CN213041934U

CN213041934U - Device and system for electrical test of surface mount component

Info

Publication number: CN213041934U
Application number: CN202021671665.2U
Authority: CN
Inventors: 彭龙辉; 祝小清; 曾艳军; 田志飞
Original assignee: Shenzhen Sunlord Electronics Co Ltd
Current assignee: Shenzhen Sunlord Electronics Co Ltd
Priority date: 2020-08-12
Filing date: 2020-08-12
Publication date: 2021-04-23
Anticipated expiration: 2030-08-12

Abstract

The utility model provides a device and system for SMD components and parts electrical property test, the device includes the base, compresses tightly subassembly, probe group and PCB board, PCB board detachably sets up on the top surface of base, the welding has a plurality of SMD components and parts that await measuring on the PCB board, it sets up to compress tightly the subassembly on the top surface of base, the probe group sets up compress tightly on the subassembly, compress tightly the subassembly with the PCB board sets up relatively, the probe group with the PCB board can be close to each other so that the probe group with the SMD components and parts contact connection that await measuring or the probe group with the PCB board can keep away from each other the messenger the probe group contactless the SMD components and parts that await measuring. The utility model discloses can improve test speed, improve work efficiency, reduce manual operation.

Description

Device and system for electrical test of surface mount component

Technical Field

The utility model relates to a test of SMD components and parts especially relates to a device and system for SMD components and parts electrical test.

Background

When testing the performance of a surface-mounted component such as a surface-mounted piezoresistor, the prior art generally performs electrical test on a single product, welds the product on a PCB to perform temperature load aging test after the test is completed, then performs desoldering on the product or cuts off the PCB, performs electrical test on the single product alone to determine whether the performance of the piezoresistor is qualified, the test of each product needs to be performed by testing, welding, desoldering and testing, and the PCB needs to be manually disassembled and welded or cut off after the temperature load is completed, so that the reciprocating is inconvenient, the speed is slow, and the high-temperature desoldering has influence on the electrical test of the product.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: make up the not enough of above-mentioned prior art, provide a device and system for SMD components and parts electrical test.

The technical problem of the utility model is solved through following technical scheme:

the utility model provides a device for SMD components and parts electrical property test, includes the base, compresses tightly subassembly, probe group and PCB board, PCB board detachably sets up on the top surface of base, the welding has a plurality of SMD components and parts that await measuring on the PCB board, it sets up to compress tightly the subassembly on the top surface of base, the probe group sets up compress tightly on the subassembly, compress tightly the subassembly with the PCB board sets up relatively, the probe group with the PCB board can be close to each other so that the probe group with the SMD components and parts contact connection that await measuring or the probe group with the PCB board can keep away from the messenger each other the probe group contactless SMD components and parts that await measuring.

Preferably, the pressing assembly comprises a quick clamp, a sliding block and a guide part, the bottom of the quick clamp is installed on the top surface of the base, the front end of the quick clamp is fixed on the sliding block, the sliding block is connected on the guide part in a sliding mode, and the probe set is connected on the sliding block and faces the PCB.

Preferably, the number of the guide portions is two, the two guide portions are respectively connected to two sides of the sliding block, each guide portion comprises a fixing plate and a guide rod, the fixing plate is fixed to the top surface of the base, the guide rods are fixed to the fixing plate, and the sliding block is sleeved on the guide rods.

Preferably, the front end of the quick clamp is fixed to the top of the middle part on the sliding block.

Preferably, still include the supporting seat, the supporting seat is fixed on the top surface of base, the PCB board with the supporting seat can be dismantled and be connected.

Preferably, the supporting seat is provided with a groove along the length direction of the supporting seat, and the PCB is detachably inserted in the groove.

Preferably, the probe set comprises a common negative probe and a plurality of positive probes corresponding to the number of the to-be-detected surface mount components on the PCB.

Preferably, the base includes a bottom plate and a top plate which are oppositely arranged, and further includes two side plates and two supporting plates, the two side plates are respectively connected to one opposite side between the top surface of the bottom plate and the bottom surface of the top plate, the two supporting plates are respectively connected to the other opposite side between the bottom plate and the top plate, and the top surface of the top plate is used as the top surface of the base.

Preferably, the patch type component is a patch type piezoresistor.

The utility model provides a system for SMD components and parts electrical test, includes device, test wire and tester, probe group on the device passes through the test wire with the tester is connected, in order to right SMD components and parts carry out electrical test.

The utility model discloses beneficial effect with the prior art contrast includes: the utility model discloses a plurality of SMD components and parts that await measuring of welding on the PCB board, through the probe group that sets up the SMD components and parts correspondence that await measuring, the probe group can be close to with the SMD components and parts contact connection that await measuring with the PCB board under the action that compresses tightly the subassembly for the electrical property detects, detects the back, and the probe group can be kept away from with the PCB board under the action that compresses tightly the subassembly. Through the utility model discloses a PCB board on can welding a plurality of products, then scan electrical test in batches, carry out temperature load aging testing back, scan electrical test in batches again to accomplish the electrical test to the product. Simultaneously, through the detachable PCB board, can realize the batch test of different specification products, the utility model has the advantages of simple structure, the cost is low, can greatly improve the trouble degree of welding test mode, reduces artifical frequent welding/unwelding and the intensity of labour who dismantles, improves work efficiency.

Drawings

Fig. 1 is a schematic diagram of an apparatus for electrical testing of a chip component according to a preferred embodiment of the present invention;

fig. 2 is a schematic diagram of an apparatus for electrical testing of a chip component according to a preferred embodiment of the present invention (after removing the PCB);

fig. 3 is a schematic diagram illustrating connection between a probe set and a to-be-tested surface mount device according to a preferred embodiment of the present invention.

Detailed Description

The invention will be further described with reference to the accompanying drawings and preferred embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

It should be noted that the terms of orientation such as left, right, up, down, top and bottom in the present embodiment are only relative concepts to each other or are referred to the normal use state of the product, and should not be considered as limiting.

A specific embodiment of the utility model provides a device for SMD components and parts electrical property test, include the base, compress tightly subassembly, probe group and PCB board, PCB board detachably sets up on the top surface of base, the welding has a plurality of SMD components and parts that await measuring on the PCB board, it sets up to compress tightly the subassembly on the top surface of base, the probe group sets up compress tightly on the subassembly, compress tightly the subassembly with the PCB board sets up relatively, the probe group with the PCB board can be close to each other so that the probe group with the SMD components and parts contact connection that await measuring or the probe group with the PCB board can keep away from each other the messenger of probe group contactless the SMD components and parts that await measuring.

In some preferred embodiments, the pressing assembly includes a quick clamp, a slider and a guide portion, the bottom of the quick clamp is mounted on the top surface of the base, the front end of the quick clamp is fixed on the slider, the slider is slidably connected on the guide portion, and the probe set is connected on the slider to face the PCB.

In some preferred embodiments, two guide portions are respectively connected to two sides of the sliding block, each guide portion includes a fixing plate and a guide rod, the fixing plate is fixed on the top surface of the base, the guide rod is fixed on the fixing plate, and the sliding block is sleeved on the guide rod.

In some preferred embodiments, the front end of the quick clamp is fixed to the top of the middle portion on the slide.

In some preferred embodiments, the PCB further comprises a supporting seat, the supporting seat is fixed on the top surface of the base, and the PCB is detachably connected with the supporting seat.

In some preferred embodiments, the support base is provided with a groove along the length direction thereof, and the PCB board is detachably inserted into the groove.

In some preferred embodiments, the probe set includes a common negative probe and a plurality of positive probes corresponding to the number of the surface mount components to be tested on the PCB. The surface mount components to be tested can share the negative probes so as to reduce the number of the probes and optimize the size of the device.

In some preferred embodiments, the base includes a bottom plate and a top plate disposed opposite to each other, and further includes two side plates and two support plates, the two side plates are respectively connected to one opposite side between a top surface of the bottom plate and a bottom surface of the top plate, the two support plates are respectively connected to the other opposite side between the bottom plate and the top plate, and a top surface of the top plate serves as a top surface of the base.

In some preferred embodiments, the surface-mount component is a surface-mount varistor.

The utility model discloses another embodiment provides a system of SMD components and parts electrical test, device, test wire and tester in any embodiment of the aforesaid, probe group on the device passes through the test wire with the tester is connected, and is right SMD components and parts carry out the electrical test.

In a preferred embodiment, as shown in fig. 1 to 3, the device for electrical testing of a chip component includes a base, a pressing assembly, a probe assembly 10, a PCB 11 and a supporting base 7. Wherein, the welding has a plurality of SMD components and parts 12 (product is called down) on the PCB board 11, and the base includes relative bottom plate 2 and roof 1 that sets up, two blocks of curb plates 4 and two backup pads 3, and two blocks of curb plates 4 connect respectively in the opposite side between the top surface of bottom plate 2 and the bottom surface of roof 1, and two backup pads 3 connect respectively in another opposite side between bottom plate 2 and roof 1. The supporting seat 7 is fixed on one side edge of the top surface of the top plate 1, a groove 71 along the length direction of the supporting seat 7 is formed in the supporting seat 7, and the PCB 11 is detachably inserted into the groove 71, so that different PCBs can be replaced conveniently. The subassembly that compresses tightly includes quick-witted clamp 5, slider 9 and guide part, the probe group is connected on slider 9 and is facing the PCB board, the guide part has two, connect the both sides at slider 9 respectively, every guide part includes fixed plate 6 and guide bar 8, fixed plate 6 is fixed on the top surface of roof 1, guide bar 8 is fixed on fixed plate 6, slider 9 cup joints on guide bar 8, install on the top surface of roof 1 the bottom of quick-witted clamp 5, the front end of quick-clamp 5 is fixed on the top at the middle part of slider 9, quick-clamp also is called horizontal quick-operation clamp or hand vice, it is from taking locking mechanism. The probe set 10 includes a common negative probe 101 and a plurality of positive probes 102 corresponding to the number of the surface mount components to be tested on the PCB, that is, the total number of the probes is one more than the number of the surface mount components to be tested.

The probe group 10 and the PCB 11 may be close to each other so that the probe group is in contact connection with the chip component to be tested or the probe group 10 and the PCB 11 may be far from each other so that the probe group does not contact the chip component to be tested, and in particular, in the working process, the movable handle 51 at the rear end of the quick clamp is pulled downwards manually to drive the slide block 9 to move horizontally on the two guide rods synchronously, so that the probe group moves backwards (i.e. away from the PCB), the PCB welded with a product to be tested is placed in a testing position (i.e. the PCB is inserted into the groove 71 on the supporting seat 7), the movable handle 51 returns upwards, the probe set moves forwards (namely moves close to the PCB) under the action of the movable handle, so that the probe set is in contact with the product, the product is ensured to be in reliable contact with each probe, and the product testing line is also connected onto the probe set and is connected to a product electrical property tester through the testing line, so that the product is subjected to electrical property testing.

In the preferred embodiment, the chip component is a chip varistor, the probe group is a set of beryllium copper probes with elasticity, which ensures good contact connection with the electrodes of the product to be tested, the PCB can be designed according to varistors of different specifications, for example, the PCB can meet but is not limited to the multipath electrical test of products with the sizes of the official 0603, 1005, 1608, 2012, 3216, 3225, 4532, 5650, etc., the PCB can be made of FR-4 with the thickness of 1.6 ± 0.1mm and the copper foil with the thickness of 35 ± 10 μm, the surfaces of the pad and the test point are plated with insulating green oil, each PCB can be designed into 20 paths of electrode tips with the thickness of 3mm, and the distance between every two electrode tips is 3mm, so that the batch test of 20 paths of pressure sensitive products can be completed by using one PCB, as shown in fig. 3, the multipath electrical test of the products with the size of the official 4532 is taken as an example, 20 products to be tested are provided, 21 probes are provided, one negative probe 101 is shared, each product to be tested corresponds to one positive probe 102, and batch testing of 20 paths of pressure-sensitive products can be completed simultaneously.

The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the technical field of the utility model belongs to the prerequisite of not deviating from the utility model discloses, can also make a plurality of equal substitution or obvious variants, performance or usage are the same moreover, all should regard as belonging to the utility model's scope of protection.

Claims

1. The utility model provides a device for SMD components and parts electrical test which characterized in that: including the base, compress tightly subassembly, probe group and PCB board, PCB board detachably sets up on the top surface of base, the welding has a plurality of SMD components and parts that await measuring on the PCB board, it sets up to compress tightly the subassembly on the top surface of base, the probe group sets up compress tightly on the subassembly, compress tightly the subassembly with the PCB board sets up relatively, the probe group with the PCB board can be close to each other so that the probe group with the SMD components and parts contact that await measuring is connected or the probe group with the PCB board can keep away from each other and make the probe group contactless the SMD components and parts that await measuring.

2. The apparatus of claim 1, wherein: the pressing assembly comprises a quick clamp, a sliding block and a guide part, the bottom of the quick clamp is installed on the top surface of the base, the front end of the quick clamp is fixed on the sliding block, the sliding block is connected on the guide part in a sliding mode, and the probe set is connected on the sliding block and faces the PCB.

3. The apparatus of claim 2, wherein: the guide portions are two and are respectively connected to two sides of the sliding block, each guide portion comprises a fixing plate and a guide rod, the fixing plates are fixed to the top surface of the base, the guide rods are fixed to the fixing plates, and the sliding blocks are sleeved on the guide rods.

4. The apparatus of claim 3, wherein: the front end of the quick clamp is fixed at the top of the middle part of the sliding block.

5. The apparatus of claim 1, wherein: the PCB is characterized by further comprising a supporting seat, wherein the supporting seat is fixed on the top surface of the base, and the PCB is detachably connected with the supporting seat.

6. The apparatus of claim 5, wherein: the supporting seat is provided with a groove along the length direction of the supporting seat, and the PCB is detachably inserted in the groove.

7. The apparatus of claim 1, wherein: the probe group comprises a common negative probe and a plurality of positive probes corresponding to the number of the to-be-detected surface mount components on the PCB.

8. The apparatus of claim 1, wherein: the base comprises a bottom plate and a top plate which are arranged oppositely, and further comprises two side plates and two supporting plates, the two side plates are connected to one opposite side between the top surface of the bottom plate and the bottom surface of the top plate respectively, the two supporting plates are connected to the other opposite side between the bottom plate and the top plate respectively, and the top surface of the top plate is used as the top surface of the base.

9. The apparatus of claim 1, wherein: the patch type component is a patch type piezoresistor.

10. A system for electrical testing of a surface mount device, comprising the apparatus of any of claims 1-9, a test line and a tester, wherein a probe set on the apparatus is connected to the tester via the test line for electrical testing of the surface mount device.