WO2000004394A1

WO2000004394A1 - Socket for device measurement, and method of measuring device

Info

Publication number: WO2000004394A1
Application number: PCT/JP1999/003811
Authority: WO
Inventors: Satoru Nagumo; Tsunehito Yokoi
Original assignee: Advantest Corporation
Priority date: 1998-07-16
Filing date: 1999-07-15
Publication date: 2000-01-27
Also published as: TW436631B

Abstract

A reliable, durable tool having good high-frequency characteristics for measuring high-frequency devices. A tool (10) for measuring high-frequency devices includes a substrate (16) on which a coplanar circuit is provided to connect between I/O terminals (42, 44) and coaxial connectors (12, 14). This substrate (16) is composed of a flexible material such as polyimide resin, and silicone rubber backing (18) on the substrate acts to press a high-frequency device (30) set on the surface. As a result, the substrate is deformed to match the surface shape of the high-frequency device (30), and the corresponding terminals come in reliable contact.

Description

Description Device measurement device socket and device measurement method

The present invention relates to a device measuring socket for mounting a device for measuring various characteristics using a measuring instrument.

Background art

Recently, various high-frequency devices have been used in accordance with demands for faster processing of various devices and higher bandwidth of signal transmission. For example, a filter or an amplifier as a high-frequency device is frequently used in an antenna input portion of a mobile phone that transmits and receives radio waves having a frequency of 800 MHz and 5 GHz. In addition, with the recent demand for miniaturization of products, these high-frequency devices have also been miniaturized, and are often formed as so-called surface-mounted devices.

Various characteristics may be measured at the time of manufacturing or assembling such high-frequency devices, but since the signals to be handled are high-frequency, special measurement jigs (test fixtures) are used.

FIG. 14 is a diagram showing a specific example of a conventional high-frequency device measuring jig. The high-frequency device measuring jig 100 shown in FIG. 14 is an external connection terminal 100 connected via a coaxial cable or the like to a measuring instrument such as a network analyzer or a spectrum analyzer for measuring high-frequency characteristics. 2 and 104, and a conductive rubber 120 inserted between the high-frequency device 200 to be measured and the microstrip substrate 110. ing. In the conductive rubber 120, conductive pins penetrating between the front surface and the back surface are arranged at predetermined intervals, and formed on the front surface of the high-frequency device 200 through the conductive pins. Electrical connection is made between the device-side terminals and the measurement terminals formed on the microstrip substrate 110 surface.

FIG. 15 is a diagram showing another specific example of the conventional high-frequency device measuring jig. The high-frequency device measurement jig 13 0 shown in FIG. 15 has external connection terminals 13 2 and 13 4 as well as a plurality of measurement terminals for making an electrical connection with the high-frequency device 200. A microstrip substrate 140 provided with the movable pins 1336 of FIG. When the high-frequency device 200 is pressed against the surface of the microstrip substrate 140, the device-side terminals formed on the surface of the high-frequency device 200 have movable pins 13 6 provided on the microstrip substrate 140. Therefore, an electrical connection is made between the device side terminal and the measurement terminal.

By the way, the conventional high-frequency device measuring jig described above has a problem that the durability and the reliability are low and the high-frequency characteristics are poor even when any kind of the jig is used. For example, in the high-frequency device measuring jig 100 shown in FIG. 14, an electrical connection between the high-frequency device 200 and the measuring terminal is made by a conductive pin included in the conductive rubber 120. Therefore, if the tip of the conductive pin is bent by repeated use, a connection failure may occur. Also, a good connection state cannot be obtained unless the entire conductive rubber 120 is pressed with a large force. In addition, for signals in the high-frequency range, the conductive pins of each are connected by a capacitor, so the device-side terminals of the high-frequency device 200 or the measurement terminals of the microstrip substrate 110 are short-circuited. As a result, the high frequency characteristics were not considered to be good.

In the high-frequency device measurement jig 130 shown in Fig. 15, if there is foreign matter or burrs around the movable pin 13 36, the movable pin 13 36 may be caught and go to the device side terminal. Contact becomes insufficient. In many cases, the movable pins 13 6 are realized by using a panel.However, since equivalently includes a coil and a large contact resistance, it becomes a complicated equivalent circuit especially for signals in the high frequency range, and This hinders the intrinsic property measurement of device 200.

The above-mentioned various problems are not specific to the high-frequency device, but are applied to various devices including the high-frequency device. Disclosure of the invention

The present invention has been made in view of the above points, and its purpose is to provide durability, An object of the present invention is to provide a high-frequency device measuring jig having excellent reliability and excellent frequency characteristics. -In the device measuring socket of the present invention, since the substrate on which the measuring terminals are formed is formed of a flexible sheet-shaped member, the measuring terminals are provided on a plurality of device-side terminals provided on the device. It can be easily contacted with it. In particular, since the terminals are brought into direct contact with each other, the structure is simple, and the durability and reliability can be improved. In addition, since the device side terminal and the measurement terminal are connected via the shortest path, good frequency characteristics can be obtained.

In the above-mentioned substrate, it is preferable that the external connection terminal connected to the measuring instrument and the measuring terminal are connected by a coplanar single line or a microstrip line. By using a coplanar line, a conductor layer can be formed only on one surface of the substrate, and the substrate can have sufficient flexibility, and the measurement terminals and device-side terminals can be securely connected. Can be contacted. Also, by using a coplanar line or microstrip line, it is possible to reduce the loss and reflection when a high-frequency signal is input and output between the device and the measuring instrument. In doing so, accurate measurement becomes possible.

Further, by forming the conductive protrusions on the measurement terminals on the substrate, the contact between the measurement terminals and the device-side terminals can be further ensured. In particular, by forming the projections using bumps commonly used for device connection, etc., it becomes easy to manufacture a substrate including the projections.

Further, it is preferable to dispose a flexible supporting member having a predetermined thickness on one surface of the substrate opposite to the surface on which the measuring terminals are formed. By pressing the back side of the substrate with a flexible support member, the substrate shape is deformed according to the surface shape of the device. The measurement terminals can be brought into contact.

In addition, the support member and the board are housed in a case, the connection to the measuring instrument is performed using the external connection terminal fixed to the case, and the wiring between the measurement terminal and the external connection terminal is provided on the board. It is preferable to use the formed pattern electrode. By using pattern electrodes, wide wiring can be easily formed and transmission lines Can be easily reduced in impedance.

Further, in this case, it is preferable that the external connection terminal and the pattern electrode on the substrate are partially pressed by a pressing means to make an electrical connection therebetween. Since the electrical connection is made by pressing, the substrate can be easily attached and detached, and if the substrate needs to be replaced due to wear of the measurement terminals, the labor required for the replacement can be reduced. .

Also, by forming a penetrating groove around the periphery of the measurement terminal, the periphery of the measurement terminal is easily deformed, and the unevenness of the device surface shape is more easily absorbed by the flexibility of the substrate. A good contact state between terminals can be realized with a small pressing force.

Further, the plurality of measurement terminals formed on the surface of the substrate are preferably formed by photoetching. An unnecessary portion of the metal film or the like can be removed by photoetching to form a terminal having a desired shape, and fine processing can be performed, so that the distance between the terminals can be reduced. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a perspective view showing a configuration of a device measurement socket according to an embodiment. FIG. 2 is an enlarged cross-sectional view including a conductor and conductors arranged on both sides of the conductor.

FIG. 3 is a cross-sectional view showing a contact state when devices with different terminal heights are attached to the device measuring socket of the present embodiment.

FIG. 4 is a diagram showing a modification of the device measurement socket.

FIG. 5 is a view showing a modification in which a groove is added to the substrate shown in FIG. 4, FIG. 6 is a view showing another modification of the device measuring socket,

FIG. 7 is a perspective view showing another modification of the device measuring socket.

FIG. 8 is a diagram showing an example of use of the device measuring socket shown in FIG. 7,

FIG. 9 is a perspective view showing a partial configuration of the device measuring socket,

FIG. 10 is a partial cross-sectional view of the device measuring socket including the coaxial connector. FIG. 11 is a cross-sectional view taken along the line A—A of FIG.

FIG. 12 is a diagram showing the internal structure of the pogo pin, FIG. 13 is a perspective view of a substrate on which a microstrip line is formed, FIG. 14 is a diagram showing a specific example of a conventional high-frequency device measurement jig,-FIG. 15 is a diagram of a conventional high-frequency device measurement jig It is a figure showing a specific example. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a device measuring socket according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a configuration of a device measuring socket according to an embodiment. The device measurement socket 10 shown in the figure includes a board 16 on which coaxial connectors 12 and 14 as external connection terminals connected to a measuring instrument (not shown) via a coaxial line are attached. And a supporting member silicon rubber 18 as a supporting member disposed adjacent to the substrate 16.

The substrate 16 is a flexible sheet-like member, and has on its surface a conductor 20 having a predetermined width extending from one coaxial connector 12 and a conductor 2 having a predetermined width extending from the other coaxial connector 14. 2 and a conductor 24 surrounding the conductors 20 and 22 over a wide area. The conductor 20 and the conductor 24 adjacent thereto form a coplanar line connecting the coaxial connector 12 and one of the device-side terminals formed on the surface of the high-frequency device 30. Similarly, the conductor 22 and the conductor 24 adjacent thereto form a coplanar line connecting the coaxial connector 14 and another device side terminal formed on the surface of the high-frequency device 30 c. The substrate 16 is, for example, a flexible substrate using polyimide resin, and conductors 20, 22, 24 are formed on the surface of the substrate 16 by a Cu thin film.

The various conductors 20, 22, 24 formed on the surface of the substrate 16 described above are preferably formed by photoetching. By removing unnecessary portions of the metal film or the like by photoetching, a measuring terminal (described later) having a desired shape can be formed, and fine processing can be performed. It can be easily narrowed.

The device to be combined with the device measuring socket 10 is a surface-mounted element in which various device-side terminals are formed on the surface facing the substrate 16. An example For example, the following description will be made assuming that the high-frequency device 30 is combined with the device measuring socket 10. When a passive element such as a filter is considered as the high-frequency device 30, input / output terminals 32, 34, and a ground terminal 36 as device-side terminals are formed on one surface of the high-frequency device 30. I have. When an active element such as an amplifier is considered as the high-frequency device 30, a bias terminal is added in addition to these terminals.

Further, on the surface of the substrate 16, measurement terminals for electrically connecting to the various device-side terminals described above when the high-frequency device 30 is pressed are formed. Specifically, the tips of the conductors 20 and 22 are used as the board-side input / output terminals 42 and 44 corresponding to the input / output terminals 32 and 34 of the high-frequency device 30, respectively. A part of the body 24 is used as a board-side ground terminal 46 corresponding to the ground terminal 36 of the high-frequency device 30. When the high-frequency device 30 is pressed against the surface of the board 16, one device-side input / output terminal 32 is connected to the board-side input / output terminal 42, and the other device-side input / output terminal 34 is set to the board-side input / output terminal. These measurement terminals formed on the surface of the substrate 16 are arranged on the substrate 44 such that the device-side ground terminal 36 contacts the substrate-side ground terminal 46.

On the surface of the substrate 16 opposite to the surface on which the coplanar line is formed, a silicon rubber 18 for supporting the substrate having a predetermined thickness (for example, 5 mm) is disposed so as to contact almost the entire surface.

FIG. 2 is an enlarged cross-sectional view including the conductor 20 and the conductors 24 arranged on both sides thereof. For example, the width A of the conductor 20 is set to 2.2 mm, and the distances B and C between the conductors 24 on both sides thereof are set to 10. The thickness D of the substrate 16 is 3 5

The thickness E of the conductors 20, 22, 24 is set to 35 m, respectively. Thus, a coplanar line is formed by forming the conductors 20, 22, 24 as a thin film on the surface of the extremely thin substrate 16, and the entire structure is formed in the thickness direction of the substrate 16. It is easy to deform.

The device measurement socket 10 of the present embodiment has such a configuration. Next, details of the case where the high-frequency device 30 is actually set will be described. Figure 3 shows two input / output terminals 32, 34 and one grounding terminal 36 on the underside of the high-frequency device 30. FIG. 9 is a cross-sectional view showing a contact state of each terminal when the terminal is formed and only the surface on which the ground terminal 36 is formed is lower than the surface on which the other two terminals are formed. When the high-frequency device 30 is set in the device measuring socket 10 of the present embodiment, the input / output terminals 32, 34 and the grounding terminal 36 of the high-frequency device 30 are connected to the substrate 1 The high-frequency device 30 is placed at a predetermined position on the substrate 16 so as to correspond to the input / output terminals 42, 44 of 6 and those of the ground terminal 46. Thereafter, the lower surface of the substrate supporting silicon rubber 18 disposed on the lower side of the substrate 16 or the upper surface of the high-frequency device 30 is pressed. Since the substrate supporting silicon rubber 18 is flexible, and the substrate 16 is also formed of a flexible and flexible polyimide resin, the input / output terminals 32, 3 4 of the high-frequency device 30 are provided. Even when the surfaces of the ground terminal 36 and the ground terminal 36 are not formed at the same height, the ground terminal 46 of the substrate 16 partially pressed by the substrate As a result, the ground terminal 36 of the high-frequency device 30 and the ground terminal 46 of the substrate 16 can be reliably brought into contact with each other.

In particular, since the corresponding terminals are brought into contact using the flexibility of the substrate 16, the structure is simple, and the durability and reliability can be improved. In addition, since the terminals are in direct contact with each other for electrical connection, excess inductance and resistance components can be reduced, and good frequency characteristics (particularly high-frequency characteristics) can be obtained. Further, by forming the conductors 20 and the like constituting the coplanar line on the substrate 16 with pattern electrodes, the electrodes for grounding or the power supply line can be formed in an arbitrary wide shape. It is easy to reduce the impedance of the line.

By the way, in the above-described embodiment, most of the area except the conductors 20 and 22 on the substrate 16 is covered with the conductor 24 including the ground terminal 46, but is opposed to the high-frequency device 30. Since the region does not need to be covered with the conductor 24 except for the portion corresponding to the ground terminal 46, the flexibility of the substrate can be further improved by removing the conductor 24 in this region.

FIG. 4 is a view showing a modification of the [high frequency] device measuring socket, showing a structure in which the conductor 24 on the substrate 16 facing the high frequency device 30 is partially removed. Have been. In FIG. 4, the area surrounded by the two-dot chain line indicated by F is the area facing the high-frequency device 30, and the conductors around the input / output terminals 42, 44 at the tips of the conductors 20, 22 are shown. 24 has been removed, and the polyimide resin forming the substrate 16 has been exposed.

Thus, by removing the conductor 24 in the region facing the high-frequency device 30, the flexibility of this portion can be increased. Therefore, the input / output terminals 42, 44 and the ground terminal 46 formed around the periphery are easily deformed according to the shape of the high-frequency device 30, and the electrical connection with the corresponding device-side terminal is ensured. Can be performed.

FIG. 5 is a view showing a modification in which a groove is added to the substrate shown in FIG. As shown in FIG. 5, grooves 50, 52 penetrating between the front and back are formed along the outer shape of the conductors 20, 22 around the input / output terminals 42, 44. By separating the ends of the conductors 20 and 22 corresponding to the input / output terminals 42 and 44 from the periphery in this way, the ends of the separated conductors 20 and 22 can be easily deformed. Therefore, the input / output terminals 42 and 44 of the substrate 16 can be reliably brought into contact with the input / output terminals 32 and 34 of the high-frequency device 30.

FIG. 6 is a view showing another modification of the device measuring socket. When a part of the conductors 20, 22, 24 on the board 16 is used as the input / output terminals 42, 44 or the ground terminal 46, as shown in Fig. 6, the position corresponding to each terminal A projection 54 is formed at the bottom. These projections 54 are formed by forming bumps of gold, solder, or the like at predetermined positions on the conductor 20, and then covering the surface with a hard protective metal having excellent wear resistance. Alternatively, the protrusion 54 may be formed by soldering a Cu ball, the surface of which is plated with Ni or the like, to a predetermined position of the conductor 20 or the like. By forming the input / output terminals 42, 44 of the substrate 16 and the ground terminal 46 using the high-frequency device 30 having a complicated surface shape, the input / output terminals The input / output terminals 42 and 44 on the substrate 16 can be reliably brought into contact with the input / output terminals 32 and 34 of the high-frequency device 30 also for the formed high-frequency device 30. Also, by using bumps and balls commonly used for wiring and mounting of various ICs, the protrusions 54 can be easily formed. Cut.

FIG. 7 is a perspective view showing another modified example of the device measuring socket. After storing the board supporting silicon rubber 18 and the board 16 (excluding the coaxial connectors 12 and 14) shown in Fig. 1 in a metal case 80 made of aluminum or the like with only the upper side opened, Attach the coaxial connectors 12 and 14 to the two opposite sides of the case 80. At this time, the outer conductors of the coaxial connectors 12 and 14 are fixed to the case 80 and the center conductors extending from the coaxial connectors 12 and 14 are the conductors 20 and 22 formed on the substrate 16. Connected to the end of each. After the mounting of the coaxial connectors 12 and 14 is completed in this manner, the metal lid portion 82 made of aluminum or the like is housed in the case 80 so as to press the entire board 16 and the mounting holes 8 4 The lid 82 is fixed to the case 80 with the metal screw 86 passed through the case 80. The cover portion 82 has a groove formed in a portion corresponding to the conductors 20 and 22 on the substrate 16, and when the cover 16 is attached so as to press down the entire substrate 16, the conductor for grounding 2 is formed. Only 4 is almost in contact. In addition, a large device setting through hole 88 for setting a high-frequency device later is formed substantially at the center. When the lid 82 is attached to the case 80, the grounding conductor 24 on the board 16 is connected to the coaxial connectors 12 and 14 via the lid 82, screws 86, and case 80. It is electrically connected to the external conductor, and the conductor 24 on the board 16 is grounded. To actually measure the characteristics of the high-frequency device 30, simply set the high-frequency device 30 in the through hole for device setting 88 formed almost in the center of the lid 82 and pressurize the top surface. In addition, various terminals on the device side and various terminals on the substrate side can be reliably contacted.

FIG. 8 is a diagram showing an example of use of the device measuring socket shown in FIG. As described above, the coaxial connectors 12 and 14 are attached to the case 80 accommodating the device measuring socket 10, and the input / output terminals 1 provided on the measuring instrument 100.

The coaxial connectors 12 and 14 are connected to the coaxial connectors 12 and 14 using coaxial lines 120 and 122, respectively. At the time of measurement, the high-frequency device 30 is mounted at the position of the device set through hole 88 formed in the center of the lid portion 82, and the high-frequency device 30 is pressed downward from above to obtain a device. An electrical connection is made between the measuring socket 10 and the high-frequency device 30. Also, when the high frequency device 30 is repeatedly attached and detached in this manner, the input / output terminals 42, 44 and the ground terminal 46 on the surface of the substrate 16 are partially worn or deformed. It is necessary to replace the entire board 16 on which the terminals are formed. As described above, the fixation of the substrate 16 in the device measurement socket 10 is performed by attaching the lid portion 82 from above the case 80. Since the lid 80 is attached with four screws 86 passed through the attachment holes 84, the lid 80 can be easily removed by removing the screws. In addition, by adopting such a structure, the coaxial cables 120 and 122 are attached to the case 80 or the case 80 is connected to another device (for example, an automatic tester or a handler). The board 16 can be replaced even in the state where the board is fixed to), and the work of the replacement work can be reduced.

Also, in order to easily replace only the board 16, a method of electrically connecting the conductors 20 formed on the surface of the board 16 to the center conductors of the coaxial connectors 12 and 14 must be devised. Need to be

FIG. 9 is a perspective view showing a partial configuration of the device measuring socket, showing details of the vicinity of the center conductor of the coaxial connectors 12 and 14. FIG. 10 is a partial cross-sectional view including a coaxial connector. FIG. 11 is a sectional view taken along line AA of FIG. Note that the two coaxial connectors 12 and 14 and their peripheral parts have basically the same structure, and the following description will focus on one coaxial connector 12.

As shown in these figures, the center conductor 200 of the coaxial connector 12 is exposed inside the case 80 so as to penetrate the side wall of the case 80, and the conductor formed on the surface of the substrate 16 These electrical connections are made by contacting the ends of the cores 20 c. Specifically, the substrate 16 is disposed below the center conductor 200, and the center conductor 20 By pressing the position corresponding to 0 by the pressing means, these contacts are reliably performed. The pressing means can be realized by using a pogo pin 210 as shown in FIGS.

FIG. 12 is a diagram showing the internal structure of the pogo pin 210. As shown in FIG. As shown in FIG. 12, the pogo pin 210 accommodates the panel 222 and a part of the movable part 224 in a cylindrical accommodation part 220. The distal end portion 226 of the movable portion 224 presses the substrate 16 toward the center conductor 200 in the direction of expansion and contraction of the panel 222. The tip portion 226 is preferably formed of a material having a low dielectric constant, such as a rubber port.

To replace the board 16, push down the tip 2 2 6 of the movable part 2 2 4, pull out the board 16 with the center conductor 200 of the coaxial connector 12 separated from the board 16, This is performed by inserting a new substrate 16 between the center conductor 200 and the tip end portion 222 and then pressing the substrate 16 again toward the center conductor 200 with the pogo pins 210. Since the electrical connection is made by contact by pressing, the board 16 can be easily attached and detached.If the board 16 needs to be replaced due to wear of the input / output terminals 42, 44, etc. The labor required for the replacement work can be reduced.

Note that the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. For example, in the embodiment described above, a coplanar line composed of the conductors 20, 22 and 24 was formed on the surface of the substrate 16, but as shown in FIG. A microstrip substrate 16A formed on the entire surface opposite to the surface on which 0 and 22 are formed may be used. A microstrip line is formed by the conductors 20 and 24 or by the conductors 22 and 24. In this case, the conductor layers are formed on both sides of the substrate, which reduces the flexibility of the substrate.However, since a flexible substrate formed of polyimide resin or the like is used, a certain degree of flexibility must be secured. This makes it possible to reliably contact various types of measurement terminals formed on the surface of the substrate with device terminals formed on one surface of the high-frequency device.

Further, in the above-described embodiment, the high-frequency device 30 is attached to the device measurement socket 10, but a device other than the high-frequency device 30 may be attached. For example, it may be used by connecting to a semiconductor test apparatus for testing various semiconductor devices such as a semiconductor memory and a logic LSI. Industrial applicability

As described above, according to the present invention, the substrate on which the measurement terminals are formed is formed of a flexible sheet-shaped member, so that the substrate is provided in the high-frequency device. In addition, it is possible to easily contact each of the measurement terminals with multiple device terminals, and the structure is simple, durability and reliability can be improved, and good high-frequency characteristics can be obtained. . In particular, by forming a coplanar line on the above-described substrate, a conductor layer is formed only on one surface of the substrate, so that the substrate can have sufficient flexibility, and the measurement terminals and The device terminals can be reliably contacted.

Claims

The scope of the claims

1. A device-measuring socket that is electrically connected to a device that is connected to a measuring instrument and that has a plurality of device-side terminals including input / output terminals on any surface, and that is electrically connected. A plurality of measurement terminals corresponding to various signals input and output between the measuring instrument and the device on one surface of the substrate. Measurement socket.

2. The coplanar line is formed on one surface of the substrate, and an external connection terminal connected to the measuring instrument and the measuring terminal are connected via the coplanar line. 2. The device measuring socket according to claim 1, wherein:

3. The substrate has a microstrip line formed on one surface, and an external connection terminal connected to the measuring instrument and the measuring terminal are connected via the microstrip line. 2. The device measuring socket according to claim 1, wherein:

4. The device measurement socket according to claim 1, wherein a conductive projection is formed on the measurement terminal.

5. The device measuring socket according to claim 4, wherein the conductive protrusion is a bump.

6. The device measurement according to claim 1, wherein a flexible support member having a predetermined thickness is disposed on a surface of the substrate opposite to a surface on which the measurement terminals are formed. Socket.

7. A case accommodating the substrate and the indicating member, and an external connection terminal fixed to the case and connected to the measuring instrument, wherein a connection between the measurement terminal and the external connection terminal is provided. 7. The device measuring socket according to claim 6, wherein the wiring is performed by a pattern electrode formed on the substrate.

8. An electric connection between the external connection terminal and the pattern electrode is provided by providing a pressing unit that partially presses and contacts the external connection terminal and the pattern electrode formed on the substrate. 8. The device measuring socket according to claim 7, wherein the device measuring socket makes a secure connection.

9. A part of the substrate, around the measuring terminal, passing between both sides of the substrate 2. The device measuring socket according to claim 1, comprising a groove formed through the device. -

10. The device measurement socket according to claim 1, comprising a plurality of the measurement terminals formed on the surface of the substrate by photoetching.

1 1. A plurality of measurement terminals formed on the surface of a flexible substrate and connected to a measuring instrument, and a plurality of device-side terminals including input / output terminals formed on any surface of the device. A device measurement method comprising: inputting and outputting various signals between the measuring device and the device by bringing the device into contact with the device.

12. A flexible supporting member having a predetermined thickness is arranged on the surface of the substrate opposite to the surface on which the measurement terminals are formed, and the device is pressed from the surface on which the measurement terminals are formed. 11. The device measuring method according to claim 11, wherein: