CN219555508U - Dustproof heat dissipation cabinet - Google Patents

Dustproof heat dissipation cabinet Download PDF

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Publication number
CN219555508U
CN219555508U CN202320475543.3U CN202320475543U CN219555508U CN 219555508 U CN219555508 U CN 219555508U CN 202320475543 U CN202320475543 U CN 202320475543U CN 219555508 U CN219555508 U CN 219555508U
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CN
China
Prior art keywords
wall
cooling
box
conducting plate
liquid
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Active
Application number
CN202320475543.3U
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Chinese (zh)
Inventor
朱琼
张笑宇
毛亚文
徐小明
孔永莉
罗生林
李极铭
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Xining Tianzhu Network Engineering Co ltd
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Xining Tianzhu Network Engineering Co ltd
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Priority to CN202320475543.3U priority Critical patent/CN219555508U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to a cabinet with dustproof, radiating and drying functions, in particular to a dustproof radiating cabinet, which comprises a cabinet body, wherein two mounting grooves are respectively formed in the left side surface and the right side surface of the inner wall of the cabinet body, hot air in the cabinet body is extracted through an exhaust fan and discharged into a connecting box, a guide plate guides the discharged hot air to uniformly spray a heat conducting plate, the heat conducting plate transfers absorbed heat to a radiating fin, the radiating fin dispersedly transfers the heat to cooling liquid in a cooling box, the cooling liquid cools the radiating fin, the cooled radiating fin transfers low temperature to the heat conducting plate, and hot air sprayed to the heat conducting plate is cooled, so that heat is radiated in a cold-hot exchange mode, contact with external air is avoided, damage of floating dust to electronic elements in the cabinet body is reduced, and the problem that the floating dust is easy to damage electronic equipment arranged in the cabinet body is solved.

Description

Dustproof heat dissipation cabinet
Technical Field
The utility model relates to a dustproof heat dissipation cabinet, in particular to a cabinet with dustproof, heat dissipation and drying functions.
Background
The cabinet is a stand-alone or self-supporting enclosure for accommodating electrical or electronic equipment, and if the operating temperature of the electronic equipment is too high, the electronic equipment is easy to influence the normal operation of the electronic equipment, so that the requirements on heat dissipation of the control cabinet, the communication cabinet and the like are higher and higher.
In the prior art, a heat dissipation window, a heat dissipation fan or a heat dissipation fin is installed on a side wall of a cabinet to dissipate heat, when the cabinet is placed for a period of time, dust enters the cabinet from a gap between the heat dissipation window, the heat dissipation fan or the heat dissipation fin and a mechanism, and floating dust easily damages electronic equipment arranged in the cabinet.
Disclosure of Invention
To solve the problems set forth in the background art. The utility model provides a dustproof heat dissipation cabinet.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a dustproof heat dissipation rack, includes the rack body, two mounting grooves have been seted up respectively to the left and right sides face of rack body inner wall, the right side rigid coupling of mounting groove inner wall has the connection box, the right flank of connection box is provided with cooling module, the connection can be dismantled with the one side that two cooling boxes are relative respectively to the left and right sides face of rack body, the lower surface of rack body and the upper surface rigid coupling of liquid reserve tank, the inside of liquid reserve tank is provided with cooling module.
Preferably, the heat dissipation assembly comprises two exhaust fans arranged on the upper side and the lower side of the right side of the connecting box, a plurality of guide plates are fixedly connected to the front surface and the back surface of the inner wall of each exhaust fan respectively, two air outlets are respectively formed in the upper surface and the lower surface of the connecting box, a heat conducting plate is fixedly connected to the inner wall of the mounting groove, and the left side of the right side of the connecting box of the heat conducting plate is attached to the left side of the connecting box.
Preferably, the lower surface rigid coupling of rack body inner wall has the drying cabinet, a plurality of through-holes have been seted up to the upper surface symmetry of drying cabinet, the inside of drying cabinet is provided with the drier.
Preferably, the cooling assembly comprises a diaphragm pump arranged on the lower surface of the inner wall of the liquid storage tank, double liquid discharge ends of the diaphragm pump are respectively communicated with one ends of two liquid inlet pipes, the other ends of the liquid inlet pipes penetrate through the left side surface of the inner wall of the liquid storage tank to be communicated with the lower surface of the cooling tank, a radiating fin is detachably connected to the left side of the inner wall of the mounting groove, and the right side surface of the radiating fin is attached to the left side surface of the heat conducting plate.
Preferably, a semiconductor refrigerating plate is arranged on the right side surface of the liquid storage tank, and a heat dissipation fan is arranged at the heat dissipation end of the semiconductor refrigerating plate.
Preferably, the upper side of the back surface of the cooling tank is communicated with one end of a liquid return pipe, and the other end of the liquid return pipe is communicated with the back surface of the liquid storage tank.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the hot air in the cabinet body is extracted through the exhaust fan and discharged into the connecting box, the guide plate guides the discharged hot air to uniformly spray the heat-conducting plate, the heat-conducting plate transfers the absorbed heat to the radiating fins, the radiating fins disperse and transfer the heat to the cooling liquid in the cooling box, the cooling liquid cools the radiating fins, the cooled radiating fins transfer low temperature to the heat-conducting plate, the hot air sprayed on the heat-conducting plate is cooled, so that heat exchange is carried out, and meanwhile, the heat-conducting plate is prevented from contacting with external air, the damage of floating dust to electronic elements in the cabinet body is reduced, and the problem that the floating dust is easy to damage electronic equipment arranged in the cabinet body is solved.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the present utility model;
FIG. 3 is a schematic perspective view of a connection box according to the present utility model;
FIG. 4 is a schematic view of the rear view of the present utility model;
in the figure: 1. a cabinet body; 2. a mounting groove;
and (3) a cooling assembly: 31. a heat sink; 32. a cooling box; 33. a liquid inlet pipe; 34. a diaphragm pump;
4. a liquid storage tank; 5. a drying box; 6. a through hole; 7. a connection box;
and a heat radiation assembly: 81. an exhaust fan; 82. an air outlet; 83. a deflector; 84. a heat conductive plate; 9. a liquid return pipe; 10. a semiconductor refrigeration sheet; 11. a heat dissipation fan.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1-4, the present utility model provides the following technical solutions: the utility model provides a dustproof heat dissipation rack, includes cabinet body 1, two mounting grooves 2 have been seted up respectively to the left and right sides face of cabinet body 1 inner wall, the right side rigid coupling of mounting groove 2 inner wall has connection box 7, the right flank of connection box 7 is provided with radiating element, the connection can be dismantled with the one side that two cooling boxes 32 are relative respectively to the left and right sides face of cabinet body 1, the lower surface of cabinet body 1 and the upper surface rigid coupling of liquid reserve tank 4, the inside of liquid reserve tank 4 is provided with cooling element.
Specifically, the heat dissipation assembly comprises two exhaust fans 81 installed on the upper side and the lower side of the right side surface of the connection box 7, a plurality of guide plates 83 are fixedly connected to the front surface and the back surface of the inner wall of each exhaust fan 81, two air outlets 82 are respectively formed in the upper surface and the lower surface of the connection box 7, a heat conducting plate 84 is fixedly connected to the inner wall of the installation groove 2, and the left side surface of the right side surface of each heat conducting plate 84 is attached to the left side surface of the connection box 7;
the exhaust fan 81 extracts hot air in the cabinet body 1 and discharges the hot air into the connecting box 7 through the exhaust end, the guide plate 83 in the connecting box 7 guides the discharged hot air, the hot air is uniformly sprayed on the heat conducting plate 84, and the heat conducting plate 84 absorbs heat of the hot air.
Specifically, a drying box 5 is fixedly connected to the lower surface of the inner wall of the cabinet body 1, a plurality of through holes 6 are symmetrically formed in the upper surface of the drying box 5, and a drying agent is arranged in the drying box 5;
the drier in the drying box 5 absorbs water vapor and moisture in the cabinet body 1, so that the air in the cabinet body 1 is kept dry, and the electronic equipment short circuit caused by the moisture is avoided.
Specifically, the cooling assembly comprises a diaphragm pump 34 arranged on the lower surface of the inner wall of the liquid storage tank 4, the double drainage ends of the diaphragm pump 34 are respectively communicated with one ends of two liquid inlet pipes 33, and the other ends of the liquid inlet pipes 33 penetrate through the left side surface of the inner wall of the liquid storage tank 4 to be communicated with the lower surface of the cooling tank 32;
specifically, the left side of the inner wall of the installation groove 2 is detachably connected with the cooling fin 31, and the right side surface of the cooling fin 31 is attached to the left side surface of the heat conducting plate 84;
the diaphragm pump 34 pumps the cooling liquid in the liquid storage tank 4 and discharges the cooling liquid into the cooling tank 32 through the liquid inlet pipe 33;
the heat conducting plate 84 transfers the absorbed heat to the cooling fin 31, the cooling fin 31 dispersedly transfers the heat to the cooling liquid in the cooling box 32, the cooling liquid cools the cooling fin 31, the cooled cooling fin 31 transfers the low temperature to the heat conducting plate 84, the hot air of the spray heat conducting plate 84 is cooled, the heat is dissipated through cold-heat exchange, the contact with the external air is avoided, and the damage of floating dust to electronic elements in the cabinet body 1 is reduced.
Specifically, the upper side of the back surface of the cooling box 32 is communicated with one end of the liquid return pipe 9, and the other end of the liquid return pipe 9 is communicated with the back surface of the liquid storage box 4;
after the cooling liquid subjected to cold-heat exchange rises to a certain height, the cooling liquid returns to the liquid storage tank 4 through the liquid return pipe 9 for recycling, so that the resource waste is reduced.
Specifically, a semiconductor refrigeration piece 10 is installed on the right side surface of the liquid storage tank 4, and a heat dissipation fan 11 is installed at the heat dissipation end of the semiconductor refrigeration piece 10;
the semiconductor cooling fin 10 radiates the cooling liquid in the liquid storage tank 4, and the radiation fan 11 radiates the heat generated at the radiation end of the semiconductor cooling fin 10.
The working principle and the using flow of the utility model are as follows:
the utility model, when in use;
the diaphragm pump 34 pumps the cooling liquid in the liquid storage tank 4 and discharges the cooling liquid into the cooling tank 32 through the liquid inlet pipe 33, the exhaust fan 81 pumps the hot air in the cabinet body 1 and discharges the hot air into the connecting box 7 through the exhaust end, the guide plate 83 in the connecting box 7 guides the discharged hot air to uniformly spray the heat conducting plate 84, the heat conducting plate 84 absorbs the heat of the hot air, the heat conducting plate 84 transfers the absorbed heat to the cooling fin 31, the cooling fin 31 dispersedly transfers the heat to the cooling liquid in the cooling tank 32, the cooling liquid cools the cooling fin 31, the cooled cooling fin 31 transfers the low temperature to the heat conducting plate 84, the hot air sprayed to the heat conducting plate 84 is cooled, so that heat exchange is radiated, meanwhile, the contact with the outside air is avoided, the damage of floating dust to electronic components in the cabinet body 1 is reduced, and the cooling liquid after the heat exchange is returned into the liquid storage tank 4 through the liquid return pipe 9 after the heat exchange rises to a certain height, and is recycled;
the drier in the drying box 5 absorbs water vapor and moisture in the cabinet body 1, so that the air in the cabinet body 1 is kept dry, and the electronic equipment short circuit caused by the moisture is avoided.
The circuit, the electronic components and the modules are all in the prior art, and can be completely realized by a person skilled in the art, and needless to say, the protection of the utility model does not relate to the improvement of software and a method.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (6)

1. The utility model provides a dustproof heat dissipation rack, includes rack body (1), its characterized in that: two mounting grooves (2) have been seted up respectively to the left and right sides face of rack body (1) inner wall, the right side rigid coupling of mounting groove (2) inner wall has connection box (7), the right flank of connection box (7) is provided with cooling module, the connection can be dismantled with the one side that two cooling boxes (32) are relative respectively to the left and right sides face of rack body (1), the upper surface rigid coupling of lower surface and liquid reserve tank (4) of rack body (1), the inside of liquid reserve tank (4) is provided with cooling module.
2. A dustproof heat dissipating cabinet according to claim 1, wherein: the heat dissipation assembly comprises two exhaust fans (81) arranged on the upper side and the lower side of the right side of a connecting box (7), a plurality of guide plates (83) are fixedly connected to the front side and the back side of the inner wall of the exhaust fans (81) respectively, two air outlets (82) are formed in the upper surface and the lower surface of the connecting box (7) respectively, a heat conducting plate (84) is fixedly connected to the inner wall of the mounting groove (2), and the right side of the heat conducting plate (84) is attached to the left side of the connecting box (7).
3. A dustproof heat dissipating cabinet according to claim 1, wherein: the drying cabinet is characterized in that a drying box (5) is fixedly connected to the lower surface of the inner wall of the cabinet body (1), a plurality of through holes (6) are symmetrically formed in the upper surface of the drying box (5), and a drying agent is arranged in the drying box (5).
4. A dustproof heat dissipating cabinet according to claim 1, wherein: the cooling assembly comprises a diaphragm pump (34) arranged on the lower surface of the inner wall of the liquid storage tank (4), two liquid discharge ends of the diaphragm pump (34) are respectively communicated with one ends of two liquid inlet pipes (33), the other ends of the liquid inlet pipes (33) penetrate through the left side surface of the inner wall of the liquid storage tank (4) to be communicated with the lower surface of the cooling tank (32), a radiating fin (31) is detachably connected to the left side of the inner wall of the mounting groove (2), and the right side surface of the radiating fin (31) is attached to the left side surface of the heat conducting plate (84).
5. A dustproof heat dissipating cabinet according to claim 1, wherein: the right side face of the liquid storage tank (4) is provided with a semiconductor refrigerating sheet (10), and the radiating end of the semiconductor refrigerating sheet (10) is provided with a radiating fan (11).
6. A dustproof heat dissipating cabinet according to claim 1, wherein: the upper side of the back of the cooling box (32) is communicated with one end of a liquid return pipe (9), and the other end of the liquid return pipe (9) is communicated with the back of the liquid storage box (4).
CN202320475543.3U 2023-03-14 2023-03-14 Dustproof heat dissipation cabinet Active CN219555508U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320475543.3U CN219555508U (en) 2023-03-14 2023-03-14 Dustproof heat dissipation cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320475543.3U CN219555508U (en) 2023-03-14 2023-03-14 Dustproof heat dissipation cabinet

Publications (1)

Publication Number Publication Date
CN219555508U true CN219555508U (en) 2023-08-18

Family

ID=87704322

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320475543.3U Active CN219555508U (en) 2023-03-14 2023-03-14 Dustproof heat dissipation cabinet

Country Status (1)

Country Link
CN (1) CN219555508U (en)

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