CN220231806U - DBC assembly test fixture and DBC assembly test device of IGBT module - Google Patents
DBC assembly test fixture and DBC assembly test device of IGBT module Download PDFInfo
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- CN220231806U CN220231806U CN202321397214.8U CN202321397214U CN220231806U CN 220231806 U CN220231806 U CN 220231806U CN 202321397214 U CN202321397214 U CN 202321397214U CN 220231806 U CN220231806 U CN 220231806U
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- 238000012360 testing method Methods 0.000 title claims abstract description 76
- 239000000523 sample Substances 0.000 claims abstract description 98
- 238000003825 pressing Methods 0.000 claims description 10
- 229920001342 Bakelite® Polymers 0.000 claims description 4
- 239000004637 bakelite Substances 0.000 claims description 4
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- CJDNEKOMKXLSBN-UHFFFAOYSA-N 1-chloro-3-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1 CJDNEKOMKXLSBN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model provides a DBC component test fixture of an IGBT module and a DBC component test device of the IGBT module, comprising: the probe comprises a platform, a base, a supporting part and a probe frame; the base is arranged on the platform and used for installing the DBC component to be tested; the supporting part is arranged on the platform and comprises a first supporting part and a second supporting part; the probe frame is arranged on the supporting part and is positioned above the base and used for installing a PCB (printed circuit board); one end of the probe frame is rotatably connected with the first supporting part, and the other end of the probe frame is detachably connected with the second supporting part. The clamp is simple in structure, convenient to move and flexible to test; meanwhile, the specific light-shielding testing environment of the chip is met.
Description
Technical Field
The utility model belongs to the field of IGBT module testing, and particularly relates to a DBC assembly testing fixture of an IGBT module.
Background
IGBTs are core devices for energy conversion and transmission, commonly called as "CPUs" of power electronic devices, and are widely applied in the fields of rail transit, smart grids, aerospace, electric vehicles, new energy equipment and the like. Before packaging, the IGBT module is generally welded on a DBC substrate, then the DBC assembly is subjected to subsequent bonding to obtain the DBC assembly, and finally packaging is carried out to form the complete IGBT module. The encapsulated IGBT module is directly applied to equipment such as a frequency converter, a UPS uninterrupted power supply and the like.
The test of the IGBT module cannot be performed after the complete IGBT module is formed, otherwise, once defective products exist, the IGBT module is unpacked, and the production efficiency is reduced. The DBC assembly should be tested to find defects in advance. Currently, the testing of DBC components is usually performed by manually operating the IGBT emitter E and gate G on the DBC to wire the bond wire and engage the device, and the collector C is clamped on the DBC copper layer to achieve electrical connection between the device and the DBC. However, the repeated disassembly and connection actions are required for measurement of different DBC components to be measured, the operation is complex, and the reliability is poor due to connection by a method of hooking wires and pole clamps. For this reason, chinese patent document with publication number CN208672690U discloses a half-bridge DBC test fixture inside the IGBT module, adopts test fixture auxiliary measurement, has improved the connection reliability with electrode and equipment on the DBC, after detecting, can improve the yields of IGBT products, promotes the effect and reaches more than 6%. However, the device requires a lifting mechanism, is complex in structure and inconvenient to move, and cannot meet the specific light-shielding test environment of the chip.
Disclosure of Invention
The technical problem solved by the utility model is to provide the DBC component test fixture of the IGBT module, so as to solve the problems that the existing test fixture is complex in structure and inconvenient to move, and cannot meet the specific light-shielding test environment of the chip.
In order to solve the above problems, the present utility model provides a DBC assembly test fixture of an IGBT module, including: the probe comprises a platform, a base, a supporting part and a probe frame;
the base is arranged on the platform and used for installing the DBC component to be tested;
the supporting part is arranged on the platform and comprises a first supporting part and a second supporting part;
the probe frame is arranged on the supporting part and is positioned above the base and used for installing a PCB (printed circuit board); one end of the probe frame is rotatably connected with the first supporting part, and the other end of the probe frame is detachably connected with the second supporting part.
Preferably, the probe frame and the supporting part are fixed by pressing down a buckle.
Preferably, the first supporting part comprises a supporting block, a first fixing column and a first elastic piece;
the support block is provided with a through hole; the bottom end of the first fixing column penetrates through the through hole to be connected with the platform;
the top end of the supporting block is rotationally connected with one end of the probe frame, a first groove is formed in the bottom end of the supporting block, and the first groove is located below the through hole;
the first elastic piece is arranged between the first groove and the platform, a downward pressing distance is arranged between the supporting block and the platform, and when the supporting block is pressed down, the first elastic piece applies reverse acting force to the supporting block.
Preferably, the second supporting part comprises a second fixing column and a second elastic piece;
the lower end of the second fixing column is connected with the platform; the upper end of the second fixing column is detachably connected with the other end of the probe frame;
the second elastic piece is sleeved on the second fixing column;
the probe frame is provided with a first opening at a position corresponding to the second fixing column, and the diameter of the first opening is larger than the outer diameter of the second fixing column and smaller than the outer diameter of the second elastic piece.
Preferably, a positioning pin with an adjustable position is arranged around the base.
Preferably, the first elastic member and the second elastic member are both springs.
Preferably, the method further comprises: a light-shielding cover body; the light-shielding cover body is a cuboid cover body with an open bottom surface and is arranged above the probe frame; and a second opening is formed in the light-shielding cover body and used for leading out a test connecting wire and an NTC resistance test wire.
Preferably, a circle of second grooves are formed in the periphery of the upper surface of the platform, and the bottom edge of the light-shielding cover body is embedded into the second grooves.
Preferably, the probe frame is made of bakelite.
Preferably, a DBC assembly test fixture and a PCB board comprising an IGBT module as defined in any one of the above; and the PCB is provided with a probe hole, the probe hole is used for penetrating the PCB probe, and when the probe frame is connected with the second supporting part, the PCB probe is contacted with the corresponding electrode position on the DBC assembly.
Compared with the prior art, the utility model has the following beneficial effects:
1. one end of the fixture probe frame is rotationally connected with the first supporting part, the other end of the fixture probe frame is detachably connected with the second supporting part, and the test can be completed by only rotating the probe frame and fixing and opening the connection between the other end of the probe frame and the second supporting part, so that the fixture probe frame has a simple structure, is convenient to move and is flexible to test;
2. the fixture adopts the probe to replace the hooking wire to realize the electrical connection between the DBC component to be tested and the testing equipment, the operation is simple, the contact stability between the PCB probe and the DBC component to be tested is good, and the reliability of the testing data is ensured;
3. the base is matched with the positioning pin with an adjustable position, is suitable for DBC components with different specifications, and has wider adaptability;
4. the fixture comprises a probe frame, so that the defects of leakage current increase, inflection point reduction and the like generated by the test of the chip by illumination are avoided.
Drawings
Fig. 1 is a schematic structural diagram of a DBC component test fixture of an IGBT module according to an embodiment of the utility model;
fig. 2 is a schematic structural view of a probe frame of a DBC component test fixture of an IGBT module according to an embodiment of the utility model;
fig. 3 is a schematic structural view of a first support portion of a DBC component test fixture of an IGBT module according to an embodiment of the utility model;
fig. 4 is a schematic structural view of a light-shielding cover body of a DBC assembly test fixture of an IGBT module according to an embodiment of the utility model.
Wherein: 1-a platform; 2-a base; 3-probe frame; 4-locating pins; 5-supporting blocks; 6-a first fixing column; 7-a first elastic member; 8-a second fixing column; 9-a second elastic member; 11-pressing down the buckle; 12-a PCB board; 13-probe holes; 14-a light-shielding cover body;
101-a first groove; 102-a second groove;
201-a first opening; 202-second openings.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
As shown in fig. 1 to 4, a DBC component test fixture for an IGBT module according to this embodiment includes: a platform 1, a base 2, a support part, and a probe frame 3; the base 2 is arranged on the platform 1 and is used for installing the DBC component to be tested; the support part is arranged on the platform 1 and comprises a first support part and a second support part; the probe frame 3 is arranged on the supporting part and is positioned above the base 2 for installing the PCB; one end of the probe frame 3 is rotatably connected to the first support portion, and the other end is detachably connected to the second support portion.
The PCB is used as a carrier for electrical connection of electronic components, probe holes corresponding to the electrodes on the DBC assembly to be tested are formed in the PCB, and the probe holes are used for installing PCB probes. After the DBC component to be tested and the PCB board on which the PCB probe is mounted are mounted, the probe frame 2 is rotated downwards, the other end of the probe frame 2 is connected with the second supporting part, and electrodes are led out by contact between each PCB probe and the corresponding electrode on the chip of the DBC component to be tested, so that the electrical connection between the DBC component to be tested and the testing equipment is realized, and the test of the DBC component is completed. The fixture can complete the test by connecting the other end of the probe frame 3 with the second supporting part, and the component to be tested is convenient to take, simple in structure, convenient to move and flexible to test. The PCB probe replaces a hooking connection mode, the operation is simple, the contact stability of the PCB probe and the DBC component to be tested is good, and the reliability of test data is guaranteed.
Preferably, the probe frame 2 and the support are fixed by pressing down the buckle 11. The probe frame 2 is fixed with the supporting part, so that the contact stability of the PCB probe and the DBC component to be tested is further ensured, and the PCB probe is not deviated during testing.
Preferably, the first support part includes a support block 5, a first fixing post 6, and a first elastic member 7; the supporting block 5 is provided with a through hole; the bottom end of the first fixed column 6 passes through the through hole and is connected with the platform 1; the top end of the supporting block 5 is rotationally connected with one end of the probe frame 2, a first groove 101 is arranged at the bottom end of the supporting block 5, and the first groove 101 is positioned below the through hole; the first elastic piece 7 is arranged between the first groove 101 and the platform 1, a downward-pressing distance is arranged between the supporting block 5 and the platform 1, and when the supporting block 5 is pressed down, the first elastic piece 7 applies reverse acting force to the supporting block 5. Further preferably, the first elastic member 7 is sleeved on the first fixing post 6, and the outer diameter of the first elastic member 7 is larger than the diameter of the through hole.
The probe frame 3 is pressed down, one end of the probe frame 3 is fixed with the first supporting part by matching with the pressing buckle 11, so that the PCB probe is firmly contacted with the DBC component to be tested, and the measurement accuracy is ensured. The first fixing column 6 connects and fixes the supporting block 5 and the platform 1, further fixes the positions of the probe frame 3 and the platform 1, limits offset, and plays an auxiliary fixing role in test work.
Preferably, the second supporting part comprises a second fixing column 8 and a second elastic piece 9; the lower end of the second fixing column 8 is connected with the platform 1; the upper end of the second fixing column 8 is detachably connected with the other end of the probe frame 3; the second elastic piece 9 is sleeved on the second fixing column 8; the probe frame 3 is provided with a first opening 201 at a position corresponding to the second fixing column 8, and the diameter of the first opening 201 is larger than the outer diameter of the second fixing column 8 and smaller than the outer diameter of the second elastic member 9.
The diameter of the first opening 201 is between the outer diameter of the second elastic piece 9 and the outer diameter of the second fixing column 8, when the probe frame 3 is pressed down, the second fixing column 8 passes through the first opening 201, the probe frame 3 compresses the second elastic piece 9, the other end of the probe frame 3 is fixed with the second supporting part by matching with the pressing buckle 11, the contact firmness of the PCB probe and the DBC component to be measured is ensured, and the measurement accuracy is ensured. The second fixing column 8 fixes the positions of the probe frame 3 and the platform 1, limits the offset, and plays an auxiliary fixing role in test work.
Preferably, a positioning pin 4 with adjustable position is arranged around the base 2. Further preferably, the positioning pin 4 is fixed to the platform 1 by magnetic attraction. When testing DBC components of different specifications, the positioning pin 4 is moved to a proper position and fixed through magnetic attraction, so that the adaptability of the clamp is improved.
Preferably, the first elastic member and the second elastic member are both springs.
Preferably, the method further comprises: a light-shielding cover 14; the light-shielding cover 14 is a cuboid cover with an open bottom surface and is arranged above the probe frame 3; a second opening 202 is provided in the light-shielding cover 14 for leading out the test connection wire and the NTC resistance test wire.
When the chip is irradiated by light, if the energy of the photon is equal to or larger than the forbidden bandwidth of the chip, the electron in the valence band absorbs the photon and then enters the conduction band, and electron-hole pairs are generated. Causing the defects of increased leakage current, reduced inflection point, and the like. Accordingly, the probe frame 14 provides a light-protected testing environment for DBC assembly testing to avoid the above drawbacks. Meanwhile, the top end of the PCB probe is connected with testing equipment through a testing connecting wire, an NTC thermistor is arranged on the DBC component to be tested and used for monitoring the junction temperature of the chip, the PCB probe is connected with the testing equipment through a resistance testing wire, and the second opening 202 is used for leading out the testing connecting wire and the NTC resistance testing wire.
Preferably, a circle of second grooves 102 are formed around the upper surface of the platform 1, and the bottom edge of the light-shielding cover 14 is embedded into the second grooves 102. The second groove 102 ensures that the connection between the light-shielding cover 14 and the platform 1 is stable, and at the same time, the light-shielding cover is convenient to take down when not in use.
Preferably, the probe frame 14 is made of bakelite. The bakelite has high mechanical strength, high insulating performance, light resistance, heat resistance and corrosion resistance. Is a preferred material for the probe frame.
A DBC assembly testing device of an IGBT module comprises a DBC assembly testing clamp of the IGBT module and a PCB 12; the PCB 12 is provided with a probe hole 13, the probe hole 13 is used for penetrating a PCB probe, and when the probe frame 3 is connected with the second supporting part, the PCB probe is contacted with the corresponding electrode position on the DBC component. After the DBC component to be tested and the PCB 13 on which the PCB probes are mounted, the probe frame 2 is rotated downwards, the other end of the probe frame 2 is connected with the second supporting part, and the electrodes are led out by contact between the PCB probes and the corresponding electrodes on the chip of the DBC component to be tested, so that the electrical connection between the DBC component to be tested and the testing equipment is realized, and the test of the DBC component is completed.
The working process of the DBC component test fixture of the IGBT module is as follows: placing the DBC component to be tested on the base 2, adjusting the positioning pin 4 to fix the DBC component to be tested to a proper position, rotating the probe frame 3 to enable the other end of the probe frame 3 to be connected with the second fixing column 8, pressing down the probe frame 3 to compress the spring, fixing the probe frame 3 with the supporting part by using the pressing down buckle 11, and enabling the PCB probe to be firmly contacted with the DBC component to be tested; the light-shielding cover body 14 is placed in the second groove 102 on the platform 1, the test connecting wire and the NTC resistance test wire are led out through the preset second opening 202, and the test wire is connected with the test equipment, so that the electrical connection between the DBC component to be tested and the test equipment is realized, and the test on the DBC component is completed. After completion, the press-down buckle 11 is released, the probe frame 3 is lifted up, the DBC assembly is taken out, and the next test is performed.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.
Claims (10)
1. A DBC assembly test fixture for an IGBT module, comprising:
the probe comprises a platform, a base, a supporting part and a probe frame;
the base is arranged on the platform and used for installing the DBC component to be tested;
the supporting part is arranged on the platform and comprises a first supporting part and a second supporting part;
the probe frame is arranged on the supporting part and is positioned above the base and used for installing a PCB (printed circuit board); one end of the probe frame is rotatably connected with the first supporting part, and the other end of the probe frame is detachably connected with the second supporting part.
2. The IGBT module DBC component test fixture of claim 1 wherein the probe frame and the support are secured by a push-down snap.
3. The DBC component test fixture of the IGBT module of claim 2 wherein the first support section includes a support block, a first fixed column, and a first resilient member;
the support block is provided with a through hole; the bottom end of the first fixing column penetrates through the through hole to be connected with the platform;
the top end of the supporting block is rotationally connected with one end of the probe frame, a first groove is formed in the bottom end of the supporting block, and the first groove is located below the through hole;
the first elastic piece is arranged between the first groove and the platform, a downward pressing distance is arranged between the supporting block and the platform, and when the supporting block is pressed down, the first elastic piece applies reverse acting force to the supporting block.
4. The DBC component test fixture of the IGBT module of claim 3 wherein the second support section includes a second fixed column and a second elastic member;
the lower end of the second fixing column is connected with the platform; the upper end of the second fixing column is detachably connected with the other end of the probe frame;
the second elastic piece is sleeved on the second fixing column;
the probe frame is provided with a first opening at a position corresponding to the second fixing column, and the diameter of the first opening is larger than the outer diameter of the second fixing column and smaller than the outer diameter of the second elastic piece.
5. The IGBT module DBC component test fixture of claim 1 wherein the base is provided with position adjustable locating pins around it.
6. The DBC component test fixture of the IGBT module of claim 4, wherein the first resilient member and the second resilient member are springs.
7. The DBC component test fixture of an IGBT module of claim 1, further comprising: a light-shielding cover body; the light-shielding cover body is a cuboid cover body with an open bottom surface and is arranged above the probe frame; and a second opening is formed in the light-shielding cover body and used for leading out a test connecting wire and an NTC resistance test wire.
8. The DBC assembly test fixture of the IGBT module of claim 7 wherein a ring of second grooves are provided around the upper surface of the platform, and the bottom edge of the light shielding cover is embedded in the second grooves.
9. The IGBT module DBC component test fixture of claim 7 wherein the probe frame is bakelite.
10. A DBC component testing apparatus of an IGBT module, comprising the DBC component testing jig of an IGBT module according to any one of claims 1 to 9 and a PCB board; and the PCB is provided with a probe hole, the probe hole is used for penetrating the PCB probe, and when the probe frame is connected with the second supporting part, the PCB probe is contacted with the corresponding electrode position on the DBC assembly.
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CN202321397214.8U CN220231806U (en) | 2023-06-02 | 2023-06-02 | DBC assembly test fixture and DBC assembly test device of IGBT module |
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CN202321397214.8U CN220231806U (en) | 2023-06-02 | 2023-06-02 | DBC assembly test fixture and DBC assembly test device of IGBT module |
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CN220231806U true CN220231806U (en) | 2023-12-22 |
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CN202321397214.8U Active CN220231806U (en) | 2023-06-02 | 2023-06-02 | DBC assembly test fixture and DBC assembly test device of IGBT module |
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