CN110602928A - Local enhanced heat dissipation device for closed case - Google Patents
Local enhanced heat dissipation device for closed case Download PDFInfo
- Publication number
- CN110602928A CN110602928A CN201910904427.7A CN201910904427A CN110602928A CN 110602928 A CN110602928 A CN 110602928A CN 201910904427 A CN201910904427 A CN 201910904427A CN 110602928 A CN110602928 A CN 110602928A
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- Prior art keywords
- heat
- heat dissipation
- plate
- case
- centrifugal fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 77
- 238000010521 absorption reaction Methods 0.000 claims abstract description 23
- 238000012546 transfer Methods 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000712 assembly Effects 0.000 abstract description 3
- 238000000429 assembly Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a local enhanced heat dissipation device of a closed case, which is integrally arranged on the outer wall surface of the case corresponding to an electronic component or a printed board assembly in the case and consists of a heat absorption part, a heat transfer part and a heat dissipation part; the heat absorption part adopts a heat absorption plate, the inner end surface of the heat absorption plate is fixedly attached to the outer wall surface of the case, and grooves are uniformly distributed on the outer end surface of the heat absorption plate; the heat transfer part adopts a plurality of heat transfer pipes which are respectively embedded and fixed in the grooves on the heat absorbing plate, and one ends of the plurality of heat transfer pipes extend out from one end of the heat absorbing plate to form an external connecting end; the heat dissipation part comprises a heat dissipation assembly and a centrifugal fan; the heat dissipation assembly consists of a heat dissipation plate and heat dissipation fins, and the heat dissipation plate is fixedly connected with the outer wall of the case; the centrifugal fan is fixedly connected with the outer end of the heat absorbing plate, the air inlet of the centrifugal fan faces outwards, and the air outlet of the centrifugal fan faces the radiating fin; one end of the heat dissipation plate close to the heat absorption plate is fixedly connected with the outer connecting end part of the heat transfer pipe. The device meets the heat dissipation requirements of electronic components and board card assemblies in the closed box in a military high-temperature environment.
Description
Technical Field
The invention belongs to the technical field of electronic equipment cooling, relates to the field of closed case heat dissipation, and particularly relates to a local strengthening and scattering device for a closed case
Background
Military electronic equipment works in the environment of high temperature, high humidity, sand blown by the wind or salt fog, the operational reliability of electronic components is restricted by the environment, in order to solve the problems of salt fog, sand blown by the wind, humidity and the like of the electronic equipment, manufacturers tend to design the electronic cabinet into a sealing form, and clean and dry working environment is provided for the electronic board card. However, this causes a problem of heat dissipation.
At present, with the rapid development of the integrated manufacturing technology, the integration level of the chip is higher and higher, and the heat productivity is larger and larger. The overhigh environment temperature threatens the stable work and the service life of electronic components, and causes the frequency reduction work and even the halt of computer equipment. Because the air only circulates in the case, the temperature is higher and higher along with the work of the board card, so that the temperature of the working environment of the board card is obviously higher than the temperature outside the case.
The heat pipe technology is rapidly developed, the heat conductivity coefficient can reach 3000W/m.K, the heat pipe is various in types, is not limited by conditions such as installation directions and the like, is high in cost performance, has excellent secondary processing performance, can be shaped into various required shapes, and widens the application occasions.
Through the search of the prior art, the technical scheme similar to the patent is not searched.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a local strengthening and radiating device for a closed case, which can meet the radiating requirements of electronic components and board card assemblies in the closed case in a military high-temperature environment.
The above object of the present invention is achieved by the following technical solutions:
the utility model provides a heat abstractor is reinforceed to airtight quick-witted case part which characterized in that: the local reinforced heat dissipation device is integrally arranged on the outer wall surface of the case corresponding to the electronic components or the printed board assembly in the case, and consists of a heat absorption part, a heat transfer part and a heat dissipation part;
the heat absorption part is made of red copper material and is formed by a heat absorption plate, the inner end face of the heat absorption plate is fixedly connected with the outer wall face of the case in an attaching manner, and grooves are uniformly distributed on the outer end face of the heat absorption plate;
the heat transfer part adopts a plurality of heat pipes which are respectively embedded and fixed in the grooves on the heat absorbing plate, and one ends of the heat pipes extend out from one end of the heat absorbing plate to form an external connecting end;
the heat dissipation part comprises a heat dissipation assembly and a centrifugal fan; the heat dissipation assembly is composed of a heat dissipation plate and heat dissipation fins connected to the heat dissipation plate, the heat dissipation plate and the heat dissipation fins are made of red copper materials, and the heat dissipation plate is fixedly connected with the outer wall of the case; the centrifugal fan is fixedly connected with the outer end of the heat absorbing plate, the air inlet of the centrifugal fan faces outwards, and the air outlet of the centrifugal fan faces the radiating fin; the bottom surface of the heat dissipation plate is fixedly connected with the outer connecting end part of the heat pipe.
And moreover, four connecting columns with internal threads are vertically arranged on the heat absorbing plate in a riveting manner, the four connecting columns are arranged according to four square corner positions, connecting holes are respectively arranged at the four corner positions of the centrifugal fan, the four connecting holes and the four connecting columns are in one-to-one penetrating fit, and the centrifugal fan and the heat transfer plate are fixedly connected through locking screws screwed at the end parts of the four connecting columns respectively.
The invention has the advantages and positive effects that:
the local strengthening heat dissipation device of the closed case absorbs heat directly transmitted to the case wall by electronic components or printed board components inside the case through the heat absorbing plate, and utilizes the high heat conduction performance of the heat pipe to realize rapid directional transmission of the heat from the heat absorbing plate to the heat dissipation part and the heat transmitted to the heat dissipation fins, and realizes forced air cooling heat dissipation through the blowing of the centrifugal fan.
The local enhanced heat dissipation device for the closed case realizes rapid heat dissipation and cooling of a high-heating area in the case, and meets the heat dissipation requirements of electronic components and board card assemblies in the closed case in a military high-temperature environment.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a use state reference diagram of the present invention;
FIG. 3 is a schematic structural diagram 1 of a closed case using the local enhanced heat dissipation device;
fig. 4 is a schematic structural diagram 2 of a closed chassis adopting the local enhanced heat dissipation device of the closed chassis.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments, which are illustrative only and not limiting, and the scope of the present invention is not limited thereby.
The invention relates to a local enhanced heat dissipation device for a closed case, please refer to fig. 1-4, the invention points are:
the local reinforced heat dissipation device is integrally arranged on the outer wall surface of the case corresponding to the electronic component or the printed board assembly 7 in the case, and the local reinforced heat dissipation device is composed of a heat absorption part, a heat transfer part and a heat dissipation part.
The heat absorption part adopts a heat absorption plate 1 and is formed by processing red copper materials, the inner end face of the heat absorption plate is fixedly connected with the outer wall face of the case in an attaching mode, and grooves 1-1 are uniformly distributed and arranged on the outer end face of the heat absorption plate.
The heat transfer part adopts a plurality of heat pipes 2, the heat pipes are respectively embedded and fixed in the grooves on the heat absorbing plate, and one ends of the heat pipes extend out from one end of the heat absorbing plate to form an external connecting end 2-1. The heat pipe is generally composed of a red copper pipe shell, a liquid absorption core and an end cover. The interior of the heat pipe is pumped into a negative pressure state and filled with proper liquid, and the liquid has a low boiling point and is easy to volatilize. The tube wall has a wick that is constructed of a capillary porous material. When one end of the heat pipe is heated, the liquid in the capillary tube is quickly vaporized, the vapor flows to the other end under the power of heat diffusion, the vapor is condensed at the cold end to release heat, and the liquid flows back to the evaporation end along the porous material by the capillary action, so that the circulation is not stopped until the temperatures of the two ends of the heat pipe are equal (at the moment, the heat diffusion of the vapor is stopped). This cycle is rapid and heat can be conducted away from the heat source.
The heat dissipation part includes a heat dissipation assembly 4 and a centrifugal fan 3. The heat dissipation assembly is composed of a heat dissipation plate 4-1 and heat dissipation fins 4-2 connected to the heat dissipation plate, the heat dissipation plate and the heat dissipation fins are made of red copper materials, and the heat dissipation plate is fixedly connected with the outer wall of the case. The centrifugal fan is fixedly connected with the outer end of the heat absorbing plate, an air inlet 3-1 of the centrifugal fan faces outwards, and an air outlet of the centrifugal fan faces the radiating fin; the bottom surface of the heat dissipation plate is fixedly connected with the outer connecting end part of the heat pipe.
In the above structure, the centrifugal fan is further fixed on the heat absorbing plate by:
four connecting columns 5 with internal threads are vertically arranged on the heat absorbing plate in a riveting mode, the four connecting columns are arranged according to four square corner positions, connecting holes 3-2 are respectively formed in the four corner positions of the centrifugal fan, the four connecting holes and the four connecting columns are in one-to-one penetrating fit, and the centrifugal fan and the heat transfer plate are fixedly connected through locking screws 6 screwed at the end portions of the four connecting columns respectively.
The local intensified heat dissipation device is applied to the outside of a closed case, protective plates are required to be installed at the front end, the rear end, the lower part and four side plates of the local intensified heat dissipation device correspondingly installed outside the closed case, a front air inlet 9 and a lower air inlet 10 are respectively arranged on the front protective plate and the lower protective plate, an air outlet 8 is arranged on the rear protective plate, and the air inlet and the air outlet can adopt the grid type structure shown in the attached drawings.
The printed board assembly and the case in the closed case need to adopt the following structures and installation modes:
1. the surface of a printed board component is installed facing the heat transfer wall of the case in a direct wall-sticking mode of the printed board, a protruding structure is designed on the heat transfer wall surface of the case body according to the height of the heat dissipation end surface of the high-power component, and a heat conduction interface material gap is reserved, so that all high-power components are installed in a wall-sticking mode at the same time;
2. the printed board is provided with a metal cold plate, a metal cold plate structure is designed, gaps of heat-conducting interface materials are reserved on the joint side of the cold plate and the printed board according to the height of the heat-radiating end face of a high-power-consumption component, and a heat-radiating convex structure is designed to ensure that all high-power components are contacted with a cold plate heat-radiating boss after being provided with a cold plate; the other side of the cold plate is designed into a plane structure and is tightly attached to the inner wall of the planar case;
3. the heat transfer wall of the case is designed according to the existence of a heat dissipation convex structure on the inner wall of the case, the outer side surface of the heat transfer wall is designed to be a plane structure, the contact area between the heat transfer wall and the local enhanced heat dissipation device is increased, and the good contact between the heat transfer wall and the local enhanced heat dissipation device is ensured by using an interface material between the case wall and the heat dissipation device.
The local reinforced heat radiator consists of heat absorbing part, heat radiating part and heat transferring part. The heat absorbing part is a flat heat absorbing plate processed by red copper, and a groove is processed on the surface of the heat absorbing part to increase the contact area between the heat absorbing plate and the heat pipe. The heat absorbing plate is riveted with the connecting column to provide an installation structural element for the centrifugal fan; the heat dissipation part consists of a red copper plate and heat dissipation fins, the fins can be formed by vacuum brazing or shoveling machining, and the size parameters of the fins are determined according to the heat dissipation capacity; the heat transfer part is realized by a plurality of heat pipes, and the heat is quickly and directionally transferred from the heat absorbing plate to the heat dissipation part by utilizing the high heat conduction performance of the heat pipes. Because the structural strength of the heat pipe is high, the heat pipe set simultaneously plays a role in connecting and supporting the heat absorption part and the heat dissipation part. The heat pipe is bent, so that the structural form of the heat dissipation device can be flexibly changed. And a centrifugal fan is arranged on the heat absorbing plate, so that the air outlet of the fan is opposite to the radiating fins of the radiating part, and the radiating fins are subjected to forced air cooling radiation.
In conclusion, the local enhanced heat dissipation device builds a high-efficiency heat conduction and forced air cooling path from the high-power electronic component to the environment, greatly improves the cooling efficiency of the chassis to the electronic board card, ensures the airtightness of the chassis, prevents the board card from working in an overhigh temperature working environment, has flexible structural form, reliable performance and high cost performance, can be widely applied to the heat dissipation design of military airtight electronic equipment, and has popularization and application values.
Although the embodiments of the present invention and the accompanying drawings are disclosed for illustrative purposes, those skilled in the art will appreciate that: various substitutions, changes and modifications are possible without departing from the spirit and scope of the invention and the appended claims, and therefore the scope of the invention is not limited to the disclosure of the embodiments and the accompanying drawings.
Claims (2)
1. The utility model provides a heat abstractor is reinforceed to airtight quick-witted case part which characterized in that: the local reinforced heat dissipation device is integrally arranged on the outer wall surface of the case corresponding to the electronic components or the printed board assembly in the case, and consists of a heat absorption part, a heat transfer part and a heat dissipation part;
the heat absorption part is made of red copper material and is formed by a heat absorption plate, the inner end face of the heat absorption plate is fixedly connected with the outer wall face of the case in an attaching manner, and grooves are uniformly distributed on the outer end face of the heat absorption plate;
the heat transfer part adopts a plurality of heat pipes which are respectively embedded and fixed in the grooves on the heat absorbing plate, and one ends of the heat pipes extend out from one end of the heat absorbing plate to form an external connecting end;
the heat dissipation part comprises a heat dissipation assembly and a centrifugal fan; the heat dissipation assembly is composed of a heat dissipation plate and heat dissipation fins connected to the heat dissipation plate, the heat dissipation plate and the heat dissipation fins are made of red copper materials, and the heat dissipation plate is fixedly connected with the outer wall of the case; the centrifugal fan is fixedly connected with the outer end of the heat absorbing plate, the air inlet of the centrifugal fan faces outwards, and the air outlet of the centrifugal fan faces the radiating fin; the bottom surface of the heat dissipation plate is fixedly connected with the outer connecting end part of the heat pipe.
2. The local reinforced heat dissipation device for the enclosed chassis of claim 1, wherein: four connecting columns with internal threads are vertically arranged on the heat absorbing plate in a riveting mode, the four connecting columns are arranged according to four square corner positions, connecting holes are respectively formed in the four corner positions of the centrifugal fan, the four connecting holes and the four connecting columns are in one-to-one penetrating fit, and the centrifugal fan and the heat transfer plate are fixedly connected through locking screws screwed at the end portions of the four connecting columns respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910904427.7A CN110602928A (en) | 2019-09-24 | 2019-09-24 | Local enhanced heat dissipation device for closed case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910904427.7A CN110602928A (en) | 2019-09-24 | 2019-09-24 | Local enhanced heat dissipation device for closed case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110602928A true CN110602928A (en) | 2019-12-20 |
Family
ID=68862713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910904427.7A Pending CN110602928A (en) | 2019-09-24 | 2019-09-24 | Local enhanced heat dissipation device for closed case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110602928A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048097A (en) * | 2021-04-29 | 2021-06-29 | 杭州余杭特种风机有限公司 | Centrifugal blower impeller and centrifugal blower thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309572A (en) * | 2007-05-18 | 2008-11-19 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101464618A (en) * | 2007-12-19 | 2009-06-24 | 富准精密工业(深圳)有限公司 | Projection apparatus with cooling structure |
| CN101610662A (en) * | 2008-06-20 | 2009-12-23 | 沈国忠 | Heat pipe cooling type fully sealed high-efficiency radiating electronic cabinet |
| CN102378552A (en) * | 2010-08-24 | 2012-03-14 | 富瑞精密组件（昆山）有限公司 | Radiating device and electronic device using same |
| CN103188914A (en) * | 2011-12-29 | 2013-07-03 | 富瑞精密组件（昆山）有限公司 | Radiating module |
| CN104750209A (en) * | 2013-12-31 | 2015-07-01 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation module |
| CN106102424A (en) * | 2016-08-19 | 2016-11-09 | 苏州科勒迪电子有限公司 | Heat pipe type heat radiation module and use this heat pipe type heat radiation module charging pile module |
| CN210808041U (en) * | 2019-09-24 | 2020-06-19 | 中国船舶重工集团公司第七0七研究所 | Local enhanced heat dissipation device for closed case |
-
2019
- 2019-09-24 CN CN201910904427.7A patent/CN110602928A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309572A (en) * | 2007-05-18 | 2008-11-19 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101464618A (en) * | 2007-12-19 | 2009-06-24 | 富准精密工业(深圳)有限公司 | Projection apparatus with cooling structure |
| CN101610662A (en) * | 2008-06-20 | 2009-12-23 | 沈国忠 | Heat pipe cooling type fully sealed high-efficiency radiating electronic cabinet |
| CN102378552A (en) * | 2010-08-24 | 2012-03-14 | 富瑞精密组件（昆山）有限公司 | Radiating device and electronic device using same |
| CN103188914A (en) * | 2011-12-29 | 2013-07-03 | 富瑞精密组件（昆山）有限公司 | Radiating module |
| CN104750209A (en) * | 2013-12-31 | 2015-07-01 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation module |
| CN106102424A (en) * | 2016-08-19 | 2016-11-09 | 苏州科勒迪电子有限公司 | Heat pipe type heat radiation module and use this heat pipe type heat radiation module charging pile module |
| CN210808041U (en) * | 2019-09-24 | 2020-06-19 | 中国船舶重工集团公司第七0七研究所 | Local enhanced heat dissipation device for closed case |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048097A (en) * | 2021-04-29 | 2021-06-29 | 杭州余杭特种风机有限公司 | Centrifugal blower impeller and centrifugal blower thereof |
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