CN213042835U

CN213042835U - Dustproof heat dissipation type pressure switch

Info

Publication number: CN213042835U
Application number: CN202022407794.7U
Authority: CN
Inventors: 辛宏伟
Original assignee: Tianjin Langjie Intelligent Technology Co ltd
Current assignee: Tianjin Langjie Intelligent Technology Co ltd
Priority date: 2020-10-26
Filing date: 2020-10-26
Publication date: 2021-04-23
Anticipated expiration: 2030-10-26

Abstract

The utility model provides a dustproof heat dissipation type pressure switch belongs to the electrical switch field. The dustproof heat dissipation type pressure switch comprises a shell and a heat dissipation assembly. And a dustproof screen is fixed in the heat dissipation port. The heat radiating fins are attached to the heating surfaces of the semiconductor refrigerating pieces, the refrigerating surfaces of the semiconductor refrigerating pieces are arranged in the shell, and the temperature sensor is arranged in the shell; when the heat dissipation of electrical equipment is less than the heat production in the casing, the unable nature of heat is arranged and is dispersed, and temperature risees in the casing, when reaching the threshold value that temperature sensor set for, control semiconductor refrigeration piece starts, initiatively absorbs the heat to carry out heat diffusion to the external world through the radiating fin who adds, be favorable to reducing the casing internal temperature, make inside electrical equipment operate under normal environment, the life of extension equipment reduces the possibility that the fire incident that arouses because of high temperature in the casing takes place.

Description

Dustproof heat dissipation type pressure switch

Technical Field

The utility model relates to an electrical switch field particularly, relates to a dustproof heat dissipation type pressure switch.

Background

At present, an electrical switch is one of the indispensable articles in daily life, and mainly comprises a switch housing and elements located inside the housing. At present, the switch shell is mainly made of high polymers and has excellent mechanical properties.

Although the shell of the existing electric switch can meet the requirements of most production, the heat generation of internal components is too fast in a specific use process, and the internal components do not have the function of self-heat dissipation, so that the temperature of the switch is increased, equipment is easily burnt out due to high temperature or the service life of the equipment is shortened, and the potential safety hazard of fire disasters can be caused in serious conditions.

SUMMERY OF THE UTILITY MODEL

In order to compensate the above deficiency, the utility model provides a dustproof heat dissipation type pressure switch aims at improving the problem that current electrical switch radiating effect is poor, have the potential safety hazard when using.

The utility model discloses a realize like this:

the utility model provides a dustproof heat dissipation type pressure switch, including casing and radiator unit.

The surface of the shell is provided with a heat dissipation opening, and a dustproof screen plate is fixed in the heat dissipation opening.

The heat dissipation assembly comprises a semiconductor refrigeration piece, a heat dissipation fin and a temperature sensor, the semiconductor refrigeration piece is embedded in the surface of the shell, the heat dissipation fin is attached to the heating surface of the semiconductor refrigeration piece, the refrigeration surface of the semiconductor refrigeration piece is arranged in the shell, and the temperature sensor is arranged in the shell.

The utility model discloses an in one embodiment, the thermovent sets up the casing bottom, dustproof otter board joint in the thermovent.

The utility model discloses an in one embodiment, casing back opening sets up the fixed mounting and has the backplate, backplate surface fixed mounting has power connection, the backplate surface inlays and is equipped with the pressure input air cock.

The utility model discloses an in an embodiment, be provided with the cotton that absorbs water in the cooling opening, the cotton setting that absorbs water is in dustproof otter board surface, pressure input air cock surface cover has the sealing washer, the external screw thread has been seted up to pressure input air cock tip.

The utility model discloses an in an embodiment, the casing openly inlays and is equipped with the display screen, display screen downside fixed mounting has the button, the button with display screen electric connection.

The utility model discloses an in the embodiment, install the singlechip in the casing, the automatically controlled end of semiconductor refrigeration piece with the electric connection of the automatically controlled output of singlechip, temperature sensor's signal output part with the signal reception end electric connection of singlechip.

The utility model discloses an in the embodiment, semiconductor refrigeration piece sets up the casing top, radiating fin fixes the casing surface.

The utility model discloses an in the embodiment, shells inner wall is fixed with the heat-conducting plate, the heat-conducting plate with the laminating of the refrigeration face of semiconductor refrigeration piece.

In an embodiment of the present invention, the heat conducting plate is made of copper, and the heat conducting plate has a heat pipe fixedly connected to the surface thereof, and both ends of the heat pipe extend to both sides of the inner wall of the casing.

In an embodiment of the present invention, the semiconductor refrigeration piece and the binding face between the heat dissipation fins are coated with heat conductive silicone grease, the semiconductor refrigeration piece and the binding face between the heat conduction plates are coated with heat conductive silicone grease.

The utility model has the advantages that: the utility model discloses a what above-mentioned design obtained prevents dust heat dissipation type pressure switch, during the use, the thermovent that housing face was seted up dispels the heat in the inner wall electrical component use of being convenient for, the effectual isolated external dust of dustproof otter board that adds and impurity get into in the casing, for providing a good operational environment in the casing, when the electrical equipment heat dissipation is less than the heat production in the casing, the heat can't be discharged naturally, rise when casing internal temperature, when reaching the threshold value that temperature sensor set for, control semiconductor refrigeration piece starts, initiatively absorb heat, and carry out heat diffusion to the external world through the radiating fin who adds, be favorable to reducing the casing internal temperature, make inside electrical equipment function under normal environment, the life of extension equipment, reduce the possibility that the fire incident that arouses because of casing internal high temperature takes place.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic external perspective structure diagram provided in an embodiment of the present invention;

fig. 2 is a schematic view of a back plate structure provided in an embodiment of the present invention;

fig. 3 is a schematic view of a shell cut-away structure provided in an embodiment of the present invention;

fig. 4 is a schematic structural view of a heat dissipation assembly according to an embodiment of the present invention.

In the figure: 100. a housing; 110. a dustproof screen plate; 130. a back plate; 131. a power supply connector; 133. a pressure input air nozzle; 150. a display screen; 170. pressing a key; 300. a heat dissipating component; 310. a semiconductor refrigeration sheet; 311. a heat conducting plate; 313. a heat pipe; 330. a heat dissipating fin; 350. a temperature sensor.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the utility model provides a. Embodiments, all other embodiments obtained by a person skilled in the art without any inventive step are within the scope of the present invention.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Examples

Referring to fig. 1-4, the present invention provides a technical solution: a dustproof heat dissipation type pressure switch comprises a shell 100 and a heat dissipation assembly 300.

The heat sink assembly 300 is fixedly disposed on a sidewall of the housing 100, a heat generating portion of the heat sink assembly 300 is disposed outside the housing 100, and a heat absorbing portion of the heat sink assembly 300 is disposed inside the housing 100.

Referring to fig. 1-2, a heat sink is disposed on the surface of the housing 100, and a dust screen 110 is fixed in the heat sink;

in this embodiment, the heat dissipation opening is disposed at the bottom of the housing 100, the dustproof screen 110 is clamped in the heat dissipation opening for ventilation and heat dissipation, and the dustproof screen 110 is additionally provided to reduce impurities such as dust from entering the housing 100; wherein, heat dissipation department is provided with the water conservancy diversion fan, water conservancy diversion fan fixed mounting in the 100 inner walls of casing add the water conservancy diversion fan, be convenient for drive the air current and flow, it is cotton to be provided with the absorption in the heat dissipation mouth, the cotton setting that absorbs water is in dustproof otter board 110 surfaces, pressure input air cock 133 surface cover has the sealing washer, the external screw thread has been seted up to pressure input air cock 133 tip.

It should be noted that a back plate 130 is fixedly installed at an opening of the back of the housing 100, a power connector 131 is fixedly installed on the outer surface of the back plate 130, and a pressure input nozzle 133 is embedded on the surface of the back plate 130 and is used for connecting an air source and a power supply.

In specific implementation, the front surface of the casing 100 is embedded with a display screen 150, a key 170 is fixedly installed at the lower side of the display screen 150, and the key 170 is electrically connected with the display screen 150.

In other embodiments, a single chip microcomputer is installed in the housing 100, the electrical control end of the semiconductor refrigeration chip 310 is electrically connected to the electrical control output of the single chip microcomputer, and the signal output end of the temperature sensor 350 is electrically connected to the signal receiving end of the single chip microcomputer.

Referring to fig. 3 to 4, the heat dissipation assembly 300 includes a semiconductor refrigeration sheet 310, a heat dissipation fin 330 and a temperature sensor 350, the semiconductor refrigeration sheet 310 is embedded on the surface of the housing 100, the heat dissipation fin 330 is attached to the heating surface of the semiconductor refrigeration sheet 310, the cooling surface of the semiconductor refrigeration sheet 310 is disposed in the housing 100, and the temperature sensor 350 is disposed in the housing 100.

In this embodiment, the semiconductor cooling plate 310 is disposed on the top of the housing 100, and the heat dissipation fins 330 are fixed on the outer surface of the housing 100; the inner wall of the casing 100 is fixed with a heat conducting plate 311, the heat conducting plate 311 is attached to the refrigerating surface of the semiconductor refrigerating sheet 310, the heat conducting plate 311 is made of copper, the heat conducting plate 311 is fixedly connected with a heat pipe 313, two ends of the heat pipe 313 extend to two sides of the inner wall of the casing 100, the heat pipe 313 is additionally arranged to increase the contact area between the refrigerating surface of the semiconductor refrigerating sheet 310 and the inner wall of the casing 100, and heat absorption and heat dissipation efficiency is improved.

It should be noted that the adhesion surface between the semiconductor refrigeration sheet 310 and the heat dissipation fin 330 is coated with heat conductive silicone grease, and the adhesion surface between the semiconductor refrigeration sheet 310 and the heat conduction plate 311 is coated with heat conductive silicone grease, so as to improve the heat conduction effect.

This dustproof heat dissipation type pressure switch's theory of operation: when the heat dissipation device is used, the heat dissipation port formed in the surface of the shell 100 is convenient for heat dissipation of the inner wall electric element in the using process, the additionally arranged dustproof screen 110 effectively isolates external dust and impurities from entering the shell 100, a good operation environment is provided for the shell 100, when the heat dissipation of the electric equipment in the shell 100 is smaller than the heat generation of the electric element, the heat cannot be naturally dissipated, when the temperature in the shell 100 rises and reaches the threshold value set by the temperature sensor 350, the semiconductor refrigeration sheet 310 is controlled to start to absorb the heat actively, and the heat is diffused to the outside through the additionally arranged heat dissipation fins 330, so that the temperature in the shell 100 is favorably reduced, the internal electric equipment is enabled to operate in a normal environment, the service life of the equipment is prolonged, and the possibility of fire accidents caused by high temperature in the shell.

It should be noted that the specific model specifications of the power connector 131, the display screen 150, the semiconductor chilling plate 310 and the temperature sensor 350 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.

The power supply and the principle of the power connector 131, the display 150, the semiconductor cooling plate 310 and the temperature sensor 350 are clear to those skilled in the art and will not be described in detail herein.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A dustproof heat dissipation type pressure switch is characterized by comprising

The dustproof screen plate comprises a shell (100), wherein a heat dissipation opening is formed in the surface of the shell (100), and a dustproof screen plate (110) is fixed in the heat dissipation opening;

radiating assembly (300), radiating assembly (300) include semiconductor refrigeration piece (310), radiating fin (330) and temperature sensor (350), semiconductor refrigeration piece (310) inlay and adorn in casing (100) surface, radiating fin (330) with the face laminating that heats of semiconductor refrigeration piece (310), the refrigeration face setting of semiconductor refrigeration piece (310) is in casing (100), temperature sensor (350) set up in casing (100).

2. The dustproof heat dissipation type pressure switch according to claim 1, wherein the heat dissipation opening is disposed at the bottom of the housing (100), and the dustproof mesh plate (110) is clamped in the heat dissipation opening.

3. The dustproof heat dissipation type pressure switch according to claim 1, wherein a back plate (130) is fixedly installed at an opening of the back surface of the housing (100), a power connector (131) is fixedly installed on the outer surface of the back plate (130), and a pressure input air nozzle (133) is embedded on the surface of the back plate (130).

4. The dustproof heat dissipation type pressure switch according to claim 3, wherein water absorbent cotton is arranged in the heat dissipation port, the water absorbent cotton is arranged on the surface of the dustproof screen (110), a sealing ring is sleeved on the surface of the pressure input air nozzle (133), and an external thread is formed at the end of the pressure input air nozzle (133).

5. The dustproof heat dissipation type pressure switch according to claim 1, wherein a display screen (150) is embedded in a front surface of the housing (100), a button (170) is fixedly installed on a lower side of the display screen (150), and the button (170) is electrically connected with the display screen (150).

6. The dustproof heat dissipation type pressure switch according to claim 1, wherein a single chip microcomputer is installed in the housing (100), an electric control end of the semiconductor refrigeration chip (310) is electrically connected with an electric control output of the single chip microcomputer, and a signal output end of the temperature sensor (350) is electrically connected with a signal receiving end of the single chip microcomputer.

7. The dustproof heat dissipation type pressure switch of claim 1, wherein the semiconductor cooling plate (310) is disposed on the top of the housing (100), and the heat dissipation fins (330) are fixed on the outer surface of the housing (100).

8. The dustproof heat dissipation type pressure switch according to claim 1, wherein a heat conducting plate (311) is fixed on the inner wall of the casing (100), and the heat conducting plate (311) is attached to the refrigerating surface of the semiconductor refrigerating sheet (310).

9. The dustproof heat dissipation type pressure switch according to claim 8, wherein the heat conducting plate (311) is made of copper, a heat pipe (313) is fixedly connected to the surface of the heat conducting plate (311), and two ends of the heat pipe (313) extend to two sides of the inner wall of the housing (100).

10. The dustproof heat dissipation type pressure switch according to claim 8, wherein the bonding surface between the semiconductor refrigeration piece (310) and the heat dissipation fin (330) is coated with heat conductive silicone grease, and the bonding surface between the semiconductor refrigeration piece (310) and the heat conduction plate (311) is coated with heat conductive silicone grease.