetrates through the body 231, and the through hole 2321 is used for penetrating the connection line 22, so that the connection line 22 penetrates through the through hole 2321 and then is connected to the calibration source meter 40.
The middle part of the output shaft 232 of the motor 23 adopted in this embodiment is provided with the through hole 2321, and the connecting wire 22 can be penetrated, so that the connecting wire 22 can be conveniently guided from the switching arm 21 to the calibration source meter 40, and the connecting wire 22 is not affected in the rotation process of the switching arm 21.
In one embodiment, the adaptor test mechanism 20 includes a pressing driving member 24 connected to the adaptor arm 21 for driving the adaptor arm 21 to move up and down, where the pressing driving member 24 may be a driving source such as a cylinder capable of outputting a linear displacement.
Fig. 4 is an exploded view of the transit testing mechanism 20, the slide plate 52, and the cover plate of the low leakage current calibration system 100 according to one embodiment of the invention, the transit testing mechanism 20 and the slide plate 52 of fig. 4 still being assembled. Fig. 5 is a schematic diagram of an assembly structure of the transit testing mechanism 20, the cover 51, and the slide plate 52 of the low leakage current calibration system 100 according to one embodiment of the present invention. In one embodiment, as shown in FIG. 5, the low leakage current calibration system 100 further includes a cover 51 and a sled 52. The cover 51 is fixedly disposed above the fixing device 10, and the cover 51 has a cavity 511 with an opening at the bottom thereof. As shown in fig. 4, the sliding plate 52 is used for fixing the pressing driving member 24 and the motor 23, and the sliding plate 52 is disposed in the accommodating cavity 511 and can slide up and down relative to the cover 51.
Fig. 6 is a schematic structural diagram of the fixture 10 of the low leakage current calibration system 100 according to one embodiment of the present invention. In one embodiment, the fixture 10 includes a base 11 and a stop assembly 12. The limiting component 12 is fixedly arranged above the base 11 and is used for forming a plurality of clamping parts.
Fig. 7 is a schematic diagram illustrating an assembly structure of the fixture 10 (the shadow mount and the clamping ring 124) and the chip test head 200 of the low leakage current calibration system 100 according to an embodiment of the present invention. Fig. 8 is a schematic diagram illustrating the structure of the fixture 10 (the shadow mount and the clamping ring 124) of the low leakage current calibration system 100 according to an embodiment of the present invention. Fig. 9 is an exploded view of the fixture 10 (the shadow mount and the clamping ring 124) of the low leakage current calibration system 100 according to one embodiment of the present invention. Fig. 10 is a partial cross-sectional view of the fixture 10 of the low leakage current calibration system 100 according to one embodiment of the present invention. In a further embodiment, as shown in fig. 8, and as also seen in fig. 9, the spacing assembly 12 includes a base plate 121, an inner annular member 122, an outer collar 123, and a pressure ring 124 (see fig. 7). As shown in fig. 9, the bottom plate 121 is provided with a card hole 1211 for threading the input cable 220 (see fig. 10) of each chip test head 200, and the card hole 1211 may be each notch at the periphery of the bottom plate 121, and the bottom plate 121 may be fixed to the base 11 by a fastener. As shown in fig. 10, the bottom of the inner ring 122 is fixedly connected with the bottom plate 121, the top of the inner ring 122 is used for overlapping each chip test head 200, and the outer wall is used for abutting each chip test head 200. The outer snap ring 123 is disposed concentrically with the inner circular ring 122, and the inner wall of the outer snap ring 123 is provided with a plurality of snap grooves 1231 (see fig. 9) recessed along the radial direction thereof for snap-coupling the respective chip test heads 200 one by one. As shown in fig. 10, a raised limit ring 1241 is provided at the inner wall of the pressure ring 124, and the bottom surface of the limit ring 1241 is used for pressing each chip test head 200 onto the top surface of the bottom plate 121.
The present embodiment provides a specific limiting structure of the chip testing head 200, and the chip testing head 200 can be fixed on a preset circumference through the cooperation of the bottom plate 121, the inner ring member 122, the outer clamping ring 123 and the pressing ring 124.
In a further embodiment, as shown in fig. 9 and 10, the bottom plate 121 is further provided with first positioning holes 1212 matching the first positioning pins 230 of each chip test head 200, where the number of the first positioning pins 230 and the first positioning holes 1212 may be 1 or more, respectively. A second positioning hole 1221 matching the second positioning pin 240 of each chip test head 200 is provided at the top surface of the inner ring 122.
The present embodiment can position the chip test head 200 at the position of the spacing assembly 12 by positioning holes respectively provided at the bottom plate 121 and the inner ring member 122 for matching with the positioning pins of the chip test head 200, so as to improve the mounting accuracy of the chip test head 200.
By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described herein in detail, many other variations or modifications of the invention consistent with the principles of the invention may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims (8)

1. A low leakage current calibration system, comprising:
the fixing device is provided with a plurality of clamping parts which are sequentially arranged along the same preset circumference, and each clamping part is used for fixing one chip test head;
the switching testing mechanism comprises a switching arm, wherein the switching arm is configured to rotate around the circle center of the preset circumference, the switching arm is provided with a connecting wire, and one end of the connecting wire is sequentially in butt joint with the output probes of each chip testing head when the switching arm rotates;
the voltmeter is used for detecting a first electric signal at an output probe of the chip test head when the chip test head receives a test signal; and
the calibration source table is connected with one end, away from the butt joint of the output probes of the chip testing head, of the connecting wire, and is used for receiving a second electric signal transmitted by the connecting wire when the chip testing head receives the testing signal, and obtaining an electric signal compensation value according to the first electric signal and the second electric signal;
the switching test mechanism further comprises:
the motor comprises a body and an output shaft, wherein the output shaft is fixedly connected with the switching arm and is used for driving the switching arm to rotate around the circle center of the preset circumference;
the middle part of output shaft is equipped with the through-hole, the output shaft runs through the body, the through-hole is used for wearing to establish the connecting wire, make the connecting wire pass behind the through-hole with the calibration source table links to each other.
2. The low leakage current calibration system according to claim 1, wherein,
the calibration source table is used for obtaining the electric signal compensation value corresponding to the test signal in different numerical ranges according to the first electric signal and the second electric signal under the test signal with different numerical values.
3. The low leakage current calibration system according to claim 1, wherein,
the adapter arm is further configured to move downward a preset distance when the connection wire is aligned with an output probe of the chip test head so as to be crimped with the output probe of the chip test head.
4. The low leakage current calibration system of claim 1, wherein the transit test mechanism further comprises:
and the pushing-down driving piece is connected with the switching arm and used for driving the switching arm to move up and down.
5. The low leakage current calibration system of claim 4, further comprising:
the cover body is fixedly arranged above the fixing device and is provided with a containing cavity with an opening at the bottom; and
the sliding plate is used for fixing the downward-pressing driving piece and the motor, is arranged in the containing cavity and can slide up and down relative to the cover body.
6. The low leakage current calibration system according to any one of claims 1-5, wherein the fixture comprises:
a base; and
and the limiting assembly is fixedly arranged above the base and used for forming a plurality of clamping parts.
7. The low leakage current calibration system according to claim 6, wherein the limiting assembly comprises:
the bottom plate is provided with clamping holes for penetrating the input cables of the chip test heads;
the bottom of the inner ring piece is fixedly connected with the bottom plate, the top of the inner ring piece is used for lap joint of each chip test head, and the outer wall of the inner ring piece is used for abutting against each chip test head;
the outer clamping ring is concentrically arranged with the inner circular ring piece, and the inner wall of the outer clamping ring is provided with a plurality of clamping grooves recessed along the radial direction of the outer clamping ring and used for clamping each chip testing head one by one; and
the inner wall of the compression ring is provided with a raised limit ring, and the bottom surface of the limit ring is used for compressing each chip testing head on the top surface of the bottom plate.
8. The low leakage current calibration system according to claim 7,
the bottom plate is also provided with a first positioning hole matched with the first positioning pin of each chip test head;
and a second positioning hole matched with the second positioning pin of each chip testing head is formed in the top surface of the inner circular ring piece.
CN202310090261.6A 2023-02-09 2023-02-09 Low leakage current calibration system Active CN115825835B (en)

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CN202310472020.8A CN116466286A (en) 2023-02-09 2023-02-09 Calibration system for chip test

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KR20050066413A (en) * 2003-12-26 2005-06-30 동부아남반도체 주식회사 Connecting apparatus for wafer testing system
CN101487874B (en) * 2008-01-15 2011-07-13 旺矽科技股份有限公司 High-speed test device
CN101738575B (en) * 2008-11-11 2013-08-21 京元电子股份有限公司 Integrated card (IC) tester capable of changing with different probe cards
CN111721979B (en) * 2019-03-18 2023-05-23 台湾中华精测科技股份有限公司 Probe card testing device and signal switching module thereof
CN113341360B (en) * 2021-05-28 2023-05-30 广东利扬芯片测试股份有限公司 Radio frequency calibration device for chip test and calibration method thereof
CN114646787A (en) * 2022-05-18 2022-06-21 苏州联讯仪器有限公司 Chip test probe and chip test device
CN218099475U (en) * 2022-07-13 2022-12-20 苏州辉垦电子科技有限公司 Probe tower structure for wafer chip test

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