KR100389227B1 - An inspection equipment for a flat-mount-type semiconductor device and method of inspecting the semiconductor device - Google Patents

Abstract

The present invention makes it possible to ignore the inductance of the contactor portion of the tester, and enables high accuracy measurement. This invention removes the contactor socket conventionally used, and directly contacts the external lead 10 of the planar-mounted semiconductor device 6 to a 2nd wiring board.

Description

Inspection device for flat-mount semiconductor device and its inspection method {AN INSPECTION EQUIPMENT FOR A FLAT-MOUNT-TYPE SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING THE SEMICONDUCTOR DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an inspection apparatus for a flat surface mount type semiconductor device having a contactor capable of ensuring a contact without using a contactor and a socket, or capable of coping with other semiconductor devices.

Fig. 18 shows the device portion around the contactor of the inspection apparatus for the conventional flat mount type semiconductor device. In FIG. 18, 1 is a test board, 2 is a coaxial cable or POGO pin, and 3 is a printed circuit board with a contactor socket, which will be described later, referred to as an I / F (interface) substrate. 4 is a contactor socket, 5 is a contactor, 6 is a semiconductor device to be inspected, and 7 is a measuring device. In addition, 8 is a support | pillar, and is fixed by falling between the test board 1 and the I / F board | substrate 3.

In the conventional inspection device for flat-mount semiconductor devices as described above, since the miniaturization, high integration, and high speed of the semiconductor device 6 are progressing dramatically, the inductance of the contact portion of the contactor socket 4 deteriorates the measurement accuracy. There was a problem that the degree could not be ignored. In addition, since the contactor socket 4 is inherent in the size and pin arrangement of the semiconductor device 6, the contactor socket 4 is separated from the test board 1 according to the semiconductor device 6 to be measured. It was necessary to exchange all up to) and there was a problem of being expensive.

SUMMARY OF THE INVENTION The present invention has been given to solve these problems, and one object of the present invention is to reduce the inductance of the contact portion of the contactor socket and to easily cope with inspection of semiconductor devices of various sizes and pin arrangements. Another object of the present invention is to provide a method for inspecting such a planar-mounted semiconductor device.

1 is a cross-sectional view showing an inspection apparatus for a flat surface mount type semiconductor device according to Embodiment 1 of the present invention;

2 is a sectional view showing the principal parts of the inspection apparatus for the flat-mount semiconductor device according to the first embodiment of the present invention;

3 is a sectional view showing the principal parts of a test apparatus for a flat-mount semiconductor device according to Embodiment 1 of the present invention;

4 is a plan view of an I / F substrate according to Embodiment 1 of the present invention;

5 is a cross-sectional view showing an inspection apparatus for a flat surface mount semiconductor device according to a second embodiment of the present invention;

6 is a sectional view showing the principal parts of the inspection apparatus for the flat-mount semiconductor device according to the third embodiment of the present invention;

FIG. 7 is a sectional view showing the principal parts of a test apparatus for a flat-mount semiconductor device according to Embodiment 4 of the present invention; FIG.

Fig. 8 is a sectional view showing the principal parts of the inspection apparatus for the flat-mount semiconductor device according to the fifth embodiment of the present invention;

Fig. 9 is a sectional view showing the principal parts of the inspection apparatus for a planar-mounted semiconductor device according to the sixth embodiment of the present invention;

10 is a sectional view showing the principal parts of the inspection apparatus for the flat-mount semiconductor device according to the seventh embodiment of the present invention;

Fig. 11 is a sectional view showing the principal parts of a testing apparatus for a planar semiconductor device according to Embodiment 8 of the present invention;

12 is a sectional view showing the principal parts of the inspection apparatus for the flat-mount semiconductor device according to the ninth embodiment of the present invention;

Fig. 13 is a sectional view showing the principal parts of the inspection apparatus for a flat-mount semiconductor device according to the tenth embodiment of the present invention;

Fig. 14 is a sectional view showing the principal parts of the inspection apparatus for a flat-mount semiconductor device according to the eleventh embodiment of the present invention;

Fig. 15 is a sectional view showing the principal parts of a test apparatus for a flat mount semiconductor device according to a twelfth embodiment of the present invention;

Fig. 16 is a sectional view showing the principal parts of the inspection apparatus for the flat-mount semiconductor device according to the thirteenth embodiment of the present invention;

17 is a sectional view showing the principal parts of the inspection apparatus for the flat-mount semiconductor device according to Embodiment 14 of the present invention;

18 is a cross-sectional view showing a conventional inspection device for a flat surface mount semiconductor device.

* Description of the symbols for the main parts of the drawings *

1: first wiring board 2: 2nd wiring board

3: Planar Mounting Semiconductor Device 7: Measuring Device

10: external lead 11: trench structure

12: leaf spring 23: trench structure

25 opening structure 30 third wiring board

36: elastic body

An inspection apparatus for a flat surface mount type semiconductor device according to a first aspect of the present invention includes a measuring device, a first wiring board electrically connected to the measuring device, and a second wiring board electrically connected to the first wiring board. In the inspection device for a planar-mounted semiconductor device including, the planar-mounted semiconductor device is in direct electrical contact with the second wiring board.

In addition, in the inspection device for a flat surface mount type semiconductor device according to the second aspect of the present invention, the semiconductor device main body corresponding portion of the second wiring board has an opening or trench structure.

In addition, in the inspection device for a flat surface mount type semiconductor device according to the third aspect of the present invention, the semiconductor device outer lead corresponding portion of the second wiring board has a trench structure.

In addition, in the inspection device for a flat surface mount type semiconductor device according to the fourth aspect of the present invention, a leaf spring is provided on a semiconductor device external lead corresponding portion of a second wiring board.

In addition, in the inspection apparatus for a flat surface mount type semiconductor device according to the fifth aspect of the present invention, an elastic body is provided below the electrical contact portion between the flat surface mount type semiconductor device and the second wiring board.

In addition, in the inspection apparatus for a planar-mounted semiconductor device according to the sixth aspect of the present invention, the elastic body can be attached to and detached from the side opposite to the planar-mounted semiconductor device with respect to the second wiring board.

In addition, the semiconductor device according to the seventh aspect of the present invention is inspected using the inspection apparatus for the planar-mounted semiconductor device according to any one of the above aspects.

In addition, the inspection method of the planar-mounted semiconductor device according to the eighth aspect of the present invention is electrically connected to the first and second wiring boards when a plurality of semiconductor devices having different sizes, the number of pins or the pin arrangement are inspected. Inspection for the planar-mounted semiconductor device according to any one of the first to sixth aspects, wherein the third wiring board is placed between the first and second wiring boards and is made exclusively for each semiconductor device. The semiconductor device is inspected by attaching and detaching a second wiring board for use in the device on the third wiring board so as to be detachable.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 17.

(Example 1)

1 is a cross-sectional view of an inspection apparatus for a plane-mounted semiconductor device according to Embodiment 1 of the present invention. Referring to FIG. 1, 1 is a test board which is a first wiring board, 2 is a coaxial cable or pogo pin, 3 is an I / F board which is a second wiring board, 6 is a planar-mounted semiconductor device as an inspection object, and 7 is It is a measuring device. In addition, 8 is a support | pillar, and is fixed by falling between the test board 1 and the I / F board | substrate 3. 11 denotes a trench, 10 denotes an external lead of the semiconductor device 6, and the external lead 10 contacts the spring-type contactor 12 to inspect the semiconductor device 6.

In the first embodiment, the contactor socket shown in the prior art is removed, and the external lead 10 of the semiconductor device is directly contacted with the I / F substrate 3. By doing in this way, the inductance of a contactor part can be disregarded and a high precision measurement is attained. In FIG. 2, the contactor part 11 of the trench structure of the I / F board | substrate 3 is expanded and shown. Thus, by making the contactor part of an I / F board | substrate into a trench structure, the positioning accuracy of the semiconductor device 6 is improved, and also the contactor part is plate-spring type as shown in FIG. Non-contact with the spring-type contactor part 12 by the height gap of the outer lead 10 can be prevented. Here, although the top view of the I / F board | substrate 3 provided with the trench 11 was shown in FIG. 4, in this FIG. 4, 15 is a wiring hole.

(Example 2)

Fig. 5 is a cross-sectional view of the inspection device for a planar-mounted semiconductor device according to the second embodiment of the present invention. In Fig. 5, 20 is a positioning mechanism of the semiconductor device, and the other reference numerals are the same as those in the first embodiment, or indicate a substantial part. In the second embodiment, positioning pins are provided in the positioning mechanism 20 itself of the semiconductor device to improve the positioning accuracy.

(Example 3)

6 is a sectional view of principal parts of the inspection apparatus for a planar-mounted semiconductor device according to the third embodiment of the present invention. As shown in FIG. 6, the same size as in the above embodiment can be obtained by drilling a package size in the I / F substrate 3 and positioning it with the main body of the semiconductor device 6.

(Example 4)

7 is a sectional view of principal parts of the inspection apparatus for a flat-mount semiconductor device according to the fourth embodiment of the present invention. As shown in FIG. 7, even if the external lead 10 of the semiconductor device 6 is located above the lower surface of the main body of the semiconductor device 6, the lower surface of the semiconductor device on the surface of the I / F substrate 3 is located on the corresponding portion. By forming the trench 23, it is possible to contact the external lead 10 and the spring contactor 12.

(Example 5)

8 is a sectional view of principal parts of the inspection apparatus for a planar-mounted semiconductor device according to the fifth embodiment of the present invention. As shown in FIG. 8, even if the external lead 10 of the semiconductor device 6 is located above the lower surface of the main body of the semiconductor device 6, the corresponding portion of the lower surface of the semiconductor device on the surface of the I / F substrate 3. By forming the hole 25 in the hole, the external lead 10 and the spring contactor 12 can be contacted.

(Example 6)

Fig. 9 is a sectional view of an inspection apparatus for a planar semiconductor device according to Embodiment 6 of the present invention. As shown in FIG. 9, when the size, the number of pins, and the pin arrangement of the semiconductor device 6 are different, the third wiring board 30 is provided between the I / F board 3 and the test board 1. On the third wiring board 30, the I / F board 3 for each of the various semiconductor devices is detachably attached. As this I / F board | substrate 3, any of the said Examples 1-5 is used. When the conventional I / F substrate is used as the third wiring substrate 30, the inspection apparatus for the planar-mounted semiconductor device of the sixth embodiment can be realized at low cost.

(Example 7)

10 is a sectional view of principal parts of the inspection apparatus for a flat-mount semiconductor device according to the seventh embodiment of the present invention. The seventh embodiment shows a case where an elastic material is inserted into the back surface of the pad. In FIG. 10, 6 is a semiconductor device, 35 is a plate-shaped pin or conductive pad, 36 is an elastic body such as silicone rubber. 37 indicates a through-hole for contacting an impedance-regulated wiring pattern, a power supply / GND layer, etc. in a multilayer substrate, 38 a wiring pattern, and 39 an electric path.

In the seventh embodiment, the structure in which the I / F substrate 3 and the semiconductor device 6 are connected by a short electric path, and the elastic structure is separately provided under the contactor according to the necessity of elasticity or stroke amount. The structure of the case is shown. In other words, by providing an elastic structure under the contact without requiring a spring function on the contact pin (plate), the desired amount of elasticity or stroke can be achieved while connecting the semiconductor device 6 and the I / F substrate 3 to the shortest. Can be obtained. By doing so, the electric path is shortened, and parasitic components such as inductance can be reduced.

(Example 8)

11 is a sectional view of principal parts of the inspection apparatus for a planar-mounted semiconductor device according to the eighth embodiment of the present invention. In the eighth embodiment, the contact portion has a trench structure in the seventh embodiment, and the explanation, the effect, and the like of the sign are the same as in the seventh embodiment, and thus the description is omitted here.

(Example 9)

12 is a sectional view of principal parts of the inspection apparatus for a planar-mounted semiconductor device according to the ninth embodiment of the present invention. In the ninth embodiment, the substrate is inserted, and only the contact portion is detachable (characterized in that the detachable socket structure including the conventional spring portion is provided on the back side of the substrate), and 40 is a screw. Explanations and effects of other symbols are the same as those of the seventh embodiment, and are omitted here. However, in the ninth embodiment, there is a characteristic effect that replacement of consumable parts becomes easy.

(Example 10)

Fig. 13 is a perspective view of an inspection apparatus for a planar semiconductor device according to a tenth embodiment of the present invention. In the tenth embodiment, the silicone rubber 45 has elasticity for each pin in order to cope with the height difference for each external lead 10, so that non-contact due to the height difference of the external lead 10 can be prevented. .

(Example 11)

14 is a sectional view of principal parts of the inspection apparatus for a planar-mounted semiconductor device according to the eleventh embodiment of the present invention. In this eleventh embodiment, the spring-like elasticity is included under the contactor pin 35, the inductance of the contactor portion can be reduced, and the contact can be prevented due to the height difference of the external lead, Spring property can be secured while making it the shortest.

(Example 12)

15 is a sectional view of principal parts of the inspection apparatus for a planar-mounted semiconductor device according to the twelfth embodiment of the present invention. In Example 12, the spring was inserted below the substrate to be detachable, thereby reducing the inductance of the contactor portion, preventing non-contact due to the height difference of the leads, and replacing consumable parts such as springs. Can be facilitated.

(Example 13)

Fig. 16 is a sectional view of principal parts of the inspection apparatus for planar-mounted semiconductor device according to the thirteenth embodiment of the present invention. In the thirteenth embodiment, the spring is immersed down to the bottom of the substrate, and the insulator 50 is inserted and detached between the plate-shaped pin 35 and the spring, so that the inductance of the contactor portion can be reduced, and the height difference between the leads It is possible to prevent non-contact due to this, and to facilitate replacement of consumable parts such as springs.

(Example 14)

17 is a sectional view of principal parts of the inspection apparatus for a planar-mounted semiconductor device according to Embodiment 14 of the present invention. In Example 14, a spring structure is formed on a lower surface of a contact path with a substrate by applying to a package featuring solder balls such as ball grid array (BGA) and chip size package (CSP). In this way, the inductance of the contactor portion can be reduced, the non-contact due to the height difference of the lead can be prevented, the spring property can be ensured while the contact is made shortest, and the replacement of consumable parts such as the spring can be facilitated.

Since this invention is comprised as mentioned above, it has an effect as shown below.

According to the first aspect, the inductance of the contactor portion can be reduced because the planar-mounted semiconductor device is in direct electrical contact with the second wiring board.

Further, according to the second aspect, since the semiconductor device main body corresponding portion of the second wiring board has an opening or trench structure, it is possible to contact the contactor even when the external lead of the semiconductor device is above the lower surface.

In addition, according to the third aspect, since the external lead corresponding portion of the semiconductor device of the second wiring board has a trench structure, the positioning accuracy of the semiconductor device can be improved.

Further, according to the fourth aspect, since the leaf spring is provided in the external lead corresponding portion of the semiconductor device of the second wiring board, non-contact with the contactor portion due to the height difference of the external lead of the semiconductor device can be prevented.

According to the fifth aspect, since an elastic body is provided below the electrical contact portion of the planar-mounted semiconductor device and the second wiring board, parasitic components such as inductance can be reduced while obtaining the desired elasticity or the amount of stroke.

According to the sixth aspect, since the elastic body is detachably attached to the second wiring board from the side opposite to the planar-mounted semiconductor device, the inductance of the contactor portion can be reduced, and non-contact due to the height difference of the external lead is prevented. At the same time, the replacement of consumables can be facilitated.

In addition, according to the seventh aspect, the inspection is carried out using any one of the above-described aspects, and therefore, the present invention has an effect.

According to the eighth aspect, when inspecting a plurality of semiconductor devices having different shapes, the second wiring board made for each semiconductor device is replaced and inspected, so that inspection can be made inexpensively.

Claims (3)

In the inspection device for a flat-mount semiconductor device comprising a measuring device, a first wiring board electrically connected to the measuring device, and a second wiring board electrically connected to the first wiring board. An opening or a trench is formed in the corresponding portion of the semiconductor device main body of the second wiring board, and a contactor having elasticity is provided in the opening or the trench, and the contactor is electrically contacted with an external lead of the semiconductor device. Inspection device for semiconductor device. delete In the case of inspecting a plurality of semiconductor devices having different sizes, pin numbers, or pin arrangements, a third wiring board electrically connected to the first and second wiring boards is placed between the first and second wiring boards. A second wiring board for use in the inspection apparatus for the flat-mount semiconductor device according to claim 1, made exclusively for each semiconductor device, is placed on the third wiring board, and placed in a contactor provided in the opening or trench of the second wiring board. And inspecting the semiconductor device by electrically contacting external leads of the semiconductor device.