KR101358146B1 - Cooling apparatus for computer - Google Patents

Cooling apparatus for computer Download PDF

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Publication number
KR101358146B1
KR101358146B1 KR1020130071226A KR20130071226A KR101358146B1 KR 101358146 B1 KR101358146 B1 KR 101358146B1 KR 1020130071226 A KR1020130071226 A KR 1020130071226A KR 20130071226 A KR20130071226 A KR 20130071226A KR 101358146 B1 KR101358146 B1 KR 101358146B1
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KR
South Korea
Prior art keywords
cooling
cooling pipe
substrate
air
housing
Prior art date
Application number
KR1020130071226A
Other languages
Korean (ko)
Inventor
이원대
Original Assignee
쉐도우시스템즈(주)
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Priority to KR1020130071226A priority Critical patent/KR101358146B1/en
Application granted granted Critical
Publication of KR101358146B1 publication Critical patent/KR101358146B1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

Abstract

The present invention relates to an air-cooling device using a cooling pipe and more specifically, to an air-cooling device using a cooling pipe which comprises an upper discharging hole in order to effectively discharge heating generated in a board of a computer to the outside of a housing and to prevent computer performance degradation and a defect caused by foreign materials of a cooling fan. The air-cooling device using the cooling pipe comprises a housing comprising a board, a bracket which is installed in the board, and a plurality of cooling pipes which is installed in the bracket and comprises the discharge hole to discharge the heating of the board and the hot air of the housing to the outside of the housing.

Description

Air-cooled chiller using cooling pipes {COOLING APPARATUS FOR COMPUTER}

The present invention relates to an air-cooled cooling device using a cooling pipe,

In more detail, the heat generated from the board embedded in the computer is effectively discharged to the outside of the housing, and at the same time, foreign matter such as dust is accumulated when cooling with a conventional cooling fan, thereby preventing the problem of computer performance degradation and failure. It relates to an air-cooled cooling device using a cooling pipe having an upward discharge hole exposed to.

BACKGROUND Electronic components embedded in electronic devices such as computers are improving performance at a tremendous speed through technological development.

The computer parts are made of substrates (mainboards, CPUs, graphics cards, etc.) on which a plurality of semiconductor chips are mounted. As high-integration transistors are used for the purpose of improving performance and processing speed, power consumption increases, and thus It is common to dissipate heat through a cooling device attached to a housing or a board because it generates a lot of heat and the computer component itself cannot dissipate heat.

BACKGROUND ART Conventional techniques for dissipating and cooling heat generated by a computer component include a cooling apparatus using an air cooling plate and a cooling fan as air cooling.

In the case of using the conventional cooling device, there is a problem in that the weight of the heating plate increases with the performance of the computer parts, and very high temperature heat is generated inside the computer, so that a large number of cooling fans are attached to the housing and used. As a result, the power consumption is increased, there is a problem that noise occurs.

In addition, in the case of using a cooling apparatus including a conventional cooling fan, foreign matter such as dust is accumulated in a substrate or a cooling fan while the air in the housing is forcedly communicated, and thus performance is degraded, which is a main reason for the occurrence of a computer failure.

Another conventional technique is a cooling apparatus using a water cooling system, and a technology related to a water cooling cooling apparatus is disclosed in Korean Patent Publication No. 10-2005.0120557 (2005.12.22.).

The present invention relates to a cooling device using a liquid refrigerant, and more particularly, to cool the heat generated from the main components inside the computer using the liquid refrigerant, and to absorb the heat absorbed liquid refrigerant from the conventional radiator and fan. Cooling by using a water-cooled tank using a water tank and a natural heat-generating structure to store the liquid refrigerant differently.

The invention is equipped with a device that absorbs heat to the components that generate the main heat in the computer, and through the mounted device to pass through the liquid refrigerant, to cool the cooling liquid is moved to the external natural cooling device again It is a device for cooling by moving to the device that naturally dissipates the heat absorbed.

As described above, the water-cooled cooling device employing a liquid refrigerant or a water circulation system has excellent thermal conductivity and excellent cooling performance, and may cause a fatal failure of the computer board when leaking, and the installation of the water-cooled cooling device in the housing may be difficult. It is difficult and there is a problem that the weight of the computer increases because a certain amount of water is used.

As another conventional technology for solving the above problems, there is published Patent Publication No. 10-2006-0067775 (2006.06.20.),

The present invention relates to a cooling system for a computer component using a thermoelectric element. The cooling air obtained from the heat absorbing portion of the thermoelectric element is cooled by transferring a cooled air using a blower to an air jacket attached to the computer component through a pipe. In addition, the present invention relates to a circulatory system that sends a pipe to a hot sink of a thermoelectric element through a pipe to cool the heat generating portion of the thermoelectric element and then returns to a cooling sink of the thermoelectric element.

To this end, the present invention installs a hot sink on the top of the thermoelectric element and a cool sink on the bottom to transfer the cooling air obtained from the cool sink to the air jacket through a pipe, which is a designated passage, to cool the computer parts bonded to the air jacket and again. It is a circulation system of cooling air that is sent to a hot sink through a pipe to cool the heat generating portion of the thermoelectric element and return to the cool sink.

However, the present invention is not easy to install on a computer as the structure of the cooling device is complicated, and thus the weight of the computer is increased, it is not easy to install and use in a small PC,

In particular, as the size of the main body housing such as the main body of the sleep type, the monitor-integrated main body is reduced, there is a problem that the durability of the computer is lowered because heat generation through the above-described conventional cooling apparatus is not smooth.

Accordingly, the present invention has been made to solve the above-mentioned problems,

Its simple structure makes it easy to manufacture and reduces the manufacturing cost, and it is easy to install on the existing computer and the cooling pipe connected to the board is exposed to the outside of the housing so that the heat generated in the housing can be effectively discharged and eliminated. It is an object of the present invention to provide an air-cooled cooling device using a cooling pipe is cooled while being discharged to the upward discharge hole.

Another object of the present invention is to provide an air-cooled cooling apparatus using a cooling pipe in which a heat conductor in contact with the substrate is introduced into a bracket body provided with a cooling pipe to directly discharge heat generated from the substrate to improve cooling performance.

Next, the present invention has a heat dissipation member including a twist portion surrounding the outer circumferential surface of the bolt member and a connection portion connecting the twist portion and the thermal conductor so that cooling pipes can be firmly assembled to the substrate while assisting heat dissipation of the substrate. An object of the present invention is to provide an air-cooled cooling device using a cooling pipe.

In addition, an object of the present invention is to provide an air-cooled cooling apparatus using a cooling pipe having a cooling fan connected to a circulation hole provided in the lower portion of the cooling pipe to assist the air circulation in the cooling pipe to further improve the cooling performance.

In order to achieve the above object, the air-cooled cooling device using a cooling pipe according to the present invention is

A housing in which the substrate is embedded;

A bracket installed on the substrate; And

And a plurality of cooling pipes provided in the bracket and having discharge holes exposed to the outside of the housing to discharge the heat of the substrate and the hot air inside the housing to the outside of the housing.

In the air-cooled cooling apparatus using the cooling pipe according to the present invention, the bracket is provided with a heat conductor for transferring heat of the substrate to the cooling pipe at the contact portion between the substrate and the cooling pipe.

And the air-cooled cooling apparatus using a cooling pipe according to the present invention is further made of a bolt member for fastening the bracket to the substrate,

Between the bolt member and the bracket is characterized in that the twisted portion surrounding the outer peripheral surface of the bolt member and the heat dissipation member consisting of a connecting portion connected in contact with the heat conductor or the substrate.

In addition, in the air-cooled cooling apparatus using a cooling pipe according to the present invention, the cooling pipe comprises a circulation hole formed on the opposite side of the discharge hole,

The circulation hole is provided with an auxiliary cooling fan for discharging air in the cooling pipe to the discharge hole.

The air-cooled cooling apparatus using the cooling pipe according to the present invention is installed to contact the substrate with a cooling pipe having an upwardly discharged hole exposed to the outside of the housing, thereby dissipating heat generated from the substrate and hot air inside the housing to the outside of the housing, By circulating, the heat of the computer can be effectively eliminated.

In addition, the air-cooled cooling apparatus using the cooling pipe according to the present invention is simple in structure, easy to manufacture, can reduce the manufacturing cost, and very easy to install in the existing computer is very versatile.

In addition, the air-cooled cooling apparatus using the cooling pipe according to the present invention is provided with a heat conductor at the contact portion between the substrate and the cooling pipe, so that the heat generated from the substrate can be directly delivered to the cooling pipe to be eliminated, thereby providing excellent cooling performance.

Furthermore, the air-cooled cooling apparatus using another cooling pipe according to the present invention introduces a heat radiating member having a twisted portion surrounding the bolt member for assembling the bracket to the substrate to assist in dissipation of heat and at the same time improve the fastening force of the bolt member to secure the cooling apparatus. Assembly is possible.

In addition, the air-cooled cooling apparatus using the cooling pipe according to the present invention may further improve the cooling performance of the cooling apparatus by introducing an auxiliary cooling fan into the downward circulation hole of the cooling pipe, thereby improving the air discharge and circulation function through the cooling pipe. .

1 and 2 are a perspective view showing a preferred embodiment of an air-cooled cooling apparatus using a cooling pipe according to the present invention.
3 is an exploded perspective view of an air-cooled cooling apparatus using a cooling pipe according to the present invention.

While the present invention has been described in connection with certain embodiments, it is obvious that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

In the drawings, the same reference numerals are used for the same reference numerals, and in particular, the numerals of the tens and the digits of the digits, the digits of the tens, the digits of the digits and the alphabets are the same, Members referred to by reference numerals can be identified as members corresponding to these standards.

In the drawings, the components are expressed by exaggeratingly larger (or thicker) or smaller (or thinner) in size or thickness in consideration of the convenience of understanding, etc. However, It should not be.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

 In the present application, the term " comprising " or " consisting of ", or the like, refers to the presence of a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

It is to be understood that the first to second aspects described in the present specification are merely referred to in order to distinguish between different components and are not limited to the order in which they are manufactured, It may not match.

In describing the air-cooled cooling apparatus using the cooling pipe according to the present invention, for the sake of convenience, the non-strict approximate direction reference is specified with reference to FIG. In the description and claims of the invention in conjunction with the other figures, the direction is specified in accordance with this criterion unless otherwise stated.

Hereinafter, an air-cooled cooling apparatus using a cooling pipe according to the present invention will be described with reference to the accompanying drawings.

1 and 2 are views showing a preferred embodiment of the air-cooled cooling apparatus according to the present invention at different angles, and FIG. 3 is an exploded perspective view of the air-cooled cooling apparatus according to the present invention.

First, as shown in Figures 1 to 3, the air-cooled cooling apparatus using a cooling pipe according to the present invention

A housing 10 in which the substrate 11 is embedded;

A bracket 20 installed on the substrate 11; And

Is provided in the bracket 20, having a discharge hole (30A) exposed to the outside of the housing 10 to discharge the heat of the substrate 11 and the hot air inside the housing 10 to the outside of the housing (10) It comprises a plurality of cooling pipes (30).

The housing 10 is used as a conventional computer body, and includes not only a typical desktop computer body used in an office or home, but also all housings in which a substrate used as a computer component such as a slim PC and a monitor-integrated computer is embedded. The concept of the present invention will be described on behalf of the cooling device of the present invention in a desktop computer body housing for convenience of description.

In addition, the housing 10 includes not only a computer body but also all housings in which computer related components, such as a smart TV, can be embedded.

In addition, the substrate 11 is a concept including all computer components accompanying heat generation while being used as a computer component such as a main board, a CPU installed on the main board, a graphics card, and the like for the convenience of description. Representation on behalf of

Typically, the motherboard to which the CPU is coupled is provided with a screw mounting portion and a screw hole 11A for screwing the heat sink around the mounting portion.

As shown in FIG. 3, the present invention introduces a bracket 20 coupled to a bolt member 29 to a screw hole 11A of the substrate, and is formed perpendicular to the bracket 20 to form a housing 10. The cooling function is implemented by discharging heat generated in the substrate 11 and hot air in the housing 10 to the outside of the housing 10 by using the cooling pipe 30 exposed to the outside.

The cooling pipe 30 is made of a material having excellent thermal conductivity such as copper or copper plate, and is formed by communicating upper and lower holes.

In particular, the present invention by introducing a plurality of the cooling pipe 30 to be provided in the bracket 20 while being in contact with each other, thereby maximizing the heat conduction effect between the cooling pipe 30 to improve the cooling performance.

In addition, the one side hole of the cooling pipe 30 is exposed to the outside of the housing 10 to function as an upward discharge hole 30A, so that hot air and heat generation inside the housing 10 are naturally discharged and circulated due to a temperature difference. The internal temperature of the housing 10 and the heat generation of the substrate 11 may be cooled.

To this end, the housing 10 is provided with a communication hole 10A for allowing the discharge hole 30A of the cooling pipe 30 to communicate with air outside the housing.

1 to 3 and the expression that the discharge hole 30A is upwardly exposed to the outside of the housing 10 in the cooling pipe 30 are exemplary expressions for understanding the description.

The cooling pipe 30 is not only an upper direction of the housing 10 according to the shape, size, installation place, etc. of the housing 10, but also a lateral direction, and in some cases, the auxiliary cooling fan to be described later. 10) it may be exposed to the outside, the concept including a discharge hole (30A) in all directions exposed to the outside of the housing (10).

In addition, the cooling pipe 30 may be formed to have a length in the form of a straight line, as shown in the drawing, but may be bent or curved in some cases.

The cooling pipe 30 allows the hot air inside the housing 10 to be discharged to the discharge hole 30A through the circulation hole 30B formed on the opposite side of the discharge hole 30A, and the substrate 11 The heat generated from the substrate 11 may be also eliminated by the cooling pipes 30 in contact with each other.

Subsequently, as shown in FIG. 3, the bracket 20 includes a main body 21 through which the cooling pipes 30 pass, and a corresponding screw hole for installing the main body 21 on the substrate 11. It comprises a coupling portion 22 having 22A).

The body has a through hole 21A through which the cooling pipe 30 can be formed.

Corresponding screw hole 22A of the bracket 20 is configured to correspond to the screw hole (11A) provided for assembling the heating element in the substrate 11, as described above,

The bolt member 29 penetrates through the corresponding screw hole 22A and is screwed into the screw hole 11A of the substrate 11 so that the bracket 20 is installed on the substrate 11.

In addition, the present invention introduces a thermal conductor 25 into the contact portion of the bracket 20, more specifically, the body 21 of the bracket 20 in contact with the cooling pipe 30 and the substrate 11 The heat generation generated in the substrate 11 is better transmitted to the cooling pipe 30, thereby maximizing the heat dissipation function.

The thermal conductor 25 may be formed in a plate shape and provided to correspond to a heat generating portion of the substrate 11, that is, a CPU, a graphics card, or the like.

In some cases, it is possible to increase the versatility of the present invention by borrowing the heating element installed in the existing computer as the thermal conductor 25, and the bracket 20 is brought into contact with the cooling pipe 30 to the existing heating element. Modifications can be sufficiently predicted and reproduced by those of ordinary skill in the art (collectively, those skilled in the art).

3, the thermal conductor 25 may be formed at a contact portion of the cooling pipe 30 and the substrate 11, and may be provided on the opposite side of the thermal conductor 25 to form a pair. The heat conductor transfers heat inside the housing to the cooling pipe,

In this case, the bracket 20 is composed of upper and lower powders 20A and 20B so that the cooling pipe 30 penetrates the powders, and the thermal conductor 25 is connected to a coupling member such as a bolt. It is configured to interconnect the upper and lower powders.

Next, in the air-cooled cooling apparatus according to the present invention, the coupling portion 22 of the bracket 20 is fastened to the substrate 11 through a bolt member 29.

Between the bolt member 29 and the bracket 20, a twisted portion 26A surrounding the outer circumferential surface of the bolt member 29, the twisted portion 26A and the thermal conductor 25 or the substrate 11 It characterized in that the heat dissipation member 26 is composed of a connecting portion (26B) for connecting the.

The heat dissipation member 26 is also made of a good thermal conductivity material, the twisted portion (26A) is configured to exert an elastic force in the opposite direction of the coupling of the bolt member (29).

Therefore, when screwing the bolt member 29 when coupling the air-cooled cooling system according to the present invention after the completion of the fastening by the elastic force exerted in the opposite direction of the coupling can be secured by the screw loosening phenomenon.

In addition, the heat generated from the substrate 11 is transmitted to the bolt member 29 via the twisted portion 26A through the connection portion 26B connected to the thermal conductor 25 or the substrate 11. In addition, the heat generation generated from the substrate 11 may increase the area in contact with the air to improve the heat generation effect.

In addition, the connecting portion 26B is formed in a bent shape to increase the contact area with the thermal conductor 25.

That is, the heat dissipation member 26 includes a bent portion 26C connected to the connecting portion 26B opposite to the twisted portion 26A and formed to be bent, and the bent portion 26C has an elastic force on both sides in the longitudinal direction of the heat dissipation member. This can be used to assist and increase the bonding force between the bracket and the heat conductor.

Subsequently, the cooling apparatus using the cooling pipe according to the present invention further includes an auxiliary cooling fan 40 connected to the circulation hole 30B formed on the opposite side of the discharge hole 30A of the cooling pipe 30.

The auxiliary cooling fan 40 may be a known cooling fan, and circulates air due to the rotating propeller.

The auxiliary cooling fan 40 comprises a drive unit 41 having a propeller, the drive unit 41 is provided to correspond to the air circulation hole for the cooling fan provided in the housing 10 outside the housing 10 It is configured to circulate the air into the housing.

In addition, the auxiliary cooling fan 40 is further provided with a box-shaped support portion 42 and the wing 43 connected thereto that the cooling pipe 30 is supported through.

The support portion and the wing portion is provided with a through hole through which the cooling pipe can be coupled.

The support portion 42 serves to connect the circulation fan 30B of the cooling fan 40 and the cooling pipe 30 while supporting the cooling pipe 33,

In some cases, the cooling hole 40 may be provided to directly contact the circulation hole 30B.

According to the present invention, the cooling fan 40 is connected to the circulation hole 30B so that the air can be forced to circulate in the direction of the discharge hole 30A, so that hot air inside the housing 10 is transferred to the outside of the housing 10. At the same time as the discharge to the cooling pipe 30 has a function to cool, it is possible to maximize the heat dissipation function through the cooling pipe (30).

In the above description of the present invention, the air-cooled cooling apparatus using a cooling pipe having a specific shape and structure has been described with reference to the accompanying drawings. However, various modifications, changes, and substitutions are possible by those skilled in the art. Modifications, changes and substitutions should be construed as falling within the protection scope of the present invention.

10 housing 11 substrate
20: bracket 21: main body
22: coupling portion 25: thermal conductor
26: heat dissipation member 26A: twisted portion
26B: connecting portion 29: bolt member
30: cooling pipe 30A: discharge hole
30B: circulating hole 40: cooling fan

Claims (4)

In the cooling device installed in the substrate 11 embedded in the housing 10 to dissipate heat of the substrate,
A discharge hole 30A exposed to the outside of the housing 10 to discharge the heat of the substrate 11 and the hot air inside the housing 10 to the outside of the housing 10 and the circulation opposite to the discharge hole 30A. A plurality of cooling pipes 30 having balls 30B; And
A main body having a through hole 21A through which the cooling pipe 30 is coupled and a coupling portion 22 to be installed on the substrate 11 and composed of a pair of upper and lower powders 20A and 20B. With 21,
Coupled between the upper and lower powders are provided in the contact portion and the contact portion of the substrate 11 and the cooling pipe 30 to transfer the heat of the substrate 11 and the heat inside the housing 10 to the cooling pipe 30. An air-cooled cooling apparatus using a cooling pipe, comprising: a bracket (20) comprising a pair of thermal conductors (25) to transfer. The method of claim 1,
Further comprising a bolt member 29 for fastening the bracket 20 to the substrate 11,
Between the bolt member 29 and the engaging portion 22 of the bracket 20, the twisted portion 26A surrounding the outer peripheral surface of the body of the bolt member 29, and the twisted portion is connected to the thermal conductor 25 Or a heat dissipation member 26 composed of a connection part 26B contacting the substrate 11 and a bending part 26C connected to the connection part 26B and bent toward the twisted part 26A. Air-cooled chiller using a cooling pipe characterized in that. 3. The method according to claim 1 or 2,
Air circulation type cooling apparatus using a cooling pipe, characterized in that the circulation hole (30B) is provided with an auxiliary cooling fan (40) for discharging the air in the cooling pipe (30) to the discharge hole (30A). The method of claim 3, wherein
The auxiliary cooling fan 40 includes a drive unit 41 having a propeller, a support unit 42 connected to the drive unit and supported by the cooling pipe 30, and a wing unit 43 connected to the support unit. Air-cooled chiller using a cooling pipe, characterized in that configured.
KR1020130071226A 2013-06-20 2013-06-20 Cooling apparatus for computer KR101358146B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107613732A (en) * 2017-09-28 2018-01-19 深圳兴奇宏科技有限公司 Heat-sinking structure of chassis
KR101854153B1 (en) * 2017-10-30 2018-05-03 (주)아이브리지닷컴 Server computer
CN109753124A (en) * 2019-01-22 2019-05-14 南昌科悦企业管理咨询有限公司 A kind of computer cooling control system and its cooling device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010000940A (en) * 2000-05-25 2001-01-05 천기완 Computer having cooling apparatus and heat exchanging device of the cooling apparatus
KR20050120557A (en) * 2004-09-18 2005-12-22 박재호 Computer cooling case using the liquid refrigerant
KR100574090B1 (en) 2003-06-05 2006-04-27 유니윌 컴퓨터 코포레이션 Cool air-supplying device for a computer system
KR101185567B1 (en) * 2012-02-23 2012-09-26 주식회사 씨앤엘 Cooling apparatus using thermoelement module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010000940A (en) * 2000-05-25 2001-01-05 천기완 Computer having cooling apparatus and heat exchanging device of the cooling apparatus
KR100574090B1 (en) 2003-06-05 2006-04-27 유니윌 컴퓨터 코포레이션 Cool air-supplying device for a computer system
KR20050120557A (en) * 2004-09-18 2005-12-22 박재호 Computer cooling case using the liquid refrigerant
KR101185567B1 (en) * 2012-02-23 2012-09-26 주식회사 씨앤엘 Cooling apparatus using thermoelement module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107613732A (en) * 2017-09-28 2018-01-19 深圳兴奇宏科技有限公司 Heat-sinking structure of chassis
KR101854153B1 (en) * 2017-10-30 2018-05-03 (주)아이브리지닷컴 Server computer
CN109753124A (en) * 2019-01-22 2019-05-14 南昌科悦企业管理咨询有限公司 A kind of computer cooling control system and its cooling device

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