CN208227420U - A kind of easy heat radiation circuit board - Google Patents
A kind of easy heat radiation circuit board Download PDFInfo
- Publication number
- CN208227420U CN208227420U CN201820712783.XU CN201820712783U CN208227420U CN 208227420 U CN208227420 U CN 208227420U CN 201820712783 U CN201820712783 U CN 201820712783U CN 208227420 U CN208227420 U CN 208227420U
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- China
- Prior art keywords
- water
- circuit board
- heat
- fixedly installed
- water pipe
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Abstract
The utility model provides a kind of easy heat radiation circuit board, including circuit board, the bottom surface of the circuit board is fixedly installed with snakelike heat conducting pipe, heat dissipating housing is socketed at the top of the lateral wall of the circuit board, the inner cavity top of the heat dissipating housing is fixedly installed with the first radiator, since the element height in various boards is different, heat dissipation effect can be kept more preferable by can fit closely the different element of height with the second thermally conductive sheet, it is radiated using left and right ends of second radiator to heat dissipation cavity, heat dissipation cavity is contacted by water-cooling head, the internal heat of heat dissipation cavity imported into the water in water-cooling head, then pass through the first water pipe, U-typed water pipe, second water pipe, pass through water pump again, cold water is pumped into water-cooling head by radiator, the rear and front end of heat dissipation cavity is exported by third thermally conductive sheet, heat is given out by heat release hole , by repeatedly radiating, circuit board is made to be easier to radiate.
Description
Technical field
The utility model relates to circuit board technology field, specially a kind of easy heat radiation circuit board.
Background technique
The circuit board plate material being widely used at present is to cover copper, epoxy glass fabric substrate or phenolic resin glass cloth base material, also
There is the paper-based copper-coated board material used on a small quantity.Although these substrates have excellent electric property and processing performance, poor radiation,
As the sinking path of high heater element, can hardly look to conducting heat by circuit board resin itself, but from the table of element
Towards radiating in surrounding air.Current heat dissipation keeps heat dissipation effect poor, does not have good simply by external fan cooling
Heat spreading function.
Utility model content
The purpose of this utility model is to provide a kind of easy heat radiation circuit boards, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the utility model provides the following technical solutions: a kind of easy heat radiation circuit board, including circuit
Plate, the bottom surface of the circuit board are fixedly installed with snakelike heat conducting pipe, are socketed with heat dissipating housing at the top of the lateral wall of the circuit board, institute
The inner cavity top for stating heat dissipating housing is fixedly installed with the first radiator, and the inner cavity left and right ends of the heat dissipating housing are fixedly installed with
Second radiator.
Preferably, first radiator includes shell, and the lower surface of the shell offers heat dissipation cavity, the heat dissipation
It is fixedly installed with the first thermally conductive sheet at the top of the inner sidewall of chamber, the lower surface of first thermally conductive sheet is equidistant to be uniformly fixedly installed with
One end of spring, the other end of the spring are fixedly installed with the second thermally conductive sheet.
Preferably, second radiator includes water-cooling head, and water-cooling head is fixedly installed in the inner sidewall right side of heat dissipating housing
End, the upper surface top of the water-cooling head offer water inlet, and the right side wall bottom end of the water-cooling head offers water outlet, described
The inner sidewall of water outlet is plugged with one end of the first water pipe, and the first water pipe runs through the right side wall of heat dissipating housing, first water pipe
The other end be plugged with one end of U-typed water pipe, the other end of the U-typed water pipe is plugged with the water inlet of water pump, the water
The water outlet of pump is plugged with one end of the second water pipe, and the other end of second water pipe is plugged in the inner sidewall of water inlet, described
Radiator is socketed at the top of the lateral wall of first water pipe.
Preferably, the lateral wall of the heat dissipating housing is equidistant is uniformly provided with heat release hole.
Preferably, the lower surface four corners of the circuit board are fixedly installed with foot pad.
Preferably, the inner cavity front-rear side walls of the heat dissipating housing are fixedly installed with third thermally conductive sheet.
Compared with prior art, the utility model has the beneficial effects that the utility model respectively from the bottom of circuit board and
Top respectively effectively radiates to circuit board, i.e., bottom carries out Homogeneouslly-radiating, and the heat dissipation at top by snakelike heat conducting pipe
The first radiator and the second radiator in cover radiate to the top of circuit board and surrounding, and the first radiator can
With the heat dissipation that the first thermally conductive sheet and the second thermally conductive sheet by top are bonded the heater element on circuit board, enhancing dissipates
Thermal effect can be by can be with second by the different element of height since the element height in various boards is different
Thermally conductive sheet, which fits closely, keeps heat dissipation effect more preferable, is radiated using left and right ends of second radiator to heat dissipation cavity, i.e., logical
Water-cooling head contact heat dissipation cavity is crossed, the internal heat of heat dissipation cavity imported into the water in water-cooling head, the first water is then passed through
Pipe, U-typed water pipe, the second water pipe, then cold water is pumped into water-cooling head by water pump, radiator, Water-cooling circulating is formed, makes to dissipate
Thermal effect is more preferable, and the rear and front end of heat dissipation cavity is exported by third thermally conductive sheet, heat is given out by heat release hole, by repeatedly dissipating
Heat makes circuit board be easier to radiate.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the first construction for heat radiating device schematic diagram of the utility model；
Fig. 3 is heat dissipating housing right end the second construction for heat radiating device schematic diagram of the utility model.
In figure: 1 circuit board, 2 snakelike heat conducting pipes, 3 heat dissipating housings, 4 first radiators, 41 shells, 42 heat dissipation cavities, 43 first
Thermally conductive sheet, 44 springs, 45 second thermally conductive sheets, 5 second radiators, 51 water-cooling heads, 52 water inlets, 53 water outlets, 54 first water
Pipe, 55 water pumps, 56 second water pipes, 57 radiators, 58 U-typed water pipes, 6 heat release holes, 7 foots pad, 8 third thermally conductive sheets.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of easy heat radiation circuit board, including circuit board 1,
The bottom surface of circuit board 1 is fixedly installed with snakelike heat conducting pipe 2, is socketed with heat dissipating housing 3 at the top of the lateral wall of circuit board 1, heat dissipating housing 3
Inner cavity top is fixedly installed with the first radiator 4, and the inner cavity left and right ends of heat dissipating housing 3 are fixedly installed with the second radiator
5, it is effectively radiated to circuit board 1 respectively from the bottom and top of circuit board 1 respectively first, i.e., bottom passes through snakelike thermally conductive
Pipe 2 carries out Homogeneouslly-radiating, and the first radiator 4 and the second radiator 5 in the heat dissipating housing 3 at top are to the top of circuit board 1
Portion and surrounding radiate, and the first radiator 4 can be right by first thermally conductive sheet 43 at top and the second thermally conductive sheet 45
The heat dissipation that heater element on circuit board is bonded enhances heat dissipation effect, since the element height in various boards is different,
Heat dissipation effect can be kept more preferable by can fit closely the different element of height with the second thermally conductive sheet 45, use second
Radiator 5 radiates to the left and right ends of heat dissipation cavity 42, i.e., heat dissipation cavity 42 is contacted by water-cooling head 51, to heat dissipation cavity 42
Internal heat imported into the water in water-cooling head 51, then by the first water pipe 54, U-typed water pipe, the second water pipe 56, then
Cold water is pumped into water-cooling head 51 by water pump 55, radiator 57, Water-cooling circulating is formed, keeps heat dissipation effect more preferable, heat dissipation cavity
42 rear and front end is exported by third thermally conductive sheet 8, is given out heat by heat release hole 6, by repeatedly radiating, is made circuit board 1
It is easier to radiate.
Specifically, in order to first to the fever on circuit board by first thermally conductive sheet 43 at top and the second thermally conductive sheet 45
The heat dissipation that part is bonded enhances heat dissipation effect, can be by will height since the element height in various boards is different
Different elements can be fitted closely with the second thermally conductive sheet 45 keeps heat dissipation effect more preferable, and the first radiator 4 includes shell 41,
The lower surface of shell 41 offers heat dissipation cavity 42, is fixedly installed with the first thermally conductive sheet 43 at the top of the inner sidewall of heat dissipation cavity 42, and first
The equidistant one end for being uniformly fixedly installed with spring 44 in the lower surface of thermally conductive sheet 43, the other end of spring 44 are fixedly installed with second
Thermally conductive sheet 45.
Specifically, contacting heat dissipation cavity 42 by water-cooling head 51, then pass through the first water pipe 54, U-typed water pipe, the second water
Pipe 56 and water pump 55, radiator 57 imported into the water in water-cooling head 51 to the internal heat of heat dissipation cavity 42, then lead to
The first water pipe 54, U-typed water pipe, the second water pipe 56 are crossed, then cold water is pumped by water-cooling head 51 by water pump 55, radiator 57
It is interior, Water-cooling circulating is formed, keeps heat dissipation effect more preferable, the second radiator 5 includes water-cooling head 51, and water-cooling head 51 is fixedly installed in
The inner sidewall right end of heat dissipating housing 3, the upper surface top of water-cooling head 51 offer water inlet 52, and the right side wall bottom end of water-cooling head 51 is opened
Equipped with water outlet 53, the inner sidewall of water outlet 53 is plugged with one end of the first water pipe 54, and the first water pipe 54 is through heat dissipating housing 3
The other end of right side wall, the first water pipe 54 is plugged with one end of U-typed water pipe 58, and the other end of U-typed water pipe 58 is plugged with water
The water inlet of pump 55, the water outlet of water pump 55 are plugged with one end of the second water pipe 56, the other end of the second water pipe 56 be plugged in into
The lateral wall top of the inner sidewall at the mouth of a river 52, the first water pipe 54 is socketed with radiator 57, and water pump 55 is electrically connected external power supply.
Specifically, improve heat dissipation effect, the lateral wall of the heat dissipating housing 3 and lateral wall of shell 41 is equidistant uniformly opens up
There is heat release hole 6.
Specifically, snakelike heat conducting pipe 2 deforms in order to prevent, the lower surface four corners of circuit board 1 are fixedly installed with foot
Pad 7.
Specifically, in order to radiate from the surrounding of heat dissipation cavity 42 to circuit board 1, the inner cavity front-rear side walls of heat dissipating housing 3 are equal
It is fixedly installed with third thermally conductive sheet 8.
Working principle: it is effectively radiated to circuit board 1 respectively from the bottom and top of circuit board 1 respectively first, i.e.,
Bottom carries out Homogeneouslly-radiating by snakelike heat conducting pipe 2, and the first radiator 4 and the second heat dissipation dress in the heat dissipating housing 3 at top
The top and surrounding for setting 5 pairs of circuit boards 1 are radiated, the first radiator 4 can by first thermally conductive sheet 43 at top with
And second heat dissipation that the heater element on circuit board is bonded of thermally conductive sheet 45, enhance heat dissipation effect, due to various boards
On element height it is different, can make to radiate by can fit closely the different element of height with the second thermally conductive sheet 45
Effect is more preferable, is radiated using the second radiator 5 to the left and right ends of heat dissipation cavity 42, that is, passes through the contact heat dissipation of water-cooling head 51
Chamber 42 imported into the water in water-cooling head 51 to the internal heat of heat dissipation cavity 42, then passes through the first water pipe 54, U-typed
Water pipe, the second water pipe 56, then cold water is pumped into water-cooling head 51 by water pump 55, radiator 57, Water-cooling circulating is formed, makes to dissipate
Thermal effect is more preferable, and the rear and front end of heat dissipation cavity 42 is exported by third thermally conductive sheet 8, heat is given out by heat release hole 6, by more
Secondary heat dissipation makes circuit board 1 be easier to radiate.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of easy heat radiation circuit board, including circuit board (1), it is characterised in that: the bottom surface of the circuit board (1) is fixedly installed with
The lateral wall top of snakelike heat conducting pipe (2), the circuit board (1) is socketed with heat dissipating housing (3), the inner cavity top of the heat dissipating housing (3)
Portion is fixedly installed with the first radiator (4), and the inner cavity left and right ends of the heat dissipating housing (3) are fixedly installed with the second heat dissipation dress
Set (5).
2. a kind of easy heat radiation circuit board according to claim 1, it is characterised in that: first radiator (4) includes
The lower surface of shell (41), the shell (41) offers heat dissipation cavity (42), fixed at the top of the inner sidewall of the heat dissipation cavity (42)
It is equipped with the first thermally conductive sheet (43), the lower surface of first thermally conductive sheet (43) is equidistant to be uniformly fixedly installed with spring (44)
The other end of one end, the spring (44) is fixedly installed with the second thermally conductive sheet (45).
3. a kind of easy heat radiation circuit board according to claim 1, it is characterised in that: second radiator (5) includes
Water-cooling head (51), and water-cooling head (51) is fixedly installed in the inner sidewall right end of heat dissipating housing (3), the upper surface of the water-cooling head (51)
Top offers water inlet (52), and the right side wall bottom end of the water-cooling head (51) offers water outlet (53), the water outlet
(53) inner sidewall is plugged with one end of the first water pipe (54), and the first water pipe (54) runs through the right side wall of heat dissipating housing (3), described
The other end of first water pipe (54) is plugged with one end of U-typed water pipe (58), and the other end of the U-typed water pipe (58) is plugged with
The water outlet of the water inlet of water pump (55), the water pump (55) is plugged with one end of the second water pipe (56), second water pipe
(56) the other end is plugged in the inner sidewall of water inlet (52), is socketed with radiator at the top of the lateral wall of first water pipe (54)
(57).
4. a kind of easy heat radiation circuit board according to claim 1, it is characterised in that: the lateral wall etc. of the heat dissipating housing (3)
Distance is uniformly provided with heat release hole (6).
5. a kind of easy heat radiation circuit board according to claim 1, it is characterised in that: the lower surface four of the circuit board (1)
Foot pad (7) are fixedly installed at angle.
6. a kind of easy heat radiation circuit board according to claim 1, it is characterised in that: before and after the inner cavity of the heat dissipating housing (3)
Side wall is fixedly installed with third thermally conductive sheet (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820712783.XU CN208227420U (en) | 2018-05-14 | 2018-05-14 | A kind of easy heat radiation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820712783.XU CN208227420U (en) | 2018-05-14 | 2018-05-14 | A kind of easy heat radiation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208227420U true CN208227420U (en) | 2018-12-11 |
Family
ID=64507808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820712783.XU Expired - Fee Related CN208227420U (en) | 2018-05-14 | 2018-05-14 | A kind of easy heat radiation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208227420U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267504A (en) * | 2019-07-19 | 2019-09-20 | 深圳市睿晖新材料有限公司 | A kind of conductive structure |
-
2018
- 2018-05-14 CN CN201820712783.XU patent/CN208227420U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267504A (en) * | 2019-07-19 | 2019-09-20 | 深圳市睿晖新材料有限公司 | A kind of conductive structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 Termination date: 20190514 |