CN101309572A - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
- Publication number
- CN101309572A CN101309572A CNA2007100743659A CN200710074365A CN101309572A CN 101309572 A CN101309572 A CN 101309572A CN A2007100743659 A CNA2007100743659 A CN A2007100743659A CN 200710074365 A CN200710074365 A CN 200710074365A CN 101309572 A CN101309572 A CN 101309572A
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- heat
- groups
- fins
- heat abstractor
- pedestal
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat radiating device used for the heat radiating of at least two electronic elements. The heat radiating device comprises a base seat, a heat radiating fin group positioned on the base seat, a plurality of heat pipes used for connecting the base seat and the heat radiating fin group in a heat conduction way, and the base seat is provided with at least two heat absorbing plates used for being respectively contacted with the electronic elements. The heat radiating device can be used for the heat radiating of the two electronic heating elements, the two heat absorbing plates are arranged on the base seat and are contacted with the electronic elements, heat is uniformly transmitted to the identical heat radiating fin group through the two groups of heat pipes respectively connected with heat absorbing plates in a heat conduction way, therefore to ensure the heat quantity to be quickly radiated.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used for cooling electronic components.
Background technology
Along with the develop rapidly of electronic industry, electronic component (as the central processing unit) speed of service constantly promotes, and produces a large amount of heats during operation, and itself and system temperature are raise, and influences its operation stability then.For guaranteeing that electronic component can normally move, heat abstractor is installed usually thereon, discharge the heat that it produces.
The traditional solution of electronic element radiating problem is normally installed a radiator on each heat-generating electronic elements, this radiator comprises the base plate that closely contacts with electronic component, is located at the some radiating fins on the base plate.Along with the electronic component arithmetic speed grows with each passing day, for further satisfying radiating requirements, also can in radiator, wear heat pipe, a fan is installed at one side or top is distributed to promote air flows to accelerate heat, simultaneously such heat abstractor is except that radiating efficiency has greatly improved on than original radiator basis, and dimension volume also increases much.But along with the arrival in digital code information epoch, the compact main trend that becomes current electronic product, its manufacturing process be also constantly towards the development of high-density packages and multifunctional direction, and the distance between electronic component such as the chip is more and more littler and caloric value is increasing.Therefore in actual applications, when distance between a plurality of heat-generating electronic elements is very little, if adopting independently respectively, heat abstractor dispels the heat to keep the normal operation of system to it, not only can make the radiator structure of system disperse complexity to cause the system space waste, and because the very little size that also can limit independent heat abstractor of spacing between electronic component, thereby the heat dispersion of system is very restricted.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor of adaptive two or more electronic components simultaneously.
A kind of heat abstractor is used at least two electronic element radiatings, comprise that a pedestal, is positioned at groups of fins on the pedestal, some heat pipes that pedestal and groups of fins heat conduction are connected, described pedestal is provided with and is used at least two absorber plates that contact with described electronic component respectively.
Above-mentioned heat abstractor can dispel the heat to two heat-generating electronic elements, its pedestal is provided with two absorber plates respectively and contacts with electronic component, by two groups of heat pipes that are connected with two absorber plate heat conduction respectively heat evenly is delivered on the same groups of fins again, and heat is distributed fast.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the three-dimensional combination figure of heat abstractor one embodiment of the present invention.
Fig. 2 is the inverted view of heat abstractor among Fig. 1.
Fig. 3 is another angular views of heat abstractor among Fig. 1.
Fig. 4 is the exploded view of heat abstractor among Fig. 1.
Fig. 5 is the enlarged drawing of pedestal among Fig. 4.
Fig. 6 is the enlarged drawing of groups of fins among Fig. 4.
Fig. 7 is the enlarged drawing of fixed mount among Fig. 4.
Embodiment
Heat abstractor of the present invention is to be used for a plurality of heat-generating electronic elements such as CPU (figure does not show) etc. are dispelled the heat.See also Fig. 1 to Fig. 4, heat abstractor in a preferred embodiment of the present invention, it comprises a pedestal 10, be positioned at a groups of fins 30 on the pedestal 10, with the heat pipe heat 20 that pedestal 10 and groups of fins 30 heat conduction link together, cover a wind scooper 40 on the groups of fins 30, be installed in a fixed mount 50 of groups of fins 30 front sides and be fixed to a fan 60 on the fixed mount 50.
As shown in Figure 5, said base 10 comprises two identical absorber plate 11 and substrates 13.These absorber plate 11 rectangular plate bodys are made of such as copper by heat conductivility good metal material, and these absorber plate 11 upper surfaces are offered three continuous and parallel straight storage tanks 110, and these storage tanks 110 are parallel with the relative dual-side of absorber plate 11.
This substrate 13 is made by density less Heat Conduction Material such as aluminium, and it comprises two supporting brackets 132 and two crossbeams 134 that are connected two supporting brackets 132 and parallel interval of parallel interval.This two supporting bracket 132 is a strip rectangle plate body, and wherein two junctions of a supporting bracket 132 and two crossbeams 134 and offer a location notch 1320 that is the strip depression along its inside edge respectively are used for cooperating with the bottom of fan Fixture 50.This supporting bracket 132 offers some shoulder holes 1322 on the edge in the outer part, and these shoulder holes 1322 are used to wear fixture (figure does not show) so that heat abstractor is fixed to CPU.These two supporting brackets, 132 bottom surfaces partly are formed with the end difference 1324 of depression in the inner part, this two end difference 1324 forms the space of ccontaining two absorber plates 11, so that two absorber plates 11 are contained in this accommodation space and the bottom surface flushes with the bottom surface of supporting bracket 132, respectively offer a screw 1326 on the both ends of the surface of this supporting bracket 132, wind guide cover 40 is installed on the heat abstractor to cooperate with screw 100.The setting of being separated by of these two crossbeams, 134 vertical support plate 132 is formed with opening 130 between this two crossbeam 134, and is formed with rectangular indentation 131 in both sides, wears for heat pipe heat 20.The bottom surface of this two crossbeam 134 respectively offers three storage tanks 1340 corresponding with the storage tank 110 of absorber plate 11, to form circular holding channel with absorber plate 11 storage tanks 110.
Above-mentioned heat pipe heat 20 comprises and is arranged side by side two groups of heat pipes, and every group of heat pipe is made up of three heat pipes 21, the bending that takes the shape of the letter U of this heat pipe 21, it comprise the endotherm section 212 of a level and from endotherm section 212 two ends upwards bending extend two vertical heat release section 214.The endotherm section 212 of three heat pipes 21 offsets to one side from the plane that its corresponding release end of heat 214 is determined in each group, and the degrees of offset of three heat pipes, 21 endotherm sections 212 increases progressively successively in same group, the endotherm section 212 of just same group of interior three heat pipes 21 increases gradually with the distance on the plane that corresponding heat release section 214 is determined, can make the more intensive storage tank 110 that is contained in pedestal 10 absorber plates 11 and crossbeam 134 of endotherm section 212 of each group heat pipe 21 like this, in 1340 holding channels that form, and the heat release section 214 of heat pipe 21 is located in the groups of fins 30 more dispersedly, so that heat is transmitted on the groups of fins 30 more equably.
As shown in Figure 6, above-mentioned groups of fins 30 is piled up by the foil of some horizontal intervals and is formed, it forms a rectangular recess 32 parallel with both side edges in the crown center position, this groove 32 is divided into the identical rectangular platform of two structures 34 with groups of fins 30 tops simultaneously, each offers three containing holes 340 side by side each place, platform 34 nearly two ends, is used for the heat release section 224 of ccontaining heat pipe 22.These containing holes 340 vertically run through the top and the bottom of groups of fins 30.These groups of fins 30 bottoms are formed with one first support portion 36 and 2 second support portions 38.This first support portion 36 and second support portion 38 all are rectangular shape, pile up by the sheet metal of arranging at interval vertically and to form, and the equal horizontal-extending of ora terminalis up and down of these sheet metals has flanging (not label), these flangings are in juxtaposition and form the end face and the bottom surface of first support portion 36 and second support portion 38, their end face is connected with the sheet metal that is positioned at its top by modes such as welding, and their bottom surfaces are undertaken on pedestal 10 end faces.Wherein this first support portion 36 is located at interval between two second support portions 38, and its width is little than second support portion 38, and the length of first support portion 36 than second support portion 38 long and than second support portion 38 to the protruding place of heat abstractor rear side.
Please consult Fig. 4 once more, above-mentioned wind scooper 40 is by the sheet metal body by integral forming, and it comprises a top board 42 and two side plates 44 that extend from top board 42 two ends downwards.This top board 42 has the both ends of broad and connects both ends and to lower recess and the less brace 422 of width, offer rectangle button hole 4220 on this brace 422, is used for mounting and fixing support 50.The width of this side plate 44 is from the appropriate location, middle and upper part, increase gradually downwards, and extend a fixing feet 442 more vertically downward in the inside level bending of bottom edge, this fixing feet 442 respectively offers an installing hole 4420 at place, nearly two ends, this installing hole 4420 is corresponding with the screw 1324 of pedestal 10, passes with screw 1326 with screw 100 to screw togather.
As shown in Figure 7, said fixing frame 50 is a roughly rounded framework, is a roughly rounded through hole 52 in the middle of it, and the forced draft that air feed fan 60 produces is passed through.The ora terminalis up and down of these fixed mount 50 frameworks is that straight horizontal is linear, both sides of the edge then are circular arc, wherein should go up inside horizontal-extending one hold-down arm 54 of ora terminalis, this approximate mid-section position, hold-down arm 54 bottom surface is convexly equipped with a clasp 540 downwards, and this clasp 540 is used for fastening with the button hole 4220 of wind scooper 40; The nearly end positions of this time ora terminalis is convexly equipped with a card 56 respectively downwards, and this card 56 is used for holding in the location notch 1320 of pedestal 10 substrates 13, fixed mount 50 is fixed on heat abstractor one side.Offer several fixing holes 58 on the arc framework of these fixed mount 50 both sides, be used for cooperating fan 60 fixing with screw 200.
Please consult Fig. 4 once more, said fans 60 shape specification and fixed mount 50 are suitable, are installed on the fixed mount 50 by screw 200.
As shown in Figures 1 to 3, this heat abstractor when assembled state, its pedestal 10 by two absorber plates 11 be fixed on substrate 13 bottom surfaces and with 13 liang of crossbeam 134 be combined intos of substrate; This groups of fins 30 is placed on above the substrate 13, wherein second support portion 38 of groups of fins 30 is pressed on respectively above the supporting bracket 132 of 10 liang of crossbeams 134 of pedestal and crossbeam 134 1 sides (as shown in Figure 3), and its first support portion 36 is across the opening 130 of pedestal 13 and be pressed on the supporting bracket 132 of opening 130 1 sides.The endotherm section 212 of these two groups of heat pipes 21 is contained in respectively in the holding channel that the storage tank 110,1340 of two absorber plates 11 and crossbeam 134 forms, the heat release section 214 of these two groups of heat pipes 21 is passed the opening 130 of pedestal 10 centres and the breach 131 of both sides thereof respectively, and be contained in the containing hole 340 of groups of fins 30, thereby pedestal 10 and groups of fins 30 heat conduction are connected; This wind scooper 40 covers above the groups of fins 30, the brace 422 at its top is contained in the groove 32 at groups of fins 30 tops, the fixing feet 442 of its biside plate 44 bottoms cooperates with the screw 1326 of pedestal 10 both sides by the installing hole 4420 that screw 100 passes on it, and wind scooper 40 is installed on pedestal 10 and the groups of fins 30; The fixed arm 54 at these fixed mount 50 tops is placed on the brace 422 of wind scooper 40, and the button hole 4220 on clasp below the fixed arm 54 540 and the brace 422 is fastened, in two location notchs 1320 of two cards, 56 difference holdings on pedestal 10 of these fixed mount 50 bottoms,, fixes fixed mount 50 thereby being close to groups of fins 30 installed in front; This fan 60 is installed on the fixed mount 50 by screw 200 at last, thinks that the entire heat dissipation device provides forced draft.
From the above, this heat abstractor can dispel the heat to two heat-generating electronic elements, its pedestal 10 is provided with two absorber plates 11 respectively and contacts with electronic component, by two groups of heat pipes 21 that are connected with 11 heat conduction of two absorber plates respectively heat evenly is delivered on the same groups of fins 30 again, groups of fins 30 installed in front one fan 60 that can cover entire heat dissipation sheet group 30 provides sufficient forced draft for heat abstractor then, thereby heat is distributed fast.Be appreciated that, heat abstractor can be to three or above electronic element radiating in other embodiments of the invention, its pedestal can be provided with three or three above absorber plates, there are the corresponding heat pipes more than three groups or three groups that absorber plate and groups of fins heat conduction are connected simultaneously, the fan that one or more covers entire heat dissipation sheet group are installed in groups of fins one side.
Claims (10)
1. a heat abstractor is used at least two electronic element radiatings, comprise that a pedestal, is positioned at groups of fins on the pedestal, some heat pipes that pedestal and groups of fins heat conduction are connected, and is characterized in that: described pedestal is provided with and is used at least two absorber plates that contact with described electronic component respectively.
2. heat abstractor as claimed in claim 1, it is characterized in that: described pedestal comprises that also one is combined in the substrate on the absorber plate, described groups of fins is formed on the described substrate, and described heat pipe comprises endotherm section and heat release section, and described endotherm section is interposed between substrate and the absorber plate.
3. heat abstractor as claimed in claim 2, it is characterized in that: at least two crossbeams that are crossed with the space in the middle of the described substrate, described at least two crossbeam bottom surfaces respectively with the corresponding combination of described at least two absorber plate end faces, and described at least two absorber plate end faces and described at least two crossbeam bottom surfaces offer and match and the storage tank of ccontaining heat pipe heat-absorbing section.
4. heat abstractor as claimed in claim 3, it is characterized in that: described heat pipe takes the shape of the letter U, it comprises two heat release section, and described heat release section is respectively from the opposite end vertical extent of described endotherm section, and described heat release section strides across and is set in the groups of fins from described at least two crossbeam both sides respectively.
5. heat abstractor as claimed in claim 1, it is characterized in that: comprise that also one covers the wind scooper on the groups of fins, described wind scooper comprises a top board that is installed on the groups of fins top and two side plates that extend and be positioned at the groups of fins both sides from described top board two ends vertically downward, offer a button hole in the middle of the described top board, described side plate bottom is fixed on the substrate.
6. heat abstractor as claimed in claim 5 is characterized in that: also comprise a fixed mount, described fixed mount top end marginal lappet directly bends and extends a hold-down arm, and described hold-down arm protrudes out a clasp that is fastened with button hole downwards.
7. heat abstractor as claimed in claim 6 is characterized in that: described fixed mount bottom ora terminalis is extended with the card that is placed in the substrate downwards.
8. heat abstractor as claimed in claim 6 is characterized in that: also comprise a fan, described fan posts on fixed mount by some screws.
9. heat abstractor as claimed in claim 1 is characterized in that: described each absorber plate all is connected with groups of fins by heat pipe, and described groups of fins comprises some first fin and is positioned under first fin and perpendicular some second fin.
10. heat abstractor as claimed in claim 9 is characterized in that: described heat pipe is at least two, corresponding respectively described at least two absorber plates and the described groups of fins of connecting of this at least two heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100743659A CN101309572B (en) | 2007-05-18 | 2007-05-18 | Heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100743659A CN101309572B (en) | 2007-05-18 | 2007-05-18 | Heat radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101309572A true CN101309572A (en) | 2008-11-19 |
| CN101309572B CN101309572B (en) | 2011-06-08 |
Family
ID=40125728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100743659A Expired - Fee Related CN101309572B (en) | 2007-05-18 | 2007-05-18 | Heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101309572B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566760A (en) * | 2018-01-16 | 2018-09-21 | 东莞市远鑫电子科技有限公司 | Irregular radiator and its production technology |
| CN110602928A (en) * | 2019-09-24 | 2019-12-20 | 中国船舶重工集团公司第七0七研究所 | Local enhanced heat dissipation device for closed case |
| CN113835480A (en) * | 2020-06-24 | 2021-12-24 | 鸿富锦精密电子(天津)有限公司 | Fixing support and electronic device shell |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0563385A (en) * | 1991-08-30 | 1993-03-12 | Hitachi Ltd | Electronic apparatus and computer provided with heat pipe |
| CN1624909A (en) * | 2004-12-02 | 2005-06-08 | 奇宏电子(深圳)有限公司 | Method and device of air exhausting guide of CPU heat sink |
| CN2792116Y (en) * | 2005-03-29 | 2006-06-28 | 富准精密工业(深圳)有限公司 | Heat pipe radiating device |
| CN2843009Y (en) * | 2005-04-01 | 2006-11-29 | 威盛电子股份有限公司 | Radiating module |
-
2007
- 2007-05-18 CN CN2007100743659A patent/CN101309572B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566760A (en) * | 2018-01-16 | 2018-09-21 | 东莞市远鑫电子科技有限公司 | Irregular radiator and its production technology |
| CN110602928A (en) * | 2019-09-24 | 2019-12-20 | 中国船舶重工集团公司第七0七研究所 | Local enhanced heat dissipation device for closed case |
| CN113835480A (en) * | 2020-06-24 | 2021-12-24 | 鸿富锦精密电子(天津)有限公司 | Fixing support and electronic device shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101309572B (en) | 2011-06-08 |
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Granted publication date: 20110608 Termination date: 20140518 |