JP2734412B2 - Semiconductor device socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for a semiconductor device, and particularly to a QFP (Quad Flat Package).
e) and a test socket for a surface-mounted semiconductor device such as a BGA package.

[0002]

2. Description of the Related Art There are two types of sockets for semiconductor devices, especially IC sockets, for product mounting and testing. There are structural differences depending on the purpose.

A socket for mounting a product is used when a completed semiconductor device is incorporated into a final product. Therefore, the semiconductor device does not have a structure in which the lead of the semiconductor device can be properly taken out of the socket only by fitting the lead once into the terminal of the socket, and the semiconductor device does not have durability enough to withstand many attachments and detachments.

However, the test socket needs to have a structure capable of performing an electrical characteristic test of a semiconductor device which is considered to be completed, and to have a structure capable of withstanding at least several thousand times of attachment and detachment of the semiconductor device. Here, it relates to this test socket. The semiconductor device to be tested is of a type, for example, a QFP, which is directly soldered and mounted on the surface of the printed wiring board. In this type, a large number of leads are led out in two or four directions from the side of a rectangular insulating resin or ceramic package of a predetermined thickness. It is provided. Furthermore, the present invention also relates to sockets that are compatible with ball grid array (BGA) package ICs that have recently attracted attention.

Referring to a sectional view of FIG. 7 and a top view of FIG. 8 showing a test socket of a QFP type semiconductor device, the socket has a large number of rectangular receiving portions 12 in each of four directions. The contact pins 40 are arranged, the receiving portion 12 is detachable, and the contact pins 40 are directly fixed to the socket body 11. The contact pins 40 have an arrangement pitch common to the leads of the semiconductor device, and the terminals connected to the lands of the printed wiring board are led out to the lower part. Holding section 1 for semiconductor device 1 housed therein
A cover 14 for pressing and fixing at 5 is fixed to the socket body 11 with a hinge.

First, the semiconductor device 1 is connected to the socket body 1.
It is stored in one receiving part 12. The receiving portion 12 is usually a separate member from the socket main body 11, and
With the contact pins 4 embedded in the socket body 11.
Adjust each position to 0. In this state, when the cover 14 is put on from above, the leads 2 are pressed against the contact pins 40 by the lead pressing portions 15 formed on the inner surface of the cover 14 on all sides, and the claw portions 16 provided on the cover 14 The semiconductor device 1 is held by engaging with an engaging portion 17 provided on the semiconductor device 1. Here, the electrical connection between the lead 2 and the contact pin 40 is ensured.

Although not shown here, in the socket for the handler, only the socket body 11 is used, and instead of the lid 14, the lead 2 is pushed by a pusher having a similar lead holding portion.
A structure may be used in which electrical measurement is performed while pressing and holding the contact pins 40 on the contact pins 40.

FIG. 7 shows a state in which the semiconductor device 1 is set, while FIG. 8 shows a state in which the lid 14 is opened and the semiconductor device 1 is removed.

Referring to FIG. 9 which shows a plan view of the contact pin 40 shown in FIGS.
Is formed by punching a plate-like material having excellent spring properties equivalent to beryllium and having high electric conductivity into a bent shape as shown in the figure and having a spring property. When the lead 2 pushes the contact portion 41 of the contact pin 40 with the lead 2 from above, the contact portion 41 and the arm portion 42 of the contact pin 40 bend downward with the root 43 as a substantially fulcrum, eliminating the load from above. Then, it has a spring property that returns to its original state. In order to achieve an appropriate contact load with the lead 2, the arm 42 needs to have a certain length (about 10 mm), depending on the thickness of the contact material. On the other hand, the current flowing through the contact pins 40 takes a route from the connection terminal portion 44 to the circuit board by soldering, passing through the root portion 43, the arm portion 42, and the contact portion 41 to reach the lead 2. Therefore, when the ammeter path is about 10 mm, it is inevitable that the inductance of the contact pin becomes about 10 nH.

[0010]

However, the conventional socket described above has a disadvantage that the impedance of the contact pin 40 cannot be neglected and a high-frequency signal cannot be accurately transmitted to the IC when measuring for inspecting an IC operating at high speed. was there. Contact pins 4
It has been considered to shorten the length of 0, but in the above-described structure, there is a limit because the spring property is sacrificed.

Further, since adjacent contact pins are close to each other, mutual interference cannot be ignored, and high-frequency signals, especially 100M
When the frequency exceeds Hz, there is a problem that signals cannot be transmitted and received accurately, and that the circuit does not operate as a predetermined circuit function.

In particular, when a semiconductor device rejected in a test using a test socket is solder-mounted on a printed wiring board, the semiconductor device may work normally, which is a troublesome problem.

By the way, FIG. 1 described in Japanese Utility Model Laid-Open Publication No. 63-185575 using a strip line for a socket is disclosed.
Referring to FIG. 0, the semiconductor device 1 ′ is a DIP (Dual
Although it is of an in-line package type, the lead 2 of the semiconductor element 1 'is inserted into a contact 40' in which two strip-shaped metal conductors having spring properties are stacked. The ground conductor 18 is formed on the outer surface of the contact conductor 40 'via the insulator 7. The distance between the contact conductor 40 'and the ground conductor 18 has a characteristic impedance determined by the dielectric constant of the insulator 7 and the width of the contact conductor 40', and this characteristic impedance is set to the characteristic impedance of the strip line 33 of the circuit board 30. It is considered that the reflection and the loss of the high-frequency signal can be eliminated by being matched with.

However, such a structure has a problem that mutual interference between adjacent contact conductors occurs. Particularly, when the number of leads 2 is large, the influence is large, and a QFP type having more than 100 leads is required. Has been determined to be unusable.

That is, while the interval between the leads 2 of the DIP type is as wide as 2.54 mm, the lead pitch of the QFP is as narrow as about 0.5 mm. Therefore, a strip line cannot be formed in a form that avoids mutual interference. found.

Further, it has been found that since there is no structure in which the contact conductor 40 'serving as a contact portion of the lead 2 resiliently receives the lead 2, abrasion occurs due to repeated use, and contact failure will soon occur. .

Further, since there is a variation in the bending of the leads 2, in this case, all the leads 2 cannot be fitted into the contact conductor 40 'at the same time. Therefore, it has been found that this is not suitable for automatically attaching and detaching the semiconductor element 1 '.

In view of the above problems, the present invention has the following problems.

(1) There is no mutual interference between contact pins.

(2) Impedance matching should be achieved so that there is no loss in signal transmission / reception.

(3) To make the equivalent inductance of the contact pin negligible.

(4) A high-frequency signal, particularly a signal of 100 MHz or more, must be transmitted accurately.

(5) To ensure the elasticity of the contact pins so as to withstand frequent use.

(6) The electrical characteristics of a semiconductor device such as a QFP or BGA can be measured accurately.

(7) The interval between contact pins is 0.5
To be able to perform high-frequency transmission satisfactorily even in the order of mm.

(8) To ensure good electrical and mechanical connection of the contact pins.

(9) Even if there is some variation in the external terminals of the semiconductor device, it is necessary to prevent a contact failure.

(10) A semiconductor device can be automatically attached and detached.

(11) Improving the reliability of the socket itself so that the electrical characteristics of the semiconductor device can be accurately performed.

(12) To avoid increasing the number of test processes using sockets.

[0031]

According to the present invention, there is provided a semiconductor device having one end resiliently in contact with an external electrode of a semiconductor device and the other end connected to a conductor of a mounting substrate. In the socket of the semiconductor device, a large number of contact pins electrically connected to the socket body are arranged on the socket body, and a lid for pressing the external electrode is connected to the socket body so that the external electrode contacts the one end. The contact pin is located between the ground portion of the mounting substrate and the external electrode.
A ground conductor which is extended to near, and it has a micro <br/> strip line and a this along the grounding conductor extended by interposing an insulating layer signal conductor, said ground conductor,
It is characterized in that it is arranged between the contact pin arrangements .

In particular, the grounding conductor is made of an elastic metal plate, and the insulating layer and the signal conductor are made of a flexible material.

Further the insulating layer is characterized by an insulator covering the surface of the ground conductor, further wherein the co
The other end of the contact pin goes through the through hole of the mounting board.
It has a coaxial cable structure that penetrates .

Further, in the above structure, the external electrode is preferably formed of an external lead or a solder ball mounted on the surface.

[0035] In particular said ground conductor, characterized in that it is electrically derived collectively fixing surface of the mounting substrate of the socket body, the characteristic impedance of the previous SL microstrip line In addition, the mounting characterized in that which is matched to the characteristic impedance of the strip line on the substrate.

[0036]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the cross-sectional view of FIG. 1 showing a first embodiment of the present invention, this embodiment tests an external lead on which electrodes of a semiconductor device 1 are surface-mounted, for example, a QFP type. The socket is the same as the socket of FIG. 7 except that the configuration of the contact pin 34 and the provision of the base plate 35 are provided.

The contact pin 34 of this embodiment is formed of an unbalanced microstrip line, and the ground conductor serving as a base is arranged so as to be in a plane parallel to the paper surface.
First, it is connected to the base plate 35, further connected to the back conductor 31 of the substrate 32, and grounded. Here, the substrate 32 to which the socket body 11 'is fixed constitutes a microstrip line in which an insulating base is interposed between the back conductor 31 and the back conductor 33.

The contact pin 34 has a structure in which the electrical performance of a high-frequency signal is improved while maintaining the mechanical performance of resiliently receiving the lead 2 and no mutual interference occurs even at a narrower pitch.

Referring to a perspective view of FIG. 2 showing the structure and arrangement of the contact pins 34 in detail, an insulating layer 22 is partially fixed on a ground conductor 21 serving as a base. The conductor 23 is fixed to form a microstrip line. Contact pad 2 with lead 2
4 is fixed to the side surface of the ground conductor 21 via the insulating layer 22. The upper end of the signal conductor 23 is a contact pad 24, and the lower end is an external connection terminal 25. The auxiliary conductor 29 extending from the side of the signal conductor 23 is connected to the terminal 25.
Alternatively, it is a matching line for correcting an impedance mismatch generated at the contact pad 24, and this impedance is determined by the mounting position and the length. Is formed. The signal conductor 2
If no standing wave is generated in 3, the attached conductor 29
Is unnecessary.

The ground conductor 21 of the contact pin 34 is preferably made of a resilient material such as beryllium copper, which is common with the prior art.
Its thickness is, for example, 0.2 mm, and its planar shape is common to the conventional contact pin 40. For this reason, it is possible to elastically receive the lead 2 as in the related art.

The insulating layer 22 is preferably made of a material having a small dielectric loss, such as polyimide, and has a thickness of, for example, 0.1 mm or less. The signal conductor 23 is formed by etching a copper foil or the like, and is appropriately plated with gold or the like.
mm, the width is determined by the characteristic impedance,
It is about 0.1 to 0.2 mm. The characteristic impedance of this line is preferably 50Ω to 75Ω.

When the width of the signal conductor 23 is sufficiently smaller than the width of the ground conductor 21, the transmission line of the signal conductor 23 can be regarded as a microstrip structure, and when the dielectric constant of the insulating layer 22 is constant, the insulating layer By selecting the thickness of the conductor 22 and the width of the conductor 23, the characteristic impedance can be set to, for example, 50Ω, and the characteristic impedance of the circuit board can be matched. The insulating layer 22 and the signal conductor 23 can be easily realized by using a flexible printed circuit board, and are adhered to the ground conductor 1 with an adhesive. The contact pins 34 themselves bend up and down due to opening and closing of the lid 14, but the insulating layer 22 and the signal conductor 23 are also somewhat flexible, and no problem occurs. The contact portion with the lead 2 is formed by bending the insulating layer 22 and the signal conductor 23 along the side surface at the upper end of the contact pin 34 to form the signal conductor 23.
Is formed. The terminal 25 for external connection with the circuit board 32 extends only the signal conductor 23 so that it can be connected to an opening or a through hole of the circuit board 32.

The contact pins 34 are provided between the spacers 28.
And a contact pin 3 of another common shape
4 are arranged. The spacer 28 has a thickness that has a commonality with the pitch of the leads 2, and its plane contacts the plane of the base 27 of the contact pin 34. The spacer 28
In order to ground the base 27, a metal sheet is preferable, and is integrally formed with the base plate 35. Since a ground conductor is interposed between the signal conductor 23 of the nearby contact pin 34 and the signal conductor 23, there is no concern about mutual interference.

The contact pin 34 shown in FIG. 2 is an unbalanced microstrip line.
If an insulating layer having the same dimension as the insulating layer 22 is interposed on the opposite surface of the micro-strip line 1, a balanced microstrip line is obtained, which is more preferable in terms of reducing transmission loss.

Referring to FIG. 3, which shows a perspective view of the connecting portion between the contact pin 34 and the substrate 32 in FIG. 1 as viewed from the side of the surface conductor 33, the contact pin 34 is formed in an opening penetrating the substrate 32. Many are arranged at a lead pitch, and the signal conductors 25 of the respective contact pins 34 are connected to each other by solder 37 at ends so as to be orthogonal to the surface conductor 33 of the substrate 32. It is preferable that the back conductor 31 of the substrate 32 be connected to the ground conductor 21 of the contact pin 34 by solder 38 in order to further reduce the loss.
Since the solder 38 is already connected to the back conductor 31 through the base plate 35, the connection of the solder 38 may be omitted. The auxiliary conductor 36 extends from the back surface conductor 33, and is formed with a predetermined size in advance in order to perform impedance matching of the connection portion, similarly to the auxiliary conductor 29 in FIG. If the matching state is within the allowable value, the attached conductor 36 is unnecessary.

The opening of this connection portion has a diameter of 0.3 m in which each signal conductor 25 enters, in addition to that shown in FIG.
A circular hole of about m may be opened.
In this case, a coaxial cable structure is adopted. Also, the substrate 32
Is set so as to have the same characteristic impedance as the contact pins 34,
1 is thicker.

The substrate 32 is a non-balanced type microstrip line. In addition, the insulating layer 22 is fixed to both surfaces of the signal conductor 23, and is sandwiched between the ground conductor 21 and the ground conductor 21 to be symmetric. It is more preferable to adopt a so-called balanced strip line as a mold in order to reduce the loss.

The electrical and mechanical connection between the socket body 11 'and the board 32 is made using bolts and nuts not shown in FIG. 1, but in order to make the electrical connection better, A conductive adhesive or the like is used between the base plate 35 and the back conductor 31. Although the end of the board 32 is not shown, a coaxial cable connector is attached thereto.
The end of the board 32 is electrically connected to a conductor (not shown), and the center conductor of the connector is electrically connected to the back conductor 33. In addition, it is preferable that the surface conductor 33 is shielded with a distance of 5 mm or more. Also, the substrate 3 in the central part
2, a back conductor 31 is electrically led out to the front, and a projection inserted into the through hole is formed by being electrically connected to the base plate 35. The protrusion and the surface of the through hole may be connected by solder.

Further, in the structure shown in FIG. 3, a through-hole is formed using the connection terminal 25 of the portion without the ground conductor 21 as a central conductor, and the through-hole serving as the ground conductor and the terminal 25 are coaxial cables. May be configured. When configuring a coaxial cable, the signal conductor 25
However, the center line of the circular cross section may be used instead of the square bar, and the surface of the center line may be covered with an insulating layer, and the covered line may constitute the signal conductor 23 on the contact pin 34, It may extend to the contact pad 24. In this case, a strip line having a predetermined characteristic impedance is constituted by the covered wire and the slow conductor 21.

As described above, according to the present embodiment, 0.5 m
Even for QFP type ICs with a narrow pitch of about m, the insulating layer and the signal conductor layer can be formed with a thickness of 0.1 mm or less, so that impedance matching can be performed well and a ground conductor is provided between the contact pins. There is no mutual interference because it intervenes,
There is an advantage that transmission loss is extremely small.

Referring to the sectional view of FIG. 4 showing the second embodiment of the present invention, this embodiment is different from the first embodiment except for the contact pin 20, the ground contact pin, the receiving portion 12 'and the substrate 32' associated therewith. 1 are common to the first embodiment shown in FIG. 1, the description of the points common to both the configuration and the effects is omitted, and different parts will be described.

The socket of this embodiment has a receiving portion 12 'on which a BGA type semiconductor device 1' is mounted. In this type of semiconductor device 1 ', the electrodes arranged on the lower surface of the package body are connected to the solder balls 3. It has a pitch of 1.27 mm and is arranged at a grid-like intersection. The signal path to the solder ball 3 corresponding to the lead 2 is short and suitable for a package for a high-speed IC, but the solder ball 3 is easily damaged. ,
In order to make contact with a low load, it is necessary to lengthen the contact pin 20, and when it is put in a socket and measured, the electric performance has been significantly deteriorated in the past.

The contact pins 6 of this embodiment are composed of unbalanced microstrip lines. The ground contact pin 4 passes through the through hole of the substrate 32 'as it is. The lower end of the contact pin 20 penetrates through the through hole 6 of the substrate 32 'and is connected to the surface conductor 33 by solder. Here, the through hole 6 forms a coaxial cable. A common ground layer 8 for electrically connecting the ground conductor of the contact pin 20 and the ground contact pin 4 all in common.
Are in close contact with the back conductor 31 of the substrate 32 '. The ground contact pin 4 is connected to the ground potential of the through hole by solder or the like via the through hole 5.

The mechanical points different from the first embodiment are that a load for contact from above is applied from the upper part of the package body and that the contact pins 20 are provided not on the periphery of the package but on the lower surface of the package. For example, it may be different from a contact pin such as QEP due to the density.

Referring to the perspective view of FIG. 5 showing the contact pin 20 of this embodiment in detail, the contact pin 20 bends the head of a plate-shaped metal conductor so that the solder ball 3 can be placed thereon. The ground conductor 21 is formed by bending the middle part into an S-shape and having spring properties. Therefore, as in the first embodiment, the contact pin 20 is connected to the ground conductor 2.
1, a three-layer structure of the insulating layer 22 and the signal conductor 23, and a microstrip structure. Also,
When the GND / power supply terminal of the semiconductor device 1 'is known, only the contact pin 4 is made of a metal conductor, and the ground base plate 35 is not provided as in the first embodiment.
It can be connected to the ground layer 31 of the circuit board 32 '.

Although not shown in the embodiment, if a coated single wire having a small diameter is used as the signal conductor 23 and is adhered to the ground conductor 33, impedance matching is performed in the same manner as in the first embodiment. Contact pins can be realized.

Incidentally, also in this embodiment, the signal conductor 2
Conductors extending from 3 can be formed as needed to provide impedance matching.

Referring to FIG. 6, which shows a top view of the semiconductor device 1 'with the socket open, contact pins 4 and 20 are respectively placed on the socket body 11' according to the arrangement of the electrodes composed of the solder balls 3 of the semiconductor device 1 '. It is prepared.

[0059]

As described above, according to the present invention,
Contact pins can be made into microstrip structure even for IC packages with narrow pitches and many pins, which was impossible in the past, and it is possible to match with the characteristic impedance of the circuit board except for the contact parts with electrodes such as leads. Becomes
Therefore, even if a high-frequency signal is applied via the socket,
There is an effect that signals without reflection and attenuation can be transmitted, and furthermore, most of the components of the conventional socket can be used in common, and there is also an economic effect that the development cost of a mold and the like can be reduced. Each of the tasks (1) to (12) is achieved.

[0060]

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of the present invention.

FIG. 2 is a perspective view showing a contact pin of the first embodiment.

FIG. 3 is a perspective view showing a state of being mounted on a board according to the first embodiment.

FIG. 4 is a sectional view of a second embodiment of the present invention.

FIG. 5 is a perspective view showing a contact pin of a second embodiment.

FIG. 6 is a top view showing a state where the socket of the second embodiment is opened.

FIG. 7 is a cross-sectional view showing an example of a conventional test socket.

FIG. 8 is a top view showing a state where a conventional socket is opened.

FIG. 9 is a plan view showing contact pins of a conventional socket.

FIG. 10 is a sectional view showing another example of a conventional socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 1 'Semiconductor device 2 Lead 3 Solder ball 4 Ground contact pin 5 Ground through hole 6 Through hole 7 Insulator 8 Common ground layer 11, 11', 11 "Socket body 12, 12 'Receiving part 14 Cover 15 Lead Holding part 16 Claw part 17 Engaging part 18, 21 Ground conductor 20, 34, 40 Contact pin 22 Insulating layer 23 Signal conductor 24 Contact pad 25 Connection terminal 26, 43 Root 27 Base 28 Spacer 29, 36 Attached conductor 31 Back surface Conductor 32, 32 'Board 33 Surface conductor 35 Base plate 37, 38 Solder 41 Contact part 42 Arm part 44 Connection terminal part

Claims (7)

(57) [Claims] 1. A contact pin having one end elastically in contact with an external electrode of a semiconductor device and the other end connected to a conductor of a mounting board, wherein the one end and the other end are electrically connected. In a socket of a semiconductor device , wherein a lid for pressing the external electrode is connected to the socket body so that the external electrode contacts the one end so that the external electrode contacts the one end. Is the grounding part of the mounting board
A ground conductor extending from
And it has a microstrip line and a along the grounding conductor is interposed an insulating layer is extended signal conductors, the grounding conductor, distribution between the contact pin arrangement
A socket for a semiconductor device, wherein the socket is placed . 2. The semiconductor device socket according to claim 1, wherein the ground conductor is made of a resilient metal plate, and the insulating layer and the signal conductor are made of a flexible material. 3. The semiconductor device socket according to claim 1, wherein said insulating layer is made of an insulator covering a surface of said ground semiconductor. 4. The mounting method according to claim 1, wherein the other end of the contact pin is mounted on the mounting pin.
2. The socket for a semiconductor device according to claim 1 , wherein the socket has a coaxial cable structure penetrating through holes in the substrate . 5. The socket of a semiconductor device according to claim 1, wherein said external electrodes are formed of external leads or solder balls mounted on a surface. 6. The socket of a semiconductor device according to claim 1, wherein said ground conductor is electrically led out to a fixing surface of said mounting board in said socket body. 7. Characteristics of the characteristic impedance of a microstrip line, a strip line on the mounting board
The socket of the semiconductor device according to claim 1, wherein the socket is matched with impedance .