CN109874281B - Communication equipment and optical module with heat radiation structure thereof - Google Patents
Communication equipment and optical module with heat radiation structure thereof Download PDFInfo
- Publication number
- CN109874281B CN109874281B CN201910251231.2A CN201910251231A CN109874281B CN 109874281 B CN109874281 B CN 109874281B CN 201910251231 A CN201910251231 A CN 201910251231A CN 109874281 B CN109874281 B CN 109874281B
- Authority
- CN
- China
- Prior art keywords
- baffles
- optical module
- bottom plate
- heat
- baffle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 64
- 230000005855 radiation Effects 0.000 title claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims description 10
- 230000000191 radiation effect Effects 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of optical modules, and provides an optical module with a heat dissipation structure, which comprises an optical module body and a heat conduction structure arranged on the outer surface of at least one side of the optical module body, wherein the heat conduction structure comprises a plurality of first baffles and a bottom plate for arranging the first baffles, the bottom plate and the outer surface are oppositely arranged, the first baffles are positioned between the bottom plate and the outer surface, and one end of each first baffle far away from the bottom plate is contacted with the outer surface. The communication equipment comprises a communication equipment body and the optical module. According to the optical module with the heat radiation structure, the heat transmitted to the outer surface of the optical module body is conducted through the heat conduction structure, the heat radiation area is increased through the bottom plate and the plurality of baffles, the heat radiation effect is improved, in addition, the baffles are arranged between the bottom plate and the outer surface, and the formed openings at the two ends can form air convection, so that the heat radiation speed can be increased, and electromagnetic leakage can be effectively controlled.
Description
Technical Field
The invention relates to the technical field of optical modules, in particular to communication equipment and an optical module with a heat dissipation structure.
Background
The development trend of high integration and high speed of the optical communication module enables the optical module to continuously develop towards multiple channels, miniaturization and high concentration. Meanwhile, the power of the optical module is continuously increased, the volume heat density is also continuously increased, the temperature of the optical module is high during operation, the temperature-sensitive electro-optical/photoelectric conversion components and the chip performance in the optical module can be greatly reduced, and even the whole optical module cannot normally work or fail.
Disclosure of Invention
The invention aims to provide a communication device and an optical module with a heat radiation structure, wherein the heat transmitted to the outer surface of the optical module body is conducted through the heat conduction structure, the heat radiation area is increased through a bottom plate and a plurality of baffles, the heat radiation effect is improved, in addition, the baffles are arranged between the bottom plate and the outer surface, and the formed openings at two ends can form air convection, so that the heat radiation speed can be increased, and electromagnetic leakage can be effectively controlled.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the utility model provides an optical module with heat radiation structure, includes the optical module body, still including set up in heat conduction structure on the surface of at least one side of optical module body, heat conduction structure includes a plurality of first baffles and supplies each the bottom plate that first baffle was installed, the bottom plate with the surface sets up relatively, each first baffle all is located the bottom plate with between the surface, and each first baffle is kept away from the one end contact of bottom plate the surface.
Further, the bottom plate and each first baffle are in seamless bonding through heat conducting glue.
Further, a limiting structure for installing the heat conducting structure is arranged on the outer surface.
Further, the limit structure comprises two second baffles which are protruded outwards from the opposite edges of the optical module body and are used for the installation and fixation of the heat conduction structure, the two second baffles are arranged oppositely, and each first baffle is located between the two second baffles.
Further, the outer surfaces of the two second baffles are respectively located in the same plane with the outer surfaces corresponding to the optical module body.
Further, the two second baffles extend from the light port of the light module body to the electric port of the light module body.
Further, the surfaces of the two second baffles, which deviate from the optical module body, are located in the same plane with the outer surface of the bottom plate.
Further, two first baffles positioned on the outer side are respectively attached to two second baffles.
Further, the contact part between the outer surface and each baffle is filled with heat-conducting glue.
The embodiment of the invention provides another technical scheme that: the utility model provides a communication equipment, includes the communication equipment body, still includes foretell optical module, the communication equipment body has the EMI leakage mouth, the optical module by EMI leakage mouth department inserts in the communication equipment body, the inboard of communication equipment body by heat conduction structure intercommunication is to the outside.
Compared with the prior art, the invention has the beneficial effects that:
1. the heat transferred to the outer surface by the light module body is conducted through the heat conducting structure, the heat radiating area is increased through the bottom plate and the plurality of baffles, the heat radiating effect is improved, the baffles are arranged between the bottom plate and the outer surface, and the formed openings at the two ends can form air convection, so that the heat radiating speed can be increased, and electromagnetic leakage can be effectively controlled.
2. The whole heat conduction structure is compact in structure, small in number of parts, easy to assemble with the existing optical module body, convenient to operate, high in reliability and low in cost.
Drawings
Fig. 1 is an exploded schematic diagram of an optical module with a heat dissipation structure according to an embodiment of the present invention;
fig. 2 is an assembly schematic diagram of an optical module with a heat dissipation structure according to an embodiment of the present invention;
fig. 3 is a schematic installation diagram of an optical module body and two second baffles of an optical module with a heat dissipation structure according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a heat conducting structure of an optical module with a heat dissipating structure according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of FIG. 2;
fig. 6 is a schematic structural diagram of a communication device according to an embodiment of the present invention;
in the reference numerals: 1-an optical module body; 10-outer surface; 2-a heat conducting structure; 20-a bottom plate; 21-a first baffle; 3-a second baffle; 4-grooves; 5-ventilation holes; 6-a front housing; 7-an EMI leak; a-inside the communication device body; b-outside the body of the communication device; .
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, an embodiment of the present invention provides an optical module with a heat dissipation structure, which includes an optical module body 1 and a heat conduction structure 2 disposed on an outer surface 10 of at least one side of the optical module body 1, wherein the heat conduction structure 2 includes a plurality of first baffles 21 and a bottom plate 20 on which each of the first baffles 21 is disposed, the bottom plate 20 and the outer surface 10 are disposed opposite to each other, each of the first baffles 21 is disposed between the bottom plate 20 and the outer surface 10, and an end of each of the first baffles 21 away from the bottom plate 20 contacts the outer surface 10. In this embodiment, the bottom plate 20 and each of the first baffles 21 may conduct heat, and when each of the first baffles 21 contacts with the outer surface 10 of the optical module body 1, a large amount of heat generated by electronic components in the optical module body 1 during operation is transferred to the outer surface 10 of the optical module body 1, and then transferred to the bottom plate 20 and each of the first baffles 21, so that the contact area with air is further increased, i.e. the heat dissipation area is increased, so as to achieve the purpose of accelerating the heat dissipation speed, compared with the case where only the outer surface of the optical module body is used, so that the heat conducting structure 2 may also be said to be a heat dissipation structure. The heat conducting structure 2 and the optical module body 1 in this embodiment are independent, do not need to change the structure of the existing optical module shell, reduce the transformation cost, and the bottom plate 20 that establishes can make things convenient for each first baffle 21 installation setting on the one hand, on the other hand has also increased the radiating area, has promoted the radiating rate, in addition, bottom plate 20, surface 10 and adjacent two first baffles 21 can enclose and close and form ventilation hole 5, the both ends opening in this ventilation hole 5 can let the air get into in this ventilation hole 5 in order to form the air convection, with the loss of acceleration heat, and then improved the radiating rate. In addition, the smaller the aperture of the vent 5, the longer the length, the less EMI (electromagnetic) radiation within the device can be leaked. Preferably, the bottom plate 20 and the outer surface 10 are parallel to each other, and each first baffle 21 is vertically disposed between the bottom plate 20 and the outer surface 10, so that the heat dissipation structure can be more neat and convenient to match with the existing equipment.
As an optimization scheme of the embodiment of the present invention, the bottom plate 20 and each first baffle 21 are bonded by heat conducting glue in a seamless manner. In this embodiment, the bottom plate 20 and each of the first baffles 21 are bonded by a heat-conducting adhesive, so that on one hand, the heat-conducting efficiency is improved, and on the other hand, the vent holes 5 are tightly connected except for the openings at the two ends, so that air can only enter the vent holes 5 from the openings at the two ends, thereby enhancing convection.
As an optimization scheme of the embodiment of the present invention, a limiting structure for installing the heat conducting structure 2 is disposed on the outer surface 10. In this embodiment, the limit structure is provided to facilitate the fixed installation and positioning of the heat conducting structure 2.
With further optimization of the above-mentioned scheme, referring to fig. 1, 2, 3 and 5, the limiting structure includes two second baffles 3 protruding outwards from opposite edges of the optical module body 1 and configured to mount and fix the heat conducting structure 2, where the two second baffles 3 are disposed opposite to each other, and each first baffle 21 is located between the two second baffles 3. In this embodiment, two second baffles 3 are used to fix the heat conducting structure 2, each first baffle 21 is disposed between two second baffles 3 that are disposed opposite to each other, the number of the first baffles 21 can be selected by the actual manufacturing capability, the greater the number of the vent holes 5 is, the greater the contact area with air is, the greater the convection channel is, the better the heat dissipation effect is, on the other hand, the greater the number of the first baffles 21 is, the smaller the distance between two adjacent first baffles 21 is, i.e. the smaller the aperture of the vent hole 5 is, so as to reduce EMI radiation leakage inside the communication device. Of course, instead of using two baffles, other types of mounting structures for mounting the heat conducting structure 2, such as mounting blocks, may be used, which is not limited in this embodiment.
Further optimizing the above scheme, referring to fig. 2, the outer surfaces 10 of the two second baffles 3 are respectively located in the same plane with the outer surfaces 10 corresponding to the optical module body 1. In this embodiment, the more optimal choice is that the two second baffles 3 are flush with the corresponding outer surfaces 10 of the light module, so that the structure of the overall light module can be optimized to also match existing equipment.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 and 2, two second baffles 3 extend along the direction from the optical port of the optical module body 1 to the electrical port of the optical module body 1. In this embodiment, two second baffles 3 are defined to extend towards the direction from the light port to the electric port, so that the light module is inserted into the device, when the light module works on the device, one end of the light module is exposed outside the device, one end of the light module is inserted into the device, a fan in the device can pump and exhaust air inside the device to form air convection heat dissipation, one end of a vent hole 5 extends into the device, and the other end of the vent hole is exposed outside the device, so that air in the device and air outside the device form convection, thereby achieving a better heat dissipation effect, and electromagnetic leakage inside the device can be reduced.
As an optimization scheme of the embodiment of the present invention, referring to fig. 2, the surfaces of the two second baffles 3 facing away from the optical module body 1 are both located in the same plane with the outer surface 10 of the bottom plate 20. In this embodiment, the structure is defined so that two second baffles 3 and the bottom plate 20 form a complete planar structure for use in the apparatus.
As an optimization scheme of the embodiment of the invention, two first baffles 21 positioned on the outer side are respectively attached to two second baffles 3. In this embodiment, the two first baffles 21 on the outer sides are respectively attached to the two second baffles 3, so as to strengthen fixation, and in addition, electromagnetic radiation leakage can be prevented. Preferably, a heat-conductive glue may be filled between them.
As an optimization scheme of the embodiment of the present invention, the contact part between the outer surface 10 and each first baffle 21 is filled with heat-conducting glue. In this embodiment, the heat conduction glue is filled in the contact portion or the heat conduction material made of other materials can promote heat conduction on one hand, and on the other hand, the gap of the contact portion can also be eliminated, so that the contact portion and the gap are connected into a whole, the tightness of other portions except for the openings at the two ends of the vent hole 5 is promoted, and further electromagnetic radiation leakage is effectively prevented.
As an optimization scheme of the embodiment of the present invention, the outer surface 10 of the optical module body 1, which is in contact with each first baffle 21, and the two second baffles 3 are enclosed to form a groove 4, the heat conducting structure 2 is arranged in the groove 4, and the heat conducting structure 2 and the groove 4 are in close-fit connection, adhesive connection, bolt connection or snap connection. Wherein close-fitting connection is interference fit, and the viscose is connected by adopting heat conduction glue, and threaded holes can be formed in the bolt connection through bolts or screw threaded connection, and the buckle connection is locked by adopting a buckle. Of course, other connection means besides those described above may be used. The present embodiment is not limited.
As an optimization scheme of the embodiment of the present invention, the heat conducting structure 2, that is, the base plate 20 and each of the first baffles 21 are made of aluminum alloy, zinc alloy, copper alloy or magnesium alloy, or other heat conducting materials, and the base plate 20 also has a good electromagnetic shielding function by adopting these materials. These materials are not limited in this embodiment.
Referring to fig. 1-6, an embodiment of the present invention provides a communication device, including a communication device body, and the optical module described above, where the communication device body has an EMI leakage port 7, specifically, the EMI leakage port 7 is located at a front housing 6 of the body, the optical module is inserted into the communication device body from the EMI leakage port, and an inner side of the communication device body is connected to an outer side by the heat conducting structure. In this embodiment, the heat conducting structure (or the heat dissipating structure) is used to communicate the inside and the outside of the communication device body, and EMI radiation in the communication device can only leak through each vent hole 5, so that electromagnetic radiation can be effectively prevented from leaking when the number of vent holes 5 (formed by the base plate 20, the outer surface 10 and two adjacent first baffles 21 can be enclosed) is increased and narrowed.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an optical module with heat radiation structure, includes optical module body, its characterized in that: the light module comprises a light module body, and is characterized by further comprising a heat conduction structure arranged on the outer surface of at least one side of the light module body, wherein the heat conduction structure comprises a plurality of first baffles and a bottom plate for arranging the first baffles, the bottom plate and the outer surface are oppositely arranged, each first baffle is positioned between the bottom plate and the outer surface, one end of each first baffle away from the bottom plate is contacted with the outer surface, a limiting structure for arranging the heat conduction structure is arranged on the outer surface, the limiting structure comprises two second baffles which are outwards protruded from one opposite edge of the light module body and are fixedly arranged by the heat conduction structure, the two second baffles are oppositely arranged, each first baffle is positioned between the two second baffles, the bottom plate and each first baffle are in seamless adhesion through heat conduction glue, the two first baffles positioned on the outer side are respectively attached to the two second baffles, the contact part of the outer surface and each baffle is filled with heat conduction glue, and the heat conduction glue is filled between the first baffles and the second baffles.
2. The optical module with heat dissipation structure as defined in claim 1, wherein: the two second baffles are vertically arranged on the outer surface of the optical module body, and one side, deviating from the heat conducting structure, of each second baffle is located in the same plane with the side surface of the optical module body.
3. The optical module with heat dissipation structure as defined in claim 1, wherein: the two second baffles extend along the direction from the light port of the optical module body to the electric port of the optical module body.
4. The optical module with heat dissipation structure as defined in claim 1, wherein: the two second baffles are vertically arranged on the outer surface of the optical module body, and the upper surface of each second baffle is flush with the bottom plate.
5. Communication equipment, including communication equipment body, its characterized in that: the optical module according to any one of claims 1-4, wherein the communication device body has an EMI leakage port, the optical module is inserted into the communication device body from the EMI leakage port, and the inner side of the communication device body is communicated to the outer side by the heat conducting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910251231.2A CN109874281B (en) | 2019-03-29 | 2019-03-29 | Communication equipment and optical module with heat radiation structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910251231.2A CN109874281B (en) | 2019-03-29 | 2019-03-29 | Communication equipment and optical module with heat radiation structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109874281A CN109874281A (en) | 2019-06-11 |
| CN109874281B true CN109874281B (en) | 2024-03-19 |
Family
ID=66921706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910251231.2A Active CN109874281B (en) | 2019-03-29 | 2019-03-29 | Communication equipment and optical module with heat radiation structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109874281B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114063226B (en) * | 2020-08-06 | 2023-03-28 | 苏州旭创科技有限公司 | Optical module shell and optical module |
| CN113260237B (en) * | 2021-07-07 | 2021-10-01 | 武汉联特科技股份有限公司 | Optical module cooling system and optical module |
| CN115134002B (en) * | 2022-06-30 | 2023-06-23 | 重庆秦嵩科技有限公司 | 4-channel external modulation electro-optical conversion assembly based on photoelectric hybrid integration |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307450A (en) * | 2014-06-19 | 2016-02-03 | 中兴通讯股份有限公司 | Optical module radiator and communication equipment employing optical module radiator |
| JP2017111421A (en) * | 2015-12-14 | 2017-06-22 | 日本オクラロ株式会社 | Optical module and optical transmission device |
| CN208172310U (en) * | 2018-06-11 | 2018-11-30 | 深圳市英伟博科技有限公司 | The optical module shell of radiating structure design |
| CN109031550A (en) * | 2018-09-18 | 2018-12-18 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN209982994U (en) * | 2019-03-29 | 2020-01-21 | 武汉联特科技有限公司 | Communication equipment and optical module with heat dissipation structure |
-
2019
- 2019-03-29 CN CN201910251231.2A patent/CN109874281B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307450A (en) * | 2014-06-19 | 2016-02-03 | 中兴通讯股份有限公司 | Optical module radiator and communication equipment employing optical module radiator |
| JP2017111421A (en) * | 2015-12-14 | 2017-06-22 | 日本オクラロ株式会社 | Optical module and optical transmission device |
| CN208172310U (en) * | 2018-06-11 | 2018-11-30 | 深圳市英伟博科技有限公司 | The optical module shell of radiating structure design |
| CN109031550A (en) * | 2018-09-18 | 2018-12-18 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN209982994U (en) * | 2019-03-29 | 2020-01-21 | 武汉联特科技有限公司 | Communication equipment and optical module with heat dissipation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109874281A (en) | 2019-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109874281B (en) | Communication equipment and optical module with heat radiation structure thereof | |
| JP2018503934A (en) | Heat sink and power battery system | |
| CN113133279A (en) | Electronic device | |
| CN213603033U (en) | Cooling device of power converter and power converter | |
| CN117355089A (en) | Power conversion device and energy storage device | |
| CN209982994U (en) | Communication equipment and optical module with heat dissipation structure | |
| CN219592959U (en) | Heat abstractor and vehicle | |
| CN117320345A (en) | Power module and charging equipment | |
| CN116321690A (en) | Power equipment | |
| CN216596066U (en) | Electronic device | |
| CN215496843U (en) | Unmanned aerial vehicle battery heat radiation structure and unmanned aerial vehicle | |
| CN211090372U (en) | Waterproof heat radiation structure of ground station and ground station | |
| CN115209687A (en) | Electronic assembly for a motor vehicle | |
| CN211429851U (en) | Waterproof heat radiation structure and ground station | |
| CN113784583A (en) | Heat radiation structure, power driver and electric servo device | |
| CN218602539U (en) | Heat abstractor, power supply unit and integral type energy storage equipment | |
| CN215912434U (en) | Data transmission module assembly and electronic equipment | |
| CN218414749U (en) | Heat radiation structure, power supply unit and electric automobile | |
| CN217693548U (en) | Camera measuring device | |
| CN218570698U (en) | Closed heat dissipation device | |
| CN221225448U (en) | Heat dissipation module and computer device | |
| CN217684873U (en) | Control box | |
| CN221881399U (en) | Base heat radiation structure | |
| CN218071292U (en) | Integrated power module with good heat dissipation | |
| CN220305743U (en) | Radiator maintenance door structure and reinforced computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 430000 building 12, Block E, 52 Liufang Avenue, Donghu New Technology Development Zone, Wuhan, Hubei Province Applicant after: Wuhan Liante Technology Co.,Ltd. Address before: 430000 building 12, Block E, 52 Liufang Avenue, Donghu New Technology Development Zone, Wuhan, Hubei Province Applicant before: LINKTEL TECHNOLOGIES Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |