CN115267275B

CN115267275B - Test device, test assembly and test method for surface-mounted components

Info

Publication number: CN115267275B
Application number: CN202211206024.3A
Authority: CN
Inventors: 韩良; 姜鑫
Original assignee: Nantong Mi Lewei Microelectronics Technology Co ltd
Current assignee: Nantong Mi Lewei Microelectronics Technology Co ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2023-08-01
Anticipated expiration: 2042-09-30
Also published as: CN115267275A

Abstract

The invention provides a test device, a test assembly and a test method for surface-mounted components. The testing device comprises a base, a PCB testing board covered on the base and a pressing piece; the base is provided with an inwards concave accommodating cavity, and a slot is formed in the PCB test board; the main body of the surface-mounted component is inserted into the accommodating cavity from the slot, and the pins extend out from the edge of the slot and form electric connection with the electric connection wires; the pressing piece covers the main body and the PCB test board, and two ends of the pressing piece are detachably fixed with the base. Above-mentioned test assembly need not to set up the intermediate layer structure, through directly placing the PCB test board in the top, and the surface mounted components and parts main part is placed in the mode of acceping the intracavity, makes the pin extend from the fluting edge and form electric connection with electric connection wire for the surface mounted components and parts has the one side of pin can need not the intermediate layer and directly be connected with the electric connection wire electricity of PCB test board, thereby improves the directly perceived of test accuracy and test process and reduces testing arrangement cost.

Description

Test device, test assembly and test method for surface-mounted components

Technical Field

The invention relates to the technical field of chip testing, in particular to a testing device, a testing assembly and a testing method adopted in the field.

Background

In the prior art, a special testing device is required to be adopted for testing the surface mounted components including the chip, for example, in patent number CN107797044a, and a testing device is provided. The apparatus 101 for testing a semiconductor device includes an interposer 110 in which the semiconductor device 10 is accommodated, a test socket 120 disposed under the interposer 110 to electrically connect the semiconductor device 10 to a tester generating an inspection signal, and an interposer 150 disposed between the interposer 110 and the test socket 120 to enable the semiconductor device 10 to be electrically connected to the test socket 120. The connection terminals of the test socket 120 extend upward to connect with the via contacts 132, and the contact terminals 12 of the semiconductor device 10 are located above the via contacts 132 and also connected with the via contacts 132 to form an electrical connection with the test socket. In other prior art, such via contacts 132 may also be replaced with conductive films as intermediate media to form electrical connections of the semiconductor device to the test socket.

The above structure for forming the electrical connection through the intermediate medium has the problem that the test of the electronic component is equivalent to the series connection of a complex parasitic parameter consisting of the parallel connection of the resistive-capacitive sensing strings at each terminal or pin due to the introduction of the medium layer in the test fixture. The effect of these spurious parameters on circuit performance is not so pronounced at low frequencies, and as the operating frequency increases, the parasitic effects they produce become increasingly significant. At present, a plurality of 'de-embedding' methods are adopted to eliminate the influence of a dielectric layer, but the test precision of a final surface-mounted device is always influenced. In addition, the dielectric layer has a fine and complex structure, so that the dielectric layer has very high value, and is particularly suitable for high-frequency circuits and surface-mounted components with larger sizes. The dielectric layer is a consumable material in the testing device, and needs to be replaced after being used for a certain number of times, so that the testing cost is high.

Therefore, a new technical solution is needed to solve the above technical problems.

Disclosure of Invention

The invention provides a testing device, a testing assembly and a testing method for surface-mounted components, and aims to omit an intermediate layer structure of a traditional testing device so as to improve testing precision and the observability of testing results and reduce testing cost.

In order to achieve the above purpose, the testing device of the invention can adopt the following technical scheme:

a testing device of surface-mounted components comprises a base, a PCB test board covered on the base and a pressing piece covered on the PCB test board; the PCB testing board is provided with a slot which penetrates through the PCB testing board and is positioned above the accommodating cavity, and the PCB testing board is provided with an electric connection wire at the side edge of the slot.

The beneficial effects are that: compared with the prior art, the testing device does not need to be provided with an intermediate layer structure, the PCB testing board is directly placed above, and the surface-mounted component device can be placed in the accommodating cavity below the PCB testing board, so that one surface of the surface-mounted component device with pins can be directly electrically connected with the electric connection wires of the PCB testing board without the intermediate layer, thereby improving the testing precision and the observability of the testing result and reducing the testing cost.

Furthermore, a plurality of spring collision beads are arranged on the bottom surface of the accommodating cavity, and the heights of the spring collision beads are the same. The spring collision bead can be used as an auxiliary elastic positioning device to elastically position the surface-mounted component in the accommodating cavity when the surface-mounted component is pressed by the pressing piece.

Further, a depth adjusting block which moves up and down along the accommodating cavity is arranged in the accommodating cavity, and the spring collision bead is arranged on the upper surface of the depth adjusting block; the holding cavity is also internally provided with a stop screw which is inserted from the side surface of the holding cavity and is contacted with the depth adjusting block.

Further, the depth adjusting block is a depth adjusting nut; the cross section of the accommodating cavity is circular, and the inner surface of the accommodating cavity is provided with internal threads; the cross-sectional area of the accommodating cavity is larger than that of the slot.

Further, the two ends of the pressing piece are detachably fixed on the base and pressed on the PCB test board, and the pressing piece is conductive and electrically connected with a grounding point on the PCB test board. The pressing piece can play the role of the grounding intermediary at the same time.

Further, the electric connection wire arranged on the PCB test board is a microstrip line.

Or further, the PCB radio frequency probe is further included, the electric connection wire arranged on the PCB test board is a coplanar waveguide wire, and the PCB radio frequency probe is electrically connected with the coplanar waveguide wire.

The test assembly of the invention can adopt the following technical scheme:

the test assembly of the surface-mounted component comprises a test device and the surface-mounted component to be tested, wherein the test device comprises a base, a PCB test board covered on the base and a pressing piece; the PCB test board is provided with a slot which penetrates through the PCB test board and is positioned above the accommodating cavity, and an electric connection wire is arranged at the side edge of the slot; the surface-mounted component comprises a main body and pins extending from the side surface of the main body; the main body is inserted into the accommodating cavity from the slot, and the pins extend out from the edge of the slot and form electric connection with the electric connection wires; the pressing piece covers the main body and the PCB test board, and two ends of the pressing piece are detachably fixed with the base.

The beneficial effects are that: compared with the prior art, the test assembly does not need to be provided with an intermediate layer structure, the surface-mounted component main body is placed in the accommodating cavity by directly placing the PCB test board above, pins extend out of the slotted edges and are electrically connected with the electric connecting wires, one surface of the surface-mounted component with the pins can be electrically connected with the electric connecting wires of the PCB test board without the intermediate layer, and therefore the test precision and the observability of test results are improved, and the test cost is reduced.

Further, the cross-sectional dimension of the accommodating cavity is larger than or equal to the cross-sectional dimension of the main body, and the cross-sectional dimension of the slot is consistent with the cross-sectional dimension of the main body.

Further, a depth adjusting block which moves up and down along the accommodating cavity is arranged in the accommodating cavity, and a spring collision bead is arranged on the upper surface of the depth adjusting block; the holding cavity is also internally provided with a stop screw which is inserted from the side surface of the holding cavity and is contacted with the depth adjusting block.

Furthermore, the cross section of the accommodating cavity is circular, the inner surface of the accommodating cavity is provided with internal threads, and the accommodating cavity is internally provided with a depth adjusting nut meshed with the internal threads; the upper surface of the depth adjusting nut is provided with a plurality of spring collision beads, and the heights of the spring collision beads are the same.

Further, when the main body is positioned in the accommodating cavity, the upper surface of the main body is flush with the upper surface of the PCB test board, and pins extend out from the grooves and are pressed on the electric connection wires to form electric connection; the electrical connection of the pins and the electrical connection wires is achieved by a gold wire bonding process or a metal tape press-fit.

The invention also provides a testing method adopting the testing component, which can adopt the following technical scheme:

the main body is inserted into the accommodating cavity through the slot and is covered on the main body and the PCB test board through the pressing piece to fix the main body, the upper surface of the main body is a grounding surface, the pressing piece is conductive, the pressing piece is contacted with the upper surface of the main body, and at least one end of the pressing piece is electrically connected with the grounding point on the PCB test board to enable the main body to be grounded; the pins extend from the slots and are pressed on the electric connection wires to form electric connection, the electric connection wires arranged on the PCB test board are microstrip lines, and the test reference surface is aligned to the microstrip lines and the pins of the tested piece by matching with a TRL alignment method of the microstrip lines of the PCB; and testing the surface-mounted components after the setting is finished.

The beneficial effects are that: the test method enables the surface-mounted component to form grounding connection in the test device, and after the pins are electrically connected with the PCB test board, the test reference surface is calibrated to the positions of the microstrip line and the pin of the tested piece by matching with the TRL calibration method of the microstrip line of the PCB, so that the test electrical connection requirement can be met without an intermediate layer.

Drawings

FIG. 1 is a perspective view of a test assembly of the present invention.

Fig. 2 is an exploded perspective view of the test assembly of the present invention.

FIG. 3 is a cross-sectional view of example 2 of the test device of the present invention.

FIG. 4 is a cross-sectional view of example 3 of the test device of the present invention.

Detailed Description

Example 1

Referring to fig. 1 and 2, the invention discloses a testing assembly for a surface mounted component, which comprises a testing device and the surface mounted component to be tested.

The testing device comprises a base 1, a PCB testing board 2 covered on the base 1 and a pressing piece 3. The upper surface of the base 1 is provided with an inwards concave accommodating cavity 11, the PCB test board 2 is provided with a slot 21 penetrating the PCB test board and positioned above the accommodating cavity, and the PCB test board 2 is provided with an electric connection wire 22 at the side edge of the slot 21.

The surface-mounted component comprises a main body 4 and pins 5 extending from the side surface of the main body 4. The main body 4 is inserted into the accommodating cavity 11 from the slot 21, and the pins 5 extend out from the edge of the slot and form electric connection with the electric connection wires 22; the pressing piece 3 covers the main body 4 and the PCB test board 2, and two ends of the pressing piece 3 are detachably fixed with the base 1. When the conventional surface-mounted component is used in a specific electronic product, the conventional surface-mounted component is generally mounted on the upper surface of the PCB, the side edge of the main body with the pins is the lower side edge of the main body, and the pins extend outwards from the lower side edge and are directly and electrically connected with the PCB; in this embodiment, therefore, the connection with the PCB test board 2 is performed not in this manner, but by positioning the side edge of the pin 5 above and mounting the side edge without the pin down into the housing chamber 11. The cross section of the slot 21 is the same as the cross section of the main body 4, and the main body 4 is positioned in the accommodating cavity 11. Because the pins are welded with the PCB board when the surface mount component is specifically used, but the pins cannot be welded when the surface mount component is tested, an interposer is adopted in the prior art, and in order to eliminate the middle level in the embodiment, the pins 5 can be directly extended to the electrical connection position of the PCB test board 2 by the way of the embodiment, the upper surface of the main body 4 is level with the upper surface of the PCB test board 2, and the pins 5 extend from the slots 21 and are pressed on the electrical connection wires to form electrical connection; the electrical connection between the pins 5 and the electrical connection wires 22 is achieved by a gold wire bonding process or metal tape bonding (the electrical connection wires of the PCB test board are microstrip lines). The gold wire bonding process or metal tape press-fit can enable the pins 5 to be detachably separated from the PCB test board 2 without leaving residual traces such as soldering on the pins, which meets the test requirements. When the pressing member 3 is pressed from top to bottom, the main body 4 and the PCB testing board 2 are pressed at the same time, so that the upper surface of the main body 4 is flush with the upper surface of the PCB testing board 2. And a plurality of spring collision beads 12 are arranged on the bottom surface of the accommodating cavity 11, and the heights of the spring collision beads 12 are the same. The spring ball 12 can be used as an auxiliary elastic positioning device to elastically position the surface-mounted component in the accommodating cavity when the surface-mounted component is pressed by the pressing piece. At the moment, the test reference surface is calibrated to the positions of the microstrip line and the pin of the tested piece by matching with a TRL calibration method of the microstrip line of the PCB; and after the setting is finished, the surface mounted components can be tested.

Example 2

Referring to fig. 3, the test apparatus provided in this embodiment is substantially the same as the test apparatus provided in embodiment 1, except that in this embodiment, a depth adjusting block 13 is further disposed in the accommodating cavity 11 and moves up and down along the accommodating cavity 11, and the adjusting block 13 may be square, circular, etc. The holding cavity is also internally provided with a stop screw 14 which is inserted from the side surface of the holding cavity and is contacted with the depth adjusting block 13. When the depth adjustment block 13 moves to a predetermined position within the housing cavity 11, the depth adjustment block 13 is fixed in that position by the stopper screw 14. A plurality of spring balls 12 are arranged on the upper surface of the depth adjusting block 13, and the height of each spring ball 12 is the same. The design can adjust the depth of the accommodating cavity 11 so as to be suitable for surface-mounted components with different sizes, and the testing device has universality.

Example 3

Referring to fig. 4, the testing device provided in this embodiment is substantially the same as the testing device provided in embodiment 2, except that in this embodiment, the cross section of the accommodating cavity 11 is circular, the inner surface of the accommodating cavity 11 is provided with an internal thread, the depth adjusting block 13 is provided with a depth adjusting nut engaged with the internal thread, and the depth of the accommodating cavity 11 can be adjusted more accurately by rotating the nut.

Example 4

The test device provided in this embodiment is substantially the same as that provided in embodiment 1, except that in this embodiment, a PCB radio frequency probe is further included. The electrical connection wires provided on the PCB test board are coplanar waveguide wires (instead of the microstrip lines in embodiment 1). The PCB radio frequency probe is electrically connected with the coplanar waveguide wire, and pins of the surface-mounted component are connected with the PCB radio frequency probe through the coplanar waveguide wire, so that direct testing of the pins of the component by using the handheld or fixture-fixed PCB radio frequency probe is realized.

There are many ways in which the invention may be embodied, and the above description is only of a preferred embodiment of the invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be comprehended within the scope of the present invention. The components not explicitly described in this embodiment can be implemented by using the prior art.

Claims

1. The utility model provides a test assembly of surface mounted components and parts, includes testing arrangement and the surface mounted components and parts that are tested, its characterized in that: the testing device comprises a base, a PCB testing board covered on the base and a pressing piece; the PCB test board is provided with a slot which penetrates through the PCB test board and is positioned above the accommodating cavity, and an electric connection wire is arranged at the side edge of the slot;

the surface-mounted component comprises a main body and pins extending from the side surface of the main body; the main body is inserted into the accommodating cavity from the slot, and the pins extend out from the edge of the slot and form electric connection with the electric connection wires; the pressing piece covers the main body and the PCB test board, and two ends of the pressing piece are detachably fixed with the base; the pressing piece is conductive and is electrically connected with a grounding point on the PCB test board;

the cross section size of the accommodating cavity is larger than or equal to that of the main body, and the cross section size of the slot is consistent with that of the main body;

the bottom surface of the accommodating cavity is provided with a plurality of spring collision beads, and the heights of the spring collision beads are the same.

2. The test assembly of claim 1, wherein: the accommodating cavity is internally provided with a depth adjusting block which moves up and down along the accommodating cavity, and a spring collision bead is arranged on the upper surface of the depth adjusting block; the holding cavity is also internally provided with a stop screw which is inserted from the side surface of the holding cavity and is contacted with the depth adjusting block.

3. The test assembly of claim 1, wherein: the cross section of the accommodating cavity is circular, the inner surface of the accommodating cavity is provided with internal threads, and the accommodating cavity is internally provided with a depth adjusting nut meshed with the internal threads; the upper surface of the depth adjusting nut is provided with a plurality of spring collision beads, and the heights of the spring collision beads are the same.

4. The test assembly of claim 1, wherein: when the main body is positioned in the accommodating cavity, the upper surface of the main body is flush with the upper surface of the PCB test board, and pins extend out from the grooves and are pressed on the electric connection wires to form electric connection; the electrical connection of the pins and the electrical connection wires is achieved by a gold wire bonding process or a metal tape press-fit.

5. The test assembly of claim 1, wherein: and the electric connection lead arranged on the PCB test board is a microstrip line.

6. The test assembly of claim 1, wherein: the PCB radio frequency probe is electrically connected with the coplanar waveguide line.

7. A test method using the test assembly of the surface mount device according to any one of claims 1 to 6, characterized in that: the main body is inserted into the accommodating cavity through the slot and is covered on the main body and the PCB test board through the pressing piece to fix the main body, the upper surface of the main body is a grounding surface, the pressing piece is conductive, the pressing piece is contacted with the upper surface of the main body, and at least one end of the pressing piece is electrically connected with the grounding point on the PCB test board to enable the main body to be grounded;

the pins extend from the slots and are pressed on the electric connection wires to form electric connection, the electric connection wires arranged on the PCB test board are microstrip lines, and the test reference surface is aligned to the microstrip lines and the pins of the tested piece by matching with a TRL alignment method of the microstrip lines of the PCB;

and testing the surface-mounted components after the setting is finished.