CN202042475U - Liquid-cooling radiator - Google Patents
Liquid-cooling radiator Download PDFInfo
- Publication number
- CN202042475U CN202042475U CN2011201233674U CN201120123367U CN202042475U CN 202042475 U CN202042475 U CN 202042475U CN 2011201233674 U CN2011201233674 U CN 2011201233674U CN 201120123367 U CN201120123367 U CN 201120123367U CN 202042475 U CN202042475 U CN 202042475U
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- urceolus
- liquid
- heat
- outer cylinder
- radiator
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Abstract
The utility model relates to a radiator, in particular to a liquid-cooling radiator. The liquid-cooling radiator comprises a closed outer cylinder (1); the outer wall of the closed outer cylinder is provided with a radiating fin (3); and the liquid-cooling radiator is characterized in that the outer cylinder (1) is internally and coaxially provided with an axial flow pump (4) which is supported at the lower part of the outer cylinder (1) in a suspension manner, an inlet end of a pump cylinder (2) faces downwards, an outlet end of the pump cylinder (2) upwards extends to a position approaching to an upper end cover (1-1) of the outer cylinder (1), an input shaft (4-2) upwards extends to a position above the outer cylinder (1), the end part of the input shaft (4-2) is butted with an output shaft of a motor (6), and the motor (6) is arranged on the upper end cover (1-1) of the outer cylinder (1). Liquid in the liquid-cooling radiator can flow in a circulating way, so that the radiating effect is obvious.
Description
Technical field
The utility model relates to a kind of heat exchanger, is specifically related to a kind of liquid cooling heat radiator.
Background technology
The electronic chip heat dissipation problem is the restraining factors of chip development always, and as cpu chip heat radiation, high-power LED chip heat radiation etc., developing efficiently, chip radiator is to improve the chip service efficiency and the only way in life-span.
The radiator of electronic chip can be divided into two kinds of passive heat radiation and active heat removal by the mode of taking away heat, wherein, passive heat radiation is to be dispersed in the air by the heat of fin with thermal source, it is a kind of natural heat dissipation mode, its radiating effect is limited, is usually used in the parts that the space does not require or heat dissipation capacity is little; Active heat removal can be subdivided into cold heat radiation, liquid cooling heat radiation, heat pipe heat radiation etc., and wherein, the liquid cooling heat radiation has advantages such as heat-transfer rate is fast, thermal capacity is big, obtains application more and more widely in the big electronic chip of caloric value (cpu chip, high-power LED chip).Common liquid cooling heat radiator has microchannel heat sink and micro-injection radiator in the electronic chip, wherein, microchannel heat sink is to offer a series of minitype channels on the substrate of chip, the outside pump housing is thrown liquid cooling medium in the minitype channel into, by circulating of liquid cooling medium the heat of chip is taken away; The micro-injection radiator is after liquid cooling medium is transported to the micropore injection apparatus by the outside pump housing, to be ejected on the chip substrate, heat is brought to outside heat abstractor dispel the heat.Above-mentioned two kinds of radiators have the effect of significant heat radiation to the big electronic chip of caloric value, but they need many pipelines to connect, and have both made complex structure, also the fluid seepage problem may occur.For solving this technical problem, the Xu Xing wave designed a kind of do not have the fluid radiator that pipeline connects (Xu Xinglang. the research of high-power LED lamp active heat removal device. Central China University of Science and Technology's master thesis, 2009.5), the closed container of this radiator for making by highly heat-conductive material, fill liquid cooling medium in the container, the one side of container contacts with thermal source, and other faces are provided with heat sink and fan; Form circulating fluid by the liquid in the stirred vessel, constantly draw heat and heat is distributed by chamber wall and fin.This technical scheme does not have pipeline to connect, good reliability, but, liquid that is heated in the described airtight container and cooled liquid mix mutually, make the fluid temperature that is positioned at container heat radiation wall place be lower than the fluid temperature at heat absorption wall place, can not get maximum temperature difference like this between the liquid at heat radiation wall place and external environment, heat transfer efficiency is restricted.
Summary of the invention
The technical problems to be solved in the utility model is to improve the radiating effect of liquid cooling heat radiator.
The technical scheme that the utility model addresses the above problem is:
A kind of liquid cooling heat radiator, it has the urceolus of a sealing, its outer wall is provided with the heat radiation fin, it is characterized in that the coaxial axial-flow pump that is provided with in the described urceolus, the unsettled bottom that is bearing in urceolus of this axial-flow pump, the entrance point of pump barrel is downward, the port of export extends upwardly to the upper end cover near urceolus, and power shaft extends upwardly to urceolus top, and dock with the output shaft of motor on being located at the urceolus upper end cover end.
A kind of liquid cooling heat radiator described in the utility model in order to strengthen radiating effect, need be provided with radiator fan usually near the heat radiation fin, this radiator fan can be arranged at the outside of urceolus, also can be arranged at the top of urceolus.A kind of optimal way that the inventor thinks is that the position that the power shaft at axial-flow pump is extending above the urceolus is provided with a fans, the covering of the fan of this fans is downward, and its diameter is greater than the diameter of urceolus, the benefit of this set is, on the one hand, this fans and axial-flow pump can be driven by same motor synchronous, on the other hand, this fans can act on the upper end cover of urceolus and the heat radiation fin on the outer wall simultaneously, has the advantage of compact conformation.
A kind of liquid cooling heat radiator described in the utility model, during use, the bottom of urceolus and electronic chip are fitted, because the coaxial axial-flow pump that is provided with in the urceolus, the opening of its pump barrel are down, the port of export extends upwardly to the upper end cover near urceolus, therefore under the effect of axial-flow pump, the liquid that absorbs heat that is positioned at outer tube bottom up flows along pump barrel, arrives the annular space of outbound port palintrope baffling between urceolus and pump barrel, heat by outer tube wall and on the heat radiation fin be delivered in the external environment condition; Liquid after being cooled is back to outer tube bottom, and continues to repeat above-mentioned heat radiation process.
By top description as can be known, heated fluid stream in the liquid cooling heat radiator of the present utility model flows in the pump barrel in axial-flow pump, make that walking around the pump line port of export enters the fluid temperature of annular space between urceolus and the pump barrel and the temperature basically identical of outer tube bottom heated liquid, temperature difference between liquid and the external environment condition when having improved heat radiation, radiating rate enlarges markedly, and the radiating effect that it improved is conspicuous.
Description of drawings
Fig. 1~Fig. 3 is the structural representation of a specific embodiment of liquid cooling heat radiator described in the utility model, and wherein Fig. 1 is a front view, and Fig. 2 vertical view, Fig. 3 are the A-A cutaway view of Fig. 1, the flow direction of arrow express liquid among the figure.
Embodiment
Referring to Fig. 1~Fig. 3, liquid cooling heat radiator of the present utility model comprises the cylindrical urceolus 1 and the coaxial axial-flow pump 4 that is arranged in the urceolus 1 of sealing, and wherein, the outer wall of urceolus 1 is provided with heat radiation fin 3, the top is by upper end cover 1-1 sealing, and the upper surface of this upper end cover 1-1 is provided with heat radiation fin 3; Be connected by 4 gussets 8 between the pump barrel 4-1 of axial-flow pump 4 and the urceolus 1, the opening of described pump barrel 4-1 down, the port of export extends to the upper end cover 1-1 near urceolus 1; The power shaft 4-2 of axial-flow pump 4 extends upward outside the upper end cover 1-1 of urceolus 1 along the axis of pump barrel 4-1, is connected with a fans 5 on this extension, and dock with the output shaft of motor 6 end of extension.The covering of the fan of described fans 5 down, its diameter is slightly less than the diameter of the outline of heat radiation fin 3 on urceolus 1 outer wall, the fans 5 outer annular shells 6 that are provided with, the lower end of this shell 6 is placed on the step of heat radiation fin 3 upper ends on urceolus 1 outer wall, the upper end is provided with 4 radial radiation supporting brackets 9, described motor 7 be fixed in this supporting bracket 9 in the heart.
Be described in further detail below in conjunction with the course of work of accompanying drawing liquid cooling heat radiator described in the utility model:
Referring to Fig. 1, during installation, the bottom of urceolus 1 fits in the back side of electronic chip, the heat of chip passes to the liquid of urceolus 1 bottom through substrate and urceolus 1 bottom, liquid after the heat absorption up flows at the effect lower edge of axial-flow pump 4 pump barrel 4-1, and behind the port of export of arrival pump barrel 4-1, bending flows to annular space and the past current downflow between urceolus 1 and the pump barrel 2, liquid is in described annular space flow process, and heat wherein is dispersed in the external environment condition through the barrel and the heat radiation fin 3 of urceolus 1; Cooled liquid returns the bottom of urceolus 1 again, enters the heat absorption and the heat radiation process of next circulation.
Claims (2)
1. liquid cooling heat radiator, it has the urceolus (1) of a sealing, its outer wall is provided with heat radiation fin (3), it is characterized in that, the coaxial axial-flow pump (4) that is provided with in the described urceolus (1), the unsettled bottom that is bearing in urceolus (1) of this axial-flow pump (4), the entrance point of pump barrel (2) is downward, the port of export extends upwardly near the upper end cover of urceolus (1) (1-1), power shaft (4-2) extends upwardly to urceolus (1) top, and dock with the output shaft of motor (6) on being located at urceolus (1) upper end cover (1-1) end.
2. a kind of liquid cooling heat radiator according to claim 1, it is characterized in that, the power shaft (4-2) of described axial-flow pump (4) is provided with a fans (5) at the position of extending urceolus (1) top, and the covering of the fan of this fans (5) is downward, and diameter is greater than the diameter of urceolus (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011201233674U CN202042475U (en) | 2011-04-24 | 2011-04-24 | Liquid-cooling radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011201233674U CN202042475U (en) | 2011-04-24 | 2011-04-24 | Liquid-cooling radiator |
Publications (1)
Publication Number | Publication Date |
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CN202042475U true CN202042475U (en) | 2011-11-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011201233674U Expired - Fee Related CN202042475U (en) | 2011-04-24 | 2011-04-24 | Liquid-cooling radiator |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104403934A (en) * | 2014-11-05 | 2015-03-11 | 吉首大学 | Air-pump type fermentation tank |
CN104679191A (en) * | 2013-11-29 | 2015-06-03 | 技嘉科技股份有限公司 | Liquid cooling radiating device and liquid cooling radiating temperature control method |
CN110662392A (en) * | 2019-04-29 | 2020-01-07 | 何佳俊 | Network switch heat dissipation mounting bracket |
CN111599775A (en) * | 2020-06-03 | 2020-08-28 | 武义县达香电子有限公司 | Chip overheating water-cooling heat dissipation equipment |
-
2011
- 2011-04-24 CN CN2011201233674U patent/CN202042475U/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104679191A (en) * | 2013-11-29 | 2015-06-03 | 技嘉科技股份有限公司 | Liquid cooling radiating device and liquid cooling radiating temperature control method |
CN104679191B (en) * | 2013-11-29 | 2017-12-08 | 技嘉科技股份有限公司 | Liquid-cooling heat radiator and liquid-cooling heat radiation temperature control method |
CN104403934A (en) * | 2014-11-05 | 2015-03-11 | 吉首大学 | Air-pump type fermentation tank |
CN104403934B (en) * | 2014-11-05 | 2018-08-24 | 吉首大学 | Air-pump type fermentation tank |
CN110662392A (en) * | 2019-04-29 | 2020-01-07 | 何佳俊 | Network switch heat dissipation mounting bracket |
CN110662392B (en) * | 2019-04-29 | 2020-09-01 | 卢杰 | Network switch heat dissipation mounting bracket |
CN111599775A (en) * | 2020-06-03 | 2020-08-28 | 武义县达香电子有限公司 | Chip overheating water-cooling heat dissipation equipment |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131202 Address after: Yongxing village, Taihe Town Longxing Road, Baiyun District of Guangzhou City, Guangdong Province, No. 133 of 510540 Patentee after: Guangzhou Zhongheng Optoelectronics Technology Co., Ltd. Address before: 510006 Guangdong City, Guangzhou Province University, West Ring Road, No. 230 Patentee before: Guangzhou University |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20170424 |
|
CF01 | Termination of patent right due to non-payment of annual fee |