CN218099475U - Probe tower structure for wafer chip test - Google Patents
Probe tower structure for wafer chip test Download PDFInfo
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- CN218099475U CN218099475U CN202221875462.4U CN202221875462U CN218099475U CN 218099475 U CN218099475 U CN 218099475U CN 202221875462 U CN202221875462 U CN 202221875462U CN 218099475 U CN218099475 U CN 218099475U
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Abstract
The utility model discloses a wafer chip test is with probe tower structure, including the circular shape chassis, set up two convex mounting holes along its circumferencial direction on the chassis, two mounting holes are central symmetry and axial symmetry setting, be connected with the fixed lantern ring on the chassis, all block in two mounting holes and be equipped with a first fixed block, the side of keeping away from the chassis of two first fixed blocks all is connected with a second fixed block, all wear to be equipped with many probes on every first fixed block and the second fixed block that corresponds, first fixed block and second fixed block are the convex massive structure of cooperation mounting hole, the outside of two first fixed blocks and two second fixed blocks is located to fixed lantern ring cover. The utility model has the advantages that: the processing difficulty of the first fixing block and the second fixing block and the insertion difficulty of the probes can be reduced; the first fixing block and the second fixing block are firmly fixed; the probe tower structure has the advantages of ingenious design, simple structure, easy processing and assembly and high processing and assembly efficiency.
Description
Technical Field
The utility model relates to a chip test technical field specifically is a wafer chip test is with probe tower structure.
Background
The wafer is the most basic semiconductor material for making the IC, and the quality of the wafer will directly determine the quality of the finished IC. Due to different process levels, wafers may generate three defects, namely redundancy, crystal defects and mechanical damage at the production stage. Therefore, the efficient and accurate detection equipment can provide guarantee for high-reliability wafer materials. With the rapid improvement of the chip manufacturing technology, the challenges of wafer inspection are increasing, and the cost proportion of the test is also obviously increased. The wafer test is to perform a probe test on each die on the chip, and a probe (probe) made of gold wire into fine hair is mounted on the test head to contact with a contact (pad) on the die to test the electrical characteristics of the die, so that the unqualified die is marked with a mark, and then when the chip is cut into independent dies according to the unit of the die, the unqualified die marked with the mark is eliminated, and the next process is not performed, so as to avoid waste. When a wafer chip is tested, a probe tower is generally adopted to detect the wafer chip, and the conventional probe tower has the defects of complex structure, more production procedures, inconvenience in probe installation and low production efficiency.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer chip test is with probe tower structure to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a probe tower structure is used in wafer chip test, includes the circular shape chassis, set up two convex mounting holes, two along its circumferencial direction on the chassis the mounting hole is central symmetry and axisymmetric setting, be connected with the fixed lantern ring on the chassis, two all block in the mounting hole and be equipped with a first fixed block, two the side of keeping away from the chassis of first fixed block all is connected with a second fixed block, every all wear to be equipped with many probes on first fixed block and the second fixed block that corresponds, first fixed block and second fixed block are the convex massive structure of cooperation mounting hole, the outside of two first fixed blocks and two second fixed blocks is located to fixed lantern ring cover.
Further preferably, the side of the first fixing block close to the fixing sleeve ring is provided with a plurality of first positioning blocks, and the second fixing block is provided with a second positioning block matched with the first positioning block and used for fixing the positioning of the sleeve ring and strengthening the firmness of the first fixing block and the second fixing block.
Further preferably, a fifth connecting hole is formed in the first positioning block, a sixth connecting hole is formed in the second positioning block, and the fifth connecting hole is correspondingly communicated with the sixth connecting hole and used for connecting the first fixing block and the second fixing block.
Further preferably, the fixing sleeve ring is provided with a clamping groove matched with the first positioning block and the second positioning block, so that the first fixing block and the second fixing block can be fixed.
Further preferably, a convex clamping table is arranged on the side face, far away from the fixed sleeve ring, of the first fixed block along the arc direction of the first fixed block and used for clamping the first fixed block and the chassis; and a boss matched with the clamping table is arranged on the side face, far away from the fixing lantern ring, of the second fixing block and used for connecting the second fixing block with the first fixing block.
Preferably, the clamping table is provided with a plurality of seventh connecting holes, the boss is provided with a plurality of eighth connecting holes, the edge of the mounting hole in the chassis is provided with a plurality of third connecting holes, and the third connecting holes, the seventh connecting holes and the eighth connecting holes are correspondingly communicated and used for connecting the first fixing block, the second fixing block and the chassis.
Further preferably, a plurality of fourth connecting holes are formed in the side face, close to the chassis, of the fixed lantern ring, and a plurality of second connecting holes matched with the fourth connecting holes are formed in the chassis, so that the fixed lantern ring and the chassis are fixedly connected.
Further preferably, a first connecting hole is formed in the middle of the chassis, the first connecting hole is circular and used for connecting the chassis and the chip testing head, and meanwhile the circular first connecting hole facilitates adjustment of the mounting angle of the chassis.
Has the advantages that: the probe tower structure for testing the wafer chip of the utility model realizes the installation of the probe through the first fixed block and the second fixed block, ensures the fixation of the probe to be firm, can reduce the processing difficulty of the jack of the probe on the first fixed block and the second fixed block, and reduces the insertion difficulty of the probe; the first fixing block and the second fixing block are fixed on the chassis through the fixing lantern ring, and the first fixing block and the second fixing block are installed and positioned through installation Kong Shixian; the first fixing block and the second fixing block are firmly fixed through the clamping table and the clamping groove; the probe tower structure has the advantages of ingenious design, simple structure, easy processing and assembly and high processing and assembly efficiency.
Drawings
Fig. 1 is an exploded schematic view of a probe tower structure for wafer chip testing according to an embodiment of the present invention;
fig. 2 is a schematic axial view of a probe tower structure for wafer chip testing according to an embodiment of the present invention;
fig. 3 is a schematic bottom view of a probe tower structure for wafer chip testing according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a chassis according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a fixing collar disclosed in an embodiment of the present invention;
fig. 6 is a schematic view of an assembly structure of the first fixing block, the second fixing block and the probe according to the embodiment of the present invention;
fig. 7 is a schematic view of another view angle assembly structure of the first fixing block, the second fixing block and the probe according to the embodiment of the present invention.
Reference numerals: 1-base plate, 11-mounting hole, 12-first connecting hole, 13-second connecting hole, 14-third connecting hole, 2-fixing lantern ring, 21-clamping groove, 22-fourth connecting hole, 3-first fixing block, 31-first positioning block, 32-fifth connecting hole, 33-clamping table, 34-seventh connecting hole, 4-second fixing block, 41-second positioning block, 42-sixth connecting hole, 43-boss, 44-eighth connecting hole and 5-probe.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
As shown in fig. 1-7, a probe tower structure for wafer chip testing comprises a circular base plate 1, wherein the base plate 1 is used for connecting with a chip testing head; two convex mounting holes 11 have been seted up along its circumferencial direction on chassis 1, two mounting holes 11 are central symmetry and axisymmetric setting, be connected with fixed lantern ring 2 on chassis 1, all the card is equipped with a first fixed block 3 in two mounting holes 11, the side of keeping away from chassis 1 of two first fixed blocks 3 all is connected with a second fixed block 4, first fixed block 3 and second fixed block 4 are used for the installation of probe 5, many probes 5 run through first fixed block 3 and second fixed block 4 from top to bottom, realize the installation of probe 5, it is fixed, drive chassis 1 through the chip test head and remove, and then drive first fixed block 3 and the removal of second fixed block 4, realize the test of drive probe 5 to wafer chip. The first fixing block 3 and the second fixing block 4 are both arc-shaped block structures matched with the mounting holes 11, so that the probes 5 are arranged according to the shape of the wafer chip; the fixed lantern ring 2 is sleeved on the outer sides of the two first fixed blocks 3 and the two second fixed blocks 4, so that the first fixed blocks 3 and the second fixed blocks 4 are fixed on the chassis 1. The probe tower structure has the advantages of ingenious design, simple structure, easy processing and assembly and high processing and assembly efficiency.
In this application, the side that is close to fixed lantern ring 2 of first fixed block 3 is equipped with a plurality of first locating pieces 31, be equipped with the second locating piece 41 of the first locating piece 31 of cooperation on the second fixed block 4, be equipped with the first locating piece 31 of cooperation on the fixed lantern ring 2, the draw-in groove 21 of second locating piece 41, through first locating piece 31, the block of second locating piece 41 and draw-in groove 21, realize the location of the position of the fixed lantern ring 2, realize first fixed block 3 simultaneously, second fixed block 4 is spacing in vertical direction, guarantee first fixed block 3, second fixed block 4 is fixed firm. Wherein, be equipped with fifth connecting hole 32 on the first locating piece 31, be equipped with on the second locating piece 41 with fifth connecting hole 32 complex sixth connecting hole 42, through the intercommunication of fifth connecting hole 32 and sixth connecting hole 42, realize that the connection of first fixed block 3 and second fixed block 4 is fixed, simultaneously through the cooperation error of first fixed block 3 and second fixed block 4, make there is certain dislocation between first fixed block 3 and second fixed block 4, can form a hindrance to probe 5, improve the fixed degree of consolidation of probe 5, can reduce the processing degree of difficulty of the jack of probe 5 on first fixed block 3 and the second fixed block 4 simultaneously, reduce the cartridge degree of difficulty of probe 5.
In the application, the side surface of the first fixing block 3, which is far away from the fixing sleeve ring 2, is provided with the convex clamping table 33 along the arc direction of the first fixing block 3, so that the first fixing block 3 is mounted and limited on the chassis 1, and meanwhile, the first fixing block 3 and the chassis 1 are convenient to connect and fix; the side of the second fixed block 4 far away from the fixed lantern ring 2 is provided with a boss 43 matched with the clamping table 33, the clamping table 33 is provided with a plurality of seventh connecting holes 34, the boss 43 is provided with a plurality of eighth connecting holes 44, and the first fixed block 3 and the second fixed block 4 are connected and fixed. Meanwhile, the edge of the mounting hole 11 on the chassis 1 is provided with a plurality of third connecting holes 14, and the first fixing block 3 and the second fixing block 4 are connected and fixed with the chassis 1 through the corresponding communication of the third connecting holes 14, the seventh connecting holes 34 and the eighth connecting holes 44, so that the first fixing block 3 and the second fixing block 4 are ensured to be fixed stably.
In this application, the side that is close to chassis 1 of the fixed lantern ring 2 is equipped with a plurality of fourth connecting holes 22, is equipped with a plurality of second connecting holes 13 of cooperation fourth connecting hole 22 on the chassis 1, through fourth connecting hole 22 and second connecting hole 13, realizes fixed lantern ring 2 and chassis 1's connection, fixed, guarantees that the fixed lantern ring 2 is fixed to first fixed block 3, second fixed block 4.
In this application, the centre of chassis 1 is equipped with first connecting hole 12, and first connecting hole 12 is circular, and first connecting hole 12 is used for being connected of chassis 1 and chip test head, sets up first connecting hole 12 into circular, is convenient for rotate the adjustment to chassis 1, realizes being connected of this probe tower structure and chip test head.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.
Claims (8)
1. The utility model provides a wafer chip test is with probe tower structure which characterized in that: including circular shape chassis (1), set up two convex mounting hole (11), two along its circumferencial direction on chassis (1) mounting hole (11) are central symmetry and axisymmetric setting, be connected with fixed lantern ring (2), two on chassis (1) all block in mounting hole (11) and be equipped with one first fixed block (3), two the side of keeping away from chassis (1) of first fixed block (3) all is connected with one second fixed block (4), every all wear to be equipped with many probes (5) on first fixed block (3) and the second fixed block (4) that correspond, first fixed block (3) and second fixed block (4) are the block structure of cooperation mounting hole (11), the outside of two first fixed blocks (3) and two second fixed blocks (4) is located to fixed lantern ring (2) cover.
2. The probe tower structure for wafer chip testing according to claim 1, wherein: the side face, close to the fixed lantern ring (2), of the first fixing block (3) is provided with a plurality of first positioning blocks (31), and the second fixing block (4) is provided with a second positioning block (41) matched with the first positioning blocks (31).
3. The probe tower structure for wafer chip testing according to claim 2, wherein: the first positioning block (31) is provided with a fifth connecting hole (32), the second positioning block (41) is provided with a sixth connecting hole (42), and the fifth connecting hole (32) is correspondingly communicated with the sixth connecting hole (42).
4. The probe tower structure for wafer chip testing according to claim 3, wherein: the fixing lantern ring (2) is provided with a clamping groove (21) matched with the first positioning block (31) and the second positioning block (41).
5. The probe tower structure for wafer chip testing according to claim 1, wherein: the side of keeping away from fixed lantern ring (2) of first fixed block (3) is equipped with convex ka tai (33) along the camber line direction of first fixed block (3), the side of keeping away from fixed lantern ring (2) of second fixed block (4) is equipped with boss (43) of cooperation ka tai (33).
6. The probe tower structure for wafer chip testing according to claim 5, wherein: the clamping table (33) is provided with a plurality of seventh connecting holes (34), the boss (43) is provided with a plurality of eighth connecting holes (44), the edge of the mounting hole (11) in the chassis (1) is provided with a plurality of third connecting holes (14), and the third connecting holes (14), the seventh connecting holes (34) and the eighth connecting holes (44) are correspondingly communicated.
7. The probe tower structure for wafer chip testing according to claim 1, wherein: the side of the fixed lantern ring (2) close to the chassis (1) is provided with a plurality of fourth connecting holes (22), and the chassis (1) is provided with a plurality of second connecting holes (13) matched with the fourth connecting holes (22).
8. The probe tower structure for wafer chip testing according to claim 1, wherein: the middle of the chassis (1) is provided with a first connecting hole (12), and the first connecting hole (12) is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221875462.4U CN218099475U (en) | 2022-07-13 | 2022-07-13 | Probe tower structure for wafer chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221875462.4U CN218099475U (en) | 2022-07-13 | 2022-07-13 | Probe tower structure for wafer chip test |
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| CN218099475U true CN218099475U (en) | 2022-12-20 |
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| CN202221875462.4U Active CN218099475U (en) | 2022-07-13 | 2022-07-13 | Probe tower structure for wafer chip test |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115825835A (en) * | 2023-02-09 | 2023-03-21 | 苏州联讯仪器股份有限公司 | Low-leakage-current calibration system |
-
2022
- 2022-07-13 CN CN202221875462.4U patent/CN218099475U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115825835A (en) * | 2023-02-09 | 2023-03-21 | 苏州联讯仪器股份有限公司 | Low-leakage-current calibration system |
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