CN211831630U - Heat dissipation type radio frequency test platform - Google Patents

Abstract

The utility model relates to a heat dissipation formula radio frequency test platform for to the piece that awaits measuring that contains radio frequency microwave signal port tests, including metal base, compress tightly lid and insulating base, the standing groove that awaits measuring has been seted up at insulating base's top, be provided with the heat conduction inserts in the insulating base, the bottom surface of heat conduction inserts and metal base's top surface laminating, be provided with the earthing needle in the heat conduction inserts, the earthing needle runs through the heat conduction inserts, the upper end and the piece contact that awaits measuring of earthing needle, the lower extreme and the metal base contact of earthing needle, still be provided with heat conduction assembly in the heat conduction inserts, heat conduction assembly includes the heat conduction post and makes the heat conduction post have the elastic component towards the standing groove motion trend that awaits measuring all the time, the top of heat conduction post extends to in the standing groove. The utility model provides a radio frequency test platform to the radiating effect of chip in the testing process, has reduced because the high probability that leads to the chip inefficacy of the high temperature of chip.

Description

Heat dissipation type radio frequency test platform

Technical Field

The utility model belongs to the technical field of test platform's technique and specifically relates to a heat dissipation formula radio frequency test platform is related to.

Background

Sip (systeminpackage) system in package, as the name implies, refers to the integration of a system in a package. Generally, the system needs to package a plurality of chips and can independently complete specific tasks, such as SiP system-in-package integrating a plurality of traditional IC chips like CPU, DRAM, Flash, etc., wherein SiP packages including radio frequency integrated circuit units are also included, and the lead-out mode of the pins conventionally adopts a package fan-out mode like BGA, QFN, etc.

In the testing process of an IC, an RFIC, an SIP and related packaging substrates and high-frequency circuit boards which have the requirements of radio frequency microwave transmission or ultra-high speed transmission, the radio frequency microwave transmission frequency can reach 20GHz or even higher, and how to efficiently and conveniently carry out nondestructive testing on a radio frequency microwave channel, a traditional control channel and a traditional power supply channel is a technical problem which needs to be solved urgently at present.

In order to solve the above problems, chinese invention with publication number CN110441640A discloses a testing device for testing a device under test containing a radio frequency signal terminal, comprising a main body, a radio frequency terminal embedded in the main body and made of a conductor, a radio frequency elastic probe arranged in the radio frequency terminal, and an insulating sleeve wrapped outside the radio frequency elastic probe; a plurality of auxiliary elastic probes surrounding the radio frequency elastic probes wrapped with the insulating sleeves are also arranged in the radio frequency terminal; the upper end of the radio frequency terminal is provided with through holes through which the radio frequency elastic probes and the auxiliary elastic probes can respectively penetrate; the upper end of the radio frequency elastic probe can be contacted with a radio frequency signal terminal of a tested device, the lower end of the radio frequency elastic probe is in conductive connection with an inner conductor of a radio frequency cable, and the auxiliary elastic probe is in direct conductive contact with the radio frequency terminal; the lower end of the radio frequency terminal can be connected with a radio frequency cable.

The typical packaging mode of some existing high-power radio frequency devices is QFN and QFN-like packaging, a larger ground plane is often arranged in the middle position, radio frequency ports, other power supplies and control ports are arranged on the periphery, and due to the fact that the bottom surface of a chip is uneven and the heights of pins are different due to the fact that the embedding process tolerance of a medium substrate, a heat sink block and a shell is prone to causing the fact that a heat dissipation surface on a test platform cannot be effectively contacted with the heat sink surface of the chip. This can be 60W or even higher for some high power chips, which is fatal if the design is neglected for heat conduction.

However, the invention does not consider the situation of testing some high-power radio frequency chips, does not carry out further optimized design aiming at heat dissipation, has poor heat dissipation effect, is easy to cause heat accumulation of QFN chips in the testing process, and causes chip failure due to overhigh temperature.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heat dissipation formula radio frequency test platform has promoted radio frequency test platform to the radiating effect of chip in the testing process, has reduced because the high temperature of chip leads to the probability that the chip became invalid.

The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:

the heat dissipation type radio frequency test platform is used for testing a piece to be tested containing a radio frequency microwave signal port, and comprises a metal base, a pressing cover arranged on the metal base and used for pressing the piece to be tested, and an insulating base arranged in the metal base and used for installing the piece to be tested, wherein a radio frequency needle is arranged in the metal base, the upper end of the radio frequency needle is contacted with the radio frequency microwave signal port of the piece to be tested, the lower end of the radio frequency needle is in conductive connection with an inner conductor of a radio frequency cable, a piece to be tested placing groove is formed in the top of the insulating base, a heat conduction insert is arranged in the insulating base, the bottom surface of the heat conduction insert is attached to the top surface of the metal base, a grounding needle is arranged in the heat conduction insert and penetrates through the heat conduction insert, the upper end of the grounding needle is contacted with the piece to be tested, the heat conduction assembly comprises a heat conduction column and an elastic piece enabling the heat conduction column to always have a movement trend towards the placement groove of the piece to be measured, and the top of the heat conduction column extends into the placement groove of the piece to be measured.

By adopting the technical scheme, the part to be tested is provided with the large ground plane with concentrated heating, the large ground plane on the part to be tested is attached to the heat conduction insert, and heat generated on the part to be tested is transferred to the metal base through the heat conduction insert, so that the integral temperature of the metal base is raised, the temperature difference between the metal base and the external environment is increased, the heat dissipation of the metal base is improved, the heat dissipation area of the heat dissipation type radio frequency test platform is effectively increased to a certain extent, and the heat dissipation effect of the heat dissipation type radio frequency test platform is improved; because the part to be tested is positioned on the large ground plane and has a heating area with more concentrated heating, the heat conduction embedded piece is also internally provided with a heat conduction column which is jointed with the heating area on the part to be tested and is pressed against the bottom surface of the part to be tested under the action of the elastic piece, so that the piece to be tested is more tightly attached to the heat-conducting column, the heat conduction efficiency between the piece to be tested and the heat-conducting column is improved, and when the piece to be measured is arranged in the insulating base under the action of the pressing cover, the heat conduction column moves downwards under the pressure of the piece to be measured, so that the bottom surface of the heat-conducting column is jointed with the top surface of the metal base, the heat-conducting column and the metal base have higher heat-conducting efficiency, therefore, the heat of the grounding area on the piece to be tested is more easily transferred to the metal base, the heat dissipation effect of the heat dissipation type radio frequency test platform is effectively improved, and the probability of failure of the piece to be tested caused by overhigh temperature of the heat concentration area on the piece to be tested is reduced.

The utility model discloses further set up to: the bottom of the heat-conducting insert is provided with a stepped hole for mounting a heat-conducting column, the outer side of the heat-conducting column is provided with a positioning ring, and the positioning ring is abutted to the stepped surface at the top of the stepped hole.

Through adopting above-mentioned technical scheme, set up the shoulder hole that supplies the heat conduction post installation in the bottom of heat conduction inserts, the heat conduction post can fix a position through shoulder hole and the holding ring that is located the shoulder hole top.

The utility model discloses further set up to: the elastic piece is a compression spring, the compression spring is sleeved on the outer side of the heat conduction column, and a limiting ring for positioning the compression spring is arranged at the top of the heat conduction column.

Through adopting above-mentioned technical scheme, through setting up compression spring for the heat conduction post can carry out elastic expansion through compression spring, compresses tightly back on insulating base when the chip, and the heat conduction post is compressed down, under compression spring's effect, makes to compress tightly between heat conduction post and the chip, has ensured the heat conduction post can and the chip between the contact, simple structure, simple to operate.

The utility model discloses further set up to: the heat conduction assembly further comprises heat conduction silicone grease and a sealing cover, the sealing cover is fitted to the bottom of the stepped hole, and the heat conduction silicone grease is filled in a gap between the stepped hole and the heat conduction column.

Through adopting above-mentioned technical scheme, sealed lid sealing installation is in heat-conducting component's bottom, packs heat conduction silicone grease in the top cavity of sealed lid, and heat conduction silicone grease makes the lateral wall and the bottom of heat conduction post can directly carry out heat-conduction with the lateral wall of heat conduction inserts and the heat conduction silicone grease between the sealed lid, has reduced the isolated of air, has promoted the heat transfer efficiency between heat conduction post and the insulating base to heat dissipation formula radio frequency test platform's radiating efficiency has further been promoted.

The utility model discloses further set up to: the bottom of metal base is provided with the underframe, the bottom of underframe is provided with radiator fan.

By adopting the technical scheme, the heat exchange efficiency of the whole metal base, the bottom frame and the surrounding external air is accelerated by the rotary convection of the fan blades.

The utility model discloses further set up to: the top and the bottom of underframe all are provided with a plurality of inlet air channel, inlet air channel runs through the underframe and is linked together with radiator fan.

Through adopting above-mentioned technical scheme, establish reasonable wind channel, carry out quick heat dissipation to the heat that the heat source conduction was come, promote heat exchange efficiency.

The utility model discloses further set up to: the bottom of the placing groove is provided with a bottom cover covering the placing groove, the bottom cover is provided with a vent hole communicated with the placing groove, and the position of the cooling fan corresponds to the position of the vent hole.

By adopting the technical scheme, during installation, the tested packaged chip or the circuit substrate is placed in the placing groove, then the bottom cover covers the bottom of the placing groove, and finally the heat radiation fan is fixed with the bottom cover, so that the heat radiation fan and the circuit are convenient to install.

The utility model discloses further set up to: an insulating ring is arranged in the metal base, and a low-frequency needle insert connected with the low-frequency needle is arranged in the insulating ring.

Through adopting above-mentioned technical scheme for can establish complete low frequency channel between insulating base and the insulating ring, realize low frequency channel's insulating isolated, reduce the loss that the signal in the low frequency channel produced in transmission process.

The utility model discloses further set up to: the insulating base and the insulating ring are made of insulating materials, and the low-frequency needle insert and the low-frequency needle are directly installed in the insulating ring and the insulating base respectively.

Through adopting above-mentioned technical scheme, directly set up low frequency needle and low frequency needle inserts in insulating base and insulating ring for contact between low frequency needle and the low frequency needle inserts part can be direct and the chip, and need not set up insulating cover in addition, simple structure, simple to operate.

The utility model discloses further set up to: the insulating base and the insulating ring are made of conductive materials, and insulating sleeves are arranged on the outer sides of the low-frequency needle insert and the low-frequency needle.

Through adopting above-mentioned technical scheme, adopt above-mentioned mounting means for the position that sets up of low frequency needle and low frequency needle inserts is more free, can adjust the position of low frequency needle and low frequency needle inserts according to the chip of difference, has promoted heat dissipation formula radio frequency test platform's application scope to a certain extent.

To sum up, the utility model discloses a beneficial technological effect does:

the heat conduction insert is arranged in the insulating base, so that the heat conduction insert corresponds to a large ground plane in the middle of the piece to be tested, the ground plane is increased, the heat dissipation contact area is enlarged, and the heat of the part is mainly radiated through direct heat conduction or because the air gap is not tightly formed in the laminating process.

Through set up the earthing pin in heat conduction inserts inside, ensure the earthing pin and the ground contact of the piece bottom surface that awaits measuring, can assist the heat dissipation to the piece that awaits measuring when playing the ground effect.

Through the heat conduction assembly with the elastic movable structure arranged on the heat conduction insert, the heat source of the chip is subjected to fixed-point heat conduction, the heat conduction insert is guaranteed to be provided with a high heat transfer structure to transfer heat in direct contact with the heat source, and the heat conduction efficiency is further improved.

Through set up heat conduction silicone grease bottom and week side at the heat conduction post, reduced the air of air chamber bottom for main heat accessible heat conduction post, heat conduction silicone grease, bottom and heat conduction inserts's order are listed as and are further transmitted to whole metal base and underframe on.

Through the radiator fan who settles on underframe and apron, through the rotatory convection current of fan blade for the heat exchange efficiency of whole metal base and underframe inside and surrounding air.

Through establish the inlet channel on the underframe, establish reasonable wind channel, carry out the heat dissipation fast to heat and the circuit board that the heat source conduction was come, promote heat exchange efficiency.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the present invention.

Fig. 2 is a schematic diagram of the explosion structure of the present invention.

Fig. 3 is a schematic sectional structure of the present invention.

Fig. 4 is a schematic cross-sectional view of the insulating base and the heat-conducting insert in an exploded state.

Fig. 5 is a schematic cross-sectional view of a thermally conductive insert.

Fig. 6 is a schematic diagram of the explosion structure in another direction of the present invention.

In the figure, 1, a metal base; 11. embedding the groove; 12. a heat dissipation groove; 121. an insulating ring groove; 122. an insulating ring; 2. a compression cover; 21. a pressing part; 22. debugging the opening; 23. a locking buckle; 3. an insulating base; 31. mounting a through hole; 311. installing a groove; 312. a placing groove for the piece to be tested; 4. a heat conducting component; 41. a heat-conducting column; 411. a positioning ring; 42. a compression spring; 43. a sealing cover; 5. a thermally conductive insert; 51. embedding the protrusion; 52. a ground pin; 53. a low frequency needle insert; 531. a low frequency needle; 54. a stepped hole; 55. a radio frequency terminal; 551. a radio frequency needle; 6. a bottom frame; 61. an external radio frequency connector; 62. a low frequency connector; 63. placing a groove; 64. a bottom cover; 641. a vent hole; 65. a heat radiation fan; 651. a circuit board; 66. an air inlet channel.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to the attached drawings 1 and 2, the heat dissipation type radio frequency test platform comprises a metal base 1, a pressing cover 2 covering the top surface of the metal base 1, an insulating base 3 embedded in the metal base 1, a heat conduction insert 5 embedded in the insulating base 3 and a bottom frame 6 installed at the bottom of the metal base 1.

Referring to fig. 2 and fig. 3, the bottom that compresses tightly lid 2 is provided with the portion 21 that compresses tightly that is used for compressing tightly the chip in metal base, the debugging opening 22 has been seted up at the top that compresses tightly lid 2, the both sides that compress tightly lid 2 symmetry all install locking and detain 23, embedding recess 11 that corresponds with locking knot 23 is all seted up to two relative lateral walls of metal base 1, the latch hook joint on the locking knot 23 is in embedding recess 11, the realization is to compressing tightly lid 2 and metal base 1's being connected, compress tightly the chip in the top of insulating base 3 simultaneously.

Referring to fig. 3, the metal base 1 is made of a metal heat conducting material, and has good electrical conductivity and thermal conductivity, and in this embodiment, the metal base 1 is made of lead brass. A plurality of rf terminals 55 are disposed in the metal base 1, and the rf terminals 55 are distributed in the metal base 1. In this embodiment, the rf terminals 55 are disposed in the metal base, so that the metal contact surfaces of the upper and lower layers are maximized in design, which is beneficial to heat transfer. The above embodiment is only an optimized design of the present invention, and the rf terminal 55 can also be disposed at other positions in the same plane.

Referring to fig. 3 and 4, a heat dissipation groove 12 is formed in the top surface of the metal base 1, and the insulating base 3 is embedded in the heat dissipation groove 12 and connected to the metal base 1 through a bolt. The insulating base 3 is provided with a low frequency pin 531 connected to the low frequency pin insert 53 and a part of the ground pin 52.

The top surface of the insulating base 3 is vertically provided with a mounting through hole 31 downwards, the position of the mounting through hole 31 is communicated with the debugging opening 22, the bottom of the mounting through hole 31 is provided with a mounting groove 311, and the top of the mounting through hole 31 is provided with a placing groove 312 for placing a chip to be tested.

An insulating ring groove 121 is formed at the bottom of the heat dissipation groove 12, an insulating ring 122 is arranged in the insulating ring groove 121, a low-frequency needle insert 53 is arranged in the insulating ring 122, and the low-frequency needle 531 abuts against the low-frequency needle insert 53.

The low frequency needle insert 53 and the low frequency needle 531 are disposed in the insulating base 3 and the insulating ring 122 to insulate the low frequency signal channel, and the insulating base 3 and the insulating ring 122 can be made of metal, so that the low frequency needle insert 53 and the low frequency needle 531 are insulated by sleeving the insulating sleeves on the outer sides of the low frequency needle insert 53 and the low frequency needle 531.

In this case, the insulating base 3 and the heat conducting insert 5 may be integrally formed, and the insulating ring 122 and the metal base 1 may be integrally formed, so that the contact surfaces of the upper and lower layers may be metallized to the maximum, which is better than the outward transfer of heat. This embodiment is not shown in the drawings and can be derived directly from the disclosure of the invention.

When the chip is installed, the chip is placed in the placing groove 312 of the to-be-tested piece, the pressing cover 2 is pressed on the top of the metal base 1 through the locking buckle 23, and the pressing part 21 is driven by the spring to press the top of the chip, so that the chip is pressed.

Referring to fig. 4 and 5, in order to better transfer the heat on the chip to the metal base 1, the heat-conducting insert 5 is integrally made of a material with good heat conductivity and good electric conductivity, and in this embodiment, is made of a lead brass material.

The bottom of heat conduction insert 5 is provided with the embedding arch 51 of joint in mounting groove 311, and the bottom surface of heat conduction insert 5 is laminated with the bottom surface of heat dissipation groove 12 for heat on the chip can directly transmit to heat conduction insert 5 on, then through heat conduction insert 5 with heat transfer to metal base 1 on, increased heat radiating area, promoted the radiating efficiency.

Referring to fig. 5, the ground pin 52 and the rf pin 551 connected to the rf terminal 55 are disposed inside the heat conductive insert 5, in this embodiment, both the rf pin 551 and the ground pin 52 use a double-acting elastic probe as a transmission medium for reliable contact, wherein an insulator is disposed outside the rf pin 551 to form a transmission channel of rf signals, and further transmit microwave rf signals to the rf terminal 55 and the rf cable at the next level, the ground pin 52 penetrates through the bottom of the heat conductive insert 5 to abut against the metal base 1 to achieve grounding, and the ground pin 52 around the rf pin 551 can also form an rf ground to achieve a better rf grounding effect.

In this embodiment, the arrangement of the low frequency pin 531, the radio frequency pin 551 and the ground pin 52 is only a better arrangement for this embodiment, and other arrangements capable of detecting the chip are all within the scope of the claims of the present invention.

A stepped hole 54 is vertically formed upwards in the bottom surface of the heat-conducting insert 5, and the heat-conducting assemblies 4 are installed in the stepped hole 54.

The heat conducting assembly 4 includes a heat conducting post 41 installed in the stepped hole 54, a compression spring 42 sleeved outside the heat conducting post 41, and a sealing cover 43 for pressing the heat conducting post into the stepped hole 54.

The sealing cover 43 is hermetically mounted at the bottom of the stepped hole 54, and the bottom surface of the sealing cover 43 is attached to the bottom surface of the heat dissipation groove 12. The top lateral wall circumference of heat conduction post 41 is provided with a retaining ring 411, and the top surface of retaining ring 411 compresses tightly with the top of shoulder hole 54, and the high sum of heat conduction post 41 and sealed lid 43 slightly is less than the total height of heat conduction inserts 5, has the heat conduction clearance between heat conduction post 41 and the shoulder hole 54, and the heat conduction clearance intussuseption is filled with heat conduction silicone grease, and the packing volume of heat conduction silicone grease ensures that can not spill over from shoulder hole 54 after heat conduction post 41 is compressed tightly can. The compression spring 42 is sleeved outside the heat conduction column 41, one end of the compression spring 42 abuts against the top surface of the sealing cover 43, and the other end abuts against the bottom surface of the positioning ring 411.

In this embodiment, the distance between the top surface of the positioning ring 411 and the top end of the stepped hole 54 is smaller than the distance between the top surface of the heat conducting pillar 41 and the top surface of the positioning ring 411, so that the top of the heat conducting pillar 41 can partially extend out of the heat conducting insert 5, and the heat conducting pillar 41 can be pressed against the ground portion of the chip under the action of the compression spring 42.

In the in-service use, the design of heat conduction subassembly 4 can be designed and arrange according to the number and the position that the chip actually concentrates the regional that generates heat, and other different heat conduction inserts 5 that form by the number that changes heat conduction subassembly 4 and the mode of arranging are all in the utility model discloses the claim protection scope.

Referring to fig. 5 and 6, the bottom frame 6 is mounted at the bottom of the metal base 1, external radio frequency connectors 61 and low frequency connectors 62 are circumferentially arranged on the side wall of the bottom frame 6 at intervals, the low frequency connectors 62 are connected with the low frequency pin insert 53 through wires, and the radio frequency terminals 55 are connected with the radio frequency connectors 61 through wires.

The bottom surface of the bottom frame 6 is vertically upwards provided with a placing groove 63, the bottom of the placing groove 63 is provided with a bottom cover 64, the bottom cover 64 is provided with a vent 641 communicated with the placing groove 63, and an air inlet channel 66 communicated with the placing groove 63 is arranged between the bottom frame 6 and the metal base 1.

A heat dissipation fan 65 is installed at the bottom of the bottom cover 64, the positions of the fan blades in the heat dissipation fan 65 correspond to the positions of the ventilation holes 641, a circuit board 651 is installed at the top of the heat dissipation fan 65, and the circuit board 651 is installed in the placing groove 63 and on the circuit board 651.

The use principle of the above embodiment is as follows: during the use, be located the heat conduction post 41 on the heat conduction inserts 5 and the concentrated region of generating heat on the chip compresses tightly for the concentrated region of generating heat can be directly with heat transfer to the heat conduction post 41 on, then evenly transmit the heat to heat conduction inserts 5 and metal base 1 through the heat conduction silicone grease in the heat conduction post 41 outside, increase holistic heat radiating area, and through being located the radiator fan 65 of underframe 6 bottom increased the heat dispersion of metal base 1 and underframe 6, promoted the holistic heat dispersion of heat dissipation formula radio frequency test platform.

In addition to the heat dissipation method implemented in this embodiment, for some tested devices that do not need to be subjected to a windowing test, a method of adding heat dissipation fins and fans to the pressing cover assembly can be also used to further accelerate the air convection between the whole device and the environment, so as to achieve the effect of enhancing the heat dissipation of the whole system.

The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims (10)

1. Heat dissipation formula radio frequency test platform for to contain the radio frequency microwave signal port test of awaiting measuring, including metal base (1), set up on metal base (1) and be used for compressing tightly lid (2) and set up insulating base (3) that supply the installation of awaiting measuring in metal base (1) with the piece that awaits measuring that compresses tightly, be provided with radio frequency needle (551) in metal base (1), the upper end of radio frequency needle (551) and the radio frequency microwave signal port contact of the piece that awaits measuring, the lower extreme and the radio frequency cable inner conductor conductive connection of radio frequency needle (551), be provided with low frequency needle (531) in insulating base (3), the lower extreme and the low frequency cable conductive connection of low frequency needle (531), its characterized in that: a standing groove (312) that awaits measuring has been seted up at the top of insulating base (3), be provided with heat conduction inserts (5) in insulating base (3), the bottom surface of heat conduction inserts (5) and the top surface laminating of metal base (1), be provided with in heat conduction inserts (5) grounding pin (52), grounding pin (52) run through heat conduction inserts (5), the upper end and the contact of awaiting measuring of grounding pin (52), the lower extreme and the metal base (1) contact of grounding pin (52), still be provided with heat-conducting component (4) in heat conduction inserts (5), heat-conducting component (4) include heat conduction post (41) and force heat conduction post (41) one end to have the elastic component that extends to a standing groove (312) internal motion trend that awaits measuring all the time.

2. The heat dissipating radio frequency test platform of claim 1, wherein: the bottom of the heat-conducting insert (5) is provided with a stepped hole (54) for installing a heat-conducting column (41), the outer side of the heat-conducting column (41) is provided with a positioning ring (411), and the positioning ring (411) is abutted to the stepped surface at the top of the stepped hole (54).

3. The heat dissipating radio frequency test platform of claim 2, wherein: the heat conduction assembly (4) further comprises heat conduction silicone grease and a sealing cover (43), the sealing cover (43) is sealed and covered on the bottom of the stepped hole (54), and the gap between the stepped hole (54) and the heat conduction column (41) is filled with the heat conduction silicone grease.

4. The heat dissipating radio frequency test platform of claim 1, wherein: the bottom of metal base (1) is provided with underframe (6), the bottom of underframe (6) is provided with radiator fan (65).

5. The heat dissipating radio frequency test platform of claim 4, wherein: the top and the bottom of underframe (6) all are provided with a plurality of inlet air channel (66), inlet air channel (66) run through underframe (6) and are linked together with radiator fan (65).

6. The heat dissipating radio frequency test platform of claim 5, wherein: the radiating fan (65) is connected with a circuit board (651), a placing groove (63) for placing the circuit board (651) is formed in the bottom of the bottom frame (6), and the air inlet channel (66) is communicated with the placing groove (63).

7. The heat dissipating radio frequency test platform of claim 6, wherein: the bottom of placing groove (63) is provided with bottom cover (64) that the lid closed place groove (63), set up on bottom cover (64) and communicate and place ventilation hole (641) of groove (63), the position of radiator fan (65) and the position of ventilation hole (641) correspond to each other.

8. The heat dissipating radio frequency test platform of claim 1, wherein: the metal base (1) is provided with an insulating ring (122), and a low-frequency needle insert (53) connected with a low-frequency needle (531) is arranged in the insulating ring (122).

9. The heat dissipating radio frequency test platform of claim 8, wherein: the insulation base (3) and the insulation ring (122) are made of insulation materials, and the low-frequency needle insert (53) and the low-frequency needle (531) are directly installed in the insulation ring (122) and the insulation base (3) respectively.

10. The heat dissipating radio frequency test platform of claim 8, wherein: the insulating base (3) and the insulating ring (122) are made of conducting materials, and insulating sleeves are arranged on the outer sides of the low-frequency needle insert (53) and the low-frequency needle (531).

Images