JPH06260568A - Ic socket - Google Patents

Abstract

PURPOSE:To prevent the deterioration of electric signal characteristics due to coupling, by individually shielding each of a plurality of lead pins arranged in the vicinity of a socket main body. CONSTITUTION:Each shield part 10 is formed around a contact pin 4 engaging with a pin hole 3 of a socked main body 2, and composed of an insulating layer 11 and a conducting layer 12 of the outer peripheral surface of a socket part 5 of the contact pin 4. Each conducting layer 12 is electrically connected with a conducting layer 13 on the rear of the socket main body 2 wherein a connection pin 15 to the outside is connected. A lead part 6 of the contact pin 4 and the connection pin 15 are connected with circuit patterns 7a and 7b of a printed board 7, and the lead 9 of a semiconductor device 8 is inserted into the socket part 5. When a semiconductor 8 having analog function of high precision is operated, coupling between an analog signal and a digital signal can be prevented between adjacent contact pins 4. Further the deterioration of yield at the time of inspection and the deterioration of characteristics at the time of packaging can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used for testing or mounting a semiconductor device, and particularly to an IC which is most suitable for a semiconductor device having a highly accurate analog function.
Regarding sockets.

[0002]

2. Description of the Related Art As is well known, an IC socket is interposed between an IC tester or a printed circuit board and the semiconductor device when the semiconductor device is tested by the IC tester or when the semiconductor device is mounted on the printed circuit board or the like. And a signal connection component for mounting the semiconductor device in a replaceable manner.

Therefore, a conventional IC for mounting a printed circuit board is used.
The socket will be described with reference to FIGS. 7 and 8. FIG. 7 shows I
FIG. 8 is a partially exploded perspective view of the C socket, and FIG. 8 is an enlarged cross-sectional view of a main part in a state where the IC socket is mounted on the printed board.

As shown in FIG. 7, the IC socket 1 is composed of a socket body 2 and a plurality of contact pins 4. The socket body 2 is made of a material having a high insulation resistance, and a plurality of pin fitting holes 3 are arranged close to each other. The contact pin 4 has a cylindrical socket portion 5 and a pin-shaped lead portion 6 which are integrally formed of a low electric resistance material, and the socket portion 5 is fitted into the pin fitting hole 3 of the socket body 2. And the lead portion 6 is attached to the socket body 2
Is projected from the back side of.

IC socket 1 constructed as described above
8 is mounted on the printed circuit board 7 which is a mounted member, and the lead portions 6 of the contact pins 4 are electrically connected to the circuit pattern 7a on the back surface of the printed circuit board 7 by soldering or the like. . Then, the semiconductor device 8 is mounted on the IC socket 1 by inserting the lead 9 of the semiconductor device 8 into the socket portion 5 of the contact pin 4. As a result, electric signals are mutually transmitted between the semiconductor device 8 and the printed circuit board 7 via the contact pins 4.

As described above, the IC socket 1 basically serves as a relay between the semiconductor device 8 mounted on the top and bottom of the IC socket 1 and the printed circuit board 7. Therefore, the semiconductor device on the IC socket 1 is characteristically arranged. It is important to prevent the deterioration of the electric signal related to the operation of 8 as much as possible. Therefore, in the conventional IC socket 1, a metal having a lower electric resistance is used as the material of the contact pin 4, and the metal of the contact pin 4 is reduced in order to reduce the contact resistance with the lead 9 of the semiconductor device 8. The surface is plated with gold (Au) or the like.

[0007]

However, at present, semiconductor devices 8 themselves have remarkably improved in performance, and digital / analog coexistence, and a digital part operates at high speed has appeared. . On the other hand, the size of the semiconductor device 8 itself has been remarkably miniaturized due to the miniaturization of the process, the reduction of the mounting area, and the like, and the interval between the adjacent leads 9 is very narrow.

Such a semiconductor device 8 is mounted on the IC socket 1
When mounted on the semiconductor device 8, the distance between the leads 9 adjacent to each other in the semiconductor device 8 becomes narrower in the contact pin 4 portion. There was a problem of deterioration due to the ring.

When the characteristic deterioration due to such coupling occurs, the rate at which the semiconductor device 8 which should be a good product is unexpectedly determined to be a bad product during the test using the IC socket 1 increases. The yield is significantly reduced. Further, when the IC socket 1 is used for mounting, the original characteristics of the semiconductor device 8 are not faithfully transmitted to the printed circuit board 7.

Therefore, the present invention is an IC capable of effectively preventing characteristic deterioration of electric signals due to coupling between adjacent contact pins arranged in the socket body.
Intended to provide a socket.

[0011]

To achieve the above object, the present invention provides a plurality of contacts each having a socket portion into which a lead of a semiconductor device is inserted and a lead portion electrically connected to a mounted member. In an IC socket in which pins are arranged close to each other in a socket body, a shield portion is provided around each of the plurality of contact pins to independently shield the contact pins.

Further, according to the present invention, a plurality of contact pins having a socket portion into which a lead of a semiconductor device is inserted and a lead portion electrically connected to a mounted member are arranged close to each other in a socket body. In this IC socket, a shield portion is provided around the plurality of contact pins to independently shield the contact pins, and a conductive portion electrically connecting the shield portions to the socket body is provided. It is provided.

[0013]

According to the present invention configured as described above, each of the plurality of contact pins arranged close to each other in the socket body is independently shielded by the shield portion. Since the IC socket is generally a standard product and the leads for transmitting an analog signal differ depending on the type of the semiconductor device to be mounted, it is necessary to shield all the contact pins. As a result, regarding the operation of the semiconductor device mounted on the IC socket, coupling between adjacent contact pins, particularly between analog and digital signals, is prevented.

Further, when the socket body is provided with the conducting portion for electrically connecting the shield portions to each other, the shield potential of each shield portion is fixed as a whole, so that the shield effect becomes stronger.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to an IC socket for mounting a printed board will be described below with reference to FIGS. The same components as those in the conventional example are designated by the same reference numerals, and the description thereof will be omitted.

First, FIGS. 1 to 4 show a first embodiment. FIG. 1 is a partially exploded perspective view of an IC socket, FIG. 2 is a rear view of the IC socket, and FIG. 3 is a main part of the IC socket. FIG. 4 is an exploded enlarged cross-sectional view, and FIG. 4 is an enlarged cross-sectional view of a main part in a state where the IC socket is mounted on the printed board.

As shown in FIG. 1, in order to make each of the contact pins 4 of the IC socket 1 exhibit a shielding effect, the shield portion 1 is provided around each contact pin 4.
0 is provided. In this embodiment, as shown in FIG. 3, an insulating layer 11 is formed on the outer peripheral surface of the socket portion 5 of the contact pin 4 by applying an insulating material, and the outer peripheral surface of the insulating layer 11 is plated with a conductive material or the like. Thus, the conductive layer 12 is formed, which constitutes the shield portion 10.

Then, as shown by the hatched portion in FIG. 2 and FIG. 3, a conductive layer 13 is formed almost entirely on the back surface of the socket body 2 by patterning a conductive material.
Further, an insulating layer 14 is formed on the surface of the conductive layer 13 by coating an insulating material. A connection pin 15 is implanted on the back surface of the socket body 2, and the connection pin 15 is electrically connected to the conductive layer 13.

As shown in FIG. 4, when the plurality of contact pins 4 are fitted in the plurality of pin fitting holes 3 of the socket body 2, the conductive layer 12 of the contact pin 4 is at the lower end thereof. And is electrically connected to the conductive layer 13.

IC socket 1 constructed as described above
4, is mounted on a printed circuit board 7 which is a mounted member, and the lead portions 6 of the contact pins 4 are electrically connected to the circuit pattern 7a on the back surface of the printed circuit board 7 by soldering or the like. . At the same time, the connection pin 15 of the socket body 2 is also connected to the circuit pattern 7 on the back surface of the printed circuit board 7.
It is electrically connected to b by soldering or the like. Then, the semiconductor device 8 is mounted on the IC socket 1 by inserting the lead 9 of the semiconductor device 8 into the socket portion 5 of the contact pin 4. As a result, the contact pin 4
Electrical signals are mutually transmitted between the semiconductor device 8 and the printed circuit board 7 via the.

At this time, since each of the plurality of contact pins 4 arranged close to each other in the socket body 2 is independently shielded by the shield portion 10, the IC
Regarding the operation of the semiconductor device 8 mounted on the socket 1,
It is possible to effectively prevent the coupling between the adjacent contact pins 4 and especially between the analog and digital signals.

The conductive layers 12 of the shield portion 10 of each contact pin 4 are connected to the conductive layer 1 of the socket body 2.
Since they are electrically connected by 3, the shield potential of each conductive layer 12 can be fixed as a whole, and the shield effect can be made stronger.

The shield potential of each conductive layer 12 fixed by the conductive layer 13 is independent of the lead portion 6 of the contact pin 4 which is a path of an electric signal related to the operation of the semiconductor device 8, and is independent of the printed circuit board. 7 circuit pattern 7b
One point is concentrated by the connection pin 15 electrically connected to, and most of them are set to the GND potential.

In this embodiment, the conductive layer 13 for fixing the shield potential is formed on the back surface of the socket body 2. However, since the insulating layer 14 is formed on the surface of the conductive layer 13, Even if a circuit pattern is provided on the surface of the printed board 7, it is possible to prevent electrical contact between the circuit pattern and the conductive layer 13.

Next, FIG. 5 is an exploded enlarged sectional view of an essential part of the IC socket in the second embodiment. In this example, the insulating layer 11 is formed on the outer peripheral surface of the socket portion 5 of the contact pin 4, and the conductive layer 12 is formed on the inner peripheral surface of the pin fitting hole 3 of the socket body 2. Therefore, in the case of this example, by fitting the contact pin 4 into the pin fitting hole 3, the shield portion 10 including the insulating layer 11 and the conductive layer 12 is formed around the contact pin 4. . In this example, the conductive layer 12 on the inner peripheral surface of the pin fitting hole 3 and the conductive layer 1 on the back surface of the socket body 2 are particularly preferable.
3 and 3 can be integrally formed at the same time.

Next, FIG. 6 is an exploded enlarged sectional view of a main part of the IC socket in the third embodiment. In this example, the conductive layer 1 is formed on the inner peripheral surface of the pin fitting hole 3 of the socket body 2.
2 is formed, and the insulating layer 11 is formed on the inner peripheral surface of the conductive layer 12. Therefore, in the case of this example, by fitting the contact pin 4 into the pin fitting hole 3, the shield portion 10 that substantially includes the insulating layer 11 and the conductive layer 12 is formed around the contact pin 4. It will be. In this example, in particular, the conductive layer 12 on the inner peripheral surface of the pin fitting hole 3 and the conductive layer 13 on the back surface of the socket body 2 are
In addition, the insulating layer 11 on the inner peripheral surface of the conductive layer 12 and the insulating layer 14 on the surface of the conductive layer 13 can be simultaneously formed integrally. Furthermore, the contact pin 4 in this example
It is possible to use substantially the same as the conventional example.

In each of the above embodiments, the material of the contact pin 4 is generally 42 alloy or beryllium copper, but if it is a metal material excellent in strength and low in electrical resistance and contact resistance, Well, it is not particularly limited. As the material of the socket body 2, an insulating material such as plastics or ceramics is used, but this is not particularly limited. Further, the materials of the conductive layers 12 and 13 are not particularly limited as long as they have an effective shielding function, and similarly, the materials of the insulating layers 11 and 14 also have an effective insulating function.

However, it is necessary to consider the addition of stray capacitance due to the insulation of each contact pin 4, and a process for minimizing the capacitance is necessary in the manufacturing process. For example, the insulating layer 11 may be made relatively thick to make the conductive layer 12
Is preferably relatively thin.

Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various effective modifications and applications are made based on the technical idea of the present invention. Is possible. For example, in the present embodiment, the shield part is interposed between the socket part of the contact pin and the pin fitting hole of the socket body, but this shield part may be embedded inside the socket body so as to surround the contact pin. Good. Further, in this embodiment, the conductive layer is formed on the back surface of the socket main body as the conductive portion, but this conductive portion can also be embedded in the socket main body. Further, in the present embodiment, the connection pins are provided as the connection terminals for external connection and the connection pins are connected to the circuit pattern of the printed circuit board, but the connection terminals may be directly electrically connected to the outside. In this embodiment, the IC socket for a PGA (pin grid array) package whose illustration and description are clear has been described, but the present invention can be similarly applied to other various packages.

[0030]

As described above, according to the present invention,
Each of the plurality of lead pins arranged close to each other in the socket body is independently shielded by the shield portion so that they are adjacent to each other with respect to the operation of the semiconductor device mounted on the IC socket and having a particularly highly accurate analog function. In particular, it is possible to effectively prevent the coupling between the analog and digital signals between the contact pins. Therefore, in the test using the IC socket, it is possible to prevent a decrease in yield by correctly determining that the good semiconductor device is a good semiconductor device. Also,
When mounting using an IC socket, the characteristics of the semiconductor device are prevented from deteriorating and the characteristics of the semiconductor device are faithfully transmitted to a printed circuit board or the like, so that the original characteristics of the semiconductor device can be realized. It will be possible.

[Brief description of drawings]

FIG. 1 is a partially exploded perspective view of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a back view of the IC socket according to the first embodiment.

FIG. 3 is an exploded enlarged cross-sectional view of a main part of the IC socket in the first embodiment.

FIG. 4 is an enlarged cross-sectional view of a main part of the printed circuit board in which the IC socket according to the first embodiment is mounted.

FIG. 5 is an exploded enlarged sectional view of a main part of an IC socket according to a second embodiment of the present invention.

FIG. 6 is an exploded enlarged sectional view of a main part of an IC socket according to a third embodiment of the present invention.

FIG. 7 is a partially exploded perspective view of a conventional IC socket.

FIG. 8 is an enlarged cross-sectional view of a main part of the conventional example in which the IC socket is mounted on a printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 2 Socket body 3 Pin fitting hole 4 Contact pin 5 Socket part 6 Lead part 7 Printed circuit board (attached member) 8 Semiconductor device 9 Lead 10 Shield part 11 Insulating layer 12 Conductive layer 13 Conductive layer (conducting part) 14 Insulation layer 15 Connection pin (connection terminal)

Claims (8)

[Claims] 1. An IC socket in which a plurality of contact pins each having a socket portion into which a lead of a semiconductor device is inserted and a lead portion electrically connected to a mounted member are arranged close to each other in a socket body. The IC socket, wherein a shield portion is provided around the plurality of contact pins to independently shield the contact pins. 2. An IC socket in which a plurality of contact pins each having a socket portion into which a lead of a semiconductor device is inserted and a lead portion electrically connected to a mounted member are arranged close to each other in a socket body. In the above, in addition to providing a shield part that independently shields each of these contact pins around the plurality of contact pins, a conductive part that electrically connects the shield parts to each other is provided in the socket body. Characteristic I
C socket. 3. The shield part includes an insulating layer formed on the outer peripheral surface of the contact pin and a conductive layer formed on the outer peripheral surface of the insulating layer.
Or the IC socket described in 2. 4. The shield part comprises an insulating layer formed on an outer peripheral surface of the contact pin and a conductive layer formed on an inner peripheral surface of a pin fitting hole of the socket body. The IC socket according to claim 1 or 2. 5. The shield part includes a conductive layer formed on an inner peripheral surface of a pin fitting hole of the socket body, and an insulating layer formed on an inner peripheral surface of the conductive layer. The IC socket according to claim 1 or 2. 6. The IC socket according to claim 2, wherein the conductive portion has a connection terminal for electrically connecting to the outside. 7. The IC socket according to claim 2, wherein the conductive portion is a conductive layer provided on the back surface of the socket body facing the mounted member. 8. The IC socket according to claim 7, wherein an insulating layer for the mounted member is provided on a surface of the conductive layer.