CN220087805U - Chip heat radiation structure of vehicle-mounted image product - Google Patents

Abstract

The utility model provides a chip heat radiation structure of a vehicle-mounted image product, which comprises an upper shell, a lower shell, a circuit board assembly, a camera module flat cable and a fastener, wherein a chip to be radiated is arranged on the circuit board assembly, a heat conduction boss is arranged at the position of the upper shell or the lower shell corresponding to the chip to be radiated, a first gap is arranged between the heat conduction boss and the top surface of the chip to be radiated, the periphery of the heat conduction boss protrudes out of a surrounding structure, a second gap is formed between the inner side surface of the surrounding structure and the outer side surface of the chip to be radiated, and heat conduction interface materials are filled in the first gap and the second gap. The enclosure structure can limit the freedom degree of the heat conduction interface material, can ensure that the heat conduction interface material wraps the surface of the chip to the maximum extent, and enables the heat dissipation effect of the chip to reach the optimal state by increasing the heat conduction area.

Description

Chip heat radiation structure of vehicle-mounted image product

Technical Field

The utility model belongs to the field of vehicle-mounted image products, and particularly relates to a chip heat dissipation structure of a vehicle-mounted image product.

Background

In the field of vehicle-mounted image products, particularly in the field of front-view camera image products in an ADAS (automatic adaptive automatic acquisition system), along with the remarkable improvement of the functional integration level, electronic components on a printed circuit board are increased, the functions of part of chips are increased, and the corresponding heat power consumption is remarkably improved. In order to ensure the safe working temperature and the service life of the product, a higher demand is put forward for heat dissipation of the product.

At present, in order to provide the dispersion speed of the chip, the gap between the chip and the heat dissipation metal in the front view camera is coated with heat conduction gel, in general, the heat dissipation metal is designed to be a heat conduction boss at a position corresponding to the chip, the heat conduction boss is generally designed to be planar, the heat conduction gel is extruded between two planes, the mode can not form better package on the chip, and the heat conduction effect can not be exerted to an optimal state.

Disclosure of Invention

The utility model aims to provide a chip heat dissipation structure of a vehicle-mounted image product, and aims to solve the problems that a heat conduction boss is designed to be planar in the vehicle-mounted image product, a good package cannot be formed on a chip, and a heat conduction effect cannot be exerted to an optimal state.

The utility model discloses a chip heat dissipation structure of a vehicle-mounted image product, which comprises an upper shell, a lower shell, a circuit board assembly, a camera module flat cable and a fastener, wherein the circuit board assembly, the camera module and the camera module flat cable are fixed in a space surrounded by the upper shell and the lower shell, the camera module is electrically connected with the circuit board assembly through the camera module flat cable, a chip needing heat dissipation is arranged on the circuit board assembly, and the upper shell and the lower shell are tightly connected through the fastener; the upper shell or the lower shell is provided with a heat conduction boss at a position corresponding to the chip to be cooled, a first gap is formed between the heat conduction boss and the top surface of the chip to be cooled, the periphery of the heat conduction boss protrudes out of the enclosing structure, a second gap is formed between the inner side surface of the enclosing structure and the outer side surface of the chip to be cooled, and a heat conduction interface material is filled in the first gap and the second gap.

Further, the thermally conductive interface material is a thermally conductive gel.

Further, the heat conduction boss is arranged on the inner side wall of the lower shell.

Further, the height of the first gap is less than 0.5mm.

Further, the height of the enclosure structure is not less than 0.5mm.

Further, the fastener is a screw.

Further, the vehicle-mounted image product is an intelligent front-view camera.

Compared with the prior art, the utility model has the beneficial effects that:

the heat-conducting boss is arranged at the position of the upper shell or the lower shell corresponding to the chip to be heat-radiated, the periphery of the heat-conducting boss protrudes out of the enclosing structure, and a gap between the heat-conducting boss and the top surface of the chip to be heat-radiated and a gap between the inner side surface of the enclosing structure and the outer side surface of the chip to be heat-radiated are filled with heat-conducting interface materials. The enclosure structure can limit the freedom degree of the heat conduction interface material, can ensure that the heat conduction interface material wraps the surface of the chip to the maximum extent, and enables the heat dissipation effect of the chip to reach the optimal state by increasing the heat conduction area.

Drawings

Fig. 1 is an exploded view of a chip heat dissipation structure of a vehicle-mounted image product according to an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional elevation view of the heat dissipating structure of the chip of FIG. 1;

fig. 3 is a schematic structural view of a lower case of the heat dissipation structure of the chip shown in fig. 1.

The marks in the figure:

the LED lamp comprises a 1-upper shell, a 2-lower shell, a 3-circuit board assembly, a 4-camera module, 5-fasteners, 6-heat-radiating chips, 7-heat-conducting bosses and 8-enclosure structures.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be the communication between the two parts. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1 and 2, a chip heat dissipation structure of a vehicle-mounted image product provided in this embodiment is shown, including an upper shell 1, a lower shell 2, a circuit board assembly 3, a camera module 4, a camera module flat cable and a fastener 5, the circuit board assembly 3, the camera module 4, the camera module flat cable are fixed in a space enclosed by the upper shell 1 and the lower shell 2, the camera module 4 is electrically connected with the circuit board assembly 3 through the camera module flat cable, the upper shell 1 and the lower shell 2 are fastened and connected through the fastener 5, in this embodiment, the fastener 5 is a screw.

The circuit board assembly 3 is provided with a chip 6 needing heat dissipation, the upper shell 1 or the lower shell 2 is provided with a heat conduction boss 7 corresponding to the chip 6 needing heat dissipation, a first gap is formed between the heat conduction boss 7 and the top surface of the chip 6 needing heat dissipation, the periphery of the heat conduction boss 7 protrudes out of the enclosing structure 8, a second gap is formed between the inner side surface of the enclosing structure 8 and the outer side surface of the chip 6 needing heat dissipation, and heat conduction interface materials are filled in the first gap and the second gap.

As shown in fig. 3, this embodiment exemplifies an embodiment in which the heat conduction boss 7 is provided on the inner side wall of the lower case 2, and in other embodiments, the heat conduction boss 7 may be provided on the inner side wall of the upper case 1 or the lower case 2 at the same time, depending on the arrangement of the heat dissipation chips 6.

Preferably, the heat-conducting interface material of this embodiment adopts heat-conducting gel, and the height of the first gap is less than 0.5mm, and the height of the enclosure structure 8 is not less than 0.5mm.

The vehicle-mounted image product of the embodiment is an intelligent front-view camera.

The enclosure structure 8 provided in this embodiment can limit the degree of freedom of the heat conduction interface material, and can ensure that the heat conduction interface material wraps the surface of the chip to the maximum extent, and the heat dissipation effect of the chip reaches the optimal state by increasing the heat conduction area.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (7)

1. The chip heat dissipation structure of the vehicle-mounted image product comprises an upper shell, a lower shell, a circuit board assembly, a camera module flat cable and a fastener, wherein the circuit board assembly, the camera module and the camera module flat cable are fixed in a space surrounded by the upper shell and the lower shell, the camera module is electrically connected with the circuit board assembly through the camera module flat cable, a chip needing heat dissipation is arranged on the circuit board assembly, and the upper shell and the lower shell are tightly connected through the fastener; the heat-conducting structure is characterized in that a heat-conducting boss is arranged at the position, corresponding to the chip to be cooled, of the upper shell or the lower shell, a first gap is formed between the heat-conducting boss and the top surface of the chip to be cooled, the periphery of the heat-conducting boss protrudes out of a surrounding structure, the inner side surface of the surrounding structure and the outer side surface of the chip to be cooled form a second gap, and heat-conducting interface materials are filled in the first gap and the second gap.

2. The chip heat spreading structure according to claim 1, wherein the thermally conductive interface material is a thermally conductive gel.

3. The chip heat dissipating structure of claim 1 wherein said thermally conductive boss is disposed on an inside wall of said lower housing.

4. The chip heat dissipating structure of claim 1 wherein the height of the first gap is less than 0.5mm.

5. The chip heat dissipating structure of claim 1 wherein the height of said enclosure structure is not less than 0.5mm.

6. The chip heat dissipating structure of claim 1, wherein the fastener is a screw.

7. The chip heat dissipating structure of claim 1, wherein the onboard image product is an intelligent front-view camera.