CN112379134A - Aluminum alloy small-caliber deep-cavity inner surface weldability test fixture - Google Patents
Aluminum alloy small-caliber deep-cavity inner surface weldability test fixture Download PDFInfo
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- CN112379134A CN112379134A CN202011253871.6A CN202011253871A CN112379134A CN 112379134 A CN112379134 A CN 112379134A CN 202011253871 A CN202011253871 A CN 202011253871A CN 112379134 A CN112379134 A CN 112379134A
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- 238000012360 testing method Methods 0.000 title claims abstract description 111
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 32
- 238000004806 packaging method and process Methods 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 2
- 238000002788 crimping Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses an aluminum alloy small-caliber deep cavity inner surface weldability test fixture, which relates to the technical field of TR component automatic test systems and specifically comprises a test medium substrate, wherein an SMP radio frequency test connector, a copper sheet PAD point, an input end and an output end are respectively arranged on the upper surface of the test medium substrate, the SMP radio frequency test connector and the input end are respectively positioned on the back sides of the copper sheet PAD point and the output end, the output end is positioned right in front of the copper sheet PAD point, the copper sheet PAD point is positioned at the center of the test medium substrate, the input end is positioned on the right side of the SMP radio frequency test connector, a fan is arranged on the upper surface of the test medium substrate, and a. The structure is formed simply, and is with low costs, from taking fan and ring accuse, has improved the security among the SIP encapsulation TR subassembly test process, and it has temperature sensor to paste on the SIP encapsulation TR subassembly clamp plate, can be according to temperature feedback to the fan switch to adjust the fan amount of wind.
Description
Technical Field
The invention relates to an automatic test system for a TR component, in particular to a weldability test fixture for an inner surface of an aluminum alloy small-caliber deep cavity.
Background
Through the development of System In Package (SIP) technology for nearly 30 years, the technology is gradually applied to the core hardware TR component package of the phased array radar in recent years. The SIP integrated TR component is different from the conventional brick component and chip component in packaging process, and the testing aspect also faces a plurality of challenges, mainly the increase of radar power requires the increase of the scale of the number of front channels, and the SIP components with the increased number do not have a special testing device. This method causes two problems if the SIP components are soldered to PCB test boards using BGA solder balls for test screening: 1. each component needs to be welded during testing, so that the efficiency is low; 2. the welding and taking-off processes inevitably cause damage to welding points of the SIP component, and the yield of the component is reduced.
The core of the current nondestructive testing device is usually to continue to use a spring, an elastic needle, a fuzz button and the like to realize the conversion and transmission of components and testing models. For example, patent publication No. CN109655733A discloses a testing device based on a fuzz button, which is based on the fuzz button, and although the testing efficiency can be improved, the inherent defects of the fuzz button cannot be overcome: the problem that the end face of the fuzz button is loose and collapses can be inevitable in the repeated compression-rebound process. When the number of the common conventional SIP packaging TR components is small and the number of times of repeated compression-rebound is small, the fuzz button can still be used; however, the SIP packaging TR components in the phased array radar are large in number, and the testing device based on the fuzz button is no longer satisfactory to use.
Therefore, it is highly desirable to develop a jig capable of performing a nondestructive test on the SIP module with high efficiency. The fixture can be used for conveniently assembling and disassembling the SIP component module; the self-contained fan and the temperature feedback system of the component signal can be realized, and the heat dissipation of the tested component is realized. Meanwhile, in order to clearly judge and eliminate the fault of the tested component, the clamp needs to be capable of monitoring the signal of a single PAD point on the component.
Disclosure of Invention
The invention aims to provide a clamp for testing the weldability of the inner surface of an aluminum alloy small-caliber deep cavity, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a solderability test fixture for an inner surface of an aluminum alloy small-caliber deep cavity comprises a test medium substrate, wherein an SMP radio frequency test connector, a copper sheet PAD point, an input end and an output end are respectively arranged on the upper surface of the test medium substrate, the SMP radio frequency test connector and the input end are both positioned on the back sides of the copper sheet PAD point and the output end, the output end is positioned right in front of the copper sheet PAD point, the copper sheet PAD point is positioned at the center of the test medium substrate, the input end is positioned on the right side of the SMP radio frequency test connector, a fan is arranged on the upper surface of the test medium substrate, a positioning block is arranged on the top of the test medium substrate and positioned on the outer side of the PAD point, a switching medium substrate is movably connected inside the positioning block, the bottom of the switching medium substrate is movably connected with the top of the copper sheet PAD, the bottom of the heat dissipation plate structure is bonded with a temperature sensor which is fixedly connected with the fan through a wire.
As a further scheme of the invention: the switching medium substrate comprises an array opening and a connector, the array opening is formed in the upper surface of the switching medium substrate, and the connector is fixedly connected to the middle position of the inner wall of the array opening.
As a further scheme of the invention: the quantity of fan is two, and two fans use the vertical axis of switching medium base plate to be axisymmetric setting as the symmetry axis, and the inside of fan is provided with temperature control feedback circuit, and the upper surface of test medium base plate is provided with the positioning seat to the position that corresponds the fan, and the inside of positioning seat is provided with elastic rubber, and the surface of fan is contradicted with elastic rubber's inner wall and is connected.
As a further scheme of the invention: the heat dissipation plate structure comprises heat dissipation fins, a side fixing block, a spring and a positioning screw, wherein the positioning screw is movably connected inside a connecting hole in the side fixing block, the spring is movably sleeved on the surface of the positioning screw, the side fixing block is fixedly connected to the side of each heat dissipation fin and located at the position of a positioning block, and the positioning screw is in threaded connection inside the positioning block.
As a further scheme of the invention: the heat-radiating fins are internally provided with heat-installing pipes, and the bottoms of the heat-radiating fins are provided with heat-conducting liners.
As a further scheme of the invention: the SMP radio frequency test joint can be replaced by SMA/SSMP/SSMA according to the requirement.
As a further scheme of the invention: the connector is in a form of 'hard needle-fuzz button-hard needle'.
As a further scheme of the invention: the upper surface of the test medium substrate can be provided with a capacitor or a resistor according to actual needs.
As a further scheme of the invention: the bottom of the radiating fin is respectively provided with a placing groove and a wire groove, the temperature sensor is bonded in the placing groove, and the wire is located in the wire groove.
As a still further scheme of the invention: the using method comprises the following steps:
firstly, a switching medium substrate is placed between positioning blocks and connected with a PAD point of a copper sheet, then an SIP packaging TR component is placed on the switching medium substrate between the positioning blocks, finally a heat dissipation plate structure is placed on the SIP packaging TR component, a positioning screw is positioned right above a threaded hole on the positioning block, then a lead on the heat dissipation plate structure is connected with a fan, the fan is fixed through a positioning seat, the positioning screw is rotated to be connected with the threaded hole on the positioning block, and therefore the SIP packaging TR component is fixed through the heat dissipation plate structure,
step two, then supply power with the fan through the interface connection on connector and the test medium base plate, the rotation direction of the fan of both sides is the syntropy, consequently, heat on the SIP encapsulation TR subassembly is by heat conduction to the heating panel structure, and the fan then blows away the heat on the heating panel structure to realize quick heat dissipation.
Compared with the prior art, the invention has the beneficial effects that:
1. the structure is simple, and the cost is low: the switching medium substrate is made of a common FR4 board; the middle part of the elastic switching in the switching medium substrate is provided with the fuzz buttons, and the contact parts of the two sides of the elastic switching and the PAD point of the test medium substrate and the SIP assembly are provided with the hard needles, so that the problems of collapse, scattering and the like caused by repeated compression and overweight of the pure fuzz buttons are avoided, frequent replacement is not needed, and the cost is reduced.
2. From taking fan and environmental control, improved the security in the SIP encapsulation TR subassembly test process: paste on the SIP encapsulation TR subassembly clamp plate and have temperature sensor, can switch the fan according to temperature feedback to adjust the fan amount of wind.
3. The test interface is clear, and interpretation and troubleshooting are easy: each external SMP interface on the test medium plate corresponds to a PAD point below the switching medium substrate one by one, and the judgment on the on-off of different signals can be quickly realized.
4. The assembly and disassembly are quick, and the test efficiency is high: the mode that the spring drives the pressure head crimping is adopted to realize fixing, the trouble of screw fastening is avoided, and the reliable crimping is ensured.
Drawings
Fig. 1 is a schematic overall structure diagram of a weldability test fixture for an inner surface of an aluminum alloy small-caliber deep cavity.
FIG. 2 is a top sectional view of the copper sheet PAD point position of the aluminum alloy small-caliber deep-cavity inner surface weldability test fixture.
Fig. 3 is a schematic view of the interior of the adapter dielectric substrate in the solderability test fixture for the inner surface of the aluminum alloy small-caliber deep cavity.
Fig. 4 is a schematic structural diagram of an SIP package TR component in a solderability test fixture for an inner surface of an aluminum alloy small-caliber deep cavity.
FIG. 5 is a middle front view of a weldability test fixture for the inner surface of an aluminum alloy small-bore deep cavity.
FIG. 6 is a top view of a weldability test fixture for the inner surface of an aluminum alloy small-bore deep cavity.
FIG. 7 is a sectional view of the solderability test fixture for the inner surface of the aluminum alloy small-caliber deep cavity at the position of the placement groove.
As shown in the figure: 1. testing the dielectric substrate; 2. a switching medium substrate; 21. opening an array; 22. a connector; 3. a fan; 4. a heat-dissipating plate structure; 41. a heat dissipating fin; 42. a spring; 43. side fixed blocks; 44. a set screw; 5. a temperature sensor; 6. SIP encapsulates the TR component; 7. positioning blocks; 8. SMP radio frequency test joints; 9. a copper sheet PAD point; 10. an input end; 11. an output end; 12. positioning seats; 13. a placement groove; 14. a wire slot.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 7, in the embodiment of the present invention, an aluminum alloy small-caliber deep-cavity inner surface weldability test fixture includes a test medium substrate 1, a capacitor or a resistor may be disposed on an upper surface of the test medium substrate 1 according to actual requirements, so as to facilitate a real circuit simulation for testing, or an extension test, an SMP radio frequency test connector 8, a copper sheet PAD point 9, an input end 10, and an output end 11 are respectively disposed on the upper surface of the test medium substrate 1, and the SMP radio frequency test connector 8 may be replaced with an SMA/SSMP/SSMA according to requirements, or may be replaced with a solder wire form according to requirements, so as to further simplify assembly. However, based on the test stability, an SMP or SMA connector is proposed, the SMP radio frequency test connector 8 and the input end 10 are both positioned on the back of the copper sheet PAD point 9 and the output end 11, the output end 11 is positioned right in front of the copper sheet PAD point 9, the copper sheet PAD point 9 is positioned at the center of the test medium substrate 1, the input end 10 is positioned on the right side of the SMP radio frequency test connector 8, and the test medium substrate 1 is subjected to wiring: one end is an SMP radio frequency test joint, and the other end is PAD points 9 with copper sheets arranged in a matrix. The 'XT' XS series interfaces of an input end 10 and an output end 11 on a test medium substrate 1 and the PAD point 'A1-D17' series arranged in a matrix form are in one-to-one correspondence through microstrip lines, the upper surface of the test medium substrate 1 is provided with two fans 3, the two fans 3 are arranged in axial symmetry by taking the vertical axis of a transfer medium substrate 2 as a symmetry axis, a temperature control feedback circuit is arranged in each fan 3, the fan 3 with the temperature control feedback circuit is powered with an XT 01/XT 11 interface on the test medium substrate 1, and pass through cable interconnection with the temperature sensor 5 who pastes on elasticity fixed crimping heating panel 4, the upper surface of test medium base plate 1 is provided with positioning seat 12 to the position that corresponds fan 3, and the inside of positioning seat 12 is provided with elastic rubber, and the surface of fan 3 is contradicted with elastic rubber's inner wall and is connected.
The testing medium substrate comprises a testing medium substrate 1 and is characterized in that a positioning block 7 is arranged at the top of the testing medium substrate 1, the positioning block 7 is located on the outer side of a copper sheet PAD point 9, a switching medium substrate 2 is movably connected inside the positioning block 7, the switching medium substrate 2 comprises an array opening 21 and a connector 22, the array opening 21 is formed in the upper surface of the switching medium substrate 2, the connector 22 is fixedly connected to the middle position of the inner wall of the array opening 21, and the switching medium substrate 2 is made of an ordinary FR4 board. The inside is the array and carries out trompil 21, array trompil 21 and the PAD position one-to-one on the SIP encapsulation module, connector 22 is "hard needle-wool button-hard needle" form, except that apart from the edge of medium substrate array trompil 0.5mm, all need carry on the surface copper cladding, realize good ground connection, before the test, with test medium base plate 1, switching medium base plate 2, fan 3 from taking temperature control feedback circuit, the above-mentioned spare part assembly in the elastic fixation crimping heat-dissipating plate structure 4 is finished, fan 3 and temperature sensor 5 interconnect, with XT01 XT11 on the test medium base plate 1 with the electric interface interconnect, and fix on test medium base plate 1. Each elastic hard needle in the switching stop substrate 2 corresponds to the copper sheet PAD point 9 on the test medium substrate 1 one by one and is placed, the heat dissipation plate structure 4 adhered with the temperature sensor 5 is placed on the elastic hard needles, and the positioning screws 44 sequentially penetrate through the springs 41 and the switching medium substrate 2 and are fixed on the test medium substrate 1.
The bottom of the switching medium substrate 2 is movably connected with the top of the copper sheet PAD point 9, the top of the switching medium substrate 2 is movably connected with an SIP packaging TR component 6, the upper surface of the SIP packaging TR component 6 is movably connected with a heat dissipation plate structure 4, the heat dissipation plate structure 4 comprises a heat dissipation fin 41, a side fixing block 43, a spring 42 and a positioning screw 44, a heat loading pipe is arranged inside the heat dissipation fin 41, a heat conduction gasket is arranged at the bottom of the heat dissipation fin 41, a placing groove 13 and a wire groove 14 are respectively arranged at the bottom of the heat dissipation fin 41, the temperature sensor 5 is bonded inside the placing groove 13, a lead is positioned inside the wire groove 14, the positioning screw 44 is movably connected inside a connecting hole on the side fixing block 43, the spring 42 is movably sleeved on the surface of the positioning screw 44, the side fixing block 43 is fixedly connected to the side of the heat dissipation fin 41 and, the 41 materials of radiating fin do not have special requirement, and common aluminum alloy, steel, copper alloy can both satisfy the requirement, adopts spring crimping form and SIP encapsulation TR subassembly contact, guarantees that the heat dissipation is good, and the bottom of heating panel structure 4 bonds and has temperature sensor 5, and temperature sensor 5 passes through wire and 3 fixed connection of fan.
During testing, the radiating plate structure 4 is lifted to place the SIP packaging TR component 6 between the SIP packaging TR component and the switching medium substrate 2, and the copper sheet PAD points 9 on the back surface of the SIP packaging TR component 6 are in one-to-one correspondence with the protruding elastic hard pins; loosening the heat dissipation plate structure 4, pressing the SIP package TR component 6, and filling power supply, control signals and radio frequency signals from an SMP connector of the 'XT' series according to the corresponding relation and model definition of the copper sheet PAD point 9 'A1-D17' series and the input end 10 in the test medium substrate 1: signals enter from the SMP port, pass through the transmission microstrip line to the PAD point of the series A1-D17, and pass through the hard pin-fuzz button-hard pin connector 22 to be transmitted into the SIP package TR component 6. The signals are output from SMP components of the 'XS' series through the processing of an SIP packaging TR component 6: signals are transmitted into the hard pin-hair button-hard pin connector 22 from the corresponding PAD point in the SIP packaging TR component 6 and then transmitted to the copper sheet PAD point 9 in the testing medium substrate 1, and finally transmitted into the XS series connector 22 due to the microstrip line connected with the PAD point, so that signal output is realized.
In the testing process, the temperature sensor 5 transmits a temperature signal of the SIP packaging TR component 6 to the fan 3, the on-off and air volume control of the fan 3 are realized according to the requirement, if the SIP packaging TR component 6 fails, a testing signal can be independently injected into an 'XT' series interface and received in an 'XS' series interface, and therefore the single-point testing is realized.
After the test is finished, the heat dissipation plate structure 4 is lifted, the SIP packaging TR component 6 is taken down, and the operation is repeated, so that the test on the next component can be realized.
It should be noted that the number, the distribution form, and the position of the interfaces on the test medium substrate 1 in this embodiment are only one of the references, and the corresponding radio frequency domain telecommunications and structural designers can adjust the number, the distribution form, and the position of the interfaces according to the implementation requirements and according to the reference.
The using method comprises the following steps:
firstly, placing a switching medium substrate 2 between positioning blocks 7 and connecting the switching medium substrate with a copper sheet PAD point 9, then placing an SIP packaging TR component 6 on the switching medium substrate 2 between the positioning blocks 7, finally placing a heat dissipation plate structure 4 on the SIP packaging TR component 6, positioning a positioning screw 44 right above a threaded hole on the positioning block 7, then connecting a lead on the heat dissipation plate structure 4 with a fan 3, fixing the fan 3 through a positioning seat, rotating the positioning screw 44 to connect the positioning screw 44 with the threaded hole on the positioning block 7, thereby fixing the SIP packaging TR component 6 through the heat dissipation plate structure 4,
step two, then supply power with fan 3 through the interface connection on connector and the test medium base plate 1, the rotation direction of the fan 3 of both sides is the syntropy, consequently, heat on the SIP encapsulation TR subassembly 6 is by heat conduction to heat radiation plate structure 4 on, fan 3 then blows away the heat on the heat radiation plate structure 4 to realize quick heat dissipation.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention without departing from the spirit and scope of the invention.
Claims (10)
1. The solderability test fixture for the inner surface of the small-caliber deep cavity of the aluminum alloy comprises a test medium substrate (1) and is characterized in that an SMP radio frequency test connector (8), a copper sheet PAD point (9), an input end (10) and an output end (11) are respectively arranged on the upper surface of the test medium substrate (1), the SMP radio frequency test connector (8) and the input end (10) are respectively positioned on the back sides of the copper sheet PAD point (9) and the output end (11), the output end (11) is positioned right in front of the copper sheet PAD point (9), the copper sheet PAD point (9) is positioned at the center of the test medium substrate (1), the input end (10) is positioned on the right side of the SMP radio frequency test connector (8), a fan (3) is arranged on the upper surface of the test medium substrate (1), a positioning block (7) is arranged at the top of the test medium substrate (1), and the positioning, the inside swing joint of locating piece (7) has switching medium base plate (2), the bottom of switching medium base plate (2) and the top swing joint of copper sheet PAD point (9), the top swing joint of switching medium base plate (2) has SIP encapsulation TR subassembly (6), the upper surface swing joint of SIP encapsulation TR subassembly (6) has cooling plate structure (4), the bottom bonding of cooling plate structure (4) has temperature sensor (5), temperature sensor (5) are through wire and fan (3) fixed connection.
2. The aluminum alloy small-caliber deep-cavity inner surface weldability test fixture according to claim 1, wherein said transition dielectric substrate (2) comprises an array opening (21) and a connector (22), the array opening (21) is opened on the upper surface of the transition dielectric substrate (2), and the connector (22) is fixedly connected to the middle position of the inner wall of the array opening (21).
3. The aluminum alloy small-caliber deep-cavity inner surface weldability test fixture according to claim 1, characterized in that the number of the fans (3) is two, the two fans (3) are arranged in axial symmetry with the vertical axis of the adapter medium substrate (2) as a symmetry axis, a temperature control feedback circuit is arranged inside the fans (3), a positioning seat (12) is arranged on the upper surface of the test medium substrate (1) corresponding to the position of the fan (3), an elastic rubber is arranged inside the positioning seat (12), and the surface of the fan (3) is in interference connection with the inner wall of the elastic rubber.
4. The aluminum alloy small-caliber deep-cavity inner surface weldability test fixture according to claim 1, wherein the heat dissipation plate structure (4) comprises heat dissipation fins (41), a side fixing block (43), a spring (42) and a positioning screw (44), the positioning screw (44) is movably connected inside a connecting hole in the side fixing block (43), the spring (42) is movably sleeved on the surface of the positioning screw (44), the side fixing block (43) is fixedly connected to the side of the heat dissipation fins (41) and located at the position of the positioning block (7), and the positioning screw (44) is in threaded connection inside the positioning block (7).
5. The aluminum alloy small-caliber deep-cavity inner surface weldability test fixture according to claim 4, characterized in that the inside of said heat radiation fin (41) is provided with a heat-filling pipe, and the bottom of the heat radiation fin (41) is provided with a heat-conducting gasket.
6. The aluminum alloy small-caliber deep-cavity inner surface weldability test fixture according to claim 1, characterized in that said SMP radio frequency test connector (8) can be replaced by SMA/SSMP/SSMA as required.
7. The aluminum alloy small-caliber deep-cavity inner surface weldability test fixture as claimed in claim 2, wherein said connector (22) is in the form of "hard needle-fuzz button-hard needle".
8. The aluminum alloy small-caliber deep-cavity inner surface weldability test fixture according to claim 1, characterized in that, the upper surface of said test medium substrate (1) can be arranged with capacitor or resistor according to actual need.
9. The aluminum alloy small-caliber deep-cavity inner surface weldability test fixture according to claim 4, characterized in that the bottom of the heat dissipation fin (41) is respectively provided with a placement groove (13) and a wire groove (14), the temperature sensor (5) is bonded inside the placement groove (13), and the wire is located inside the wire groove (14).
10. The use method of the weldability test fixture of the small-caliber deep-cavity inner surface of aluminum alloy according to claim 1 is characterized in that the use method is as follows:
firstly, a switching medium substrate (2) is placed between positioning blocks (7) and connected with a copper sheet PAD point (9), then an SIP packaging TR component (6) is placed on the switching medium substrate (2) between the positioning blocks (7), finally a heat dissipation plate structure (4) is placed on the SIP packaging TR component (6), a positioning screw (44) is positioned right above a threaded hole on the positioning block (7), then a lead on the heat dissipation plate structure (4) is connected with a fan (3), the fan (3) is fixed through a positioning seat, the positioning screw (44) is rotated to be connected with the threaded hole on the positioning block (7), and therefore the SIP packaging TR component (6) is fixed through the heat dissipation plate structure (4),
step two, then supply power with fan (3) through the interface connection on connector and the test medium base plate (1), the rotation direction of the fan (3) of both sides is the syntropy, consequently, heat on SIP encapsulation TR subassembly (6) is by heat conduction to heating panel structure (4), fan (3) then blows away the heat on heating panel structure (4) to realize quick heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011253871.6A CN112379134A (en) | 2020-11-11 | 2020-11-11 | Aluminum alloy small-caliber deep-cavity inner surface weldability test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011253871.6A CN112379134A (en) | 2020-11-11 | 2020-11-11 | Aluminum alloy small-caliber deep-cavity inner surface weldability test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112379134A true CN112379134A (en) | 2021-02-19 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113030523A (en) * | 2021-03-04 | 2021-06-25 | 西安微电子技术研究所 | Aging test socket for optical imaging micro-system module |
| CN117607663A (en) * | 2024-01-18 | 2024-02-27 | 宁波吉品科技有限公司 | Built-in probe load test platform |
| CN117607663B (en) * | 2024-01-18 | 2024-04-19 | 宁波吉品科技有限公司 | Built-in probe load test platform |
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