CN212569678U - Heat radiation structure and electronic equipment - Google Patents
Heat radiation structure and electronic equipment Download PDFInfo
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- CN212569678U CN212569678U CN202020715278.8U CN202020715278U CN212569678U CN 212569678 U CN212569678 U CN 212569678U CN 202020715278 U CN202020715278 U CN 202020715278U CN 212569678 U CN212569678 U CN 212569678U
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Abstract
The application discloses heat radiation structure and electronic equipment, this heat radiation structure includes: the heat dissipation bottom plate is arranged on a heating element in the electronic equipment, and heat dissipated by the heating element can be transferred to the heat dissipation bottom plate; the first fan is arranged on the side surface of the heat dissipation bottom plate, which is far away from the heating part, and the air inlet direction of the first fan points to the heat dissipation bottom plate; the second fan is arranged on the side surface of the radiating bottom plate far away from the heating part and is adjacent to the first fan, and an air outlet of the second fan points to an air outlet of the electronic equipment; the air inlet direction of the first fan is vertical to the air outlet direction of the second fan; the heat dissipation bottom plate, the first fan and the second fan are located in the same packaging structure, so that the outlet air of the first fan can be sucked into the second fan to become the inlet air of the second fan. By adopting the heat dissipation structure provided by the application, the influence on other components in the packaging structure during operation can be reduced on the basis of meeting the heat dissipation requirement of the heating element.
Description
Technical Field
The present application relates to the field of computer technologies, and in particular, to a heat dissipation structure and an electronic device.
Background
With the development of technology, the demand for the performance of devices or components is increasing, for example, the performance of a graphics card in a computer is higher, and the heat generated during the operation is higher. If the heat generated in the operation process of the display card is not discharged in a good heat dissipation mode, the stability of the display card and even the whole equipment is possibly reduced, and the display card is even damaged, so that the high-performance display card has high requirements on heat dissipation.
In the prior art, the main method is to radiate heat of components in the device by an air cooling method or a water cooling method, when the air cooling heat radiation is performed, usually, one or more axial fans are used to radiate heat, an air inlet of the fan sucks air with normal temperature from the outside, an air outlet of the fan is aligned with a heat radiation fin connected with the component and conducting heat to the component, so that the air sucked through the air inlet radiates heat to the heat radiation fin, and further the purpose of radiating the component is achieved, however, hot air after radiating heat to the heat radiation fin is still discharged into the device, so that the ambient temperature in the device is raised, so that other components in the device also operate at higher temperature, for example, in the computer device, after the air cooling heat radiation device corresponding to the graphics card performs air cooling heat radiation to the graphics card, the generated hot air still stays in the computer device, so that other components (such as a CPU) in the whole chassis operate at higher ambient temperature, therefore, even if the heat dissipation of the graphics card is satisfied, the normal operation of other components is also affected, and how to reduce the influence on the operation of other components on the basis of satisfying the heat dissipation requirement of the component itself is a technical problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the present application is to provide a heat dissipation structure, including:
the heat dissipation base plate is arranged on a heating element in the electronic equipment, and heat dissipated by the heating element can be transferred to the heat dissipation base plate;
the first fan is arranged on the side surface of the heat dissipation bottom plate, which is far away from the heating part, and the air inlet direction of the first fan points to the heat dissipation bottom plate;
the second fan is arranged on the side surface, far away from the heating part, of the heat dissipation bottom plate and is adjacent to the first fan, and an air outlet of the second fan points to an air outlet of the electronic equipment; the air inlet direction of the first fan is vertical to the air outlet direction of the second fan;
the heat dissipation bottom plate, the first fan and the second fan are located in the same packaging structure, so that the outlet air of the first fan can be sucked by the second fan to become the inlet air of the second fan.
The beneficial effect of this application lies in: the heat radiation bottom plate, first fan with the second fan is located same packaging structure, so that the air-out of first fan can be inhaled by the second fan and become the air inlet of second fan, thereby make the heat of heat radiation bottom plate can be based on the air of first fan in transmitting packaging structure fast, and suck away the air in packaging structure by the second fan, get rid of outside electronic equipment through electronic equipment's air exit, thereby avoid generating heat the heat that the piece produced and stop in electronic equipment and produce the influence to other parts, adopt the heat radiation structure that this application provided promptly, can satisfy the heat dissipation demand of the piece that generates heat itself on the basis, reduce the influence that produces when other parts in the packaging structure move.
In one embodiment, the air inlet direction of the first fan is directed to the heat dissipation base plate to transfer heat on the heat dissipation base plate to air in the package structure;
the air inlet of the second fan is positioned in the packaging structure and used for sucking the air in the packaging structure into the second fan through the air inlet and exhausting the air in the packaging structure through the air outlet of the second fan.
In one embodiment, a first heat dissipation element is disposed between the first fan and the heat dissipation base plate, wherein the first heat dissipation element includes at least one first heat dissipation fin, and heat of the heat dissipation base plate is transferred through the first heat dissipation element.
In one embodiment, a second heat dissipation element is disposed between the second fan and the heat dissipation base plate, wherein the second heat dissipation element includes at least one second heat dissipation fin, and the heat of the heat dissipation base plate is transferred through the second heat dissipation element.
In one embodiment, the heat dissipation structure further includes:
the evaporation end of the first heat pipe is arranged in the area of the heat dissipation bottom plate, which is positioned at the bottom of the second heat dissipation element;
the condensation end of the first heat pipe is arranged in the first radiating fins so as to transfer the heat of the heating element to the first radiating fins.
The beneficial effect of this embodiment lies in: the heat transfer speed from the heat dissipation bottom plate to the first heat dissipation element can be increased through evaporation and condensation of the working liquid in the first heat pipe.
In one embodiment, the condensation end of the first heat pipe is disposed in the first heat dissipation element, including:
the preset position of the first radiating fin is provided with a hole, and the condensation end of the first heat pipe is inserted into the hole of the first radiating fin.
In one embodiment, the heat dissipation structure further includes:
the evaporation end of the second heat pipe is arranged in the area of the heat dissipation bottom plate, which is positioned at the bottom of the second heat dissipation element;
the condensation end of the second heat pipe is arranged in the second radiating fins so as to transfer the heat of the heating element to the second radiating fins.
The beneficial effect of this embodiment lies in: the heat transfer speed from the heat dissipation bottom plate to the second heat dissipation element can be increased through evaporation and condensation of the working liquid in the first heat pipe.
In one embodiment, the condensation end of the second heat pipe is disposed in a second heat dissipation element, comprising:
the second heat dissipation fins are provided with holes at preset positions, and the condensation ends of the second heat pipes are inserted into the holes in the second heat dissipation fins.
In one embodiment, the first fan is an axial fan and the second fan is a vortex fan.
The present application further provides an electronic device, comprising:
a heat generating member;
the heat dissipation structure in any embodiment is used for transferring heat dissipated by the heat generating component;
and the packaging structure is used for packaging the heating piece and the heat dissipation structure.
Drawings
Fig. 1A is a schematic view of a heat dissipation structure in an embodiment of the present application;
FIG. 1B is a top view of the heat dissipating structure with the first and second fans removed;
fig. 1C is a side view of a heat dissipation structure in an embodiment of the present application;
fig. 1D is a schematic view of a wind direction of the first heat dissipation structure in the embodiment of the present application, where the direction indicated by an arrow is the wind direction.
Description of reference numerals:
11-a heat dissipation bottom plate; 12-a first fan; 13-a second fan; 14-a first heat dissipating element; 15-a second heat dissipating element; 16-a first heat pipe; 17-a second heat pipe; 18-a heat generating member; 131-an air inlet of the second fan; 132-outlet of the second fan.
Detailed Description
Various aspects and features of the present application are described herein with reference to the drawings.
It will be understood that various modifications may be made to the embodiments of the present application. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Those skilled in the art will envision other modifications within the scope and spirit of the application.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with a general description of the application given above and the detailed description of the embodiments given below, serve to explain the principles of the application.
These and other characteristics of the present application will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.
It should also be understood that, although the present application has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of application, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.
The above and other aspects, features and advantages of the present application will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.
Specific embodiments of the present application are described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the application, which can be embodied in various forms. Well-known and/or repeated functions and constructions are not described in detail to avoid obscuring the application of unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present application in virtually any appropriately detailed structure.
The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the application.
Fig. 1A is a schematic view of a heat dissipation structure according to an embodiment of the present application, where the heat dissipation structure includes:
a heat dissipation base plate 11, which is arranged on a heat generating component 18 in the electronic device shown in fig. 1C, wherein the heat generated by the heat generating component 18 can be transferred to the heat dissipation base plate 11;
the first fan 12 is arranged on the side surface of the heat dissipation bottom plate 11 far away from the heating element 18, and the air inlet direction of the first fan 12 points to the heat dissipation bottom plate 11;
the second fan 13 is arranged on the side surface of the heat dissipation bottom plate 11 far away from the heat generating element 18, and is adjacent to the first fan 12, and an air outlet 132 of the second fan 13 points to an air outlet of the electronic device; the air inlet direction of the first fan 12 is perpendicular to the air outlet direction of the second fan 13;
the heat dissipation base plate 11, the first fan 12 and the second fan 13 are located in the same package structure, so that the outlet air of the first fan 12 can be sucked by the second fan 13 to become the inlet air of the second fan 13.
As the performance of components in the device is improved, the heat generated during the operation of the device is increased, for example, a high-performance graphics card has a high requirement on heat dissipation. In the existing air-cooled heat dissipation structure, hot air after heat dissipation of a high-performance display card is still discharged into the equipment, so that the ambient temperature in the equipment is increased, other components in the equipment also run at a higher temperature, and the normal work of other components can be influenced even if the heat dissipation of the display card is met.
In view of the above situation, the present application provides a heat dissipation structure, in which a heat dissipation bottom plate 11 is disposed on a heat generating element 18 in an electronic device, so that heat generated by the heat generating element 18 is transferred to the heat dissipation bottom plate 11, and a first fan 12 is disposed on a side of the heat dissipation bottom plate 11 away from the heat generating element 18, where the first fan 12 may be an axial fan, and an air inlet direction of the first fan 12 is directed to the heat dissipation bottom plate 11, so that heat generated by the heat generating element 18 transferred to the heat dissipation bottom plate 11 is quickly brought to air inside the device.
In addition, the side of the heat dissipation bottom plate 11 away from the heat generating element 18 is provided with a second fan 13 adjacent to the first fan 12, the second fan 13 may be an eddy fan, the air outlet 132 of the second fan 13 is directed to the air outlet of the equipment, so as to bring the air in the equipment out of the equipment, because the first fan 12 can bring the heat generated by the heat generating element 18 to the first half of the heat dissipation into the air in the equipment, the air in the equipment contains a large amount of heat, and in the case that the second fan 13 brings the air in the equipment out of the equipment, negative pressure occurs in the equipment, so that the air outside the equipment without containing a large amount of heat flows into the equipment from other unsealed gaps, interfaces or holes except the air outlet of the electronic equipment, so that the air heat in the equipment is rapidly reduced. Therefore, the air containing a large amount of heat in the equipment is continuously taken out of the equipment, the air not containing a large amount of heat outside the equipment continuously flows into the equipment, a running environment with a lower temperature is provided for the inside of the equipment, and the influence on the normal work of other parts is avoided.
The beneficial effect of this application lies in: the heat dissipation base plate 11, the first fan 12 and the second fan 13 are located in the same packaging structure, so that the outlet air of the first fan 12 can be sucked by the second fan 13 to become the inlet air of the second fan 13, and therefore the heat of the heat dissipation base plate 11 can be quickly transferred to the air in the packaging structure based on the first fan 12, the air in the packaging structure is sucked away by the second fan 13, and the heat generated by the heating element 18 is prevented from staying in the electronic equipment and affecting other components by excluding the electronic equipment through an air outlet of the electronic equipment.
In one embodiment, the air inlet direction of the first fan 12 is directed to the heat dissipation base plate 11 to transfer the heat on the heat dissipation base plate 11 to the air in the package structure;
the air inlet 131 of the second fan 13 is located in the package structure, and is configured to suck air in the package structure into the second fan 13 through the air inlet 131, and discharge the air in the package structure through the air outlet 132 of the second fan 13.
In one embodiment, a first heat dissipation element 14 is disposed between the first fan 12 and the heat dissipation base plate 11, wherein the first heat dissipation element 14 includes at least one first heat dissipation fin, and the heat of the heat dissipation base plate 11 is transferred through the first heat dissipation element 14.
In one embodiment, a second heat dissipation element 15 is disposed between the second fan 13 and the heat dissipation base plate 11, wherein the second heat dissipation element 15 includes at least one second heat dissipation fin, and the heat of the heat dissipation base plate 11 is transferred through the second heat dissipation element 15.
In the above two embodiments, the first heat dissipation element 14 is disposed between the first fan 12 and the heat dissipation base plate 11, the second heat dissipation element 15 is disposed between the second fan 13 and the heat dissipation base plate 11, the first heat dissipation element 14 and the second heat dissipation element 15 include one or more heat dissipation fins, and the heat of the heat dissipation base plate 11 is transferred through the heat dissipation fins. The heat dissipation fins are arranged on the heat dissipation base plate 11, which is equivalent to increase the heat dissipation surface area of the heat dissipation base plate 11, and improves the heat dissipation effect of the heat dissipation base plate 11.
Fig. 1D is a schematic diagram of wind directions during operation of a first fan (an axial flow fan on the right side of the figure) and a second fan (a vortex flow fan on the left side of the figure) in an embodiment of the present application, where fig. 1D is a top view of a heat dissipation structure, an air inlet direction of the first fan is directed to a heat dissipation bottom plate, i.e., to an in-paper direction shown in fig. 1D, and then the first fan blows out air from a gap between the first heat dissipation fin and the heat dissipation bottom plate, i.e., blows out the air into a device, the second fan sucks hot air in the device into the second fan through an air inlet, and then blows out the air from an air outlet of the second fan, and since an air outlet of the second fan is directed to an air outlet of the electronic device, heat can be discharged outside the computing device, thereby reducing an influence on operation of other components. It should be noted that the arrows in the drawings are not included in the heat dissipation structure in order to clearly show the flow direction of the wind.
In one embodiment, as shown in any one of fig. 1A, 1B and 1C, the heat dissipation structure further includes:
at least one first heat pipe 16, wherein the evaporation end of the first heat pipe 16 is arranged in the area of the heat dissipation bottom plate 11 at the bottom of the second heat dissipation element 15;
the condensation end of the first heat pipe 16 is disposed in the first heat dissipation fin to transfer the heat of the heat generating member 18 to the first heat dissipation fin.
The heat dissipation structure is provided with a first heat pipe 16, an evaporation end of the first heat pipe 16 is disposed in a first region of the heat dissipation base located in the second heat dissipation element 15, and a condensation end is disposed in the first heat dissipation fins in an inserting manner. After the radiating bottom plate 11 transfers heat to the evaporation end of the first heat pipe 16, the working liquid in the heat pipe core is heated to evaporate and take away heat, the heat is latent heat of evaporation of the working liquid, after the steam flows to the condensation end of the heat pipe, the steam is condensed into liquid again due to the temperature reduction of the condensation end, and latent heat is released at the same time, and the liquid flows back to the end of the heat pipe under the action of capillary force, so that the heat of the area below the second fan 13 is continuously taken to the first fin through such a closed cycle. When the structure shown in fig. 1 is placed, the evaporation end is below, and the condensation end is above, so that the reflux of the working fluid can be satisfied by gravity.
The design of the first heat pipe 16 disclosed in this embodiment can achieve better effects under the following two conditions:
situation one
The position of the heat generating member 18 under the heat-radiating base plate 11 is set in an area under the second fan 13, and the area under the first fan 12 is not provided with the heat generating member 18.
Situation two
The heat generating member 18 under the heat radiating base plate 11 is mostly located in an area under the second fan 13, and a small portion is located in an area under the first fan 12.
In summary, the heat pipe design of the present embodiment is more suitable for the case that the heat quantity of the area of the heat-dissipating base plate 11 near the lower portion of the second fan 13 is larger than the heat quantity of the area near the lower portion of the first fan 12, in which case the heat quantity transferred to the first heat-dissipating fins by the heat-dissipating base plate 11 is smaller than the heat quantity transferred to the second heat-dissipating fins by the heat-dissipating base plate 11, and the heat quantity is not uniformly transferred, and the first heat pipe 16 is provided to transfer the heat quantity of the area near the lower portion of the second fan 13 to the first heat-dissipating fins below the first fan 12, so that the heat dissipation of the first fins and the second fins is more.
The beneficial effect of this embodiment lies in: the transfer speed of heat from the heat-radiating base plate 11 to the first heat-radiating member 14 can be increased by evaporation and condensation of the working liquid in the first heat pipe 16.
In one embodiment, the condensation end of the first heat pipe 16 is disposed in the first heat dissipation element 14, and includes:
the first heat sink fins are provided with holes at predetermined positions, and the condensation ends of the first heat pipes 16 are inserted into the holes of the first heat sink fins.
In one embodiment, as shown in fig. 1B, the heat dissipation structure further includes:
at least one second heat pipe 17, wherein the evaporation end of the second heat pipe 17 is arranged in the area of the heat dissipation bottom plate 11 at the bottom of the second heat dissipation element 15;
the condensation end of the second heat pipe 17 is disposed in the second heat dissipation fin to transfer the heat of the heat generating member 18 to the second heat dissipation fin.
In this embodiment, a second heat pipe 17 is provided, an evaporation end of the second heat pipe 17 is disposed in a region of the heat dissipation base plate 11 located at the bottom of the second heat dissipation element 15, and a condensation end of the second heat pipe 17 is disposed in the second heat dissipation fins, so as to transfer heat of the heat generating member 18 to the second heat dissipation fins.
The beneficial effect of this embodiment lies in: the transfer speed of heat from the heat-radiating base plate 11 to the second heat-radiating member 15 can be increased by evaporation and condensation of the working liquid in the first heat pipe 16.
In one embodiment, the condensation end of the second heat pipe 17 is disposed in the second heat dissipation element 15, and includes:
the second heat dissipation fins are provided with holes at preset positions, and the condensation ends of the second heat pipes 17 are inserted into the holes of the second heat dissipation fins.
In one embodiment, the first fan 12 is an axial fan and the second fan 13 is a vortex fan.
The present application further provides an electronic device, comprising:
a heat generating member;
the heat dissipation structure in any embodiment is used for transferring heat dissipated by the heat generating component;
and the packaging structure is used for packaging the heating piece and the heat dissipation structure.
The above embodiments are only exemplary embodiments of the present application, and are not intended to limit the present application, and the protection scope of the present application is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present application and such modifications and equivalents should also be considered to be within the scope of the present application.
Claims (10)
1. A heat dissipation structure, comprising:
the heat dissipation base plate is arranged on a heating element in the electronic equipment, and heat dissipated by the heating element can be transferred to the heat dissipation base plate;
the first fan is arranged on the side surface of the heat dissipation bottom plate, which is far away from the heating part, and the air inlet direction of the first fan points to the heat dissipation bottom plate;
the second fan is arranged on the side surface, far away from the heating part, of the heat dissipation bottom plate and is adjacent to the first fan, and an air outlet of the second fan points to an air outlet of the electronic equipment; the air inlet direction of the first fan is vertical to the air outlet direction of the second fan;
the heat dissipation bottom plate, the first fan and the second fan are located in the same packaging structure, so that the outlet air of the first fan can be sucked by the second fan to become the inlet air of the second fan.
2. The heat dissipating structure of claim 1,
the air inlet direction of the first fan points to the heat dissipation bottom plate so as to transfer the heat on the heat dissipation bottom plate to the air in the packaging structure;
the air inlet of the second fan is positioned in the packaging structure and used for sucking the air in the packaging structure into the second fan through the air inlet and exhausting the air in the packaging structure through the air outlet of the second fan.
3. The heat dissipating structure of claim 1, wherein a first heat dissipating element is disposed between the first fan and the heat dissipating base plate, wherein the first heat dissipating element comprises at least one first heat dissipating fin, and the heat of the heat dissipating base plate is transferred through the first heat dissipating element.
4. The heat dissipating structure of claim 1, wherein a second heat dissipating element is disposed between the second fan and the heat dissipating base plate, wherein the second heat dissipating element comprises at least one second heat dissipating fin, and the heat of the heat dissipating base plate is transferred through the second heat dissipating element.
5. The heat dissipation structure of claim 3, further comprising:
the evaporation end of the first heat pipe is arranged in the area of the heat dissipation bottom plate, which is positioned at the bottom of the second heat dissipation element;
the condensation end of the first heat pipe is arranged in the first radiating fins so as to transfer the heat of the heating element to the first radiating fins.
6. The heat dissipating structure of claim 5, wherein the condensing end of the first heat pipe is disposed in the first heat dissipating element, comprising:
the preset position of the first radiating fin is provided with a hole, and the condensation end of the first heat pipe is inserted into the hole of the first radiating fin.
7. The heat dissipation structure of claim 1, further comprising:
the evaporation end of the second heat pipe is arranged in the area of the heat dissipation bottom plate, which is positioned at the bottom of the second heat dissipation element;
the condensation end of the second heat pipe is arranged in the second radiating fins so as to transfer the heat of the heating element to the second radiating fins.
8. The heat dissipating structure of claim 7, wherein the condensing end of the second heat pipe is disposed in a second heat dissipating element, comprising:
the second heat dissipation fins are provided with holes at preset positions, and the condensation ends of the second heat pipes are inserted into the holes in the second heat dissipation fins.
9. The heat dissipating structure of claim 1, wherein the first fan is an axial fan and the second fan is a vortex fan.
10. An electronic device, comprising:
a heat generating member;
the heat dissipating structure of any one of claims 1 to 9, for transferring heat dissipated from the heat generating member;
and the packaging structure is used for packaging the heating piece and the heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020715278.8U CN212569678U (en) | 2020-04-30 | 2020-04-30 | Heat radiation structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020715278.8U CN212569678U (en) | 2020-04-30 | 2020-04-30 | Heat radiation structure and electronic equipment |
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| CN212569678U true CN212569678U (en) | 2021-02-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116669370A (en) * | 2022-09-28 | 2023-08-29 | 荣耀终端有限公司 | Heat dissipation module and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116669370A (en) * | 2022-09-28 | 2023-08-29 | 荣耀终端有限公司 | Heat dissipation module and electronic equipment |
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