CN209992936U

CN209992936U - Radiator for computer

Info

Publication number: CN209992936U
Application number: CN201920092131.5U
Authority: CN
Inventors: 周业期
Original assignee: Shuanghong Electronic Technology Industry (kunshan) Co Ltd
Current assignee: Shuanghong Electronic Technology Industry (kunshan) Co Ltd
Priority date: 2019-01-21
Filing date: 2019-01-21
Publication date: 2020-01-24
Anticipated expiration: 2029-01-21

Abstract

The utility model relates to a radiator for computer, comprising a base plate, the upper surface of the base plate is integrated with a support column, the outside surface of the support column is integrated with a radiating fin, the top end inner edge of the support column is connected with a circulating box through a connecting support by welding, the inside of the circulating box is provided with a driving paddle, a fan is arranged above the circulating box, a driving rod of the fan penetrates through the top of the circulating box and is connected with a driving shaft of the driving paddle, and the inside of the support column is provided with a heat absorption pipe; the liquid of the operation through the drive paddle in this equipment use circulates the inside cooling tube, heat absorption pipe, and the air current velocity of side surface of fan operation in-process promotion fin, cooling tube, support column, heat absorption pipe promotes the heat exchange rate of fin, cooling tube, support column, heat absorption pipe, and the equipment of being convenient for dispels the heat to the chip.

Description

Radiator for computer

Technical Field

The utility model belongs to the technical field of the radiator, concretely relates to radiator for computer.

Background

The existing computer needs to be cooled by a radiator in the using process, the existing radiator generally adopts air cooling to radiate a chip so as to avoid damage caused by overhigh temperature of the chip, the radiating effect of the existing radiator in the using process is not ideal, and the radiator needs to be structurally improved and optimized aiming at the problem of exposure of the existing radiator in the using process.

SUMMERY OF THE UTILITY MODEL

For solving the above-mentioned problem that exists among the prior art, the utility model provides a radiator for computer has and is convenient for carry out radiating characteristics to computer chip.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a radiator for computer, includes the bottom plate, the upper surface integrated into one piece of bottom plate has the support column, the outside surface integrated into one piece of support column has the fin, there is the circulation case top inner edge department of support column through linking bridge welded connection, the inside of circulation case is equipped with the drive paddle, the top of circulation case is equipped with the fan, the actuating lever of fan runs through the top of circulation case and is connected with the drive shaft of drive paddle, the inside of support column is equipped with the heat absorption pipe, the outside surface of support column is located the inside of fin and runs through and is equipped with the cooling tube, the outer wall that the cooling tube all runs through the circulation case with the one end of heat absorption pipe communicates with the inside of circulation case, and the inner wall that the one end of heat absorption pipe runs through the.

As the utility model discloses a preferred technical scheme of radiator for computer, the support column is the cylinder component, and the inlet port has all been seted up to the inboard that the lower extreme outer wall of support column is located two fin, and the fin is the rectangle component, and the connecting hole has evenly been seted up to the side surface of fin, and the cooling tube runs through from the inside of connecting hole.

As the utility model discloses a preferred technical scheme of radiator for computer, the cooling tube is helical structure with the heat absorption pipe, and the heat absorption pipe is installed at the inboard surface of support column with helical structure welding, and the cooling tube is arranged in the inside of connecting hole with helical structure.

As the utility model discloses a preferred technical scheme of radiator for computer, the circulation case is the spheroid structure, and the inside packing of cooling tube, circulation case, heat absorption pipe has the coolant liquid.

As the utility model discloses a preferred technical scheme of radiator for computer, the bottom inner edge department integrated into one piece of support column has the heat-conducting plate, and the heat-conducting plate is the cylinder component, the upper surface of heat-conducting plate and the outer wall welding of heat absorption pipe.

As the utility model discloses a preferred technical scheme of radiator for computer, the cavity that holds spacing frame is seted up to the bottom of bottom plate, and spacing frame is hollow prismatic table structure, and the inside at the cavity is placed to spacing frame gomphosis.

As the utility model discloses a preferred technical scheme of radiator for computer, the fan passes through electric connection with the external world.

Compared with the prior art, the beneficial effects of the utility model are that: the liquid of the operation through the drive paddle in this equipment use circulates the inside cooling tube, heat absorption pipe, and the air current velocity of side surface of fan operation in-process promotion fin, cooling tube, support column, heat absorption pipe promotes the heat exchange rate of fin, cooling tube, support column, heat absorption pipe, and the equipment of being convenient for dispels the heat to the chip.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic side view of the present invention;

fig. 3 is a schematic cross-sectional structure of the present invention;

fig. 4 is a schematic bottom view of the present invention;

in the figure: 1. a base plate; 11. a limiting frame; 2. a heat sink; 21. connecting holes; 3. a radiating pipe; 4. a support pillar; 41. an air inlet; 5. a fan; 6. a circulation box; 61. driving the paddle; 7. a heat absorbing tube; 71. a heat conducting plate.

Detailed Description

Referring to fig. 1-4, the utility model provides the following technical scheme: a radiator for a computer comprises a bottom plate 1, wherein a supporting column 4 is integrally formed on the upper surface of the bottom plate 1, a radiating fin 2 is integrally formed on the outer side surface of the supporting column 4, a circulating box 6 is welded and connected to the inner edge of the top end of the supporting column 4 through a connecting support, a driving paddle 61 is arranged inside the circulating box 6, a fan 5 is arranged above the circulating box 6, a driving rod of the fan 5 penetrates through the top of the circulating box 6 and is connected with a driving shaft of the driving paddle 61, a heat absorbing pipe 7 is arranged inside the supporting column 4, a radiating pipe 3 penetrates through the radiating fin 2 on the outer side surface of the supporting column 4, one end of each of the radiating pipe 3 and the heat absorbing pipe 7 penetrates through the outer wall of the circulating box 6 and is communicated with the inside of the circulating box 6, one end of each heat absorbing pipe 7 penetrates through the inner wall of the supporting column 4 to reach the outside of the supporting column 4, the driving blades 61 are rotated and the cooling liquid inside the circulation box 6 is caused to flow, exchanging heat.

Specifically, support column 4 is the cylinder component, and the inlet port 41 has all been seted up to the lower extreme outer wall of support column 4 in the inboard of two fin 2, and fin 2 is the rectangle component, and connecting hole 21 has evenly been seted up to the side surface of fin 2, and cooling tube 3 runs through from the inside of connecting hole 21, and cooling tube 2 can dispel the heat to cooling tube 3 in this embodiment.

Specifically, cooling tube 3 and heat-absorbing pipe 7 are helical structure, and heat-absorbing pipe 7 is installed at the inboard surface of support column 4 with helical structure welding, and cooling tube 3 arranges in the inside of connecting hole 21 with helical structure, and helical structure makes cooling tube 3 and heat-absorbing pipe 7 have great surface area in this embodiment, is convenient for carry out heat exchange.

Specifically, the circulating box 6 is a sphere structure, and the cooling liquid is filled in the heat dissipation tube 3, the circulating box 6, and the heat absorption tube 7, and the cooling liquid is used for cooling the chip in this embodiment.

Specifically, the bottom inner edge department integrated into one piece of support column 4 has heat-conducting plate 71, and heat-conducting plate 71 is the cylinder component, and the upper surface of heat-conducting plate 71 and the outer wall welding of heat-absorbing pipe 7, heat-conducting plate 71 is the copper plate component in this embodiment, and the copper has good heat conductivility, can effectually derive the heat of chip.

Specifically, the cavity that holds limit frame 11 is seted up to bottom plate 1's bottom, and limit frame 11 is hollow terrace with edge structure, and limit frame 11 gomphosis is placed in the inside of cavity, and 11 convenient to detach of limit frame change in this embodiment can compatible various different specification models's chip.

Specifically, fan 5 passes through electric connection with the external world, and electric connection is convenient for fan 5 to obtain good power supply in this embodiment, is convenient for fan 5 good operation under the circumstances of circular telegram.

In this embodiment, the fan 5 is a known technology widely used in daily life, and the fan 5 is a micro-fan for a computer with model number SF12038a2, which is manufactured by shenzhen jinshenlan technology limited.

The utility model discloses a theory of operation and use flow: when the device is used, a worker places the bottom plate 1 on the chip through the bolts, the chip is placed inside the limiting frame 11, the worker can replace the limiting frames 11 with different specifications according to chips with different sizes, the chip emits heat during operation, the heat is transferred to the supporting column 4 through the heat conducting plate 71, the heat on the supporting column 4 is transferred to the radiating fins 2, the other part of the heat is absorbed by the heat absorbing pipes 7, at the moment, the fan 5 can operate, the driving paddle 61 is driven to rotate through the driving rod during the operation of the fan 5, the liquid inside the heat absorbing pipes 7 is enabled to flow into the circulating box 6 during the rotation of the driving paddle 61, then the liquid reaches the inside of the radiating pipes 3 through the circulating box 6, the liquid reaches the outer wall of the radiating fins 2 through the radiating pipes 3, then flows back to the inside of the heat absorbing pipes 7 through the radiating pipes 3, and the, when the air current of fin 2 side is upwards blown up, make the quick heat transfer of cooling tube 3 and external environment simultaneously, fan 5 rotates the inside that partly air-inlet hole 41 reachs support column 4 in-process, cools down the heat absorption pipe 7 of support column 4 inboard, and the air after the cooling is discharged from circulation case 6 side.

In the previous description, numerous specific details were set forth in order to provide a thorough understanding of the invention. The foregoing description is only illustrative of the preferred embodiments of the invention, which can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. All the contents that do not depart from the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical substance of the present invention all still belong to the protection scope of the technical solution of the present invention.

Claims

1. A radiator for computer, includes bottom plate (1), its characterized in that: the upper surface integrated into one piece of bottom plate (1) has support column (4), the outside surface integrated into one piece of support column (4) has fin (2), the top edge department of support column (4) has circulation case (6) through linking bridge welded connection, the inside of circulation case (6) is equipped with drive paddle (61), the top of circulation case (6) is equipped with fan (5), the actuating lever of fan (5) runs through the top of circulation case (6) and is connected with the drive shaft of drive paddle (61), the inside of support column (4) is equipped with heat-absorbing pipe (7), the outside surface of support column (4) is located the inside of fin (2) and runs through and is equipped with cooling tube (3), the outer wall that cooling tube (3) and heat-absorbing pipe (7) all run through circulation case (6) and the inside intercommunication of circulation case (6), one end of the heat absorbing pipe (7) penetrates through the inner wall of the supporting column (4) to reach the outside of the supporting column (4) and is connected with the radiating pipe (3).

2. A heat sink for a computer according to claim 1, wherein: the support column (4) is a cylindrical component, the air inlet holes (41) are formed in the inner sides, located on the two radiating fins (2), of the outer wall of the lower end of the support column (4), the radiating fins (2) are rectangular components, connecting holes (21) are uniformly formed in the side surfaces of the radiating fins (2), and the radiating pipe (3) penetrates through the connecting holes (21).

3. A heat sink for a computer according to claim 2, wherein: the radiating pipe (3) and the heat absorbing pipe (7) are both of a spiral structure, the heat absorbing pipe (7) is welded and installed on the inner side surface of the supporting column (4) in a spiral structure, and the radiating pipe (3) is arranged inside the connecting hole (21) in a spiral structure.

4. A heat sink for a computer according to claim 3, wherein: the circulating box (6) is of a spherical structure, and cooling liquid is filled in the radiating pipe (3), the circulating box (6) and the heat absorbing pipe (7).

5. The heat sink for computer according to claim 4, wherein: the heat-absorbing tube is characterized in that a heat-conducting plate (71) is integrally formed at the inner edge of the bottom end of the supporting column (4), the heat-conducting plate (71) is a cylindrical component, and the upper surface of the heat-conducting plate (71) is welded with the outer wall of the heat-absorbing tube (7).

6. The heat sink for a computer according to claim 5, wherein: the bottom of bottom plate (1) is seted up the cavity that holds spacing frame (11), and spacing frame (11) are hollow terrace with edge structure, and spacing frame (11) gomphosis is placed in the inside of cavity.

7. The heat sink for a computer according to claim 6, wherein: the fan (5) is electrically connected with the outside.