CN109655733A - The method of non-destructive testing millimeter wave bga component - Google Patents
The method of non-destructive testing millimeter wave bga component Download PDFInfo
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- CN109655733A CN109655733A CN201811418051.0A CN201811418051A CN109655733A CN 109655733 A CN109655733 A CN 109655733A CN 201811418051 A CN201811418051 A CN 201811418051A CN 109655733 A CN109655733 A CN 109655733A
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- Prior art keywords
- bga component
- frequency
- destructive testing
- hair button
- low frequency
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The method of a kind of non-destructive testing millimeter wave bga component disclosed by the invention, it is desirable to provide a kind of to be easy to dismounting, flexibility ratio height and the non-destructive testing method to tested bga component without secondary damage.The technical scheme is that: when test, metal case (1) tips upside down on tested bga component (2) on first medium substrate (7), and the soldered ball and high frequency hair button (5) and low frequency hair button (6) of bga component (2) realize elasticity touching；Low frequency hair button (6) contacts the disk of low frequency patchcord (14), the low-frequency test interface that connection finger-like line is formed；High-frequency signal is transferred to 50 ohm of standard general high-frequency test interfaces of coplanar transmission (13) formation by Low ESR matched line (12) by high frequency hair button (5) vertical transition to high impedance matched line (11)；By complanar line (13) and low frequency patchcord (14), non-destructive testing can be carried out to the performance of bga component (2).
Description
Technical field
The invention belongs to microwave technical fields, particularly for the side tested millimeter wave bga component performance
Method.
Background technique
In recent years, the continuous improvement of millimetric wave device performance, the continuous reduction of cost effectively promote millimeter wave each
The application in a field.With the raising of millimetre-wave circuit integrated level, there is high density low-and high-frequency I/O interface, can be suitably used for advising greatly
Ball grid array BGA (the Ball Grid Array Package) encapsulation of mould SMT packaging technology has been used as a kind of mainstream encapsulation skill
Art.BGA BGA Package is the bottom production array soldered ball in encapsulation structure base board as the end I/O of circuit and printed wiring board
(PCB) it interconnects.It is a kind of surface attaching type device using the device that this technology encapsulates, can be realized multi-chip module MCM
High density, the high-performance of (MultiChip Module) are integrated.
In millimeter wave frequency band, by multiple millimeter wave chip packages at BGA component, before Surface Mount is welded on pcb board, palpus
Ensure that the functional status of component after chip package is normal.Therefore, it is necessary to first test package assembling, so as to according to its performance
Index is screened.If bga component in such a way that assemble welding is tested to pcb board, is removed after the completion of test
The process of bga component can cause centainly to damage to the soldered ball of BGA package.Therefore, this is to millimeter wave bga component
Non-destructive testing proposes urgent need.
In millimeter wave frequency band, test jack not only needs to guarantee that BGA package is connected to the low-frequency electric of pcb board, also needs to examine
Consider high-frequency transmission matching problem.In the method for existing non-destructive testing, usually by spring, elastic needle, elastic Argent grain and bullet
Property silver button etc. is as the connection medium between the soldered ball and microwave pcb board of bga component.Spring usable frequency is lower,
It is difficult to use in millimeter wave frequency band；And though elastic needle, elastic Argent grain and the silver-colored button of elasticity have excellent frequency transfer characteristic,
The higher cost and process-cycle is long.In addition, elastic needle also easily causes to damage to soldered ball.
Summary of the invention
The purpose of the present invention is provide one kind and be easy to for the deficiency in existing millimeter wave bga component test method
It dismounts, flexibility ratio is high, non-destructive testing method low in cost and to tested bga component without secondary damage.
In order to solve the above technical problems, the present invention is achieved through the following technical solutions: a kind of non-destructive testing millimeter wave BGA
The method of package assembling has the feature that and covers on copper face in the front of second medium substrate 15, etches one piece and corresponds to upwards
The ground connection copper face 10 of high frequency soldered ball 3 and orthogonal to that and corresponding low frequency soldered ball 4 with the low of disk finger-like on bga component 2
Frequency patchcord 14, and produce the high impedance matched line 11 with disk on the strip direction of the ground connection copper face 10 and extend with it
Connected Low ESR matched line 12, and the coplanar transmission 13 being connected with 12 terminal of Low ESR matched line, metallized
Front ground connection copper face 10 is connected to by hole 17 with ground connection copper face 16 under the large area of the back side, is guaranteed good high frequency earthing, is situated between first
7 back side of matter substrate covers copper face and etches and shape identical welding copper face 9 corresponding with ground connection 10 position of copper face, and 7 system on substrate
Out with tested 2 soldered ball of bga component non-metallic via hole 8 correspondingly；First medium substrate 7 welds copper face 9 by it
With second medium substrate (15) welding be fixedly connected, then will as connection bga component 2 and second medium substrate 15 it
Between vertical connection medium hair button, be filled in the non-metallic via hole 8 of first medium substrate 7, constitute test jack；It surveys
When examination, metal case 1 tips upside down on tested bga component 2 on first medium substrate 7, the soldered ball elasticity of bga component 2
Touch above-mentioned hair button；Low frequency hair button 6 contacts the disk of low frequency patchcord 14, and the low-frequency test that connection finger-like line is formed connects
Mouthful；High-frequency signal is transferred to altogether by 5 vertical transition of high frequency hair button to high impedance matched line 11 by Low ESR matched line 12
50 ohm of the standard general high-frequency test interfaces that face transmission line 13 is formed；To test the performance of bga component 2.
The present invention has the following beneficial effects with respect to the prior art:
Structure is simple, improves the reliability of test.The present invention is using hair button as low-and high-frequency signal vertical transfer medium: high frequency
Hair button 5 and first medium substrate 7 collectively form media filler quasi-coaxial transmission line and realize high frequency signal transmission；Single low frequency hair
The interconnection of the direct elastic compression joint of button 6, realizes the transmission of low frequency signal.The decrement of hair button can ensure the soldered ball of BGA package 2
Realize that good electrical is connect with the cabling on second medium substrate 15.And hair button has the elastic contact force of very little, tests
The soldered ball of bga component can be protected injury-free in journey.
It is suitable for engineering variation, flexible design degree is high.The present invention supports the structure of hair button using medium substrate, by high frequency
Hair button 5 and low frequency hair button 6 are filled in the non-metallic via hole 8 of first medium substrate 7: low frequency hair button 6 passes through non-gold
Categoryization via hole 8 realizes that low-frequency electric is connect with the disk Elastic Contact of the low frequency patchcord 14 on second medium substrate 15；High frequency
Hair button 5 passes through non-metallic via hole 8, the disk elastic connection of center hair button and high impedance matched line 11, remaining mao of knob
Button and ground connection 10 elastic connection of copper face.The medium quasi-coaxial transmission line structure that high frequency hair button 5 and first medium substrate 7 are formed,
Impedance matching is participated in jointly with high impedance matched line 11 and Low ESR matched line 12.It can be tested according to bga component specific
Demand adjusts material and the thickness of first medium substrate 7, the size of high impedance matched line 11 and Low ESR matched line 12 optimizes
The high-frequency transmission performance of application band, improves the flexibility of different frequency range and bandwidth Design.
Low in cost, the process-cycle is short.The present invention carries out low-cost design, the first medium plate 7 of use in many aspects
Via hole be not necessarily to metallize, eliminate the upper copper face circuit of first medium substrate；Two single-layer medium substrates are passed through into welding
Stacking connects firmly, and avoids laminating technique using multi-layer PCB.
Separable test method is interconnected for millimeter wave bga component and PCB using of the invention, it can be to avoid weldering
Termination process protects tested BGA soldered ball injury-free；The screening, debugging and repair of bga component are also helped simultaneously；
It can be used for the quick nondestructive test to millimeter wave frequency band bga component.
Detailed description of the invention
Fig. 1 is a kind of lamination schematic diagram of the method for non-destructive testing millimeter wave bga component of the present invention.
Fig. 2 is Fig. 1 decomposition diagram.
Fig. 3 is that Fig. 1 looks up decomposition diagram.
In figure: 1 metal case, 2BGA package assembling, 3 high frequency soldered balls, 4 low frequency soldered balls, 5 high frequency hair buttons, 6 low frequency hair knobs
Button, 7 first medium substrates, 8 non-metallic via holes, 9 welding copper faces, 10 ground connection copper faces, 11 high impedance matched lines, 12 Low ESRs
Wiring, 13 coplanar transmissions, 14 low frequency patchcords, 15 second medium substrates are grounded copper face under 16 large area, and 17 metallized
Hole.
In order to be more clear the purpose of the present invention and technical solution, the present invention is carried out with reference to the accompanying drawings and embodiments
It is further described.
Specific embodiment
- Fig. 3 refering to fig. 1.According to the present invention, it is covered on copper face in the front of second medium substrate 15, one piece of etching is right upwards
Answer the finger-like with disk of the ground connection copper face 10 of high frequency soldered ball 3 and orthogonal to that and corresponding low frequency soldered ball 4 on bga component 2
Low frequency patchcord 14, and produce the high impedance matched line 11 with disk on the strip direction of the ground connection copper face 10 and prolong with it
Connected Low ESR matched line 12, and the coplanar transmission 13 being connected with 12 terminal of Low ESR matched line are stretched, second is situated between
The back side of matter substrate 15 cover copper formed large area under be grounded copper face 16, and using U-shaped metallization VIA 17 will be grounded copper face 10 with
It is grounded copper face 16 under large area to be connected to, guarantees the good earthing effect of high frequency；7 back-etching shape of first medium substrate with connect
The identical welding copper face 9 of 10 corresponding position of ground copper face, and produce nonmetallic correspondingly with tested 2 soldered ball of bga component
Change via hole 8.The length and width dimensions of second medium substrate 15 are greater than the length and width dimensions of first medium substrate 7, guarantee to reveal after the two connects firmly
The external test interface that coplanar transmission 13 and low frequency patchcord 14 are formed out.
Before test, first medium substrate 7 welds copper face 9 by its back side and connects firmly with the welding of second medium substrate 15；It will be high
Frequency hair button 5 and low frequency hair button 6 are filled in the non-metallic via hole 8 of first medium substrate 7, and high frequency connection hair button 5 is worn
Cross non-metallic via hole 8, the disk elastic connection of center hair button and high impedance matched line 11, remaining mao of button and grounding copper
10 elastic connection of face；Low frequency hair button 6 passes through non-metallic via hole 8 and the realisation elasticity of linear array disk in low frequency patchcord 14
Connection, composition connect firmly integrated test jack.
When test, metal case 1 connects firmly the back-off of tested bga component 2 on first medium substrate 7, makes BGA package
The soldered ball of component 2 and above-mentioned hair button realize elasticity touching；Low frequency hair button 6 is elastic with bga component low frequency soldered ball 4 upwards
Touching, contacts with the linear array disk of low frequency patchcord 14 downwards, forms the test interface of low frequency connection；2 high frequency of bga component
High-frequency signal on soldered ball 3 is passed by 5 vertical transition of high frequency hair button through high impedance matched line 11 and Low ESR matched line 12
Defeated 50 ohm of the standard general high-frequency test interfaces formed to coplanar transmission 13；It ultimately forms shown in FIG. 1 with low frequency turn
The external test interface of wiring 14 and coplanar transmission 13 can carry out non-destructive testing to the performance of millimeter wave bga component
Typical test jack structure.
After the completion of test, directly tested bga component 2 can be removed；The test jack is reusable.
In the use of the present invention, can change first according to the application demand of bga component soldered ball different distributions form and be situated between
Matter substrate 7 crosses hole site and size；Meanwhile the working frequency range based on tested bga component 2, it neatly adjusts first and is situated between
The material of matter substrate 7 is matched with the size of Low ESR matched line 12 progress high-frequency resistance with thickness and high impedance matched line 11 and is set
Meter.In specific working frequency range, the good transmission of high-frequency signal can be realized by design of Simulation.
Particular embodiments described above illustrates the present invention in further detail.It should be appreciated that described herein
Specific embodiment only to explain the present invention, however it is not limited to the present invention in bga component soldered ball distribution form and externally
The test interface quantity of low-and high-frequency.
Claims (9)
1. a kind of method of non-destructive testing millimeter wave bga component, has the feature that and produces in first medium substrate (7)
With tested bga component (2) soldered ball non-metallic via hole (8) correspondingly, covered in the front of second medium substrate (15)
On copper face, etch one piece upwards on corresponding bga component (2) the ground connection copper face (10) of high frequency soldered ball (3) and it is orthogonal to that simultaneously
The low frequency patchcord (14) with disk finger-like of corresponding low frequency soldered ball (4), and on the strip copper face of ground connection copper face (10)
Produce the high impedance matched line (11) with disk and extend the Low ESR matched line (12) being connected with it, and with the Low ESR
The connected coplanar transmission (13) of matched line (12) terminal；Then by first medium substrate (7) and second medium substrate (15) layer
It is folded to be fixedly connected, it will be as the height of the vertical connection medium between connection bga component (2) and second medium substrate (15)
Frequency hair button (5) and low frequency hair button (6), are filled in the non-metallic via hole (8) of first medium substrate (7), are formed up and down
The electrical communication structure of elasticity touching, constitutes test jack；When test, metal case (1) falls tested bga component (2)
It is buckled on first medium substrate (7), the soldered ball elasticity of bga component (2) touches above-mentioned hair button；Low frequency hair button (6) connects
Touch the disk of low frequency patchcord (14), the low-frequency test interface that connection finger-like line is formed；High-frequency signal passes through high frequency hair button (5)
Vertical transition is transferred to the standard of coplanar transmission (13) formation by Low ESR matched line (12) to high impedance matched line (11)
50 ohm of general high-frequency test interfaces carry out non-destructive testing to the performance of bga component (2).
2. a kind of method of non-destructive testing millimeter wave bga component as described in claim 1, it is characterised in that: described
In hair button, high frequency hair button (5) and first medium substrate (7) constitute the similar axis of medium, and elasticity touching high impedance matching
Line (11).
3. a kind of method of non-destructive testing millimeter wave bga component as described in claim 1, it is characterised in that: the circle
Piece and around ground connection copper face (10) realize high frequency electrical connection, so as to form high frequency hair button (5) upwards elasticity touching BGA envelope
High frequency soldered ball (3) on arrangement (2), downward Elastic Contact high impedance matched line (11) are connected to along Low ESR matched line (12)
To coplanar transmission (13), the external test interface of bga component (2) transmission high-frequency signal is constituted.
4. a kind of method of non-destructive testing millimeter wave bga component as described in claim 1, it is characterised in that: low frequency hair
Button (6) the low frequency soldered ball (4) in elasticity touching bga component (2) upwards, on downward Elastic Contact low frequency patchcord (14)
Linear array disk, along low frequency patchcord (14) transmit low frequency signal, formed bga component (2) transmission low frequency signal it is external
Test interface.
5. a kind of method of non-destructive testing millimeter wave bga component as described in claim 1, it is characterised in that: before test,
High frequency hair button (5) is filled in the non-metallic via hole (8) of first medium substrate (7), high frequency connection hair button (5) passes through
Non-metallic via hole (8), the disk elastic connection of center hair button and high impedance matched line (11), remaining mao of button and ground connection
Copper face (10) elastic connection.
6. a kind of method of non-destructive testing millimeter wave bga component as described in claim 1, it is characterised in that: second is situated between
The length and width dimensions of matter substrate (15) are greater than the length and width dimensions of first medium substrate (7).
7. a kind of method of non-destructive testing millimeter wave bga component as described in claim 1, it is characterised in that: first is situated between
Copper face is covered in matter substrate (7) etching bottom surface, and copper face (10) position is corresponding and the identical welding copper face (9) of shape with ground connection, is used for and the
Two substrates (15) welding connects firmly.
8. a kind of method of non-destructive testing millimeter wave bga component as described in claim 1, it is characterised in that: second is situated between
Copper face ground connection copper face (16) is covered in matter substrate (15) bottom surface, and metallization VIA (17) will be grounded grounding copper under copper face (10) and large area
Face (16) connection, guarantees good high frequency earthing effect.
9. a kind of method of non-destructive testing millimeter wave bga component as described in claim 1, it is characterised in that: first is situated between
Matter substrate (7) and second medium substrate (15), which pass through to be formed by welding, connects firmly integrated test jack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811418051.0A CN109655733B (en) | 2018-11-26 | 2018-11-26 | Method for nondestructive testing of millimeter wave BGA packaging assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811418051.0A CN109655733B (en) | 2018-11-26 | 2018-11-26 | Method for nondestructive testing of millimeter wave BGA packaging assembly |
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| CN109655733A true CN109655733A (en) | 2019-04-19 |
| CN109655733B CN109655733B (en) | 2020-11-24 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110784270A (en) * | 2019-10-11 | 2020-02-11 | 中国电子科技集团公司第二十九研究所 | BGA port radio frequency transmission performance detection device and detection method |
| CN112379134A (en) * | 2020-11-11 | 2021-02-19 | 中国电子科技集团公司第十四研究所 | Aluminum alloy small-caliber deep-cavity inner surface weldability test fixture |
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| CN112379134A (en) * | 2020-11-11 | 2021-02-19 | 中国电子科技集团公司第十四研究所 | Aluminum alloy small-caliber deep-cavity inner surface weldability test fixture |
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| CN109655733B (en) | 2020-11-24 |
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