CN115267275A - Testing device, testing assembly and testing method for surface-mounted components - Google Patents
Testing device, testing assembly and testing method for surface-mounted components Download PDFInfo
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- CN115267275A CN115267275A CN202211206024.3A CN202211206024A CN115267275A CN 115267275 A CN115267275 A CN 115267275A CN 202211206024 A CN202211206024 A CN 202211206024A CN 115267275 A CN115267275 A CN 115267275A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a testing device, a testing assembly and a testing method for surface-mounted components. The testing device comprises a base, a PCB testing board covered on the base and a pressing piece; the base is provided with an inward concave accommodating cavity, and the PCB test board is provided with a slot; the main body of the surface-mounted component is inserted into the accommodating cavity from the open slot, and the pins extend out from the edge of the open slot and are electrically connected with the electric connecting wires; the pressing piece covers the main body and the PCB test board, and two ends of the pressing piece are detachably fixed with the base. The test component does not need to be provided with an interposer structure, the PCB is directly placed above the test board, the surface-mounted component main body is placed in the accommodating cavity, the pins extend out from the edge of the groove and are electrically connected with the electric connecting wires, the surface of the surface-mounted component with the pins can be electrically connected with the electric connecting wires of the PCB test board without the interposer, and therefore the test precision and the test process are improved, and the cost of the test device is reduced.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a testing device, a testing assembly and a testing method adopted in the field.
Background
In the prior art, a special testing device is required for testing a surface-mounted device including a chip, for example, in patent No. CN107797044A, a testing device is provided. The apparatus 101 for testing a semiconductor device includes an interposer 110 in which the semiconductor device 10 is received, a test socket 120 disposed under the interposer 110 to electrically connect the semiconductor device 10 to a tester generating an inspection signal, and an interposer 150 disposed between the interposer 110 and the test socket 120 to enable the semiconductor device 10 to be electrically connected to the test socket 120. The connection terminals of the test socket 120 extend upward to be connected to the via contacts 132, and the contact terminals 12 of the semiconductor device 10 are electrically connected to the test socket after being positioned above the via contacts 132 and also connected to the via contacts 132. In other prior art, such via contacts 132 may also be replaced by conductive films as an intermediate dielectric to form electrical connections between the semiconductor device and the test socket.
The above-mentioned structure of forming electrical connection through an intermediate medium has a problem that, due to the introduction of the intermediate layer in the test fixture, the test of the electronic component is equivalent to connecting a complicated parasitic parameter composed of resistance-capacitance inductors in series and parallel at each terminal or pin. The effect of these parasitic parameters on the performance of the circuit is not significant at low frequency operation, and as the operating frequency increases, their parasitic effects become increasingly non-negligible. There are many "de-embedding" methods to eliminate the influence of the dielectric layer, but the test accuracy of the final surface-mounted device is always influenced. In addition, the dielectric layer has a fine and complex structure and is very expensive, especially for high-frequency circuits and surface-mounted components with large sizes. The dielectric layer is an easily-consumed material in the testing device, and needs to be replaced after being used for a certain number of times, so that the testing cost is high.
Therefore, a new technical solution is needed to solve the above technical problems.
Disclosure of Invention
The invention provides a testing device, a testing assembly and a testing method for surface-mounted components, and aims to save an intermediate layer structure of a traditional testing device, so as to improve the testing precision and the test result intuition and reduce the testing cost.
In order to achieve the above purpose, the testing device of the present invention can adopt the following technical scheme:
a testing device for surface-mounted components comprises a base, a PCB (printed circuit board) testing board covered on the base, and a pressing piece covered on the PCB testing board; the PCB testing board is provided with a slot which runs through the PCB testing board and is positioned above the accommodating cavity, and the PCB testing board is provided with an electric connecting wire at the side edge position of the slot.
Has the advantages that: compared with the prior art, the testing device does not need to be provided with an interposer structure, the PCB testing board is directly placed above the PCB testing board, and the surface-mounted component can be placed in the accommodating cavity below the PCB testing board in a manner of enabling the surface-mounted component to be provided with the pins to be electrically connected with the electric connecting wires of the PCB testing board without the interposer, so that the testing precision and the test result are improved, and the testing cost is reduced.
Furthermore, a plurality of spring contact balls are arranged on the bottom surface of the accommodating cavity, and the height of each spring contact ball is the same. The spring collision bead can be used as an auxiliary elastic positioning device to enable the surface-mounted component to be elastically positioned in the accommodating cavity when being pressed by the pressing piece.
Furthermore, a depth adjusting block which moves up and down along the accommodating cavity is also arranged in the accommodating cavity, and the spring collision beads are arranged on the upper surface of the depth adjusting block; the containing cavity is also internally provided with a stop screw which is inserted from the side surface of the containing cavity and is contacted with the depth adjusting block.
Further, the depth adjusting block is a depth adjusting nut; the cross section of the accommodating cavity is circular, and an internal thread is arranged on the inner surface of the accommodating cavity; the cross-sectional area of the accommodating cavity is larger than that of the slot.
Furthermore, two ends of the pressing piece are detachably fixed on the base and pressed on the PCB test board, and the pressing piece is conductive and is electrically connected with a grounding point on the PCB test board. The pressing piece can play a role of a grounding medium.
Furthermore, the electric connecting lead arranged on the PCB test board is a microstrip line.
Or further, the PCB test board further comprises a PCB radio frequency probe, the electric connection lead arranged on the PCB test board is a coplanar waveguide line, and the PCB radio frequency probe is electrically connected with the coplanar waveguide line.
The test assembly of the invention can adopt the following technical scheme:
a test assembly of surface-mounted components comprises a test device and tested surface-mounted components, wherein the test device comprises a base, a PCB test board covered on the base and a pressing piece; the PCB test board is provided with a slot which penetrates through the PCB test board and is positioned above the accommodating cavity, and the PCB test board is provided with an electric connecting wire at the side edge of the slot; the surface-mounted component comprises a main body and a pin extending from the side surface of the main body; the main body is inserted into the accommodating cavity from the open slot, and the pins extend out from the edge of the open slot and are electrically connected with the electric connecting wires; the pressing piece covers the main body and the PCB test board, and two ends of the pressing piece are detachably fixed with the base.
Has the advantages that: compared with the prior art, the test assembly does not need to be provided with an interposer structure, the PCB test board is directly placed above the interposer structure, the surface-mounted component main body is placed in the accommodating cavity in a mode that the pins extend out from the edge of the groove and are electrically connected with the electric connecting wires, so that the surface of the surface-mounted component with the pins can be electrically connected with the electric connecting wires of the PCB test board without the interposer, the test precision and the test result are improved, and the test cost is reduced.
Furthermore, the cross section size of the accommodating cavity is larger than or equal to the cross section size of the main body, and the cross section size of the groove is consistent with the cross section size of the main body.
Furthermore, a depth adjusting block which moves up and down along the accommodating cavity is also arranged in the accommodating cavity, and a spring collision bead is arranged on the upper surface of the depth adjusting block; the containing cavity is also internally provided with a stop screw which is inserted from the side surface of the containing cavity and is contacted with the depth adjusting block.
Furthermore, the cross section of the accommodating cavity is circular, an internal thread is arranged on the inner surface of the accommodating cavity, and a depth adjusting nut meshed with the internal thread is also arranged in the accommodating cavity; the upper surface of the depth adjusting nut is provided with a plurality of spring contact balls, and the height of each spring contact ball is the same.
Furthermore, when the main body is positioned in the accommodating cavity, the upper surface of the main body is flush with the upper surface of the PCB test board, and the pins extend out of the grooves and are pressed on the electric connecting leads to form electric connection; the electrical connection of the pins to the electrical connection leads is achieved by a gold wire bonding process or metal band pressing.
The invention also provides a test method adopting the test assembly, which can adopt the following technical scheme:
the main body penetrates through the slot to be inserted into the accommodating cavity, and the main body and the PCB test board are covered by the pressing piece to be fixed, at the moment, the upper surface of the main body is a grounding surface, the pressing piece is conductive, the pressing piece is in contact with the upper surface of the main body, and at least one end of the pressing piece is electrically connected with a grounding point on the PCB test board to enable the main body to be grounded; the pin extends out of the open slot and is pressed on the electric connecting lead to form electric connection, the electric connecting lead arranged on the PCB test board is a microstrip line, and the test reference surface is calibrated to the microstrip line and the pin of the tested piece by matching with a TRL calibration method of the microstrip line of the PCB; the surface mount component is tested after the above setting is completed.
Has the advantages that: the testing method enables the surface-mounted component to form grounding connection in the testing device, and after the pin is electrically connected with the PCB testing board, the testing reference surface is calibrated to the position of the microstrip line and the pin of the tested component by matching with the TRL calibration method of the microstrip line of the PCB board, and the testing electrical connection requirement can be met without an intermediate layer.
Drawings
FIG. 1 is a perspective assembly view of a test assembly of the present invention.
Figure 2 is an exploded perspective view of the test assembly of the present invention.
FIG. 3 is a cross-sectional view of example 2 of the test apparatus of the present invention.
FIG. 4 is a cross-sectional view of example 3 of the test apparatus of the present invention.
Detailed Description
Example 1
Referring to fig. 1 and 2, the present invention discloses a testing assembly for a surface mounted device, which includes a testing apparatus and a surface mounted device to be tested.
The testing device comprises a base 1, a PCB testing board 2 covering the base 1 and a pressing piece 3. The upper surface of the base 1 is provided with an inward sunken accommodating cavity 11, the PCB test board 2 is provided with a slot 21 which penetrates through the PCB test board and is positioned above the accommodating cavity, and the PCB test board 2 is provided with an electric connecting wire 22 at the side edge position of the slot 21.
The surface mount component comprises a main body 4 and pins 5 extending from the side surface of the main body 4. The main body 4 is inserted into the containing cavity 11 from the slot 21, and the pins 5 extend out from the edge of the slot and form electrical connection with the electrical connection wires 22; the pressing piece 3 covers the main body 4 and the PCB test board 2, and two ends of the pressing piece 3 are detachably fixed with the base 1. When the existing surface-mounted component is used in a specific electronic product, the surface-mounted component is generally mounted on the upper surface of the PCB in a mode of mounting on the PCB, the side edge of a main body with pins is the lower side edge of the main body, and the pins extend outwards from the lower side edge and are directly electrically connected with the PCB; therefore, in the present embodiment, the connection with the PCB test board 2 is actually performed not in this manner, but in such a manner that the side edge of the pin 5 is positioned above, and the side edge without the pin is downwardly fitted into the accommodation cavity 11. The cross section of the slot 21 is the same as the cross section of the main body 4, and the main body 4 is positioned in the containing cavity 11. This is because the pins are welded with the PCB board when the surface mounted device is used specifically, and the pins cannot be welded when the surface mounted device is tested, so the interposer is used in the prior art, and in order to omit the middle level in this embodiment, the pins 5 can directly extend to the electrical connection position of the PCB test board 2 by the way in this embodiment, the upper surface of the main body 4 is flush with the upper surface of the PCB test board 2, and the pins 5 extend from the slots 21 and are pressed on the electrical connection wires to form electrical connection; the electrical connection between the pin 5 and the electrical connection wire 22 is realized by gold wire bonding process or metal belt pressing (the electrical connection wire of the PCB test board is a microstrip line). The gold wire bonding process or metal tape bonding can make the pins 5 detachable from the PCB test board 2 without leaving any residual traces such as soldering on the pins, meeting the test requirements. When the pressing piece 3 is pressed from top to bottom, the main body 4 and the PCB test board 2 are pressed simultaneously, so that the upper surface of the main body 4 is flush with the upper surface of the PCB test board 2. And a plurality of spring contact balls 12 are installed on the bottom surface of the accommodating cavity 11, and the height of each spring contact ball 12 is the same. The spring ball 12 can be used as an auxiliary elastic positioning device to elastically position the surface-mounted component in the accommodating cavity when the surface-mounted component is pressed by the pressing piece. At the moment, the test reference surface is calibrated to the microstrip line and the pin of the tested piece by matching with a TRL calibration method of the microstrip line of the PCB; after the above setting is completed, the surface-mounted component can be tested.
Example 2
Referring to fig. 3, the testing apparatus provided in this embodiment is substantially the same as the testing apparatus provided in embodiment 1, except that in this embodiment, a depth adjusting block 13 moving up and down along the accommodating cavity 11 is further disposed in the accommodating cavity 11, and the depth adjusting block 13 may be square, circular, or other shapes. A stop screw 14 which is inserted from the side surface of the accommodating cavity and is contacted with the depth adjusting block 13 is also arranged in the accommodating cavity. When the depth adjusting block 13 moves to a predetermined position in the housing cavity 11, the depth adjusting block 13 is fixed at the position by the setscrew 14. The upper surface of the depth adjusting block 13 is provided with a plurality of spring contact balls 12, and the height of each spring contact ball 12 is the same. The degree of depth of acceping chamber 11 can be adjusted to this kind of design to be suitable for not unidimensional table and paste the components and parts, make this testing arrangement have the commonality.
Example 3
Referring to fig. 4, the testing apparatus provided in this embodiment is substantially the same as the testing apparatus provided in embodiment 2, except that in this embodiment, the cross section of the receiving cavity 11 is circular, the inner surface of the receiving cavity 11 is provided with an internal thread, and the depth adjusting block 13 is provided as a depth adjusting nut engaged with the internal thread, and the adjustment of the depth of the receiving cavity 11 can be more accurate by turning the nut.
Example 4
The testing apparatus provided in this embodiment is substantially the same as the testing apparatus provided in embodiment 1, except that in this embodiment, a PCB rf probe is further included. The electric connecting lead arranged on the PCB test board is a coplanar waveguide line (instead of the microstrip line in embodiment 1). The PCB radio frequency probe is electrically connected with the coplanar waveguide wire, and the pin of the surface-mounted component is connected with the PCB radio frequency probe through the coplanar waveguide wire, so that the direct test of the pin of the component by fixing the PCB radio frequency probe by using a handheld or jig is realized.
The methods and ways to implement the technical solution of the present invention are numerous and the above description is only the preferred embodiment of the present invention. It should be noted that modifications and adaptations can be made by those skilled in the art without departing from the principle of the present invention, and should be considered as within the scope of the present invention. All the components not specified in the present embodiment can be realized by the prior art.
Claims (12)
1. The utility model provides a test device of components and parts is pasted to table which characterized in that: comprises a base, a PCB test board covered on the base, and a pressing piece covered on the PCB test board;
the PCB test board is provided with a slot which penetrates through the PCB test board and is positioned above the accommodating cavity, and the PCB test board is provided with an electric connecting wire at the side edge of the slot;
the two ends of the pressing piece are detachably fixed on the base and pressed on the PCB test board, and the pressing piece is conductive and is electrically connected with a grounding point on the PCB test board.
2. The test device of claim 1, wherein: a plurality of spring contact balls are installed on the bottom surface of the accommodating cavity, and the height of each spring contact ball is the same.
3. The test device of claim 2, wherein: a depth adjusting block which moves up and down along the accommodating cavity is further arranged in the accommodating cavity, and the spring collision beads are arranged on the upper surface of the depth adjusting block; the containing cavity is also internally provided with a stop screw which is inserted from the side surface of the containing cavity and is contacted with the depth adjusting block.
4. The test device of claim 3, wherein: the depth adjusting block is a depth adjusting nut; the cross section of the accommodating cavity is circular, an internal thread is arranged on the inner surface of the accommodating cavity, and the cross section area of the accommodating cavity is larger than that of the slot.
5. The test device of claim 1, wherein: the PCB test board is provided with an electric connecting lead which is a microstrip line.
6. The test device of claim 1, wherein: still include PCB radio frequency probe, the electric connection wire that sets up on the PCB survey test panel is coplanar wave line, and PCB radio frequency probe is connected with coplanar wave line electricity.
7. The utility model provides a test assembly of surface mounted components and parts, includes testing arrangement and the surface mounted components and parts of being tested, its characterized in that: the testing device comprises a base, a PCB testing board covered on the base and a pressing piece; the PCB test board is provided with a slot which penetrates through the PCB test board and is positioned above the accommodating cavity, and the PCB test board is provided with an electric connecting wire at the side edge of the slot;
the surface-mounted component comprises a main body and a pin extending from the side surface of the main body; the main body is inserted into the accommodating cavity from the open slot, and the pins extend out from the edge of the open slot and are electrically connected with the electric connecting wires; the pressing piece covers on the main body and the PCB test board, and two ends of the pressing piece are detachably fixed with the base.
8. The test assembly of claim 7, wherein: the cross-sectional dimension of the accommodating cavity is larger than or equal to that of the main body, and the cross-sectional dimension of the notch is consistent with that of the main body.
9. The test device of claim 8, wherein: a depth adjusting block which moves up and down along the accommodating cavity is also arranged in the accommodating cavity, and a spring collision bead is arranged on the upper surface of the depth adjusting block; the containing cavity is also internally provided with a stop screw which is inserted from the side surface of the containing cavity and is contacted with the depth adjusting block.
10. The test assembly of claim 8, wherein: the cross section of the accommodating cavity is circular, an internal thread is arranged on the inner surface of the accommodating cavity, and a depth adjusting nut meshed with the internal thread is further arranged in the accommodating cavity; the upper surface of the depth adjusting nut is provided with a plurality of spring contact balls, and the height of each spring contact ball is the same.
11. The test assembly of claim 7, wherein: when the main body is positioned in the accommodating cavity, the upper surface of the main body is flush with the upper surface of the PCB test board, and the pins extend out of the grooves and are pressed on the electric connecting wires to form electric connection; the electrical connection of the pins to the electrical connection leads is achieved by a gold wire bonding process or metal band pressing.
12. A test method of a test assembly using a surface mount device according to any one of claims 7 to 11, characterized in that: the main body penetrates through the slot to be inserted into the accommodating cavity, and the main body and the PCB test board are covered by the pressing piece to fix the main body, at the moment, the upper surface of the main body is a ground surface, the pressing piece is conductive, the pressing piece is contacted with the upper surface of the main body, and at least one end of the pressing piece is electrically connected with a ground point on the PCB test board to enable the main body to be grounded;
the pin extends out of the open slot and is pressed on the electric connecting lead to form electric connection, the electric connecting lead arranged on the PCB test board is a microstrip line, and the test reference surface is calibrated to the microstrip line and the pin of the tested piece by matching with a TRL calibration method of the microstrip line of the PCB;
the surface-mounted component is tested after the setting is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211206024.3A CN115267275B (en) | 2022-09-30 | 2022-09-30 | Test device, test assembly and test method for surface-mounted components |
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| CN202211206024.3A CN115267275B (en) | 2022-09-30 | 2022-09-30 | Test device, test assembly and test method for surface-mounted components |
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| CN115267275A true CN115267275A (en) | 2022-11-01 |
| CN115267275B CN115267275B (en) | 2023-08-01 |
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