CN212933522U - Strengthen radiating SDD main control chip - Google Patents
Strengthen radiating SDD main control chip Download PDFInfo
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- CN212933522U CN212933522U CN202022289205.XU CN202022289205U CN212933522U CN 212933522 U CN212933522 U CN 212933522U CN 202022289205 U CN202022289205 U CN 202022289205U CN 212933522 U CN212933522 U CN 212933522U
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- fixedly connected
- heat dissipation
- sdd
- control chip
- chip
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 55
- 239000000110 cooling liquid Substances 0.000 claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 14
- 238000001816 cooling Methods 0.000 abstract description 7
- 239000002826 coolant Substances 0.000 description 5
- 230000002708 enhancing effect Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- -1 graphite alkene Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型提供一种加强散热的SDD主控芯片，属于芯片散热技术领域，该加强散热的SDD主控芯片包括主板，所述主板上表面的中部固定连接有固定框，所述主板上表面的中部固定连接有芯片本体，所述芯片本体的上表面固定连接有散热片，所述芯片本体的外侧固定连接有保护圈，所述主板的外侧固定连接有支撑架，所述支撑架的内部固定连接有冷却储液箱，所述支撑架的上表面固定连接有散热风扇，所述冷却储液箱的一端固定连接有微型水泵，所述微型水泵的一端固定连接有出液口连接头。该加强散热的SDD主控芯片中的冷却液在冷却储液箱、出液管、散热铜管和进液管内循环流动，对芯片本体进行散热，散热效果好。
The utility model provides an SDD main control chip with enhanced heat dissipation, belonging to the technical field of chip heat dissipation. The SDD main control chip with enhanced heat dissipation comprises a main board, and a fixing frame is fixedly connected to the middle of the upper surface of the main board, and the upper surface of the main board is fixedly connected with a fixing frame. A chip body is fixedly connected in the middle, a heat sink is fixedly connected to the upper surface of the chip body, a protection ring is fixedly connected to the outside of the chip body, a support frame is fixedly connected to the outside of the main board, and the inside of the support frame is fixed A cooling liquid storage tank is connected, a cooling fan is fixedly connected to the upper surface of the support frame, one end of the cooling liquid storage tank is fixedly connected with a micro water pump, and one end of the micro water pump is fixedly connected with a liquid outlet connector. The cooling liquid in the SDD main control chip with enhanced heat dissipation circulates in the cooling liquid storage tank, the liquid outlet pipe, the heat dissipation copper pipe and the liquid inlet pipe to dissipate heat to the chip body, and the heat dissipation effect is good.
Description
Technical Field
The utility model belongs to the technical field of the chip heat dissipation, concretely relates to strengthen radiating SDD main control chip.
Background
Chips, also known as microcircuits (microcircuits), microchips (microchips), and Integrated Circuits (ICs). Refers to a silicon chip containing integrated circuits, which is small in size and is often part of a computer or other electronic device.
The SDD main control chip used in the market at present is mostly subjected to integral heat dissipation by a heat dissipation fan, the heat dissipation effect is not good, the integral performance of the chip cannot be exerted, and the chip is mostly directly welded on a main board and does not have good protection, so that the chip is easy to collide with and damage.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a strengthen radiating SDD main control chip, aim at solving among the prior art SDD main control chip and carry out whole heat dissipation by radiator fan mostly, the radiating effect is not good, can not exert the wholeness ability of chip to the chip is most directly welded on the mainboard, does not have good protection, makes the chip collide with the problem of damage easily.
In order to achieve the above object, the utility model provides a following technical scheme: an SDD main control chip for enhancing heat dissipation comprises a mainboard, wherein a fixed frame is fixedly connected to the middle part of the upper surface of the mainboard, a chip body is fixedly connected to the middle part of the upper surface of the mainboard, a heat dissipation sheet is fixedly connected to the upper surface of the chip body, a protection ring is fixedly connected to the outer side of the chip body, a support frame is fixedly connected to the outer side of the mainboard, a cooling liquid storage tank is fixedly connected to the inner part of the support frame, a heat dissipation fan is fixedly connected to the upper surface of the support frame, a micro water pump is fixedly connected to one end of the cooling liquid storage tank, a liquid outlet connector is fixedly connected to one end of the micro water pump, a liquid outlet pipe is fixedly connected to one end of the liquid outlet connector, a conversion head is fixedly connected to one end of the liquid, one end of the radiating copper pipe, which is far away from the liquid outlet pipe, is fixedly connected with a liquid inlet pipe through a conversion head, and one end of the liquid inlet pipe, which is far away from the conversion head, is fixedly connected with a liquid inlet connector.
In order to make this strengthen radiating SDD main control chip fixed convenient firm, as the utility model relates to an it is preferred, the fixed orifices has all been seted up to two opposite angles on mainboard surface.
In order to make this strengthen radiating SDD main control chip radiating effect good, conduct the utility model relates to an it is preferred, radiator fan has two, two radiator fan places the both ends at the support frame upper surface respectively.
In order to make the heat dispersion of fin good among this kind of strengthen radiating SDD main control chip, as the utility model relates to an it is preferred, the fin is formed by the preparation of graphite alkene microchip, the guard circle is formed by the preparation of soft silica gel material.
In order to make the heat dispersion of the cooling liquid reserve tank good among this kind of enhancement radiating SDD main control chip, as the utility model relates to an it is preferred, the cooling liquid reserve tank is L shape, the cooling liquid reserve tank is formed by the preparation of PPS plastics.
In order to make the heat dissipation copper pipe heated area bigger among this kind of strengthen radiating SDD main control chip, as the utility model relates to an it is preferred, the heat dissipation copper pipe is continuous S-shaped in the fin.
Compared with the prior art, the beneficial effects of the utility model are that:
1. this strengthen radiating SDD main control chip, through the fin, the support frame, the cooling liquid reserve tank, radiator fan, miniature pump, the drain pipe, heat dissipation copper pipe and feed liquor pipe cooperation setting, when the higher needs of main control chip temperature dispel the heat, miniature pump pumps the coolant liquid in the cooling liquid reserve tank to the drain pipe in, carry to the heat dissipation copper pipe through the drain pipe in, the heat in the fin is taken away to the coolant liquid behind the heat dissipation copper pipe, flow back to the cooling liquid reserve tank through the feed liquor pipe in, the coolant liquid is at the cooling liquid reserve tank, the drain pipe, the intraductal circulation flow of heat dissipation copper pipe and feed liquor, dispel the heat to the chip body, the radiating effect is good, radiator fan rotates and dispels the heat to the cooling liquid reserve tank, make the coolant liquid in the cooling liquid reserve tank keep lower temperature all the time, when the coolant liquid dispels the heat.
2. This strengthen radiating SDD main control chip, through the mainboard, fixed frame, the chip body, fin and guard circle cooperation setting, when welding the mainboard, weld chip body on the mainboard earlier, fix the outside at the chip body on the mainboard with fixed frame again, fix fixed frame after, advance between fixed frame and the chip body with the guard circle stopper, play good protection to the chip body through fixed frame and guard circle, avoid other spare parts when colliding with to touch the chip body and cause the damage to the chip body, have good protection effect to the chip body.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of a front view axis measuring structure of the present invention;
fig. 2 is a schematic view of the top view axial structure of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2 according to the present invention;
fig. 4 is a schematic sectional view of the heat sink of the present invention.
In the figure: 1. a main board; 2. a fixing frame; 3. a chip body; 4. a heat sink; 5. a guard ring; 6. a support frame; 7. cooling the liquid storage tank; 8. a heat radiation fan; 9. a micro water pump; 10. a liquid outlet connector; 11. a liquid outlet pipe; 12. a conversion head; 13. a heat dissipation copper pipe; 14. a liquid inlet pipe; 15. a liquid inlet connector; 16. and (7) fixing holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-4, the present invention provides the following technical solutions: an SDD main control chip for enhancing heat dissipation comprises a main board 1, wherein a fixed frame 2 is fixedly connected with the middle part of the upper surface of the main board 1, a chip body 3 is fixedly connected with the middle part of the upper surface of the main board 1, a radiating fin 4 is fixedly connected with the upper surface of the chip body 3, a protective ring 5 is fixedly connected with the outer side of the chip body 3, a supporting frame 6 is fixedly connected with the outer side of the main board 1, a cooling liquid storage tank 7 is fixedly connected with the inner part of the supporting frame 6, a radiating fan 8 is fixedly connected with the upper surface of the supporting frame 6, a micro water pump 9 is fixedly connected with one end of the cooling liquid storage tank 7, a liquid outlet connector 10 is fixedly connected with one end of the micro water pump 9, a liquid outlet pipe 11 is fixedly connected with one end of the liquid outlet connector 10, a conversion head 12, one end of the heat dissipation copper pipe 13 far away from the liquid outlet pipe 11 is fixedly connected with a liquid inlet pipe 14 through a conversion head 12, and one end of the liquid inlet pipe 14 far away from the conversion head 12 is fixedly connected with a liquid inlet connector 15.
In the embodiment of the present invention, through the cooperation of the heat sink 4, the supporting frame 6, the cooling liquid storage tank 7, the heat dissipation fan 8, the micro water pump 9, the liquid outlet pipe 11, the heat dissipation copper pipe 13 and the liquid inlet pipe 14, when the temperature of the main control chip is high and heat dissipation is required, the micro water pump 9 pumps the cooling liquid in the cooling liquid storage tank 7 to the liquid outlet pipe 11, the cooling liquid is conveyed to the heat dissipation copper pipe 13 through the liquid outlet pipe 11, the cooling liquid takes away the heat in the heat dissipation fin 4 after passing through the heat dissipation copper pipe 13, and flows back to the cooling liquid storage tank 7 through the liquid inlet pipe 14, the cooling liquid circulates and flows in the cooling liquid storage tank 7, the liquid outlet pipe 11, the heat dissipation copper pipe 13 and the liquid inlet pipe 14, so as to dissipate the heat of the chip body 3, the heat dissipation effect is good, the heat dissipation fan 8 rotates to dissipate the heat from the cooling liquid storage tank 7, so, the radiating effect is better, through mainboard 1, fixed frame 2, chip body 3, fin 4 and the cooperation of guard circle 5 set up, when welding mainboard 1, weld chip body 3 on mainboard 1 earlier, fix fixed frame 2 in mainboard 1 chip body 3's outside again, fix fixed frame 2 after, plug into between fixed frame 2 and the chip body 3 with guard circle 5, play good protection to chip body 3 through fixed frame 2 and guard circle 5, avoid other spare parts to touch chip body 3 and cause the damage to chip body 3 when colliding with, have good protection effect to chip body 3.
Specifically, fixing holes 16 are formed in two opposite corners of the surface of the main board 1.
In this embodiment: the main board 1 is fixed through the fixing hole 16, and the fixing is convenient and firm.
Specifically, there are two cooling fans 8, and the two cooling fans 8 are respectively disposed at two ends of the upper surface of the supporting frame 6.
In this embodiment: the cooling liquid storage tank 7 is cooled by the two cooling fans 8 at the two ends of the support frame 6, and the cooling effect is good.
Specifically, the heat radiating fin 4 is made of graphene micro-sheets, and the protective ring 5 is made of soft silica gel materials.
In this embodiment: the graphene microchip has good heat conduction performance, so that the heat dissipation performance of the heat dissipation sheet 4 is good, the soft silica gel material is soft in texture, and the graphene microchip has good protection performance.
Specifically, the cooling liquid storage tank 7 is L-shaped, and the cooling liquid storage tank 7 is made of PPS plastic.
In this embodiment: PPS plastic has better heat-conducting property, so that the heat-radiating property of the cooling liquid storage tank 7 is good.
Specifically, the heat dissipating copper pipe 13 is in a continuous S shape in the heat dissipating fin 4.
In this embodiment: the continuous S-shaped heat dissipation copper pipe 13 has larger heating area and good heat dissipation effect.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
The utility model discloses a theory of operation and use flow: when the SDD main control chip for enhancing heat dissipation is used, when the temperature of the main control chip is high and heat dissipation is needed, the cooling liquid in the cooling liquid storage tank 7 is pumped out to the liquid outlet pipe 11 by the micro water pump 9 and is conveyed to the heat dissipation copper pipe 13 through the liquid outlet pipe 11, the heat in the heat dissipation fins 4 is taken away by the cooling liquid after passing through the heat dissipation copper pipe 13 and flows back to the cooling liquid storage tank 7 through the liquid inlet pipe 14, the cooling liquid circularly flows in the cooling liquid storage tank 7, the liquid outlet pipe 11, the heat dissipation copper pipe 13 and the liquid inlet pipe 14 to dissipate heat of the chip body 3, the heat dissipation effect is good, the cooling fan 8 rotates to dissipate heat of the cooling liquid storage tank 7, so that the cooling liquid in the cooling liquid storage tank 7 is always kept at a low temperature, when the cooling liquid dissipates heat of a chip, the heat dissipation effect is better, when the main board 1 is welded, the chip body 3 is firstly welded on the main board 1, and then the, after fixing fixed frame 2, pack into between fixed frame 2 and the chip body 3 with guard circle 5, play good protection to chip body 3 through fixed frame 2 and guard circle 5, avoid other spare parts to touch chip body 3 and cause the damage to chip body 3 when colliding with, have good protection effect to chip body 3.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a strengthen radiating SDD main control chip, includes mainboard (1), its characterized in that: the improved chip packaging structure is characterized in that a fixing frame (2) is fixedly connected to the middle of the upper surface of the mainboard (1), a chip body (3) is fixedly connected to the middle of the upper surface of the mainboard (1), radiating fins (4) are fixedly connected to the upper surface of the chip body (3), a guard ring (5) is fixedly connected to the outer side of the chip body (3), a support frame (6) is fixedly connected to the outer side of the mainboard (1), a cooling liquid storage box (7) is fixedly connected to the inner portion of the support frame (6), a radiating fan (8) is fixedly connected to the upper surface of the support frame (6), a micro water pump (9) is fixedly connected to one end of the cooling liquid storage box (7), a liquid outlet connector (10) is fixedly connected to one end of the micro water pump (9), a liquid outlet pipe (11) is fixedly connected to one end of the liquid outlet connector (10), a conversion head (12, one end fixedly connected with heat dissipation copper pipe (13) of drain pipe (11) are kept away from in conversion head (12), the one end that drain pipe (11) were kept away from in heat dissipation copper pipe (13) is through conversion head (12) fixedly connected with feed liquor pipe (14), one end fixedly connected with inlet connector (15) of conversion head (12) are kept away from in feed liquor pipe (14).
2. The SDD master control chip with enhanced heat dissipation of claim 1, wherein: two opposite corners of the surface of the main board (1) are provided with fixing holes (16).
3. The SDD master control chip with enhanced heat dissipation of claim 1, wherein: the number of the heat dissipation fans (8) is two, and the two heat dissipation fans (8) are respectively arranged at two ends of the upper surface of the support frame (6).
4. The SDD master control chip with enhanced heat dissipation of claim 1, wherein: the radiating fin (4) is made of graphene micro-sheets, and the protective ring (5) is made of soft silica gel materials.
5. The SDD master control chip with enhanced heat dissipation of claim 1, wherein: the cooling liquid storage tank (7) is L-shaped, and the cooling liquid storage tank (7) is made of PPS plastic.
6. The SDD master control chip with enhanced heat dissipation of claim 1, wherein: the heat dissipation copper pipe (13) is in a continuous S shape in the heat dissipation fin (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022289205.XU CN212933522U (en) | 2020-10-15 | 2020-10-15 | Strengthen radiating SDD main control chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022289205.XU CN212933522U (en) | 2020-10-15 | 2020-10-15 | Strengthen radiating SDD main control chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212933522U true CN212933522U (en) | 2021-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022289205.XU Active CN212933522U (en) | 2020-10-15 | 2020-10-15 | Strengthen radiating SDD main control chip |
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| Country | Link |
|---|---|
| CN (1) | CN212933522U (en) |
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2020
- 2020-10-15 CN CN202022289205.XU patent/CN212933522U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230525 Address after: 247099 Building 5, Phase 4, Electronic Information Industry Park, Economic and Technological Development Zone, Chizhou City, Anhui Province Patentee after: Anhui Huaxun Technology Co.,Ltd. Address before: 1611, Huatong building, No.8 Ganli 2nd Road, gankeng community, Jihua street, Longgang District, Shenzhen, Guangdong 518000 Patentee before: Shenzhen WuXun Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A SDD main control chip with enhanced heat dissipation Granted publication date: 20210409 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Huaxun Technology Co.,Ltd. Registration number: Y2024980045839 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |