CN101018471A - No-noise liquid cooling method - Google Patents
No-noise liquid cooling method Download PDFInfo
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- CN101018471A CN101018471A CN 200710067519 CN200710067519A CN101018471A CN 101018471 A CN101018471 A CN 101018471A CN 200710067519 CN200710067519 CN 200710067519 CN 200710067519 A CN200710067519 A CN 200710067519A CN 101018471 A CN101018471 A CN 101018471A
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Abstract
The provided free-noise liquid cooling method comprises: with a heat radiation tank made of isolative heat-conduct liquid and high-thermal-emissivity material, filling insulative conductive liquid in the tank to immerse the whole electronic system for transferring and dispersing heat. This invention can replace the traditional method, special to wind- and liquid-cooling system in computer, is simple and clean, and has strong heat dispersion function to reduce system fail rate.
Description
Technical field
The present invention relates to a kind of heat radiation of electronic system, the radiating mode of computer system especially, particularly a kind of no-noise liquid cooling method.
Background technology
Prior art mainly contains four kinds of radiating modes, and 1, unpowered self-loopa air cooling: promptly finned enlarges area of dissipation on needs radiating electronic chip, by thermal radiation and air self-loopa heat is dispersed in the air, reaches the purpose of chip cooling.Its shortcoming is that heat-sinking capability is low, can't satisfy the heat radiation requirement of modern high power electronic system such as computer.2, fan helps circulation air cooling: also installed fan after the finned on the electronic chip additional on fin, increase air velocity by fan, to reach the purpose of taking away heat fast from radiator.Its shortcoming is that fan brings noise, and rate of air circulation is big, makes easily to pile up dust in the cabinet, also pollutes indoor environment.In addition, use for a long time with fan, aging aft-fan noise can be bigger.3, common liquid cooling: by the liquid cooling head that is installed on the high euthermic chip, pump, conduit and heat exchanger are formed, and pump makes liquid circulate in conduit, in liquid cooling head and the heat exchanger, heat is walked from the liquid cooling headband, and be dispersed in the air by heat exchanger.Its shortcoming also need on the heat exchanger to be to accelerate radiating rate by fan, and noise is unavoidable, in addition, this system can only carry out the emphasis heat radiation to high euthermic chip, can't dispel the heat to whole electronic system, long-term use causes cabinet inner product heat, damage system easily comprehensively.4, heat pipe radiating system: by heat pipe, fast the heat on the high euthermic chip is taken on the box body, box body is made by large-area heat sink material, by large tracts of land cabinet surface heat is distributed to air.Its shortcoming is that cost is too high, system complex, and also can only dispel the heat to local electronic chip, long-term use causes cabinet inner product heat, damage system easily.
Summary of the invention
The objective of the invention is provides a kind of simple in structure for the deficiency that solves above-mentioned technology, and noise-less pollution can not brought dust and dirt in the cabinet, and can be to the no-noise liquid cooling method of the comprehensive heat radiation of electronic system.
In order to achieve the above object, a kind of no-noise liquid cooling method that the present invention is designed, it comprises the cooling cabinet that adopts insulating properties heat-conducting liquid and high-heating radiation coefficient Heat Conduction Material to make, it is characterized in that in the cooling cabinet that high-heating radiation coefficient Heat Conduction Material is made, the insulating properties heat-conducting liquid being set, again the whole electronic system of heat radiation that needs is immersed in the insulating properties heat-conducting liquid, the heat that the electronic system that need dispel the heat produces at work transfers heat to cooling cabinet by the insulating properties heat-conducting liquid, by cooling cabinet heat is dispersed in the outside air again.Described insulating properties heat-conducting liquid is that electrical conductivity is less than the liquid below 4.5.Described high-heating radiation coefficient Heat Conduction Material can be copper and copper alloy or aluminium and aluminium alloy.
When specifically using, with electronic system such as computer motherboard, CPU, power supply or the like immerses in the insulating properties conductive fluid, because high insulation characterisitic, electronic system energy operate as normal can not cause electronic failures such as short circuit after immersing the insulating properties conductive fluid.The insulating properties heat-conducting liquid places in the cabinet, and during the system operate as normal, the heat that electronic system such as CPU etc. is sent conducts to cabinet by the insulating properties heat-conducting liquid and is dispersed in the outside air by cabinet.
A kind of no-noise liquid cooling method provided by the present invention, the heat that utilizes the high-insulativity heat-conducting liquid that electronic system work is produced takes the cabinet surface to and dispels the heat, making heat-conducting liquid can be fast the heat of electronic system generation be exported to cabinet dispels the heat outward, this method can be used for replacing the radiating mode of conditional electronic system, the air-cooled liquid cooling system that particularly uses in the computer to dissipate heat, the inventive method is simple, noise-less pollution, cleaning in the cabinet, can not bring dust and dirt into, and with low cost, and can dispel the heat to electronic system comprehensively, heat-sinking capability is strong, has reduced the failure rate of system.
Description of drawings
Fig. 1 is an embodiment of the invention structural representation.
Embodiment
The invention will be further described in conjunction with the accompanying drawings below by embodiment.
Embodiment 1
As shown in Figure 1, a kind of no-noise liquid cooling method that present embodiment is described, it comprises the cooling cabinet 1 that adopts insulating properties heat-conducting liquid 2 and high-heating radiation coefficient Heat Conduction Material to make, in the cooling cabinet 1 that high-heating radiation coefficient Heat Conduction Material is made, insulating properties heat-conducting liquid 2 is set, again the whole electronic system of heat radiation that needs is immersed in the insulating properties heat-conducting liquid, present embodiment adopts the computer system of the method heat radiation, computer motherboard 4, CPU, power supply, hard disks etc. all immerse in the insulating properties heat-conducting liquid 2, and can be on CPU finned 5, the heat that makes CPU produce can conduct faster to insulating properties heat-conducting liquid 2, during the computer operate as normal, the heat that produces makes the insulating properties heat-conducting liquid form self-loopa, each point temperature in the homogenizing cabinet, and heat conducted to large-area cooling cabinet 1, and be dispersed in the external environment by it and go, reach the purpose of computer system heat radiation.When insulating heat-conductive liquid convection current in the cabinet is strong inadequately, can install motor or pump 3 additional and increase the interior liquid convection of cabinet, faster heat transferred is arrived cooling cabinet 1, because motor or pump integral body are immersed in the insulating heat-conductive liquid, cabinet can not heard any noise outward.
Because the electrical conductivity of most of board substrates is 4.5, so the insulating properties heat-conducting liquid that present embodiment provided is that electrical conductivity is less than the liquid below 4.5.As most liquid state organics, electrical conductivity at 3.5 to 4.0 vegetable oil, electrical conductivity at industrial insulating oil of 2.5 to 3.0 or the like, described high-heating radiation coefficient Heat Conduction Material can be copper and copper alloy or aluminium and aluminium alloy.
Because insulating properties heat-conducting liquid and high-heating radiation coefficient Heat Conduction Material can both be found in corresponding material handbook, no longer specifically exemplify one by one at this.
Claims (3)
1, a kind of no-noise liquid cooling method, it comprises the cooling cabinet that adopts insulating properties heat-conducting liquid and high-heating radiation coefficient Heat Conduction Material to make, it is characterized in that in the cooling cabinet that high-heating radiation coefficient Heat Conduction Material is made, the insulating properties heat-conducting liquid being set, again the whole electronic system of heat radiation that needs is immersed in the insulating properties heat-conducting liquid, the heat that the electronic system that need dispel the heat produces at work transfers heat to cooling cabinet by the insulating properties heat-conducting liquid, by cooling cabinet heat is dispersed in the outside air again.
2, a kind of no-noise liquid cooling method according to claim 1 is characterized in that described high-insulativity heat-conducting liquid is that electrical conductivity is less than the liquid below 4.5.
3, a kind of no-noise liquid cooling method according to claim 1 and 2 is characterized in that described high-heating radiation coefficient Heat Conduction Material is copper and copper alloy or aluminium and aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710067519 CN101018471A (en) | 2007-03-05 | 2007-03-05 | No-noise liquid cooling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710067519 CN101018471A (en) | 2007-03-05 | 2007-03-05 | No-noise liquid cooling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101018471A true CN101018471A (en) | 2007-08-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710067519 Pending CN101018471A (en) | 2007-03-05 | 2007-03-05 | No-noise liquid cooling method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101715283A (en) * | 2009-08-27 | 2010-05-26 | 李建权 | Radiation device |
| CN103384465A (en) * | 2013-06-24 | 2013-11-06 | 陈夏新 | Heat conducting system with electronic power element adhered on circuit board |
| CN103543806A (en) * | 2013-10-29 | 2014-01-29 | 大连生容享科技有限公司 | Partition oil cooling circulation computer main box |
| CN103593017A (en) * | 2013-10-29 | 2014-02-19 | 大连生容享科技有限公司 | Oil-cooling computer mainframe case |
| CN105116976A (en) * | 2015-09-13 | 2015-12-02 | 张雅男 | Noise-free oil cooling computer case |
| CN107102697A (en) * | 2017-03-24 | 2017-08-29 | 上海大学 | A kind of following cloud computer |
| CN109168298A (en) * | 2018-10-18 | 2019-01-08 | 中国科学院合肥物质科学研究院 | A kind of radiator for PCR detector temperature control system |
| CN110471518A (en) * | 2019-08-08 | 2019-11-19 | 昆山艾纳电子科技有限公司 | Immersion heat dissipation tank |
-
2007
- 2007-03-05 CN CN 200710067519 patent/CN101018471A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101715283A (en) * | 2009-08-27 | 2010-05-26 | 李建权 | Radiation device |
| CN103384465A (en) * | 2013-06-24 | 2013-11-06 | 陈夏新 | Heat conducting system with electronic power element adhered on circuit board |
| CN103384465B (en) * | 2013-06-24 | 2018-11-02 | 东阳市聚冉电子科技有限公司 | The heat-conducting system of electronic power component attachment in the circuit board |
| CN103543806A (en) * | 2013-10-29 | 2014-01-29 | 大连生容享科技有限公司 | Partition oil cooling circulation computer main box |
| CN103593017A (en) * | 2013-10-29 | 2014-02-19 | 大连生容享科技有限公司 | Oil-cooling computer mainframe case |
| CN105116976A (en) * | 2015-09-13 | 2015-12-02 | 张雅男 | Noise-free oil cooling computer case |
| CN107102697A (en) * | 2017-03-24 | 2017-08-29 | 上海大学 | A kind of following cloud computer |
| CN109168298A (en) * | 2018-10-18 | 2019-01-08 | 中国科学院合肥物质科学研究院 | A kind of radiator for PCR detector temperature control system |
| CN110471518A (en) * | 2019-08-08 | 2019-11-19 | 昆山艾纳电子科技有限公司 | Immersion heat dissipation tank |
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