CN110602928A - Local enhanced heat dissipation device for closed case - Google Patents
Local enhanced heat dissipation device for closed case Download PDFInfo
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- CN110602928A CN110602928A CN201910904427.7A CN201910904427A CN110602928A CN 110602928 A CN110602928 A CN 110602928A CN 201910904427 A CN201910904427 A CN 201910904427A CN 110602928 A CN110602928 A CN 110602928A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 81
- 238000012546 transfer Methods 0.000 claims abstract description 20
- 238000001816 cooling Methods 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明涉及一种密闭机箱局部强化散热装置，整体安装于对应机箱内电子元器件或印制板组件的机箱外壁面处，由吸热部分、传热部分和散热部分组成；吸热部分采用吸热板，其内端面与机箱外壁面贴合固连，在吸热板外端面上制有均布设置的凹槽；传热部分采用多个传热管，分别嵌装固定于吸热板上的凹槽内，多个传热管的一端从吸热板的一端伸出，形成外连接端；散热部分包括散热组件和离心风机；散热组件由散热板和散热翅片构成，散热板与机箱外壁固连；离心风机与吸热板外端固连，离心风机进风口朝外，离心风机出风口朝向散热翅片；散热板靠近吸热板的一端与传热管外连接端部固连。本装置足了军用高温环境中密闭箱体内电子元器件及板卡组件的散热需求。
The invention relates to a local heat dissipation device for an airtight case, which is integrally installed on the outer wall of the case corresponding to electronic components or printed board components in the case, and is composed of a heat-absorbing part, a heat-transfer part and a heat-dissipating part; the heat-absorbing part adopts a The heat plate, whose inner end surface is bonded and fixed to the outer wall of the chassis, has uniformly distributed grooves on the outer end surface of the heat-absorbing plate; the heat transfer part adopts multiple heat transfer tubes, which are respectively embedded and fixed on the heat-absorbing plate In the groove, one end of a plurality of heat transfer tubes protrudes from one end of the heat absorbing plate to form an external connection end; the heat dissipation part includes a heat dissipation component and a centrifugal fan; the heat dissipation component is composed of a heat dissipation plate and a heat dissipation fin, and the heat dissipation plate and the chassis The outer wall is fixedly connected; the centrifugal fan is fixedly connected to the outer end of the heat absorbing plate, the air inlet of the centrifugal fan faces outward, and the air outlet of the centrifugal fan faces the cooling fins; the end of the cooling plate close to the heat absorbing plate is fixedly connected to the outer connecting end of the heat transfer tube. This device satisfies the heat dissipation requirements of electronic components and board components in the airtight box in the military high-temperature environment.
Description
技术领域technical field
本发明属于电子设备冷却技术领域，涉及封闭机箱散热领域，具体涉及一种密闭机箱局部强化散入装置The invention belongs to the technical field of cooling of electronic equipment, relates to the field of heat dissipation of closed cabinets, and in particular relates to a local strengthening diffuser of a closed cabinet
背景技术Background technique
军用电子设备工作于高温、高湿、风沙或盐雾的环境中，电子元器件的工作可靠性受环境制约，为了解决电子设备抗盐雾风沙及潮湿等问题，生产厂商倾向于将电子机箱设计为密封形式，为电子板卡提供了清洁干燥的工作环境。但是，却带来散热的问题。Military electronic equipment works in the environment of high temperature, high humidity, wind and sand or salt spray, and the reliability of electronic components is restricted by the environment. In a sealed form, it provides a clean and dry working environment for electronic boards. However, it brings the problem of heat dissipation.
目前，随着集成制造技术的迅速发展，芯片的集成度越来越高，发热量越来越大。过高的环境温度会对电子元器件的稳定工作及寿命造成威胁，造成计算机类设备降频工作，甚至死机。由于空气仅在机箱内部循环，随着板卡的工作发热，温度也越来越高，使得板卡的工作环境温度明显高于机箱外部温度。At present, with the rapid development of integrated manufacturing technology, the integration of chips is getting higher and higher, and the heat generation is getting bigger and bigger. Excessive ambient temperature will threaten the stable operation and life of electronic components, causing computer equipment to reduce frequency and even crash. Since the air only circulates inside the case, as the board heats up, the temperature becomes higher and higher, making the operating environment temperature of the board significantly higher than the temperature outside the case.
热管技术飞速发展，导热系数可达3000W/m·K，种类多样，已经不受安装方向等条件限制，性价比高，而且热管的二次加工性能优良，可以整形成各种所需的形状，拓宽了其应用场合。With the rapid development of heat pipe technology, the thermal conductivity can reach 3000W/m·K, and there are various types, which are not limited by the installation direction and other conditions. of its application.
经现有技术检索，未检索到与本专利相近技术方案。After searching the prior art, no technical solution similar to this patent was found.
发明内容Contents of the invention
本发明的目的在于克服现有技术的不足之处，提供一种能满足军用高温环境中密闭箱体内电子元器件及板卡组件的散热需求的密闭机箱局部强化散入装置。The purpose of the present invention is to overcome the deficiencies of the prior art, and to provide a local reinforced diffuser for airtight enclosures that can meet the heat dissipation requirements of electronic components and board components in airtight enclosures in military high-temperature environments.
本发明的上述目的通过如下技术方案来实现：Above-mentioned purpose of the present invention is achieved by following technical scheme:
一种密闭机箱局部强化散热装置，其特征在于：局部强化散热装置整体安装于对应机箱内电子元器件或印制板组件的机箱外壁面处，所述局部强化散热装置由吸热部分、传热部分和散热部分组成；A local enhanced heat dissipation device for a closed case, characterized in that: the local enhanced heat dissipation device is integrally installed on the outer wall of the case corresponding to the electronic components or printed board assemblies in the case, and the local enhanced heat dissipation device consists of a heat-absorbing part, a heat transfer part and heat dissipation part;
所述吸热部分采用吸热板，由紫铜材料加工成形，吸热板的内端面与机箱外壁面贴合固定连接，在吸热板的外端面上制有均布设置的凹槽；The heat-absorbing part adopts a heat-absorbing plate, which is processed and formed by red copper material, and the inner end surface of the heat-absorbing plate is attached and fixedly connected with the outer wall surface of the chassis, and grooves are uniformly arranged on the outer end surface of the heat-absorbing plate;
所述传热部分采用多个热管，多个热管分别嵌装固定于吸热板上的凹槽内，多个热管的一端从吸热板的一端伸出，形成外连接端；The heat transfer part adopts a plurality of heat pipes, and the plurality of heat pipes are respectively embedded and fixed in grooves on the heat absorbing plate, and one end of the plurality of heat pipes protrudes from one end of the heat absorbing plate to form an external connection end;
所述散热部分包括散热组件和离心风机；所述散热组件由散热板和连接于散热板上的散热翅片构成，散热板和散热翅片采用紫铜材料，散热板与机箱外壁固定连接；所述离心风机与吸热板的外端固定连接，离心风机的进风口朝外，离心风机的出风口朝向散热翅片；散热板的底面与热管的外连接端部固定连接。The heat dissipation part includes a heat dissipation assembly and a centrifugal fan; the heat dissipation assembly is composed of a heat dissipation plate and heat dissipation fins connected to the heat dissipation plate, the heat dissipation plate and the heat dissipation fins are made of red copper, and the heat dissipation plate is fixedly connected to the outer wall of the chassis; The centrifugal fan is fixedly connected with the outer end of the heat-absorbing plate, the air inlet of the centrifugal fan faces outward, and the air outlet of the centrifugal fan faces the cooling fins; the bottom surface of the cooling plate is fixedly connected with the outer connecting end of the heat pipe.
而且的，在吸热板上铆接有垂直设置的四个带内螺纹的连接柱，四个连接柱按照方形的四个边角位置设置，在离心风机的四个边角位置各设置有一个连接孔，四个连接孔与四个连接柱一一穿装配合，并分别通过拧紧在四个连接柱端部的锁紧螺钉，使离心风机与传热板形成固定连接。Moreover, four connecting columns with internal threads are vertically arranged on the heat absorbing plate by riveting, and the four connecting columns are arranged according to the four corners of the square, and a connection is arranged at each of the four corners of the centrifugal fan Holes, the four connecting holes and the four connecting columns are worn and matched one by one, and the locking screws at the ends of the four connecting columns are respectively tightened to form a fixed connection between the centrifugal fan and the heat transfer plate.
本发明具有的优点和积极效果：The advantages and positive effects that the present invention has:
本密闭机箱局部强化散热装置通过吸热板吸收机箱内部电子元器件或印制板组件直接传递到机箱壁上的热量，利用热管的高导热性能，实现热量由吸热板到散热部分的快速定向传递，传递到散热翅片上的热量，通过离心风机的吹风实现强迫空气冷却散热。The local enhanced heat dissipation device of the airtight chassis absorbs the heat directly transferred to the chassis wall by the heat absorbing plate from the electronic components or printed board components inside the chassis, and utilizes the high thermal conductivity of the heat pipe to realize the rapid orientation of heat from the heat absorbing plate to the heat dissipation part Transfer, the heat transferred to the cooling fins is blown by the centrifugal fan to realize forced air cooling and heat dissipation.
本密闭机箱局部强化散热装置实现了机箱内的高发热区域的快速散热降温，满足了军用高温环境中密闭箱体内电子元器件及板卡组件的散热需求。The local enhanced heat dissipation device of the airtight case realizes the rapid heat dissipation and cooling of the high-heat area in the case, and meets the heat dissipation requirements of electronic components and board components in the airtight case in the military high-temperature environment.
附图说明Description of drawings
图1是本发明的结构示意图；Fig. 1 is a structural representation of the present invention;
图2是本发明的使用状态参考图；Fig. 2 is the use state reference figure of the present invention;
图3是采用本密闭机箱局部强化散热装置的密闭机箱的结构示意图1；Fig. 3 is a structural schematic diagram 1 of the airtight enclosure adopting the local enhanced heat dissipation device of the airtight enclosure;
图4是采用本密闭机箱局部强化散热装置的密闭机箱的结构示意图2。Fig. 4 is a structural schematic diagram 2 of the airtight enclosure adopting the local enhanced heat dissipation device of the airtight enclosure.
具体实施方式Detailed ways
下面结合附图并通过具体实施例对本发明作进一步详述，以下实施例只是描述性的，不是限定性的，不能以此限定本发明的保护范围。The present invention will be further described in detail below in conjunction with the accompanying drawings and through specific embodiments. The following embodiments are only descriptive, not restrictive, and cannot limit the protection scope of the present invention.
一种密闭机箱局部强化散热装置，请参见图1-4，其发明点为：A local heat dissipation device for an airtight case, please refer to Figure 1-4, its invention points are:
局部强化散热装置整体安装于对应机箱内电子元器件或印制板组件7的机箱外壁面处，所述局部强化散热装置由吸热部分、传热部分和散热部分组成。The local enhanced heat dissipation device is integrally installed on the outer wall of the case corresponding to the electronic components or the printed board assembly 7 in the case. The local enhanced heat dissipation device is composed of a heat absorbing part, a heat transfer part and a heat dissipation part.
所述吸热部分采用吸热板1，由紫铜材料加工成形，吸热板的内端面与机箱外壁面贴合固定连接，在吸热板的外端面上制有均布设置的凹槽1-1。The heat-absorbing part adopts heat-absorbing plate 1, which is processed and formed by red copper material. The inner end surface of the heat-absorbing plate is fixedly connected with the outer wall surface of the chassis, and the outer end surface of the heat-absorbing plate is formed with grooves 1- 1.
所述传热部分采用多个热管2，多个热管分别嵌装固定于吸热板上的凹槽内，多个热管的一端从吸热板的一端伸出，形成外连接端2-1。一般热管由紫铜管壳、吸液芯和端盖组成。热管内部是被抽成负压状态，充入适当的液体，这种液体沸点低，容易挥发。管壁有吸液芯，其由毛细多孔材料构成。热管一端为蒸发端，另外一端为冷凝端，当热管一端受热时，毛细管中的液体迅速汽化，蒸气在热扩散的动力下流向另外一端，并在冷端冷凝释放出热量，液体再沿多孔材料靠毛细作用流回蒸发端，如此循环不止，直到热管两端温度相等(此时蒸汽热扩散停止)。这种循环是快速进行的，热量可以被源源不断地传导开来。The heat transfer part adopts a plurality of heat pipes 2, and the plurality of heat pipes are respectively embedded and fixed in grooves on the heat absorbing plate, and one end of the plurality of heat pipes protrudes from one end of the heat absorbing plate to form an external connection end 2-1. Generally, the heat pipe is composed of a copper tube shell, a liquid-absorbing core and an end cover. The inside of the heat pipe is pumped into a negative pressure state and filled with a suitable liquid, which has a low boiling point and is easy to volatilize. The tube wall has a liquid-absorbing core, which is made of capillary porous material. One end of the heat pipe is the evaporation end, and the other end is the condensation end. When one end of the heat pipe is heated, the liquid in the capillary quickly vaporizes, and the vapor flows to the other end under the power of thermal diffusion, and condenses at the cold end to release heat. It flows back to the evaporation end by capillary action, and the cycle continues until the temperature at both ends of the heat pipe is equal (at this time, the thermal diffusion of steam stops). This cycle is rapid, and heat can be continuously conducted away.
所述散热部分包括散热组件4和离心风机3。所述散热组件由散热板4-1和连接于散热板上的散热翅片4-2构成，散热板和散热翅片采用紫铜材料，散热板与机箱外壁固定连接。所述离心风机与吸热板的外端固定连接，离心风机的进风口3-1朝外，离心风机的出风口朝向散热翅片；散热板的底面与热管的外连接端部固定连接。The heat dissipation part includes a heat dissipation assembly 4 and a centrifugal fan 3 . The heat dissipation assembly is composed of a heat dissipation plate 4-1 and a heat dissipation fin 4-2 connected to the heat dissipation plate. The heat dissipation plate and the heat dissipation fins are made of red copper, and the heat dissipation plate is fixedly connected with the outer wall of the chassis. The centrifugal fan is fixedly connected to the outer end of the heat absorbing plate, the air inlet 3-1 of the centrifugal fan faces outward, and the air outlet of the centrifugal fan faces the cooling fins; the bottom surface of the cooling plate is fixedly connected to the outer connecting end of the heat pipe.
上述结构中，离心风机进一步通过以下方式固定在吸热板上：In the above structure, the centrifugal fan is further fixed on the heat absorbing plate in the following ways:
在吸热板上铆接有垂直设置的四个带内螺纹的连接柱5，四个连接柱按照方形的四个边角位置设置，在离心风机的四个边角位置各设置有一个连接孔3-2，四个连接孔与四个连接柱一一穿装配合，并分别通过拧紧在四个连接柱端部的锁紧螺钉6，使离心风机与传热板形成固定连接。Four vertically arranged connecting columns 5 with internal threads are riveted on the heat absorbing plate. The four connecting columns are arranged according to the four corner positions of the square, and a connecting hole 3 is respectively arranged at the four corner positions of the centrifugal fan. -2. The four connecting holes are fitted with the four connecting columns one by one, and the locking screws 6 at the ends of the four connecting columns are respectively tightened to form a fixed connection between the centrifugal fan and the heat transfer plate.
本局部强化散热装置应用于密闭机箱外，在密闭机箱外对应安装局部强化散热装置的前端、后端、下方及四个侧板均需要安装护板，在前护板和下护板上分别设置前部进风口9和下部进风口10，在后护板上设置出风口8，进风口和出风口均可采用附图所述的格栅式结构。The local enhanced heat dissipation device is applied outside the airtight chassis, and the front, rear, bottom and four side panels of the local enhanced heat dissipation device correspondingly installed outside the airtight chassis need to install guard plates, which are respectively installed on the front guard plate and the lower guard plate. The front air inlet 9 and the lower air inlet 10 are provided with an air outlet 8 on the rear guard plate, and both the air inlet and the air outlet can adopt the grille structure described in the accompanying drawings.
封闭机箱内的印制板组件及机箱需采用如下结构及安装方式：The printed board components and the chassis in the closed chassis shall adopt the following structure and installation method:
1、印制板直接贴壁方式将印制板元器件面面向机箱传热壁安装，依据高功率元器件的散热端面高度，在箱体传热壁面上设计凸起结构，预留导热界面材料间隙，实现所有高功率器件的同时贴壁安装；1. The printed board is directly attached to the wall, and the printed board components are installed facing the heat transfer wall of the chassis. According to the height of the heat dissipation end face of the high-power components, a raised structure is designed on the heat transfer wall of the box, and the thermal interface material is reserved. Clearance, to achieve simultaneous wall-mounted installation of all high-power devices;
2、印制板安装金属冷板方式，设计金属冷板结构，该冷板与印制板贴合侧依据高功耗元器件散热端面高度，预留导热界面材料间隙，设计散热凸起结构，保证所有高功率器件安装冷板后同时与冷板散热凸台接触；冷板另一侧设计成平面结构，与呈平面状的机箱内壁紧密贴合；2. The metal cold plate is installed on the printed board, and the structure of the metal cold plate is designed. According to the height of the heat dissipation end surface of the high power consumption components on the bonding side of the cold plate and the printed board, the gap of the heat conduction interface material is reserved, and the heat dissipation protrusion structure is designed. Ensure that all high-power devices are in contact with the heat dissipation boss of the cold plate at the same time after the cold plate is installed; the other side of the cold plate is designed as a plane structure, which is closely attached to the plane inner wall of the chassis;
3、机箱传热壁设计机箱内壁依据有无散热凸起结构进行设计，外侧面设计为平面结构，增大其与局部强化散热装置的接触面积，通过在机箱壁与散热装置间使用界面材料，确保两者接触良好。3. Heat transfer wall design of the chassis The inner wall of the chassis is designed according to whether there is a heat dissipation protrusion structure, and the outer surface is designed as a plane structure to increase its contact area with the local enhanced heat dissipation device. By using interface materials between the chassis wall and the heat dissipation device, Make sure the two are in good contact.
本局部强化散热装置由吸热部分、散热部分和传热部分组成。吸热部分由紫铜加工成平板状吸热板，表面加工凹槽，增大吸热板与热管的接触面积。吸热板铆接连接柱，为离心风机提供安装结构要素；散热部分由紫铜板和散热翅片组成，翅片可通过真空钎焊或铲削加工而成，翅片尺寸参数依据散热量确定；传热部分由多根热管实现，利用热管的高导热性能，实现热量由吸热板到散热部分的快速定向传递。由于热管结构强度较高，热管组同时起到了连接并支撑吸热部分和散热部分的作用。通过对热管进行弯折加工，可实现散热装置结构形式的灵活变化。在吸热板上安装离心风机，使风机出风口正对散热部分的散热翅片，对散热翅片进行强迫空气冷却散热。The local enhanced heat dissipation device is composed of a heat absorption part, a heat dissipation part and a heat transfer part. The heat-absorbing part is processed into a flat heat-absorbing plate by red copper, and the surface is processed with grooves to increase the contact area between the heat-absorbing plate and the heat pipe. The heat-absorbing plate is riveted to the connection column, which provides installation structure elements for the centrifugal fan; the heat dissipation part is composed of a copper plate and a heat dissipation fin, and the fin can be processed by vacuum brazing or shoveling, and the fin size parameter is determined according to the heat dissipation; The heat part is realized by multiple heat pipes, and the high thermal conductivity of the heat pipe is used to realize the rapid and directional transfer of heat from the heat absorbing plate to the heat dissipation part. Due to the high structural strength of the heat pipe, the heat pipe group also plays a role of connecting and supporting the heat absorbing part and the heat dissipation part. By bending the heat pipe, the flexible change of the structural form of the heat sink can be realized. A centrifugal fan is installed on the heat-absorbing plate, so that the air outlet of the fan is facing the heat dissipation fins of the heat dissipation part, and the heat dissipation fins are forced to cool and dissipate heat.
综上，本局部强化散热装置搭建了高功率电子元器件至环境的高效热传导及强迫风冷通路，大大提高了机箱对电子板卡的冷却效率，即保证了机箱的密闭性，又防止板卡工作于过高的温度工作环境中，结构形式灵活，性能可靠，性价比高，可广泛应用于军用密闭电子装备的散热设计中，具有推广应用价值。To sum up, this local enhanced heat dissipation device builds high-efficiency heat conduction and forced air cooling passages from high-power electronic components to the environment, which greatly improves the cooling efficiency of the chassis to electronic boards, which not only ensures the airtightness of the chassis, but also prevents boards from Working in a working environment with too high temperature, the structure is flexible, the performance is reliable, and the cost performance is high. It can be widely used in the heat dissipation design of military airtight electronic equipment, and has the value of popularization and application.
尽管为说明目的公开了本发明的实施例和附图，但是本领域的技术人员可以理解：在不脱离本发明及所附权利要求的精神和范围内，各种替换、变化和修改都是可能的，因此，本发明的范围不局限于实施例和附图所公开的内容。Although the embodiments and drawings of the present invention are disclosed for the purpose of illustration, those skilled in the art can understand that various replacements, changes and modifications are possible without departing from the spirit and scope of the present invention and the appended claims Therefore, the scope of the present invention is not limited to what is disclosed in the embodiments and drawings.
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Application publication date: 20191220 |