CN108566760A - Irregular radiator and its production technology - Google Patents
Irregular radiator and its production technology Download PDFInfo
- Publication number
- CN108566760A CN108566760A CN201810038183.4A CN201810038183A CN108566760A CN 108566760 A CN108566760 A CN 108566760A CN 201810038183 A CN201810038183 A CN 201810038183A CN 108566760 A CN108566760 A CN 108566760A
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- CN
- China
- Prior art keywords
- heat
- radiating fin
- radiating
- radiator
- mounting hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to hardware fields, more particularly to irregular radiator and its production technology, including rectangular heat-radiating substrate, several radiating fins that are rectangular and being mutually parallel on heat-radiating substrate surface are set to, several mounting holes of heat-radiating substrate edge are opened in；The radiating fin includes being located at the big radiating fin in heat-radiating substrate center and being set to heat-radiating substrate both sides and the small radiating fin between adjacent mounting hole, the small radiating fin is distributed in big radiating fin both sides, along heat-radiating substrate length direction, the height of big radiating fin and small radiating fin is stepped；Heat-radiating substrate offers the thickness at mounting hole and is less than the thickness not offered at mounting hole.The configuration of the present invention is simple, easy to use, heat dissipation area is big, good heat dissipation effect and simple production process, production yield are high.
Description
Technical field
The present invention relates to hardware fields, and in particular to irregular radiator and its production technology.
Background technology
Electronic product will produce a large amount of heat at work, if these heats not distributed in time, gently if
Cause to crash, heavy then may burn electronic product, radiator is exactly for for electronic product radiating.Radiator produces electronics
The stable operation of product plays conclusive effect.
Radiator can be divided into three kinds of air-cooled, heat pipe and water cooling according to its radiating mode, wherein air-cooled radiator is by scattered
Hot device reduces electronic product temperature with surrounding air heat exchange, generally comprises heat-radiating substrate and is installed on dissipating on heat-radiating substrate
Hot fin, the radiator of the prior art, on the one hand, radiating fin is mostly regular shape, can interfere with each other, cause between radiating fin
Radiating fin is low with surrounding air heat exchanger effectiveness；Second aspect directly drills from front, needs when mounting hole is arranged
Cutter is longer, and when drilling easily causes cracking of cutter, and production difficulty is big；The third aspect mostly uses when to radiating fin grinding process
The cutter of flat, cutter and radiating fin contact area are big, and frictional force is big, since radiating fin height is larger, rub larger
It wipes and is also easy to produce resonance under force effect, radiating fin can be broken when resonating violent, cause production yield poor.Fourth aspect, right
When radiating fin is surface-treated to obtain surface texture, mostly uses steel wire and radiating fin is scrubbed to obtain surface line
Reason, but radiating fin surface abrasion can be caused in this way, the service life of radiating fin is influenced, causes production yield poor.
Invention content
The purpose of the present invention is overcome the deficiencies of the prior art and provide a kind of simple in structure, easy to use, heat dissipation area
Greatly, good heat dissipation effect and the high irregular radiator and its production technology of simple production process, production yield.
The technical solution adopted in the present invention is：Irregular radiator, including rectangular heat-radiating substrate, are set to
Several radiating fins that are rectangular and being mutually parallel on heat-radiating substrate surface are opened in several peaces of heat-radiating substrate edge
Fill hole；The radiating fin includes being located at the big radiating fin in heat-radiating substrate center and being set to heat-radiating substrate both sides and be located at phase
Small radiating fin between adjacent mounting hole, the small radiating fin is distributed in big radiating fin both sides, along heat-radiating substrate length side
To the height of big radiating fin and small radiating fin is stepped；Heat-radiating substrate offers the thickness at mounting hole and is less than not
Offer the thickness at mounting hole.
To being further improved as the side of, the big radiating fin, small radiating fin and heat-radiating substrate for above-mentioned technical proposal
Angle is rounded corner.
To being further improved as the quantity of the mounting hole is 8, is located at rectangular heat dissipation base for above-mentioned technical proposal
Between two apex angles of four vertex and length direction of plate, the one side that heat-radiating substrate corresponds to mounting hole offers and is communicated in peace
Fill the U-lag in hole.
To being further improved as the apex angle of the U-lag is rounded corner, and the size of rounded corner is for above-mentioned technical proposal
5°-6.5°。
To being further improved as the big radiating fin and small radiating fin include from inside to outside for above-mentioned technical proposal
Copper main body, the surface texture layer for being set to copper body surfaces and the anodic oxide coating for being set to surface texture layer surface.
Irregular radiator production technology, includes the following steps, a, takes aluminium section bar cut-out, cleaning, punching press, CNC processing
Obtain the radiator prototype of heat-radiating substrate and big radiating fin, small radiating fin, wherein heat-radiating substrate, big radiating fin, small
Radiating fin is rectangular-shaped, and big radiating fin is located at heat-radiating substrate center, and small radiating fin is located at big radiating fin both sides, and
Along heat-radiating substrate length direction, the height of big radiating fin and small radiating fin is stepped；B, to the radiator in step a
Prototype is drilled to obtain mounting hole, and carries out tapping to mounting hole, obtains radiator semi-finished product, c, takes heat dissipation in step b
Device semi-finished product carry out edge polishing to remove deburring to big radiating fin, small radiating fin, d, carry out table to radiator semi-finished product
Surface treatment forms surface texture layer, e, the radiator semi-finished product in step d is taken to carry out anodic oxidation formation anodic oxide coating, with
To irregular radiator.
To being further improved as in step b, mounting hole totally 8 is located at rectangular heat dissipation substrate for above-mentioned technical proposal
Two vertex of four vertex and length direction between, the position that heat-radiating substrate corresponds to mounting hole offers and is communicated in peace
The U-lag in hole is filled, heat-radiating substrate offers the thickness at mounting hole and is less than the thickness not offered at mounting hole, in drilling,
It first cuts off from heat-radiating substrate side, then is drilled from front with drill.
To being further improved as in step c, when carrying out polishing flash removed, with jagged knife for above-mentioned technical proposal
Tool carries out grinding process to radiating fin edge.
To being further improved as in step d, surface treatment passes through two when forming surface texture layer for above-mentioned technical proposal
Side pressing method makes surface generate texture.
Beneficial effects of the present invention are：
1, on the one hand, heat-radiating substrate is equipped with several big radiating fins and small radiating fin, and heat dissipation area is big, with surrounding
Air heat exchanger effectiveness is high, and radiating efficiency is high, and the configuration of the present invention is simple, easy to use.Second aspect will be dissipated by mounting hole
Hot device is installed on electronic equipment, easy to use.The third aspect, along heat-radiating substrate length direction, big radiating fin and small heat dissipation
The height of fin is stepped so that radiator is in integrally irregular, will not mutually be blocked between radiating fin so that is dissipated
Hot fin adequately can carry out heat exchange with surrounding air, further improve the radiating efficiency of the present invention.Fourth aspect, heat dissipation
Substrate offers the thickness at mounting hole and is less than the thickness not offered at mounting hole so that in drilling without the use of longer
Cutter, the shorter cutter of use can drill, and greatly reduce the difficulty of drilling, cracking of cutter when preventing from drilling, production technology
Simply.
2, the corner of big radiating fin, small radiating fin and heat-radiating substrate is rounded corner, is prevented in installation or transhipment
Staff is stabbed, the convenience that the present invention uses is further improved.
3, the quantity of mounting hole is 8, is located at two tops of four vertex and length direction of rectangular heat dissipation substrate
Between angle, radiator is installed at electronic equipment by what 8 mounting holes can be stablized, prevents radiator from shaking, heat dissipation effect
It is good.The one side that heat-radiating substrate corresponds to mounting hole offers U-lag, and the setting of U-lag reduces the heat dissipation for needing boring sites in curing
The thickness of substrate so that drilling is more simple, further simplifies production technology.
4, the apex angle of U-lag is rounded corner, and the size of rounded corner is 5 ° -6.5 °, and preferably 6 °, production cost is most at this time
It is low.
5, big radiating fin and small radiating fin include from inside to outside copper main body, are set to the table of copper body surfaces
Face texture layer and the anodic oxide coating for being set to surface texture layer surface, copper main body increase the mechanical strength of radiator, table
Face texture layer increases radiator aesthetic appearance, and outermost anodic oxide coating increases the weatherability of radiator, is conducive to
Extend the service life of radiator.
6, irregular radiator production technology, this simple production process, production cost is low, convenient for large-scale production.
7, it when drilling obtains mounting hole, first opens up U-lag on heat-radiating substrate, then drills, reduction needs drill hole
Since drill hole heat-radiating substrate thickness is small drilling can be completed using shorter knife, compared with the existing technology in heat-radiating substrate thickness
It is middle directly to be drilled from front using longer cutter, reduce cracking of cutter risk so that production difficulty reduces, production technology letter
Change.
8, when surface polishing deburring, the straight knife that tradition uses is changed to serrated cutters, reduces cutter heat radiating fin
The direct contact area of piece reduces the resonant interaction that other positions of radiating fin are subject to reduce frictional force between the two,
It prevents the radiating fin at other positions to be broken due to resonance, improves production yield.
9, when surface treatment forms surface texture layer, surface is made to generate texture by both sides pressing method, relative to use
Wire brush striped can prevent steel wire from being worn caused by radiating fin surface, further improve production yield.
Description of the drawings
Fig. 1 is the stereogram of the present invention；
Fig. 2 is the stereogram at another visual angle of the present invention；
Fig. 3 is the vertical view of the present invention；
Fig. 4 is the cross-sectional view of the big radiating fin of the present invention.
Specific implementation mode
Below in conjunction with attached drawing, the present invention is further illustrated.
As Figure 1-Figure 4, the cross section of the stereogram, vertical view and big radiating fin of different visual angles respectively of the present invention
Schematic diagram.
Irregular radiator 100, including rectangular heat-radiating substrate 110, are set to 110 surface of heat-radiating substrate
Several radiating fins that are rectangular and being mutually parallel, are opened in several mounting holes 120 of 110 edge of heat-radiating substrate；It dissipates
Hot fin includes being located at the big radiating fin 140 in 110 center of heat-radiating substrate and being set to 110 both sides of heat-radiating substrate and be located at adjacent
Small radiating fin 150 between mounting hole 120, small radiating fin 150 is distributed in 140 both sides of big radiating fin, along heat-radiating substrate
The height of 110 length directions, big radiating fin 140 and small radiating fin 150 is stepped；Heat-radiating substrate 110 offers peace
Thickness at dress hole 120 is less than the thickness not offered at mounting hole 120.
On the one hand, heat-radiating substrate 110 is equipped with several big radiating fins 140 and small radiating fin 150, heat dissipation area
Greatly, high with surrounding air heat exchanger effectiveness, radiating efficiency is high, and the configuration of the present invention is simple, easy to use.Second aspect passes through
Radiator 100 is installed on electronic equipment by mounting hole 120, easy to use.The third aspect, along 110 length direction of heat-radiating substrate,
The height of big radiating fin 140 and small radiating fin 150 is stepped so that radiator 100 is whole in irregular, heat dissipation
It will not mutually be blocked between fin so that radiating fin adequately can carry out heat exchange with surrounding air, further improve this
The radiating efficiency of invention.Fourth aspect, heat-radiating substrate 110 offer the thickness at mounting hole 120 be less than do not offer mounting hole
Thickness at 120 so that be without the use of longer cutter in drilling, the shorter cutter of use can drill, greatly reduce
The difficulty of drilling, cracking of cutter when preventing from drilling, simple production process.
The corner of big radiating fin 140, small radiating fin 150 and heat-radiating substrate 110 is rounded corner, prevent in installation or
Staff is stabbed when transhipment, further improves the convenience that the present invention uses.
The quantity of mounting hole 120 is 8, is located at four vertex and length direction two of rectangular heat dissipation substrate 110
Between a apex angle, radiator 100 is installed at electronic equipment by what 8 mounting holes 120 can be stablized, prevents radiator 100
It shakes, good heat dissipation effect.The one side that heat-radiating substrate 110 corresponds to mounting hole 120 offers U-lag 130, and U-lag 130 is set
It sets, reduces the thickness for the heat-radiating substrate 110 for needing boring sites in curing so that drilling is more simple, further simplifies production work
Skill.
The apex angle of U-lag 130 is rounded corner, and the size of rounded corner is 5 ° -6.5 °, preferably 6 °, production cost at this time
It is minimum.
Big radiating fin 140 and small radiating fin 150 include from inside to outside copper main body 140a, are set to copper main body
The surface texture layer 140b on the surfaces the 140a and anodic oxide coating 140c for being set to the surfaces surface texture layer 140b, copper main body
140a increases the mechanical strength of radiator 100, and surface texture layer 140b increases 100 aesthetic appearance of radiator, most external
Anodic oxide coating 140c increase the weatherability of radiator 100, be conducive to extend the service life of radiator 100.
100 production technology of irregular radiator, includes the following steps, a, and aluminium section bar cut-out, cleaning, punching press, CNC is taken to add
Work obtains 100 prototype of radiator of heat-radiating substrate 110 and big radiating fin 140, small radiating fin 150, wherein heat-radiating substrate
110, big radiating fin 140, small radiating fin 150 are rectangular-shaped, and big radiating fin 140 is located at 110 center of heat-radiating substrate, small
Radiating fin 150 is located at 140 both sides of big radiating fin, and along 110 length direction of heat-radiating substrate, big radiating fin 140 and small dissipates
The height of hot fin 150 is stepped；B is drilled to obtain mounting hole 120 to 100 prototype of radiator in step a, and
Tapping is carried out to mounting hole 120, obtains 100 semi-finished product of radiator, c, 100 semi-finished product of radiator in step b are taken, to dissipating greatly
Hot fin 140, small radiating fin 150 carry out edge polishing to remove deburring, d, are surface-treated to 100 semi-finished product of radiator
It forms surface texture layer 140b, e, 100 semi-finished product of radiator in step d is taken to carry out anodic oxidation formation anodic oxide coating
140c, to obtain irregular radiator 100.
In step b, mounting hole 120 totally 8 is located at four vertex and length direction of rectangular heat dissipation substrate 110
Between two vertex, the position that heat-radiating substrate 110 corresponds to mounting hole 120 offers the U-lag for being communicated in mounting hole 120
130, heat-radiating substrate 110 offers the thickness at mounting hole 120 and is less than the thickness not offered at mounting hole 120, in drilling,
It first cuts off from 110 side of heat-radiating substrate, then is drilled from front with drill.
In step c, when carrying out polishing flash removed, grinding process is carried out to radiating fin edge with jagged cutter.
In step d, when surface treatment forms surface texture layer 140b, surface is set to generate texture by both sides pressing method.
100 production technology of irregular radiator, this simple production process, production cost is low, convenient for large-scale production.
It when drilling obtains mounting hole 120, first opens up U-lag 130 on heat-radiating substrate 110, then drills, reduction needs to bore
Drilling, phase can be completed using shorter knife since 110 thickness of drill hole heat-radiating substrate is small in 110 thickness of heat-radiating substrate at hole
For directly drilling in the prior art from front using longer cutter, cracking of cutter risk is reduced so that production difficulty drops
Low, production technology simplifies.
When the polishing deburring of surface, the straight knife that tradition uses is changed to serrated cutters, reduces cutter radiating fin
Direct contact area reduce the resonance that other positions of radiating fin 150 are subject to reduce frictional force between the two and make
With preventing the radiating fin at other positions to be broken due to resonance, improve production yield.
Surface treatment makes surface generate texture when forming surface texture layer 140b, by both sides pressing method, relative to adopting
With wire brush striped, it can prevent steel wire from being worn caused by radiating fin surface, further improve production yield.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be with appended claims.
Claims (9)
1. irregular radiator, it is characterised in that：Including rectangular heat-radiating substrate, if being set to heat-radiating substrate surface
Dry radiating fin that is rectangular and being mutually parallel, is opened in several mounting holes of heat-radiating substrate edge；The heat radiating fin
Piece include positioned at heat-radiating substrate center big radiating fin and be set to heat-radiating substrate both sides and between adjacent mounting hole
Small radiating fin, the small radiating fin is distributed in big radiating fin both sides, along heat-radiating substrate length direction, big radiating fin and
The height of small radiating fin is stepped；Heat-radiating substrate offer the thickness at mounting hole be less than do not offer at mounting hole
Thickness.
2. irregular radiator according to claim 1, it is characterised in that：The big radiating fin, small radiating fin
Corner with heat-radiating substrate is rounded corner.
3. irregular radiator according to claim 2, it is characterised in that：The quantity of the mounting hole is 8, respectively
Between two apex angles of four vertex and length direction of rectangular heat dissipation substrate, heat-radiating substrate corresponds to the one side of mounting hole
Offer the U-lag for being communicated in mounting hole.
4. irregular radiator according to claim 3, it is characterised in that：The apex angle of the U-lag is rounded corner, and
The size of rounded corner is 5 ° -6.5 °.
5. irregular radiator according to claim 4, it is characterised in that：The big radiating fin and small radiating fin
Include from inside to outside copper main body, be set to the surface texture layer of copper body surfaces and be set to surface texture layer surface
Anodic oxide coating.
6. irregular radiator production technology, it is characterised in that：Include the following steps, a, takes aluminium section bar cut-out, cleaning, punching
Pressure, CNC processes to obtain the radiator prototype of heat-radiating substrate and big radiating fin, small radiating fin, wherein heat-radiating substrate, big
Radiating fin, small radiating fin are rectangular-shaped, and big radiating fin is located at heat-radiating substrate center, and small radiating fin is located at big heat dissipation
Fin both sides, and along heat-radiating substrate length direction, the height of big radiating fin and small radiating fin is stepped；B, to step
Radiator prototype in a is drilled to obtain mounting hole, and carries out tapping to mounting hole, is obtained radiator semi-finished product, c, is taken step
Radiator semi-finished product in rapid b, carry out edge polishing to remove deburring to big radiating fin, small radiating fin, d, to radiator
Semi-finished product carry out surface treatment and form surface texture layer, e, the radiator semi-finished product progress anodic oxidation in step d are taken to form sun
Pole oxide layer, to obtain irregular radiator.
7. irregular radiator production technology according to claim 6, it is characterised in that：In step b, mounting hole totally 8
It is a, it is located between two vertex of four vertex and length direction of rectangular heat dissipation substrate, heat-radiating substrate corresponds to peace
The position in dress hole offers the U-lag for being communicated in mounting hole, and heat-radiating substrate, which offers the thickness at mounting hole and is less than, not to be offered
Thickness at mounting hole is first cut off from heat-radiating substrate side in drilling, then is drilled from front with drill.
8. irregular radiator production technology according to claim 7, it is characterised in that：In step c, polishing
When flash removed, grinding process is carried out to radiating fin edge with jagged cutter.
9. irregular radiator production technology according to claim 8, it is characterised in that：In step d, it is surface-treated shape
When at surface texture layer, surface is set to generate texture by both sides pressing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810038183.4A CN108566760A (en) | 2018-01-16 | 2018-01-16 | Irregular radiator and its production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810038183.4A CN108566760A (en) | 2018-01-16 | 2018-01-16 | Irregular radiator and its production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108566760A true CN108566760A (en) | 2018-09-21 |
Family
ID=63529885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810038183.4A Pending CN108566760A (en) | 2018-01-16 | 2018-01-16 | Irregular radiator and its production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108566760A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309572A (en) * | 2007-05-18 | 2008-11-19 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101614375A (en) * | 2008-06-27 | 2009-12-30 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN103324058A (en) * | 2012-03-23 | 2013-09-25 | 京瓷办公信息系统株式会社 | Image forming device and exposure device |
| JP3186964U (en) * | 2012-11-22 | 2013-10-31 | 信十工業有限公司 | Multi-function deburring cutter |
| CN103874395A (en) * | 2012-12-17 | 2014-06-18 | 西门子（上海）电气传动设备有限公司 | Radiator and frequency converter employing same |
| CN205065381U (en) * | 2015-09-16 | 2016-03-02 | 广州晶光光电科技有限公司 | Split type heat radiation structure's LED lamps and lanterns |
| CN205452264U (en) * | 2016-01-04 | 2016-08-10 | 中兴通讯股份有限公司 | Heat radiator of chip |
| CN106288310A (en) * | 2016-08-31 | 2017-01-04 | 安徽天祥空调科技有限公司 | A kind of heat sink of air conditioner and production technology thereof |
| CN207733171U (en) * | 2018-01-16 | 2018-08-14 | 东莞市远鑫电子科技有限公司 | irregular radiator |
-
2018
- 2018-01-16 CN CN201810038183.4A patent/CN108566760A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309572A (en) * | 2007-05-18 | 2008-11-19 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101614375A (en) * | 2008-06-27 | 2009-12-30 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN103324058A (en) * | 2012-03-23 | 2013-09-25 | 京瓷办公信息系统株式会社 | Image forming device and exposure device |
| JP3186964U (en) * | 2012-11-22 | 2013-10-31 | 信十工業有限公司 | Multi-function deburring cutter |
| CN103874395A (en) * | 2012-12-17 | 2014-06-18 | 西门子（上海）电气传动设备有限公司 | Radiator and frequency converter employing same |
| CN205065381U (en) * | 2015-09-16 | 2016-03-02 | 广州晶光光电科技有限公司 | Split type heat radiation structure's LED lamps and lanterns |
| CN205452264U (en) * | 2016-01-04 | 2016-08-10 | 中兴通讯股份有限公司 | Heat radiator of chip |
| CN106288310A (en) * | 2016-08-31 | 2017-01-04 | 安徽天祥空调科技有限公司 | A kind of heat sink of air conditioner and production technology thereof |
| CN207733171U (en) * | 2018-01-16 | 2018-08-14 | 东莞市远鑫电子科技有限公司 | irregular radiator |
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