CN216217697U - Switching device - Google Patents
Switching device Download PDFInfo
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- CN216217697U CN216217697U CN202122310092.1U CN202122310092U CN216217697U CN 216217697 U CN216217697 U CN 216217697U CN 202122310092 U CN202122310092 U CN 202122310092U CN 216217697 U CN216217697 U CN 216217697U
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Abstract
The utility model is suitable for the technical field of packaging test, and provides an adapter device which comprises a microwave dielectric substrate positioned between a tested piece and a test PCB, wherein a plurality of metalized through holes for electrically connecting the tested piece and the test PCB are arranged on the microwave dielectric substrate, a first bonding pad is fixedly arranged at one end of each metalized through hole, a second bonding pad is fixedly arranged at the other end of each metalized through hole, a conductive ball structure is fixedly arranged on each second bonding pad, the first bonding pad is used for being abutted and electrically connected with one of the tested piece and the test PCB, and the conductive ball structure is used for being abutted and electrically connected with the other one of the tested piece and the test PCB. The switching device provided by the utility model realizes the electric connection test of the tested piece and the test PCB, and the whole device has low manufacturing cost and long service life.
Description
Technical Field
The utility model belongs to the technical field of packaging test, and particularly relates to a switching device.
Background
QFN packages are called Quad Flat No-lead packages, or Quad Flat non-leaded packages, BGA packages are called Ball Grid Array packages, or solder Ball Array packages, and Array solder balls are manufactured at the bottom of a Package substrate and used as I/O terminals of a circuit to be connected with a Printed Circuit Board (PCB). The device packaged by the technology is a surface-mounted device, and has the characteristics of small volume, surface-mounted installation and convenient and fast application. QFN/BGA packages are a very common form of package in electronic systems. However, as the application frequency of electronic systems gradually moves toward the millimeter wave band, the number of QFN/BGA packages applicable to high frequency is increasing. No matter at home or abroad, mature QFN/BGA packaging products with high frequency are applied. However, in the development process, how to realize the QFN/BGA package accurate test of high frequency band and even millimeter wave band becomes the problem that must be solved. In order to accurately guide the development and application of the high-frequency QFN/BGA package, a tool or a tool capable of realizing high-frequency band test, nondestructive test, high-precision test and low insertion loss test is required, and the performance of a QFN/BGA package device can be accurately evaluated.
At present, QFN/BGA packaging products are fixed on a test fixture provided with a PCB mainly through a pressing fixture, and the PCB and the QFN/BGA packaging products of the test fixture also need corresponding test conversion devices. The mainstream test conversion device has an elastic interposer (interposer) and the like, which mainly comprises a film-like soft medium, wherein after a gold-plated metal column is embedded in the middle of the film-like soft medium, a conductive and bendable flexible conductive medium is placed below the metal column. The contact part of the conventional elastic interposer and a device bonding pad is a needle point structure (the device bonding pad is easy to scratch), when the device bonding pad is in contact with a metal column and exerts certain pressure, a flexible conductive medium is in contact with a testing substrate bonding pad on a testing tool, so that the form of signal conduction can realize nondestructive testing, and each testing point can be ensured to be in contact with the testing bonding pad. However, the adapter plate is expensive (the price of a single plate is about thirty thousand yuan RMB and is mostly imported abroad), the flexible conductive medium is easy to deform and fall off, the service life is short, the flexible conductive medium can be generally damaged after dozens or dozens of limit environment tests (such as temperature cycle), and the requirement of a large number of tests cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a switching device, which aims to solve or at least improve the technical problems of high price and short service life of the switching device for testing QFN/BGA packaging products to a certain extent.
In order to achieve the above object, the present invention provides an adapter device, including a microwave dielectric substrate located between a tested piece and a test PCB, wherein the microwave dielectric substrate is provided with a plurality of metalized through holes for electrically connecting the tested piece and the test PCB, one end of each metalized through hole is fixedly provided with a first pad, the other end of each metalized through hole is fixedly provided with a second pad, the second pad is fixedly provided with a conductive ball structure, the first pad is used for abutting against and electrically connecting with one of the tested piece and the test PCB, and the conductive ball structure is used for abutting against and electrically connecting with the other of the tested piece and the test PCB.
Further, the conductive ball structure is an elastic conductive ball structure.
Furthermore, the first pad is used for being abutted and electrically connected with a tested piece, the conductive ball structure is used for being abutted and electrically connected with a test PCB, the switching device further comprises a supporting dielectric plate connected with the microwave dielectric substrate, the supporting dielectric plate is located on one side, close to the test PCB, of the microwave dielectric substrate, and a through hole for the conductive ball structure and the second pad to penetrate is formed in the supporting dielectric plate.
Furthermore, a metal conductive column is fixedly filled in the metalized via hole, and the metal conductive column is electrically connected with the first bonding pad and the second bonding pad respectively.
Further, the metal conductive pillar is a copper pillar member.
Furthermore, the switching device further comprises a positioning structure, the positioning structure comprises a positioning frame and at least two positioning insertion columns which are used for being inserted into the insertion holes of the test PCB, the positioning insertion columns are connected with the positioning frame, the positioning frame is provided with positioning openings matched with the tested piece, and the microwave medium substrate is provided with a plurality of positioning through holes for respectively inserting and positioning the positioning insertion columns.
Furthermore, the switching device further comprises a positioning structure, the positioning structure comprises a positioning frame and at least two positioning insertion columns which are used for being inserted into the insertion holes of the test PCB, the positioning insertion columns are connected with the positioning frame, the positioning frame is provided with positioning openings matched with the tested piece, and the microwave medium substrate is provided with a plurality of positioning through holes for respectively inserting and positioning the positioning insertion columns.
Compared with the prior art, the switching device provided by the utility model has the advantages that the microwave dielectric substrate with the metalized through hole is arranged, the first bonding pad and the second bonding pad which are in conductive contact with the tested piece are fixedly arranged at the two ends of the metalized through hole, and the conductive ball structure which is in conductive contact with the PCB to be tested is also fixedly arranged on the second bonding pad, so that the electric connection test of the tested piece and the PCB to be tested is realized, the manufacturing cost of the whole device is low, and the service life is long.
Another objective of the present invention is to provide another adapter device, which includes a microwave dielectric substrate located between a tested piece and a test PCB, and a conductive ball structure fixed on the test PCB, wherein the microwave dielectric substrate is provided with a plurality of metalized through holes for electrically connecting the tested piece and the test PCB, one end of the metalized through hole close to the test PCB is fixedly provided with a first pad, one end of the metalized through hole close to the test PCB is fixedly provided with a second pad, and the second pad is used for abutting against and conducting with the conductive ball structure.
Further, the conductive ball structure is an elastic conductive ball structure.
Furthermore, the switching device further comprises a supporting dielectric plate which is used for abutting against one side, close to the test PCB, of the microwave dielectric substrate, the elastic conductive ball structure is connected with the supporting dielectric plate, the supporting dielectric plate is fixed on the test PCB through the conductive ball structure, and a through hole for the conductive ball structure and the second bonding pad to penetrate through is formed in the supporting dielectric plate.
Compared with the prior art, the switching device provided by the utility model has the advantages that the microwave dielectric substrate with the metallized through hole is arranged, the first bonding pad and the second bonding pad which are in conductive contact with the tested piece are fixedly arranged at the two ends of the metallized through hole, and the conductive ball structure which is in conductive contact with the second bonding pad is arranged on the test PCB, so that the electric connection test of the tested piece and the test PCB is realized, the manufacturing cost of the whole device is low, and the service life is long.
Drawings
Fig. 1 is a schematic view of an application of an adapter device according to an embodiment of the present invention;
FIG. 2 is a schematic view illustrating a process of mounting the adapter device on a test fixture according to an embodiment of the present invention;
fig. 3 is a schematic view of a positioning structure in the adapter device according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating the manufacturing process of the adapter device according to the first embodiment after step S100 is completed;
fig. 5 is a schematic diagram illustrating the manufacturing process of the adapter device after step S200 is completed according to an embodiment of the utility model;
fig. 6 is a schematic diagram illustrating the manufacturing process of the adapter device after step S300 is completed according to an embodiment of the utility model;
fig. 7 is a schematic diagram illustrating the manufacturing process of the adapter device after step S400 is completed according to an embodiment of the utility model;
fig. 8 is a schematic diagram illustrating the manufacturing process of the adapter device after step S500 is completed according to an embodiment of the utility model;
fig. 9 is a schematic process diagram (cross-sectional view of the microwave dielectric substrate and the supporting dielectric substrate) of the second embodiment of the present invention when the adapter device is mounted on the test fixture;
fig. 10 is a second schematic process diagram of the second adaptor device according to the second embodiment of the present invention, when the adaptor device is mounted on the test fixture.
In the figure: 1. a first pad; 2. a second pad; 3. a microwave dielectric substrate; 4. metallizing the via hole; 5. a conductive ball structure; 6. a metal conductive post; 7. supporting a dielectric slab; 8. a test piece; 9. testing the PCB; 10. fixing the clamp; 11. a pressing structure; 12. a switching device; 13. a positioning structure; 131. positioning the inserted column; 132. a positioning frame; 133. and (6) positioning the notch.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
It should be noted that the terms "length," "width," "height," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," "tail," and the like, indicate orientations or positional relationships that are based on the orientations or positional relationships illustrated in the drawings, are used for convenience in describing the utility model and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be construed as limiting the utility model.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Further, "plurality" or "a plurality" means two or more unless specifically limited otherwise.
Embodiment one of the adapting device
Referring to fig. 1, fig. 2, and fig. 4 to fig. 8, a first embodiment of the adapter device according to the present invention will now be described. The adapter device 12 comprises a microwave dielectric substrate 3 which is positioned between the tested piece 8 and the test PCB 9 when in use. The microwave medium substrate 3 is provided with a plurality of metalized through holes 4 used for electrically connecting a tested piece 8 (namely a QFN/BGA packaging product) and a testing PCB 9, one end of each metalized through hole 4 is fixedly provided with a first bonding pad 1, and the other end of each metalized through hole 4 is fixedly provided with a second bonding pad 2. The second bonding pad 2 is fixedly provided with a conductive ball structure 5. Of course, the first pad 1 and the second pad 2 must be electrically connected to the walls of the metallized via 4. The first land 1 is adapted to abut and electrically connect with one of the test piece 8 and the test PCB board 9, and the conductive ball structure 5 is adapted to abut and electrically connect with the other of the test piece 8 and the test PCB board 9.
For convenience of description, the following description will be made by taking as an example that the first pad 1 abuts and is electrically connected to the device under test 8 and the conductive ball structure 5 abuts and is electrically connected to the test PCB 9 during testing, and the interposer 12 provided in the first embodiment of the present invention is actually a part of the test fixture. The test fixture comprises a fixing fixture 10, a test PCB 9 fixedly installed on the fixing fixture 10, an adapter device provided by the embodiment of the utility model and a pressing structure 11 detachably connected with the fixing fixture 10. When the tested piece 8 is tested, the adapter device provided by the first embodiment of the utility model is located on the upper side of the test PCB 9, the tested piece 8 is located on the upper side of the adapter device provided by the first embodiment of the utility model, the pressing structure 11 is located on the upper side of the tested piece 8, and the pressing structure 11 is connected with the fixing clamp 10 in an installing manner, so that the tested piece 8 and the adapter device provided by the first embodiment of the utility model are fixed. The fixing jig 10, the test PCB board 9 and the pressing structure 11 are all prior art and will not be described in detail herein.
In this embodiment, the microwave dielectric substrate 3 may be made of a conventional rf microwave dielectric material (i.e., a common rf/microwave substrate) with high hardness, low dielectric constant and good high-frequency performance, and the processes of manufacturing the metalized via 4 and printing the circuit of this type of substrate are well-established, and the process cost is low (about several hundred yuan), the service life is long, the design is simple, and the process reconfigurability is strong. By using a printed circuit process, a circuit pattern corresponding to the port of the tested piece 8 can be manufactured on the microwave dielectric substrate 3. The first pad 1 generally has a flat contact surface with a larger contact area with the pin (or pad) of the device under test 8, and the shape of the contact surface can be changed according to the pin (or pad) of the device under test 8 without scratching the pin (or pad) of the device under test 8, so that the first pad 1 can be in good contact with and conduct electricity with the pin of the device under test 8. The second pads 2 are then connected with conductive ball structures 5 for better contact and electrical conduction with the pads of the test PCB board 9. The conductive ball structure 5 may be a solder ball structure, an alloy ball structure, or a copper ball structure. The whole structure is low in material and process, the manufacturing cost is low, the microwave medium substrate 3 is firm, the connecting structures of the first bonding pad 1, the second bonding pad 2 and the conductive ball structure 5 are firm, the bonding pads are not prone to falling off, and the service life is long. In addition, through practical test, the device can be suitable for millimeter wave test, the frequency can reach 40GHz, the insertion loss is less than-1 dB, the highest frequency can be tested to 40GHz, and the temperature range is-65-150 ℃.
Compared with the prior art, the switching device provided by the embodiment of the utility model has the advantages that the microwave dielectric substrate with the metalized through hole is arranged, the first bonding pad and the second bonding pad which are in conductive contact with the tested piece are fixedly arranged at the two ends of the metalized through hole, and the conductive ball structure which is in conductive contact with the PCB to be tested is also fixedly arranged on the second bonding pad, so that the electric connection test of the tested piece and the PCB to be tested is realized, the manufacturing cost of the whole device is low, and the service life is long.
In some embodiments, the conductive ball structure 5 is a resilient conductive ball structure. In fact, the applicant investigated and found that there are some machining errors in the pins (or pads) of the tested piece 8 and in the pads of the test PCB board 9, which can cause the contact surface of the pins (or pads) of the tested piece 8 or the pads of the test PCB board 9 to be uneven, which can cause poor contact. In this embodiment, the conductive ball structure 5 is an elastic conductive ball structure, so that the conductive ball structure 5 can be fully contacted with a pin (or a pad) of the tested piece 8 or a pad of the test PCB 9 by using the pressing force of the pressing structure 11 and fully utilizing the elasticity of the conductive ball structure 5 during testing, thereby avoiding the problem of poor contact, and truly realizing the test application on large-scale products. The elastic conductive ball structure can adopt a plurality of alloy balls with elasticity and the like.
In some embodiments, referring to fig. 5 to 8, the metalized via 4 is fixedly filled with a metal conductive pillar 6, and the metal conductive pillar 6 is electrically connected to the first pad 1 and the second pad 2, respectively. After the metal conductive columns 6 are filled in the metalized through holes 4, the transmission structure similar to a coaxial structure is formed with the microwave medium substrate 3, and the better test performance is achieved.
In some embodiments, the metal conductive pillars 6 are copper pillar members for better test performance.
In some embodiments, referring to fig. 1 to 2, in the testing use, the first pads 1 abut against and are electrically connected to the device under test 8, and the conductive ball structures 5 abut against and are electrically connected to the testing PCB board 9.
In some embodiments, referring to fig. 1, fig. 2 and fig. 8, the adapting device 12 further includes a supporting dielectric plate 7 connected to the microwave dielectric substrate 3, the supporting dielectric plate 7 is located at a side of the microwave dielectric substrate 3 adjacent to the testing PCB 9, a through hole for passing the conductive ball structure 5 and the second pad 2 is provided on the supporting dielectric plate 7, and of course, the conductive ball structure 5 should protrude from the supporting dielectric plate 7, so that the conductive ball structure 5 can contact with the pad on the testing PCB 9. When the testing device is used in a test, the supporting dielectric plate 7 can provide a supporting function for the switching device provided by the embodiment of the utility model, and by utilizing the elasticity (compressibility) of the conductive ball structure 5, the supporting dielectric plate 7 can be directly abutted against the plate body of the testing PCB 9, so that the pad of the testing PCB 9 is prevented from being crushed due to the abutting of the conductive ball structure 5 and the pad on the testing PCB 9. The material of the supporting dielectric plate 7 is not limited, and the same material as the microwave dielectric substrate 3 may be used.
In some embodiments, referring to fig. 1 and fig. 2, the adapter 12 provided in the embodiments of the present invention further includes a positioning structure 13. Location structure 13 includes that location frame 132 and two at least location insert post 131, and the location is inserted post 131 and is linked to each other with location frame 132, is equipped with the jack that corresponds on the plate body of test PCB board 9, and the location is inserted post 131 and jack one-to-one, and the location is inserted post 131 and can be inserted to the jack that corresponds. The positioning frame 132 is provided with a positioning notch 133 adapted to the tested piece 8, and certainly, the positioning frame 132 is inevitably located on the side of the microwave dielectric substrate 3 close to the tested piece 8. The fitting means that the square opening is fitted with the shape of the tested piece 8, for example, if the tested piece 8 is in a square structure, the positioning opening 133 is the square opening, and if the tested piece 8 is in a triangular structure, the positioning opening 133 is the triangular opening.
The microwave dielectric substrate 3 is provided with a plurality of positioning through holes for the positioning of the positioning insertion posts 131, and the positioning insertion posts 131 are respectively in one-to-one correspondence with the positioning through holes.
When the adapting device 12 provided by the embodiment of the utility model is installed, the positioning insertion column 131 is inserted into the positioning through hole, then the positioning insertion column 131 is inserted into the insertion hole, so that the adapting device 12 provided by the embodiment of the utility model is positioned relative to the test PCB 9 (the fixing clamp 10), then the tested piece 8 is placed in the positioning notch 133, so that the tested piece 8 is positioned relative to the adapting device 12 provided by the embodiment of the utility model, and then the pressing structure 11 is installed.
Embodiment two of the adapting device
Referring to fig. 9 to 10, a second embodiment of the adapter device of the present invention will now be described. The switching device 12 comprises a microwave medium substrate 3 positioned between the tested piece 8 and the test PCB board 9 during use and a conductive ball structure 5 fixedly arranged on the test PCB board 9. The conductive ball structure 5 is arranged in a conductive manner with the pad of the test PCB board 9. The conductive ball structure 5 may be a solder ball structure, an alloy ball structure, or a copper ball structure.
The microwave medium substrate 3 is provided with a plurality of metalized through holes 4 used for electrically connecting a tested piece 8 (namely QFN/BGA packaging products) and a testing PCB 9, one end of each metalized through hole 4 close to the tested piece 8 is fixedly provided with a first bonding pad 1, and one end of each metalized through hole 4 close to the testing PCB 9 is fixedly provided with a second bonding pad 2. The second pads 2 are for abutting and electrically connecting with the conductive ball structures 5. Of course, the first pad 1 and the second pad 2 must be electrically connected to the walls of the metallized via 4.
The second embodiment of the present invention provides an adapter 12 that is actually a part of the test fixture. The test fixture comprises a fixing fixture 10, a test PCB 9 fixedly installed on the fixing fixture 10, an adapter device provided by the second embodiment of the utility model and a pressing structure 11 detachably connected with the fixing fixture 10. When the tested piece 8 is tested, the adapter device provided by the second embodiment of the utility model is located on the upper side of the test PCB 9, the tested piece 8 is located on the upper side of the adapter device provided by the second embodiment of the utility model, the pressing structure 11 is located on the upper side of the tested piece 8, and the pressing structure 11 is connected with the fixing clamp 10 in an installing manner, so that the tested piece 8 and the adapter device provided by the second embodiment of the utility model are fixed. The fixing jig 10, the test PCB board 9 and the pressing structure 11 are all prior art and will not be described in detail herein.
In this embodiment, the microwave dielectric substrate 3 may be made of a conventional rf microwave dielectric material (i.e., a common rf/microwave substrate) with high hardness, low dielectric constant and good high-frequency performance, and the processes of manufacturing the metalized via 4 and printing the circuit of this type of substrate are well-established, and the process cost is low (about several hundred yuan), the service life is long, the design is simple, and the process reconfigurability is strong. By using a printed circuit process, a circuit pattern corresponding to the port of the tested piece 8 can be manufactured on the microwave dielectric substrate 3. The first pad 1 generally has a flat contact surface with a larger contact area with the pin (or pad) of the device under test 8, and the shape of the contact surface can be changed according to the pin (or pad) of the device under test 8 without scratching the pin (or pad) of the device under test 8, so that the first pad 1 can be in good contact with and conduct electricity with the pin of the device under test 8. The arrangement of the second bonding pads 2 and the conductive ball structures 5 can make the interposer device provided by the second embodiment of the present invention better contact and conduct electricity with the bonding pads of the test PCB 9. The whole structure is low in material and process, the manufacturing cost is low, the microwave medium substrate 3 is firm, the connecting structures of the first bonding pad 1, the second bonding pad 2 and the conductive ball structure 5 are firm, the bonding pads are not prone to falling off, and the service life is long. In addition, through practical test, the device can be suitable for millimeter wave test, the frequency can reach 40GHz, the insertion loss is less than-1 dB, the highest frequency can be tested to 40GHz, and the temperature range is-65-150 ℃.
Compared with the prior art, the switching device provided by the embodiment of the utility model has the advantages that the microwave dielectric substrate with the metalized through hole is arranged, the first bonding pad and the second bonding pad which are in conductive contact with the tested piece are fixedly arranged at the two ends of the metalized through hole, and the conductive ball structure which is in conductive contact with the second bonding pad is arranged on the test PCB, so that the electric connection test of the tested piece and the test PCB is realized, the manufacturing cost of the whole device is low, and the service life is long.
In some embodiments, the conductive ball structure 5 is a resilient conductive ball structure. In fact, the applicant has investigated and found that the pads of the test PCB 9 all have some processing errors, which can cause the contact surface of the pads of the test PCB 9 to be uneven, which can lead to poor contact. In the present embodiment, the conductive ball structure 5 is configured as an elastic conductive ball structure, so that the conductive ball structure 5 can be fully contacted with the second pad 2 by using the pressing force of the pressing structure 11 and fully utilizing the elasticity of the conductive ball structure 5 during testing (although the unevenness of the pad of the test PCB 9 causes the unevenness of the conductive ball structure 5, the second pad 2 can be contacted with the lowest conductive ball structure 5 by designing the size), thereby avoiding the problem of poor contact. The elastic conductive ball structure can adopt a plurality of alloy balls with elasticity and the like.
In some embodiments, referring to fig. 9 to 10, the adapting device 12 provided in the embodiments of the present invention further includes a supporting dielectric plate 7 located on a side of the microwave dielectric substrate 3 adjacent to the test PCB 9 for abutting against and supporting the microwave dielectric substrate 3. The conductive ball structure 5 is connected with the supporting medium plate 7, and the supporting medium plate 7 is fixed on the test PCB 9 through the conductive ball structure 5. The material of the supporting dielectric plate 7 is not limited, and the same material as the microwave dielectric substrate 3 may be used. The supporting medium plate 7 is provided with a through hole for the conductive ball structure 5 and the second pad 2 to pass through.
When the testing device is used in a test, the supporting dielectric plate 7 can provide a supporting function for the switching device provided by the embodiment of the utility model, and by utilizing the elasticity (compressibility) of the conductive ball structure 5, the supporting dielectric plate 7 can be directly abutted against the plate body of the testing PCB 9, so that the pad of the testing PCB 9 is prevented from being crushed due to the abutting of the conductive ball structure 5 and the pad on the testing PCB 9.
In some embodiments, the metalized via 4 is fixedly filled with a metal conductive pillar 6, and the metal conductive pillar 6 is electrically connected to the first pad 1 and the second pad 2, respectively. After the metal conductive columns 6 are filled in the metalized through holes 4, the transmission structure similar to a coaxial structure is formed with the microwave medium substrate 3, and the better test performance is achieved.
In some embodiments, the metal conductive pillars 6 are copper pillar members for better test performance.
In addition, a manufacturing method of the adapter device provided by the first embodiment of the present invention includes the following steps:
s100, a microwave dielectric substrate 3 is obtained, and a metallized through hole 4, a first bonding pad 1 and a second bonding pad 2 are manufactured on the microwave dielectric substrate 3, so that the process in the step is mature, and the process cost is low;
s300, respectively electroplating and flattening the first bonding pad 1 and the second bonding pad 2 to thicken and flatten the first bonding pad 1 and the second bonding pad 2, wherein the thickened and flattened first bonding pad 1 and the thickened and flattened second bonding pad 2 respectively have flat contact surfaces, the hardness is remarkably improved, and the thickened and flattened first bonding pad and the thickened and flattened second bonding pad 2 both protrude out of the microwave medium substrate 3, so that the first bonding pad 1 can be in better contact with a pin (or bonding pad) of a tested piece 8, and the second bonding pad 2 can be conveniently subjected to ball planting operation;
s400, a ball mounting operation is performed on the second bonding pad 2, so that the second bonding pad 2 obtains the conductive ball structure 5.
The manufacturing method of the adapter device provided by the embodiment of the utility model has the advantages of simple process, fast manufacturing process and lower manufacturing cost.
In some embodiments, the ball placement operation is to solder the conductive ball structure 5 to the second pad 2.
In some embodiments, the aperture of the metalized via 4 is generally 100-150um, and the heights of the first bonding pad 1 and the second bonding pad 2 after being electroplated and flattened are respectively about 40-80um higher than that of the microwave dielectric substrate 3.
In some embodiments, the method for manufacturing a transition device provided by the embodiment of the present invention further includes step S200 of filling and fixing the metal conductive pillar 6 in the metalized via 4. The step is located between step S100 and step S300, and after the metal conductive posts 6 are filled in the metalized via holes 4, a coaxial transmission structure is formed with the microwave dielectric substrate 3, so that the test performance is better.
In some embodiments, the manufacturing method of the interposer device according to the embodiment of the present invention further includes step S500 of obtaining the supporting dielectric plate 7, and connecting the supporting dielectric plate 7 to the microwave dielectric substrate 3. This step is located after step S400.
The manufacturing method of the adapter device provided by the second embodiment of the utility model comprises the following steps:
s100, a microwave dielectric substrate 3 is obtained, and a metallized through hole 4, a first bonding pad 1 and a second bonding pad 2 are manufactured on the microwave dielectric substrate 3, so that the process in the step is mature, and the process cost is low;
s300, respectively electroplating and flattening the first bonding pad 1 and the second bonding pad 2 to thicken and flatten the first bonding pad 1 and the second bonding pad 2, wherein the thickened and flattened first bonding pad 1 and the thickened and flattened second bonding pad 2 respectively have flat contact surfaces, the hardness is remarkably improved, and the thickened and flattened first bonding pad and the thickened and flattened second bonding pad 2 both protrude out of the microwave medium substrate 3, so that the first bonding pad 1 can be in better contact with a pin (or bonding pad) of a tested piece 8, and the second bonding pad 2 can be in contact with the conductive ball structure 5 for conduction;
s400, performing ball mounting operation on the pads on the test PCB 9, so that the test PCB 9 obtains the conductive ball structure 5.
The manufacturing method of the adapter device provided by the embodiment of the utility model has the advantages of simple process, fast manufacturing process and lower manufacturing cost.
In some embodiments, the ball placement operation is to solder the conductive ball structures 5 to pads on the test PCB board 9.
In some embodiments, the aperture of the metalized via 4 is generally 100-150um, and the heights of the first bonding pad 1 and the second bonding pad 2 after being electroplated and flattened are respectively about 40-80um higher than that of the microwave dielectric substrate 3.
In some embodiments, the method for manufacturing a transition device provided by the embodiment of the present invention further includes step S200 of filling and fixing the metal conductive pillar 6 in the metalized via 4. The step is located between step S100 and step S300, and after the metal conductive posts 6 are filled in the metalized via holes 4, a coaxial transmission structure is formed with the microwave dielectric substrate 3, so that the test performance is better.
In some embodiments, the step S400 of performing a ball-mounting operation on the pads on the test PCB 9, so that the obtaining of the conductive ball structure 5 by the test PCB 9 specifically includes:
obtaining a supporting dielectric plate 7 (the supporting dielectric plate 7 is provided with a through hole for the second bonding pad 2 to pass through so as to be contacted with the conductive ball structure 5), and planting balls on the supporting dielectric plate 7 so as to fix the conductive ball structure 5 on the supporting dielectric plate 7;
the conductive ball structures 5 are connected to pads on the test PCB board 9.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The switching device is characterized by comprising a microwave medium substrate positioned between a tested piece and a test PCB, wherein a plurality of metalized through holes used for electrically connecting the tested piece and the test PCB are arranged on the microwave medium substrate, one end of each metalized through hole is fixedly provided with a first bonding pad, the other end of each metalized through hole is fixedly provided with a second bonding pad, a conductive ball structure is fixedly arranged on each second bonding pad, the first bonding pad is used for being abutted and electrically connected with one of the tested piece and the test PCB, and the conductive ball structure is used for being abutted and electrically connected with the other of the tested piece and the test PCB.
2. The adapter of claim 1, wherein the conductive ball structure is a resilient conductive ball structure.
3. The interposer device as claimed in claim 2, wherein the first bonding pad is adapted to abut against and electrically connect to a tested device, the conductive ball structure is adapted to abut against and electrically connect to a test PCB, the interposer device further comprises a supporting dielectric plate connected to the microwave dielectric substrate, the supporting dielectric plate is located on a side of the microwave dielectric substrate adjacent to the test PCB, and the supporting dielectric plate is provided with a through hole for passing the conductive ball structure and the second bonding pad.
4. The transition device according to any one of claims 1 to 3, wherein the metalized via is fixedly filled with a metal conductive pillar, and the metal conductive pillar is electrically connected to the first pad and the second pad, respectively.
5. The transition device of claim 4, wherein the metal conductive post is a copper post member.
6. The adapter device according to claim 4, further comprising a positioning structure, wherein the positioning structure comprises a positioning frame and at least two positioning insertion posts for inserting into the insertion holes of the test PCB, the positioning insertion posts are connected with the positioning frame, the positioning frame is provided with a positioning notch adapted to the tested piece, and the microwave dielectric substrate is provided with a plurality of positioning through holes for respectively inserting and positioning the positioning insertion posts.
7. The adapter device according to any one of claims 1 to 3, further comprising a positioning structure, wherein the positioning structure comprises a positioning frame and at least two positioning insertion posts for inserting into the insertion holes of the test PCB, the positioning insertion posts are connected with the positioning frame, the positioning frame is provided with positioning notches adapted to the tested piece, and the microwave dielectric substrate is provided with a plurality of positioning through holes for respectively inserting and positioning the positioning insertion posts.
8. The switching device is characterized by comprising a microwave medium substrate positioned between a tested piece and a test PCB and a conductive ball structure fixedly arranged on the test PCB, wherein a plurality of metalized through holes used for electrically connecting the tested piece and the test PCB are arranged on the microwave medium substrate, a first bonding pad is fixedly arranged at one end of the metalized through hole close to the test PCB, a second bonding pad is fixedly arranged at one end of the test PCB, and the second bonding pad is abutted and conductive with the conductive ball structure.
9. The adapter of claim 8, wherein the conductive ball structure is a resilient conductive ball structure.
10. The adapter device of claim 9, further comprising a support dielectric plate for abutting against the microwave dielectric substrate on a side of the microwave dielectric substrate adjacent to the test PCB, wherein the resilient conductive ball structure is connected to the support dielectric plate, the support dielectric plate is fixed to the test PCB through the conductive ball structure, and the support dielectric plate is provided with a through hole for the conductive ball structure and the second pad to pass through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122310092.1U CN216217697U (en) | 2021-09-23 | 2021-09-23 | Switching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122310092.1U CN216217697U (en) | 2021-09-23 | 2021-09-23 | Switching device |
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| CN216217697U true CN216217697U (en) | 2022-04-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117135819A (en) * | 2023-04-11 | 2023-11-28 | 荣耀终端有限公司 | terminal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117135819A (en) * | 2023-04-11 | 2023-11-28 | 荣耀终端有限公司 | terminal |
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