CN117607663A - Built-in probe load test platform - Google Patents
Built-in probe load test platform Download PDFInfo
- Publication number
- CN117607663A CN117607663A CN202410072242.5A CN202410072242A CN117607663A CN 117607663 A CN117607663 A CN 117607663A CN 202410072242 A CN202410072242 A CN 202410072242A CN 117607663 A CN117607663 A CN 117607663A
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- base
- probe
- clamp
- chip
- coaxial
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- 239000000523 sample Substances 0.000 title claims abstract description 54
- 238000012360 testing method Methods 0.000 title claims abstract description 23
- 230000000712 assembly Effects 0.000 claims description 5
- 238000000429 assembly Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 4
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 9
- 239000004020 conductor Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a built-in probe load test platform, which comprises: a base; a clamp is arranged above the base, and the chip to be tested is clamped by the cooperation of the base and the clamp; the bottom of the base is provided with a first coaxial load assembly, the inside of the clamp is provided with a second coaxial load assembly, and the first coaxial load assembly and the second coaxial load assembly are oppositely arranged to detect the end faces of the two sides of the chip to be detected; the first coaxial load assembly and the second coaxial load assembly are used for positioning and detecting the chip to be detected, two sides of the chip to be detected can be detected simultaneously, and the base is matched with the clamp, so that higher matching precision is achieved.
Description
Technical Field
The invention relates to the technical field of semiconductor detection, in particular to a built-in probe load test platform.
Background
With the miniaturization and diversification of semiconductor chips, many packaging forms are extended. In order to verify the radio frequency, low frequency performance of a chip, some performance tests are often required.
Because the size of the chip is too small, the spacing arrangement of the radio frequency and low frequency test ports tends to be very dense, the current coaxial radio frequency load is about 2.9mm minimum in inner diameter because of the diameter of the 50 Ω radio frequency resistor, and the radio frequency load profile of some conventional interfaces such as SMP series is usually 3.2mm at least, so that the outer diameter of the load structure is at least 4mm (some insulating medium and other structures are needed for fixing the inner conductor). The smaller distance between the radio frequency ports of some chips can not be discharged by the conventional coaxial structure, so that some conventional radio frequency coaxial structures can not be normally arranged and used.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a built-in probe load testing platform.
In order to achieve the above purpose, the present invention adopts the following technical scheme: a built-in probe load test platform, comprising:
a base;
a clamp is arranged above the base, and the chip to be tested is clamped by the cooperation of the base and the clamp;
the bottom of base is provided with first coaxial load subassembly, the inside second coaxial load subassembly that is provided with of anchor clamps, first coaxial load subassembly with the coaxial load subassembly of second sets up relatively, detects the both sides terminal surface of chip awaits measuring.
As a further description of the above technical solution: the upper part of the base is provided with a volume groove, the inner side of the volume groove is provided with a limit frame, and the chip to be tested is placed in the limit frame.
As a further description of the above technical solution: and a pressing plate is arranged below the clamp, and the second coaxial load assembly penetrates through the pressing plate and is elastically contacted with the upper surface of the chip to be tested.
As a further description of the above technical solution: the base is connected with the PCB through bolts, and the first coaxial load assembly penetrates through the PCB and is in elastic contact with the lower surface of the chip to be tested.
As a further description of the above technical solution: the top of the clamp is provided with a locking knob, and the clamp is connected with the base through the locking knob.
As a further description of the above technical solution: the base is also provided with a limiting column, and the downward moving distance of the clamp is limited by the limiting column.
As a further description of the above technical solution: the first coaxial load assembly comprises a shell, a plurality of first elastic probes are installed through the shell, and shielding separation blades are arranged between the first elastic probes.
As a further description of the above technical solution: offer the screw hole on the casing, with adjust knob cooperation, adjust knob one side with first elasticity probe contact, through adjust knob adjusts first elasticity probe stretches out to the length of volume groove, adjusts simultaneously with the cooperation size of resistance, carries out the debugging of radio frequency performance, ensures probe load platform's yield.
As a further description of the above technical solution: and the shielding separation blade is arranged between two adjacent first elastic probe structures and cuts the air cavity at the inner side of the shell, so that two adjacent crossed first coaxial load assemblies form an independent structure, and isolation of the small-space radio frequency ports is realized.
As a further description of the above technical solution: the second coaxial load assembly comprises a mounting block, the mounting block is positioned on the inner side of the clamp, a plurality of second elastic probes are arranged on the mounting block, and the minimum arrangement distance of the second elastic probes is 3.2mm.
The technical scheme has the following advantages or beneficial effects:
1. the first coaxial load assembly and the second coaxial load assembly are used for positioning and detecting the chip to be detected, two sides of the chip to be detected can be detected simultaneously, and the base is matched with the clamp, so that higher matching precision is achieved.
2. The coaxial radio frequency structure is formed by designing the elastic probe, and the coaxial load structure and the clamp are integrally designed by impedance matching, so that a testing platform with smaller space and lower cost is formed.
3. The ultra-small-space radio frequency structure arrangement is realized through the clamp of the shielding baffle, the adjacent two crossed first coaxial load assemblies form an independent structure through the cutting of the air cavity, the isolation of the small-space radio frequency ports is realized, then the diameter of the air cavity after the cutting is properly increased, and the 50 omega impedance matching of the radio frequency ports is ensured.
Drawings
FIG. 1 is a perspective view of a test platform according to the present invention;
FIG. 2 is an exploded view of a test platform according to the present invention;
FIG. 3 is a second exploded view of the test platform according to the present invention;
FIG. 4 is a cross-sectional view of a clamp of the present invention;
FIG. 5 is a cross-sectional view of a base of the present invention;
FIG. 6 is an exploded view of a first coaxial load assembly of the present invention;
fig. 7 is a perspective view of a second coaxial load assembly of the present invention.
Legend description:
1. a base; 11. a PCB board; 12. a limit column; 2. a clamp; 21. a pressing plate; 22. a locking knob; 3. a chip to be tested; 4. a first coaxial load assembly; 41. a housing; 42. a first elastic probe; 43. shielding baffle plates; 44. an adjustment knob; 45. a resistor; 46. a temperature sensor; 47. a first probe inner conductor; 5. a second coaxial load assembly; 51. a mounting block; 52. a second elastic probe; 6. and a limit frame.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-7, one embodiment provided by the present invention is: a built-in probe load test platform, comprising: a base 1; a clamp 2 is arranged above the base 1, and the chip 3 to be tested is clamped by the cooperation of the base 1 and the clamp 2; the bottom of base 1 is provided with first coaxial load subassembly 4, and anchor clamps 2 inside is provided with second coaxial load subassembly 5, and first coaxial load subassembly 4 and second coaxial load subassembly 5 set up relatively, detect the both sides terminal surface of chip 3 to be tested.
In this embodiment, the base 1 is matched with the fixture 2 to limit the position of the chip 3 to be tested, the first coaxial load assembly 4 and the second coaxial load assembly 5 are used for simultaneously detecting the chip 3 to be tested, the first coaxial load assembly 4 is in elastic contact with the bottom of the chip 3 to be tested, the second coaxial load assembly 5 is used for elastically contacting the top of the chip 3 to be tested, the position of the component 3 to be tested is limited, and the elastic contact enables the end faces of the upper side and the lower side of the chip 3 to be tested to be uniformly stressed, so that damage is avoided.
A volume groove is formed above the base 1, a limit frame 6 is arranged on the inner side of the volume groove, and the chip 3 to be tested is placed in the limit frame 6.
In this embodiment, the limiting frame 6 is placed in the volume groove above the base 1, and is in transition fit with the base 1, the chip 3 to be tested is placed in the limiting frame 6, the position of the chip 3 to be tested is limited, the chip 3 to be tested is placed and moves in the detection process, the upper end face of the limiting frame 6 is higher than the upper end face of the chip 3 to be tested, and the pressing plate 21 is prevented from pressing too far down to damage the chip 3 to be tested.
A pressing plate 21 is arranged below the clamp 2, and the second coaxial load assembly 5 penetrates through the pressing plate 21 and is elastically contacted with the upper surface of the chip 3 to be tested.
The second coaxial load assembly 5 extends outwards through the pressing plate 21 by aligning the pressing plate 21 with the position of the limiting frame 6, and the second coaxial load assembly 5 is positioned on the inner side of the clamp 2 and the pressing plate 21 for coaxial alignment and transmits data of the chip 3 to be detected.
The base 1 is connected with the PCB 11 through bolts, and the first coaxial load assembly 4 penetrates through the PCB 11 and is in elastic contact with the lower surface of the chip 3 to be tested.
In this embodiment, the base 1 is connected with the PCB 11, a through hole is formed at the position of the PCB 11, so that the first coaxial load component 4 penetrates through the PCB 11 from the through hole to contact with the lower surface of the chip 3 to be tested, the burn-in test can be further performed by placing the PCB 11, a plurality of bases 1 can be further placed on the PCB 11, meanwhile, a plurality of groups of burn-in tests can be performed, and particularly 10-20 bases 1 can be placed, the chip 3 to be tested is placed in the limit frame 6, then the locking knob 22 is screwed, the chip 3 to be tested is guaranteed to be effectively contacted with the first elastic probe and the second elastic probe, the PCB 11 is placed in the burn-in test box, the PCB 11 is clamped by the test fixture through the upper plate and the lower plate, the placement position is guaranteed by the locating pin and the circuit board, and then the burn-in test is performed.
The top of the clamp 2 is provided with a locking knob 22, and the clamp is connected with the base 1 through the locking knob 22.
In this embodiment, threaded holes are formed on two sides of the base 1, a threaded column of the locking knob 22 penetrates through the clamp 2 to be matched with the threaded holes, the base 1 and the clamp 2 are aligned and calibrated through the locking knob 22, and meanwhile, the locking knob 22 is rotated to coarsely adjust the distance between the first coaxial load assembly 4 and the second coaxial load assembly 5 and the chip 3 to be tested.
The base 1 is also provided with a limiting column 12, and the downward moving distance of the clamp 2 is limited by the limiting column 12.
In this embodiment, through the spacing post 12 on the base 1, prevent that anchor clamps 2 from moving the distance too big, damage chip 3 that awaits measuring, can change the spacing post 12 of co-altitude simultaneously, adjust the distance between anchor clamps 2 and the base 1, can be used for detecting chip 3 that awaits measuring of different thickness, protect chip 3 that awaits measuring not to receive the damage.
The first coaxial load assembly 4 comprises a housing 41, a plurality of first elastic probes 42 are mounted through the housing 41, and shielding baffles 43 are arranged between the plurality of first elastic probes 42.
In this embodiment, the first coaxial load assembly 4 is provided with four first elastic probes 42, and is integrally designed, and the outer shape varies according to the layout, and can be used with a pitch of 1-3 mm. Because the interval is too small, the shielding separation blades 43 at the middle position are used for separation, so that the coaxial structure can be ensured, the radio frequency coaxial structure of each first elastic probe 42 can be separated, and the processing difficulty is reduced.
The shell 41 is provided with a threaded hole which is matched with the adjusting knob 44, one side of the adjusting knob 44 is contacted with the first elastic probe 42, the length of the first elastic probe 42 extending out of the volume groove is adjusted through the adjusting knob 44, meanwhile, the matching size with the resistor 45 is adjusted, the radio frequency performance is debugged, and the yield of the probe load platform is guaranteed.
In this embodiment, since a certain error exists in the thickness of the chip 3 to be measured in the process of processing, the tolerance levels required by different types of chips 3 to be measured are different, the types of the chips 3 to be measured are adapted by selecting the limiting columns 12, the distances between the first coaxial load assembly 4 and the second coaxial load assembly 5 and the chips 3 to be measured are coarse-tuned, the length of the first elastic probe 42 extending into the volume groove can be adjusted by the adjusting knob 44, the elastic contact degree between the first elastic probe 42 and the chips 3 to be measured is fine-tuned, the chips 3 to be measured are prevented from being damaged by extrusion in the extending distance process, the resistance value of the resistor 45 is 50Ω, the impedance characteristic of 50Ω is provided for chip radio frequency detection, and the first probe inner conductor 47 is arranged on one side of the resistor 45 and is coaxially connected with the first elastic probe 42; the base 1 is also provided with a temperature sensor 46 for detecting the temperature of the chip 3 to be tested.
A shielding baffle 43 is arranged between two adjacent structures of the first elastic probe 42, and the air cavity inside the shell 41 is cut, so that two adjacent crossed load structures form an independent first coaxial load assembly 4, isolation of the small-space radio frequency ports is realized, then the diameter of the cut air cavity is properly increased, and impedance matching of the radio frequency ports and the resistor 45 is ensured.
By adding the shielding baffle plate 43, the problem that the radio frequency port is very close to the radio frequency port and the complete coaxial load assemblies are not arranged is solved, and the distance between the two first coaxial load assemblies 4 can be the smallest distance of 2.1 mm.
The second coaxial load assembly 5 comprises a mounting block 51, the mounting block 51 is positioned at the inner side of the clamp 2, a plurality of second elastic probes 52 are arranged on the mounting block 51, the minimum arrangement space of the second elastic probes 52 is 3.2mm, and the outer diameter of the second elastic probes 52 is more than or equal to 3.2mm.
In this embodiment, the second coaxial load assembly 5 is disposed inside the fixture, and is positioned by the mounting block 51, and the second elastic probe 52 is connected to the second probe inner conductor, and the resistor on the second probe inner conductor is disposed, so as to design an oblique angle on the resistor end, and effectively improve the standing wave performance. The resistor and the transition portion of the inner conductor of the second probe are cut off a part of the insulating air portion due to the spacing, and the volume of the other side of the cut-off side is increased by increasing the diameter thereof, so that the impedance characteristic reaches 50Ω and the detection is performed.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.
Claims (6)
1. A built-in probe load test platform, comprising:
a base (1);
a clamp (2) is arranged above the base (1), and the chip (3) to be tested is clamped by matching the base (1) with the clamp (2);
the bottom of the base (1) is provided with a first coaxial load assembly (4), a second coaxial load assembly (5) is arranged in the clamp (2), and the first coaxial load assembly (4) and the second coaxial load assembly (5) are oppositely arranged to detect the end faces of two sides of the chip (3) to be detected;
a volume groove is formed above the base (1), a limit frame (6) is arranged on the inner side of the volume groove, and the chip (3) to be tested is placed in the limit frame (6);
the first coaxial load assembly (4) comprises a shell (41), a plurality of first elastic probes (42) are arranged through the shell (41), and shielding baffle plates (43) are arranged between the first elastic probes (42);
the shell (41) is provided with a threaded hole which is matched with an adjusting knob (44), one side of the adjusting knob (44) is contacted with the first elastic probe (42), the length of the first elastic probe (42) extending to the volume groove is adjusted through the adjusting knob (44), meanwhile, the matching size with a resistor (45) is adjusted, the radio frequency performance is adjusted, and the yield of the probe load platform is guaranteed;
the shielding baffle piece (43) is arranged between two adjacent first elastic probe (42) structures, and the air cavity at the inner side of the shell (41) is cut, so that two adjacent crossed first coaxial load assemblies (4) form an independent structure, and isolation of small-space radio frequency ports is realized.
2. The built-in probe load test platform according to claim 1, wherein: the clamp (2) is provided with a pressing plate (21) below, and the second coaxial load assembly (5) penetrates through the pressing plate (21) and is elastically contacted with the upper surface of the chip (3) to be tested.
3. The built-in probe load test platform according to claim 1, wherein: the base (1) is connected with the PCB (11) through bolts, and the first coaxial load assembly (4) penetrates through the PCB (11) and is in elastic contact with the lower surface of the chip (3) to be tested.
4. The built-in probe load test platform according to claim 1, wherein: the top of the clamp (2) is provided with a locking knob (22), and the clamp is connected with the base (1) through the locking knob (22).
5. The built-in probe load test platform according to claim 1, wherein: the base (1) is also provided with a limiting column (12), and the downward moving distance of the clamp (2) is limited through the limiting column (12).
6. The built-in probe load test platform according to claim 1, wherein: the second coaxial load assembly (5) comprises a mounting block (51), the mounting block (51) is located on the inner side of the clamp (2), a plurality of second elastic probes (52) are arranged on the mounting block (51), and the minimum arrangement distance of the second elastic probes (52) is 3.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410072242.5A CN117607663B (en) | 2024-01-18 | 2024-01-18 | Built-in probe load test platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410072242.5A CN117607663B (en) | 2024-01-18 | 2024-01-18 | Built-in probe load test platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117607663A true CN117607663A (en) | 2024-02-27 |
| CN117607663B CN117607663B (en) | 2024-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410072242.5A Active CN117607663B (en) | 2024-01-18 | 2024-01-18 | Built-in probe load test platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117607663B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118197944A (en) * | 2024-03-17 | 2024-06-14 | 苏州奥金斯电子有限公司 | Test burning seat for wafer-level packaging chip |
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| US20150168450A1 (en) * | 2013-12-17 | 2015-06-18 | Tim WOODEN | Coaxial Impedance-Matched Test Socket |
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| CN108336461A (en) * | 2017-12-18 | 2018-07-27 | 苏州华旃航天电器有限公司 | A kind of radio frequency coaxial load |
| CN211826363U (en) * | 2020-03-02 | 2020-10-30 | 宁波吉品科技有限公司 | Double-sided radio frequency test fixture |
| CN112379134A (en) * | 2020-11-11 | 2021-02-19 | 中国电子科技集团公司第十四研究所 | Aluminum alloy small-caliber deep-cavity inner surface weldability test fixture |
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| CN115832797A (en) * | 2023-01-13 | 2023-03-21 | 中航富士达科技股份有限公司 | Booth is apart from coaxial load connecting device of radio frequency |
| CN116224016A (en) * | 2022-12-20 | 2023-06-06 | 蚌埠希磁科技有限公司 | Chip testing device |
| CN219658958U (en) * | 2023-03-21 | 2023-09-08 | 苏州莱尔微波技术有限公司 | Radio frequency coaxial load with simple assembly and good performance consistency |
| CN116735922A (en) * | 2023-07-12 | 2023-09-12 | 无锡伟测半导体科技有限公司 | Spiral cover type chip test fixture |
-
2024
- 2024-01-18 CN CN202410072242.5A patent/CN117607663B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6369593B1 (en) * | 1998-10-13 | 2002-04-09 | Test Plus Electronic Gmbh | Load board test fixture |
| US20150168450A1 (en) * | 2013-12-17 | 2015-06-18 | Tim WOODEN | Coaxial Impedance-Matched Test Socket |
| CN207148155U (en) * | 2017-07-31 | 2018-03-27 | 珠海市运泰利自动化设备有限公司 | The test fixture of IC chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118197944A (en) * | 2024-03-17 | 2024-06-14 | 苏州奥金斯电子有限公司 | Test burning seat for wafer-level packaging chip |
| CN118197944B (en) * | 2024-03-17 | 2024-08-20 | 苏州奥金斯电子有限公司 | Test burning seat for wafer-level packaging chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117607663B (en) | 2024-04-19 |
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