CN220402122U - Transceiver assembly and housing thereof - Google Patents

Abstract

The utility model discloses a shell of a transceiver component, which is provided with a cavity for placing an electronic component, wherein the cavity is provided with a heat sink welding surface for conducting heat with heating chips of the electronic component, a partition wall is arranged in the cavity for separating a plurality of the heating chips, the partition wall protrudes out of the platform in the thickness direction of the heating chips and can conduct heat outwards from the platform, and heat is conducted between the partition wall and the heat sink welding surface. In the limited space of cavity volume, set up the partition wall into the platform formula to form the great mesa of area, with partition wall and heat sink welding face heat conduction contact simultaneously, so that the partition wall can absorb the heat that generates heat the chip direction heat sink welding face, and the partition wall is because being the platform formula again, can be quick with the heat dissipation away from the mesa, in order to satisfy the heat dissipation needs. The utility model also discloses a receiving and transmitting assembly comprising the shell.

Description

Transceiver assembly and housing thereof

Technical Field

The utility model relates to the technical field of radars, in particular to a shell of a transceiver component and the transceiver component comprising the shell.

Background

In the transceiver module, a plurality of chips are generally disposed, and some of the heat-generating chips are separated by a partition wall. The transceiver component is generally packaged by a shell, and for convenience of packaging, the shell is generally box-shaped, is opened at one side, forms a box cavity, and is provided with a cover plate at the side so as to seal the box cavity. When the internal electronic structure is installed, the corresponding electronic structure is placed from the opening, and then the cover plate is covered.

In order to ensure that heat can be emitted, the heat generating chip needs to be attached to a heat dissipating device. From the installation angle, a heat conducting part is generally arranged on one side of the heating chip, which is close to the bottom of the tank, so that the heat conducting part is in direct heat conducting contact with the heating chip, and whether the heating chip can emit heat or not can be guaranteed when the heating chip is installed. The heat dissipation structure is generally disposed on a side of the heat generating chip close to the notch for convenient arrangement, and the side can be provided with more space for arranging a larger heat dissipation structure, so that weight and size are necessarily increased if heat is conducted between the heat generating chip and the heat dissipation structure through the heat conducting structure. In the prior art, the heat dissipation structure is generally installed at the bottom side of the tank to solve the installation problem. But is arranged at the bottom side of the groove, which results in a very limited volume of the heat dissipating structure. Resulting in poor heat dissipation effect for the heat generating chip.

In summary, how to effectively solve the problem of difficult heat conduction under the condition of convenient installation of the heating chip is a problem which needs to be solved by the skilled person in the art.

Disclosure of Invention

In view of the above, a first object of the present utility model is to provide a housing of a transceiver module, which can effectively solve the problem of difficult heat conduction due to the convenience of mounting a heat generating chip, and a second object of the present utility model is to provide a transceiver module including the housing.

In order to achieve the first object, the present utility model provides the following technical solutions:

the utility model provides a receiving and dispatching subassembly's casing is provided with the cavity that is used for placing electronic component, just the cavity be provided with be used for with the electronic component generates heat the heat sink welding face of chip heat conduction, be provided with the partition wall in the cavity in order to be used for separating a plurality of generate heat the chip, the partition wall is in generate heat the chip thickness direction protrusion and be the platform type and can follow the platform to the external heat conduction, the partition wall with heat sink between the welding face.

In the shell of the receiving and transmitting assembly, when the receiving and transmitting assembly is installed, reverse installation is not needed, because the partition wall protrudes in the thickness direction of the heating chip, the heat of the heating chip can be guided to the other side through the partition wall, and therefore the installation convenience is guaranteed. And in the limited space of cavity volume, set up the partition wall into the platform formula to form the great mesa of area, with partition wall and heat sink welding face heat conduction contact simultaneously, so that the partition wall can absorb the heat that generates heat the chip direction heat sink welding face, and the partition wall is because being the platform formula again, can be quick with the heat dissipation from the mesa, in order to satisfy the heat dissipation needs. Meanwhile, in conclusion, the shell can effectively solve the problem that the heat conduction is difficult when the heating chip is convenient to install.

In some embodiments, the housing includes a channel structure and a cover plate that closes a notch of the channel structure, and a channel cavity of the channel structure is the cavity.

In some embodiments, the heat sink welding surface and the table top of the partition wall face the cover plate.

In some embodiments, the mesa is provided with a connection hole.

In some embodiments, the connecting hole is a threaded hole.

In some embodiments, the cavity wall of the groove structure has a shoulder surface for supporting the heat dissipation plate, and the shoulder surface is coplanar with the mesa.

In some embodiments, the partition wall extends from a first side cavity wall of the groove-shaped structure to a middle portion of the cavity, the first side cavity wall being provided with a mounting hole for passing through a connector corresponding to the heat generating chip.

In some embodiments, the partition wall is integrally formed with the channel structure.

In some technical schemes, a boss is arranged in the middle of a second side cavity wall of the groove-shaped structural body, a shoulder surface is arranged on the boss, and the second side cavity wall is arranged opposite to the first side cavity wall; the second side cavity wall is provided with a first side section part used for installing a mounting slot hole of the low-frequency connector in the two side section parts of the boss, and the second side section part is concavely arranged so that the wall thickness is lower than that of the first side section part.

In order to achieve the second object, the utility model also provides a transceiver component, which comprises any one of the shells and a heat dissipation plate, wherein the heat dissipation plate is in heat conduction contact with the partition wall table-board in the shell. Because the above-mentioned shell has the above-mentioned technical effects, the transceiver component with this shell should also have corresponding technical effects.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic three-dimensional structure of a housing of a transceiver module according to an embodiment of the present disclosure;

fig. 2 is a schematic diagram of another directional structure of a housing of a transceiver module according to an embodiment of the present disclosure;

fig. 3 is a schematic cross-sectional view of a transceiver module through a partition wall according to an embodiment of the present disclosure;

fig. 4 is a schematic cross-sectional structure of a transceiver module according to an embodiment of the present utility model at a welding surface of a heat sink;

fig. 5 is a schematic cross-sectional structure of a transceiver module according to an embodiment of the present utility model.

The figures are marked as follows:

the electronic component 1, the cavity 2, the heat sink welding surface 3, the partition wall 4, the groove-shaped structural body 5, the cover plate 6 and the heat dissipation plate 7;

the heating chip 1-1, the connecting hole 4-1, the table top 4-2, the shoulder surface 5-1, the first side cavity wall 5-2, the mounting hole 5-3, the second side cavity wall 5-4, the mounting slot 5-5 and the boss 5-6.

Detailed Description

The embodiment of the utility model discloses a shell of a transceiver component, which is used for effectively solving the problem that a heating chip is difficult to conduct heat under the condition of convenient installation.

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 to 5, fig. 1 is a schematic three-dimensional structure of a housing of a transceiver module according to an embodiment of the utility model; fig. 2 is a schematic diagram of another directional structure of a housing of a transceiver module according to an embodiment of the present disclosure; fig. 3 is a schematic cross-sectional view of a transceiver module through a partition wall according to an embodiment of the present disclosure; fig. 4 is a schematic cross-sectional structure of a transceiver module according to an embodiment of the present utility model at a welding surface of a heat sink; fig. 5 is a schematic cross-sectional structure of a transceiver module according to an embodiment of the present utility model.

In some embodiments, the present embodiments provide a housing for a transceiver assembly.

A cavity 2 for placing the electronic component 1 is arranged in the housing. The electronic component 1 is mainly a radio frequency board, which is provided with a power module, a control module and the like, and is provided with a low-frequency connector, a radio frequency connector and corresponding circuit components, and for at least part of the radio frequency connectors, corresponding connection circulators, amplifier chips, receiving chips, multifunctional chips and the like are needed. Correspondingly, a heat dissipation structure and/or the ability of the housing to dissipate heat in the cavity 2 to the outside are also needed in the cavity 2 of the housing.

In particular, and as in which the cavity 2 is provided with a heat sink bonding surface 3 for conducting heat to a heat generating chip 1-1 of the electronic component 1, wherein the heat generating chip 1-1, such as an amplifier chip, may of course be another chip. The heat of the heating chip 1-1 can be conducted out as soon as possible through the heat sink welding surface 3 so as to be guided to the corresponding equipment. In use, the heat sink is soldered to the heat sink soldering surface 3 by solder, and the heat generating chip 1-1, such as an amplifier chip, is soldered to the heat sink by eutectic soldering.

And the cavity 2 is internally provided with the partition wall 4 for separating the plurality of heating chips 1-1, thereby playing a good role in isolation and shielding. At least one partition wall 4 is provided in the cavity 2 to partition at least two channels for mounting different chips, wherein the chips may be the heat generating chips 1-1 or may include other chips. The partition wall 4 does not need to completely isolate the cavity 2 from two independent spaces, and mainly adds a barrier between two chips with possible signal interference, which can have the effect of prolonging the interference distance. It should be noted that it is not necessary to separate all the heat generating chips 1-1, and the heat generating chips 1-1 that are far away from each other may be separated or not separated.

The partition wall 4 protrudes in the thickness direction of the heating chip 1-1 to form a platform shape, and can conduct heat outwards from the table top 4-2, namely, can radiate heat from the table top 4-2, and when the heat dissipation device is used, a heat dissipation part, such as a heat dissipation plate 7, can be installed at the table top 4-2 to dissipate heat.

Wherein, the partition wall 4 needs to be arranged through in the thickness direction of the heat generating chip 1-1 because of signal isolation between the heat generating chips 1-1, that is, in the thickness direction of the heat generating chip 1-1, one part of the partition wall 4 is positioned at a first side in the thickness direction of the heat generating chip 1-1, and the other part is positioned at a second side in the thickness direction of the heat generating chip 1-1. As described above, the partition wall 4 protrudes in the thickness direction of the heat generating chip 1-1 to form the mesa 4-2, for example, the mesa 4-2 of the heat generating chip 1-1 is located at the first side of the thickness direction of the heat generating chip 1-1 for abutting against the heat dissipating member. And the root of the partition wall 4 is located at the second side of the thickness direction of the heat generating chip 1-1. So that the partition wall 4 can transfer heat of the heat generating chip 1-1 from one side in the thickness direction to the other side in the thickness direction.

Meanwhile, heat is conducted between the partition wall 4 and the heat sink welding surface 3 to form a heat conducting path, so that when the heat generating chip 1-1 is used, heat is transferred to the heat sink welding surface 3, the heat sink welding surface 3 transfers heat to the partition wall 4, and at the partition wall 4, the heat is transferred from the root of the partition wall 4 to the table top 4-2 of the partition wall 4 and then to the heat radiating part to form the required heat conduction.

In the housing of the above-mentioned transceiver module, the reverse installation is not required at the time of the installation, because the partition wall 4 is protruded in the thickness direction of the heat generating chip 1-1, the heat of the heat generating chip 1-1 can be guided to the other side through the partition wall 4, so that the convenience of the installation is ensured. In the limited space of the volume of the cavity 2, the partition wall 4 is arranged to be a platform type to form a table top 4-2 with a larger area, and meanwhile, the partition wall 4 is in heat conduction contact with the heat sink welding surface 3, so that the partition wall 4 can absorb heat of the heating chip 1-1 guided to the heat sink welding surface 3, and the partition wall 4 can rapidly radiate the heat from the table top 4-2 due to the fact that the partition wall 4 is of the platform type, and therefore the heat radiation requirement can be met. Meanwhile, in summary, the shell can effectively solve the problem that the heat conduction is difficult when the heating chip 1-1 is convenient to install.

In some embodiments, the housing may be formed by assembling a plurality of plates, such as a box, or by combining a slot structure and a cover plate 6, or by other forming methods.

In some embodiments, considering assembly difficulty and molding difficulty, it is preferable that the housing therein includes a groove-shaped structure 5 and a cover plate 6 closed at a notch of the groove-shaped structure 5, and a groove cavity of the groove-shaped structure 5 is the cavity 2. Wherein the cover plate 6 can be embedded in the slot; or the cover plate 6 can be covered on the notch, namely the peripheral edge of the cover plate is lapped on the notch edge to form a stable structural relationship. The cover plate 6 and the groove-shaped structure body 5 can be mounted by welding, screw connection or other connection modes, and in particular, the cover plate and the groove-shaped structure body can be arranged according to the needs. The cavity of the groove-shaped structure body 5 is the cavity body 2, which is used for placing the heating chip 1-1, arranging the partition wall 4 and the like, wherein the partition wall 4 can be arranged on the cover plate 6 or on the groove bottom plate of the groove-shaped structure body. The thickness direction of the heat generating chip 1-1 is generally equal to the groove depth direction of the groove cavity of the groove-shaped structure 5. The partition wall 4 may have a mesa structure protruding in the groove depth direction, or may have a mesa structure protruding in the groove bottom direction, or may have a mesa structure protruding in the groove opening direction.

In some embodiments, for convenient installation, the heat sink welding surface 3 is directed to the cover plate 6, so that the hair chip can be installed against the bottom of the groove-shaped structural body, thereby greatly facilitating welding, facilitating heat conduction contact and simultaneously facilitating fixation.

Correspondingly, the table top 4-2 of the partition wall 4 can be made to face the cover plate 6 so as to radiate heat on the side of the heating chip 1-1 away from the heat sink welding surface 3. The heat-generating chip 1-1 is conducted away from the side close to the bottom of the groove, and then the heat is conducted away from the side of the cover plate 6, namely from the side close to the notch to the heat-dissipating structure via the heat sink welding surface 3 and the partition wall 4.

In some embodiments, a connection hole 4-1 is provided on the mesa 4-2 for heat dissipating structure connection. The table top 4-2 is provided with the connecting hole 4-1, so that the connection of the heat dissipation structure is facilitated, and meanwhile, the connection strength can be ensured by the table-shaped structure. Wherein the connection hole 4-1 may be a connection through hole for a screw or bolt to pass through; wherein the connecting hole 4-1 may also be a threaded hole for connection with a screw; of course, the connecting hole 4-1 may also be a generally cylindrical hole for interference fit with the connecting rod to effect securement. Preferably, the connecting hole 4-1 is a threaded hole or a connecting through hole so as to facilitate screw connection, so that the heat dissipation structure and the table top 4-2 can be better attached to ensure the heat dissipation effect.

In some embodiments, it is preferable that the cavity 2 of the groove-shaped structure 5 has a shoulder surface 5-1 in the wall thereof, which is coplanar with the land surface 4-2 for supporting the heat dissipation plate 7, so that the shoulder surface 5-1 can also transfer heat to the heat dissipation plate 7, effectively increasing the heat conduction path while mounting to ensure heat conduction efficiency. Shoulder surfaces 5-1 may be provided on the cavity walls on opposite sides of the channel-shaped structure; the wall of the cavity body around the groove-shaped structure body can be provided with shoulder surfaces 5-1, for example, the groove-shaped structure body can be further connected into an annular structure. For ease of attachment, it is preferable to provide attachment holes in the shoulder surfaces on opposite sides of the channel-shaped structure.

In some embodiments, the table top 4-2 may slightly protrude from the shoulder surface 5-1, so that the contact between the table top 4-2 and the heat dissipation plate 7 is sufficiently ensured while mounting, and the heat is preferentially transferred to the heat dissipation plate 7 through the table top 4-2.

In some embodiments, the partition wall 4 may be extended from the first side cavity wall 5-2 of the groove-shaped structure 5 to the middle of the cavity 2, and connected with the first side cavity wall 5-2, the first side cavity wall 5-2 being provided with a mounting hole 5-3 for passing a connector corresponding to the heat generating chip 1-1. Wherein the mounting holes 5-3 are used for mounting the radio frequency connector. The heating chip 1-1 can be installed nearby the radio frequency connector, and meanwhile, the installation strength of the first side cavity wall 5-2 can be better ensured, so that later plug connection is facilitated.

In some embodiments, the partition wall 4 may be integrally formed with the groove-shaped structure body 5, for example, integrally milled, specifically, a groove cavity may be milled in a plate body, and the partition wall 4 and the heat sink welding surface 3 may be left while the groove cavity is milled, and may further include a transition substrate welding surface, a radio frequency board welding surface, and the like. Specifically, the partition wall 4 and the groove-shaped structural body 5 are integrally formed pieces of aluminum alloy or other integrally formed pieces.

In some embodiments, a boss 5-6 may be provided at the middle of the second side cavity wall 5-4 of the groove-shaped structure 5, the boss 5-6 is provided with a shoulder surface 5-1, and the second side cavity wall 5-4 is opposite to the first side cavity wall 5-2; the second side cavity wall 5-4 is provided with a first side section part in two side section parts of the boss 5-6, which is used for installing the installation slot hole 5-5 of the low-frequency connector, and the second side section part is concavely arranged so that the wall thickness is lower than that of the first side section part, so that the inner cavity has more space, and meanwhile, the installation operation and control on the encapsulation effect of the low-frequency connector are ensured.

Based on the housing provided in the above embodiments, the present utility model further provides a transceiver module, which includes any one of the housings in the above embodiments, including a heat dissipation plate 7, where the heat dissipation plate 7 is in heat-conducting contact with the table top 4-2 of the partition wall 4 in the housing. Since the transceiver module adopts the housing in the above embodiment, the transceiver module has the beneficial effects described in the above embodiment. The heat dissipation plate 7 may be a water-cooling heat dissipation plate or an energy storage plate.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The utility model provides a shell of transceiver module, is provided with cavity (2) that are used for placing electronic component (1), just cavity (2) be provided with be used for with heat sink welding face (3) of the chip (1-1) that generates heat of electronic component (1) heat conduction, be provided with partition wall (4) in cavity (2) in order to be used for separating a plurality of chip (1-1) that generates heat, a serial communication port, partition wall (4) are in the bulge of chip (1-1) thickness direction that generates heat is the platform and can follow table (4-2) external heat conduction, partition wall (4) with heat sink welding face (3) between heat conduction.

2. The housing of a transceiver module according to claim 1, characterized in that it comprises a channel structure (5) and a cover plate (6) closing at the notch of the channel structure (5), the channel cavity of the channel structure (5) being the cavity (2).

3. The housing of a transceiver module according to claim 2, characterized in that the heat sink soldering surface (3) and the mesa (4-2) are both facing the cover plate (6).

4. A housing of a transceiver module according to claim 3, characterized in that the table top (4-2) is provided with a connection hole (4-1).

5. The housing of a transceiver module according to claim 4, wherein the connection hole (4-1) is a threaded hole.

6. A housing of a transceiver module according to any one of claims 2-5, characterized in that the cavity wall of the channel structure (5) has a shoulder surface (5-1) for supporting a heat dissipation plate (7), which shoulder surface (5-1) is arranged coplanar with the mesa (4-2).

7. The housing of a transceiver module according to claim 6, characterized in that the partition wall (4) extends from a first side cavity wall (5-2) of the channel structure (5) to the middle of the cavity (2); the first side cavity wall (5-2) is provided with a mounting hole (5-3) for passing through a connector corresponding to the heat generating chip (1-1).

8. The housing of a transceiver module according to claim 7, characterized in that the partition wall (4) is integrally formed with the channel structure (5).

9. The housing of a transceiver module according to claim 8, characterized in that a boss (5-6) is provided in the middle of a second side cavity wall (5-4) of the channel-shaped structure (5), the boss (5-6) being provided with a shoulder surface (5-1), the second side cavity wall (5-4) being arranged opposite to the first side cavity wall (5-2); the second side cavity wall (5-4) is provided with a first side section part for installing a mounting slot hole (5-5) of the low-frequency connector in two side section parts of the boss (5-6), and the second side section part is concavely arranged so that the wall thickness is lower than that of the first side section part.

10. A transceiver module comprising a heat dissipating plate (7), characterized by a housing according to any of claims 1-9, said heat dissipating plate (7) being in heat conductive contact with a partition mesa in said housing.