CN205452264U - Heat radiator of chip - Google Patents
Heat radiator of chip Download PDFInfo
- Publication number
- CN205452264U CN205452264U CN201620006640.8U CN201620006640U CN205452264U CN 205452264 U CN205452264 U CN 205452264U CN 201620006640 U CN201620006640 U CN 201620006640U CN 205452264 U CN205452264 U CN 205452264U
- Authority
- CN
- China
- Prior art keywords
- radiating
- heat
- chip
- layer
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Abstract
The utility model discloses a heat radiator of chip belongs to electronic equipment heat dissipation technical field, include: the radiator unit of multilayer superpose, every layer of radiator unit includes: radiating basal plate with install the last heat radiation fins of radiating basal plate, wherein, adjacent two -layer radiator unit interconnect together. Adjacent two -layer radiator unit have between the heat radiation fins and be greater than 0 and be less than 180 contained angle. The utility model discloses can use windy to the heat dissipation scene, improve the chip radiating efficiency.
Description
Technical field
This utility model relates to electronic equipment dissipating heat technical field, particularly relates to a kind of chip radiator.
Background technology
In the course of the work, its internal electronic device can produce a large amount of heat consumption to electronic equipment, causes each device temperature of device interior to raise, and the too high meeting of device temperature causes life-span minimizing even to damage.
Current electronic device internal power consumption device generally uses the mode installing radiator to dispel the heat, and relatively improves radiator internal convection heat exchange property frequently with inside fans drive outside cold airflow entrance radiator, reaches the purpose of chip cooling.
Traditional heat sinks is generally one piece of substrate and welds one group of radiating fin, can be only applied to the heat radiation scene of single wind direction；But, along with electronic equipment integrated level is more and more higher, device interior air channel also becomes increasingly complex, and when the air channel above power dissipating chip is more complicated, requires the harshest to the fansink designs of power consuming devices, and traditional heat sinks can cannot meet radiating requirements.
Utility model content
The problem that the purpose of this utility model is contemplated to overcome above-mentioned prior art to exist, it is provided that a kind of chip radiator, this chip radiator can be applied in many wind directions heat radiation scene, improve chip cooling efficiency.
This utility model provides a kind of chip radiator and puts, including: the radiating subassembly of multiple superposed, every layer of radiating subassembly includes: heat-radiating substrate and the radiating fin being arranged on described heat-radiating substrate；Wherein, adjacent two layers radiating subassembly interconnects.
Preferably, there is between the described radiating fin of adjacent two layers radiating subassembly the angle more than 0 ° and less than 180 °.
Preferably, the described radiating fin of adjacent two layers radiating subassembly is orthogonal.
Preferably, in the described heat-radiating substrate of each layer radiating subassembly, heat radiation conduit is set.
Preferably, connected by heat pipe between the described heat-radiating substrate of adjacent two layers radiating subassembly.
Preferably, described radiating fin is welded on heat-radiating substrate.
Preferably, described radiating fin is plugged on heat-radiating substrate.
The beneficial effects of the utility model are embodied in following aspect: this utility model can be suitable for the heat radiation scene of multiple different wind direction, compare traditional heat sinks can only be suitable for single wind direction heat radiation scene more there is adaptability, electronic devices radiating requirements can be better met.
Accompanying drawing explanation
Fig. 1 is the traditional air-cooled radiator being only applicable to single wind direction heat radiation scene；
Fig. 2 is the structural representation of the chip radiator being suitable for two kinds of heat radiation scenes being mutually perpendicular to wind direction of embodiment 1 of the present utility model；
Fig. 3 is being suitable for three kinds and being mutually perpendicular to and the structural representation of chip radiator of heat radiation scene of the wind direction that interlocks of embodiment 2 of the present utility model；
Fig. 4 is the structural representation of the chip radiator of embodiment 3 of the present utility model.
Description of reference numerals: 1-heat-radiating substrate；2-radiating fin；3-heat pipe.
Detailed description of the invention
This utility model provides a kind of chip radiator, including: the radiating subassembly of multiple superposed, as shown in Figures 2 to 4, every layer of radiating subassembly includes: heat-radiating substrate 1 and the radiating fin 2 being arranged on this heat-radiating substrate 1；Wherein, adjacent two layers radiating subassembly interconnects.
In order to be suitable for the heat radiation scene of different wind direction, this utility model when implementing according to specific needs by the radiating fin 2 of adjacent two layers radiating subassembly between angle design more than 0 ° and in the range of being less than 180 °.
Below in conjunction with the accompanying drawings and this utility model is described in detail by specific embodiment.
Embodiment 1
As in figure 2 it is shown, the chip radiator of the present embodiment includes two-layer radiating subassembly, the radiating fin 2 of two-layer radiating subassembly is orthogonal, to adapt to two kinds of heat radiation scenes being mutually perpendicular to wind direction.
Embodiment 2
As it is shown on figure 3, the chip radiator of the present embodiment includes three layers of radiating subassembly, the radiating fin 2 of adjacent two layers radiating subassembly is orthogonal, is mutually perpendicular to and the heat radiation scene of the wind direction that interlocks adapting to three kinds.
Embodiment 3
As shown in Figure 4, the chip radiator of the present embodiment includes two-layer radiating subassembly, and the radiating fin 2 of two-layer radiating subassembly is orthogonal, and is connected by heat pipe 3, to improve radiating efficiency between the heat-radiating substrate 1 of two-layer radiating subassembly.
Can apply by the way of heat pipe connects in multi-layer heat dissipation assembly between the heat-radiating substrate 1 of the two-layer radiating subassembly be given in above example 3, make multi-layer heat dissipation assembly adjacent two layers radiating subassembly heat-radiating substrate 1 between connected by heat pipe, to improve radiating efficiency.
Additionally, arrange heat radiation conduit in the heat-radiating substrate 1 of each layer radiating subassembly that this utility model is in multi-layer heat dissipation assembly, to improve the heat-radiating substrate biography capacity of heat transmission.
When radiating fin 2 of the present utility model is connected with each heat-radiating substrate 1, can be in the way of using welding；The mode of grafting can also be used, but connected mode is not limited to this.
Although above-mentioned, this utility model is elaborated; but this utility model is not limited to this; those skilled in the art can modify according to principle of the present utility model; therefore, all various amendments carried out according to principle of the present utility model all should be understood to fall into protection domain of the present utility model.
Claims (7)
1. a chip radiator, it is characterised in that including: the radiating subassembly of multiple superposed, every layer of radiating subassembly includes: heat-radiating substrate and the radiating fin being arranged on described heat-radiating substrate；
Wherein, adjacent two layers radiating subassembly interconnects.
2. chip radiator as claimed in claim 1, it is characterised in that there is between the described radiating fin of adjacent two layers radiating subassembly the angle more than 0 ° and less than 180 °.
3. chip radiator as claimed in claim 2, it is characterised in that the described radiating fin of adjacent two layers radiating subassembly is orthogonal.
4. chip radiator as claimed in claim 3, it is characterised in that in the described heat-radiating substrate of each layer radiating subassembly, heat radiation conduit is set.
5. chip radiator as claimed in claim 4, it is characterised in that connected by heat pipe between the described heat-radiating substrate of adjacent two layers radiating subassembly.
6. chip radiator as claimed in claim 5, it is characterised in that described radiating fin is welded on heat-radiating substrate.
7. chip radiator as claimed in claim 5, it is characterised in that described radiating fin is plugged on heat-radiating substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620006640.8U CN205452264U (en) | 2016-01-04 | 2016-01-04 | Heat radiator of chip |
| PCT/CN2016/088209 WO2017117937A1 (en) | 2016-01-04 | 2016-07-01 | Heat dissipation device for chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620006640.8U CN205452264U (en) | 2016-01-04 | 2016-01-04 | Heat radiator of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205452264U true CN205452264U (en) | 2016-08-10 |
Family
ID=56600961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620006640.8U Active CN205452264U (en) | 2016-01-04 | 2016-01-04 | Heat radiator of chip |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205452264U (en) |
| WO (1) | WO2017117937A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566760A (en) * | 2018-01-16 | 2018-09-21 | 东莞市远鑫电子科技有限公司 | Irregular radiator and its production technology |
| CN109413931A (en) * | 2017-08-18 | 2019-03-01 | 泽鸿(广州)电子科技有限公司 | Radiator |
| CN111370378A (en) * | 2020-03-17 | 2020-07-03 | 电子科技大学 | Chip radiator |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7167364B2 (en) * | 2003-03-27 | 2007-01-23 | Rotys Inc. | Cooler with blower between two heatsinks |
| CN2839943Y (en) * | 2005-06-20 | 2006-11-22 | 中兴通讯股份有限公司南京分公司 | Air heat exchanger and communication outdoor machine cabinet with the same air heat exchanger |
| CN100561399C (en) * | 2005-11-16 | 2009-11-18 | 富准精密工业(深圳)有限公司 | Heating radiator |
| CN100533716C (en) * | 2006-09-15 | 2009-08-26 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN203167506U (en) * | 2013-03-19 | 2013-08-28 | 深圳市汇川技术股份有限公司 | Heat radiating structure and equipment with heat radiating structure |
-
2016
- 2016-01-04 CN CN201620006640.8U patent/CN205452264U/en active Active
- 2016-07-01 WO PCT/CN2016/088209 patent/WO2017117937A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413931A (en) * | 2017-08-18 | 2019-03-01 | 泽鸿(广州)电子科技有限公司 | Radiator |
| CN108566760A (en) * | 2018-01-16 | 2018-09-21 | 东莞市远鑫电子科技有限公司 | Irregular radiator and its production technology |
| CN111370378A (en) * | 2020-03-17 | 2020-07-03 | 电子科技大学 | Chip radiator |
| CN111370378B (en) * | 2020-03-17 | 2022-08-05 | 电子科技大学 | Chip radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017117937A1 (en) | 2017-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |