JP2007281279A - Cooling device, and electronic equipment having same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device that brings a heat-conducting sheet and a heat receiving body into contact with a plurality of electronic components having different height from a substrate or the substrate, can cool all electronic components within a prescribed range reliably, and can cool a plurality of electronic components having a different heating value sufficiently and efficiently according to each heating value; to provide a reliable cooling device capable of preventing temperature from rising more than necessary in the electronic component packaged onto the substrate; and to provide electronic equipment having the cooling device. <P>SOLUTION: The cooling device 1 has: the heat receiving body 2 for receiving the heat of the electronic component X1, refrigerant pipes 6a, 6b connected to the heat receiving body 2; a radiator 8 connected to the refrigerant pipes 6a, 6b, and a circulation pump 7 for circulating a refrigerant. The cooling device 1 cools the electronic components X1-X5 packaged onto the substrate A, and has the heat-conducting sheet 3 for covering the electronic components X1-X5. The heat-conducting sheet 3 is connected to the outer surface of a prescribed section 6a' in the refrigerant pipe 6b while heat can be transferred. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling device that cools electronic components such as a plurality of semiconductor elements mounted on a substrate inside a housing of an electronic device such as a personal computer or an OA device, and an electronic device including the same.

  In recent years, an electronic device such as a personal computer has been increased in processing speed, and this speeding-up has progressed extremely rapidly. In particular, the clock frequency of the central processing unit (hereinafter referred to as CPU) is significantly higher than that of the conventional one. As a result, the amount of heat generated by the CPU increases, and the cooling capacity is insufficient simply by air cooling using a heat sink as in the prior art. Therefore, a cooling device having a high cooling capacity is strongly demanded.

  There are various types of such cooling devices. In recent years, a cooling method (refrigerant circulation method) in which a refrigerant is circulated between a heat receiving body and a heat radiating body is particularly effective from the viewpoint of cooling efficiency and noise reduction. Attention has been paid. In the cooling device of the refrigerant circulation system, a heat receiving body made of a block-like or plate-like metal body having a refrigerant flow path is brought into contact with the upper surface of the CPU, and the heat of the CPU is received from the contact surface (heat receiving surface). The CPU is efficiently cooled by transmitting the refrigerant to the refrigerant passing through the refrigerant flow path, and circulating the refrigerant through the radiator to dissipate heat.

  Further, in recent electronic devices, not only the CPU but also the peripheral electronic components tend to increase the processing load and generate heat. For example, video processors, liquid crystal driver ICs, and the like have increased processing loads with higher definition of image processing. In addition, a liquid crystal driver IC or the like often requires a high voltage for liquid crystal control, and as a result, often generates high heat. However, in the conventional refrigerant circulation cooling device, it is difficult to receive heat from electronic components other than the CPU in contact with the heat receiving surface of the heat receiving body, and it is difficult to efficiently cool a plurality of electronic components. there were. In order to cool a plurality of electronic components, it is conceivable to increase the area of the heat receiving surface by increasing the size of the heat receiving body. However, a new type of electronic device such as a notebook personal computer with reduced useless space has been proposed. Space must be taken, and this is contrary to the purpose of electronic devices such as miniaturization and thinning. Furthermore, even if the area of the heat receiving surface is increased, the arrangement of the electronic components in the electronic device is various, and the height of each electronic component from the substrate surface is not uniform, and the heat receiving surface is made up of each electronic device. There was a problem that the parts could not be brought into proper contact.

  In order to solve such a problem, Patent Document 1 discloses a frame that is fixed on the substrate so as to surround a plurality of elements (electronic components) mounted on the substrate, and covers the elements. A soft heat transfer material filled inside the frame body and a cooling plate to which a pipe through which a liquid refrigerant flows is fixed, and flattening the surface of the heat transfer material filled in the frame body, A cooling structure for an integrated circuit element configured to bring the cooling plate into close contact with the surface of a heat material is disclosed.

  Also, in (Patent Document 2), water cooling jackets (heat receiving bodies) are brought into contact with the upper surfaces of a plurality of multichip modules mounted on a mother board (substrate) via connectors, and cooling in each of the water cooling jackets is performed. A cooling mechanism is disclosed in which the flow path of the agent is connected in series by a flexible hose so that the coolant is circulated between each of the water cooling jackets and the heat exchanger (heat radiator).

Further, (Patent Document 3) is a cooling structure for cooling heat generated from a plurality of semiconductors having different heights from a substrate mounted on a substrate, and a heat dissipation sheet is provided on the upper surface of the semiconductor. A heat radiating plate is interposed, and the heat radiating sheet is a thin-film reinforcing layer whose upper and lower surface layers are hardened in a rubber-like shape. A semiconductor cooling structure configured as described above is disclosed.
JP-A-63-236351 JP-A-6-195154 JP 2002-261206 A

  However, the above conventional techniques have the following problems.

  In the cooling structure of (Patent Document 1), since an electronic component is buried inside the heat transfer material, there is a problem that it is difficult to find and maintain a defective product.

  In the cooling mechanism of (Patent Document 2), it is necessary to provide an expensive heat receiving body for each of a plurality of electronic components, and there are problems that the number of components increases, attachment workability decreases, and cost increases.

  In the cooling structure of (Patent Document 3), since the heat dissipation sheet is formed by a thin-film reinforcing layer cured in a rubber shape of the surface layer portion and an inner compound layer, the heat dissipation sheet becomes expensive and lacks productivity, Although some level differences of a plurality of semiconductors on the substrate may be absorbed by deformation of the compound layer, if the level difference is larger than the thickness of the compound layer, it cannot be dealt with and there is a problem that it lacks practicality.

  In the techniques of (Patent Document 1) and (Patent Document 3), it is necessary to match the height of the cooling plate and the heat radiating plate to the one having the highest height from the substrate among the plurality of electronic components mounted on the substrate. The other relatively low ones have the problem that the heat transfer distance to the cooling plate and the heat radiating plate becomes long and the heat radiating efficiency is lacking, and the space saving is lacking.

  A plurality of electronic components mounted on a substrate usually have different amounts of heat generation, and those having a large amount of heat generation and those having a small amount of heat are mixed, but in the technologies of (Patent Document 1) to (Patent Document 3), each electronic component However, it has a problem that the heat dissipation efficiency is insufficient because the heat generation amount is large. In particular, the CPU generates a larger amount of heat than other electronic components around it, and it is desirable to develop a cooling device that can sufficiently and efficiently cool both the CPU and other electronic components according to the amount of heat generated. ing.

  The present invention solves the above-described conventional problems, and makes sure that a heat conductive sheet or a heat-receiving body is brought into contact with a plurality of electronic components or substrates having different heights from the substrate, so that all electronic components within a predetermined range can be reliably obtained. Providing a cooling device capable of sufficiently and efficiently cooling a plurality of electronic components having different calorific values according to each calorific value, and more than necessary electronic components mounted on the board An object of the present invention is to provide an electronic device that can prevent an increase in temperature and has excellent reliability.

  In order to solve the above problems, a cooling device of the present invention includes a heat receiving body that has a refrigerant flow path therein and receives heat from an electronic component, a refrigerant pipe connected to the refrigerant flow path of the heat receiving body, and a refrigerant pipe. A radiator that radiates the heat of the refrigerant to the outside and a circulation pump that circulates the refrigerant between the heat receiver and the radiator via a refrigerant pipe, and cools the electronic components mounted on the board The cooling device includes a heat conductive sheet that covers one or more electronic components, and the heat conductive sheet is connected to an outer surface of a predetermined portion of the refrigerant pipe so as to be able to transfer heat. ing.

  As a result, the heat conductive sheet and the heat receiving body can be reliably brought into contact with a plurality of electronic components having different heights from the substrate, and all the electronic components within a predetermined range can be reliably cooled, and a plurality of electrons having different heat generation amounts can be obtained. It is possible to provide a cooling device that can sufficiently and efficiently cool a component in accordance with each calorific value.

  In order to solve the above problems, a cooling device of the present invention includes a heat receiving body that has a refrigerant flow path therein and receives heat from an electronic component, a refrigerant pipe connected to the refrigerant flow path of the heat receiving body, and a refrigerant pipe. A radiator that radiates the heat of the refrigerant to the outside and a circulation pump that circulates the refrigerant between the heat receiver and the radiator via a refrigerant pipe, and cools the electronic components mounted on the board The cooling device includes a heat conductive sheet that is covered with a substrate, and the heat conductive sheet is connected to an outer surface of a predetermined portion of the refrigerant pipe so as to be able to transfer heat.

  As a result, the heat conductive sheet is brought into contact with the substrate or the lead of the electronic component protruding from the substrate, the heat receiving body is brought into contact with the predetermined electronic component, and the heat of the electronic component is received through the substrate or the lead. It is possible to provide a cooling device that can reliably cool all of the electronic components, and can sufficiently and efficiently cool a plurality of electronic components having different calorific values according to the calorific values.

  In order to solve the above problems, an electronic apparatus of the present invention has a configuration including the cooling device.

  Thereby, it is possible to provide an electronic device that can prevent an electronic component mounted on the substrate from being heated more than necessary and has excellent reliability.

  As described above, according to the cooling device of the present invention and the electronic apparatus including the same, the following advantageous effects can be obtained.

  A plurality of electronic components with different heights from the substrate can be reliably cooled by the heat receiving body and the heat conductive sheet, and among the plurality of electronic components, an electronic component with a relatively large amount of heat generation can be sufficiently absorbed by the heat receiving body. Since other electronic components that can be cooled and have a relatively small amount of heat generation can be cooled by the heat conductive sheet, a plurality of electronic components having different heat generation amounts can be efficiently cooled according to the respective heat generation amounts. Can prevent the temperature from rising more than necessary and has excellent reliability.

  In the present invention, a plurality of electronic components having different heights from the substrate can be reliably brought into contact with the heat conductive sheet and the heat receiving body, and all electronic components within a predetermined range can be reliably cooled, and a plurality of heat generation amounts can be varied. For the purpose of providing a cooling device capable of sufficiently and efficiently cooling an electronic component according to the amount of heat generated, the electronic component includes a thermally conductive sheet covered by one or more electronic components, This was realized by being connected to the outer surface of a predetermined part of the refrigerant pipe so as to be able to transfer heat.

  The present invention also provides a heat conductive sheet in contact with a substrate or a lead of an electronic component protruding from the substrate, a heat receiving member is brought into contact with a predetermined electronic component, and the heat of the electronic component is received through the substrate or the lead. It is an object of the present invention to provide a cooling device that can reliably cool all electronic components within a predetermined range and can sufficiently and efficiently cool a plurality of electronic components having different calorific values according to each calorific value. And the heat conductive sheet is realized by being connected to the outer surface of a predetermined portion of the refrigerant pipe so as to be capable of transferring heat.

  In addition, the present invention has achieved the object of providing an electronic device that can prevent an electronic component mounted on a substrate from being heated more than necessary and has excellent reliability, by including the cooling device.

  A first invention made to solve the above problems includes a heat receiving body that has a refrigerant flow path therein and receives heat from an electronic component, a refrigerant pipe connected to the refrigerant flow path of the heat receiving body, and a refrigerant pipe. A radiator that radiates the heat of the refrigerant to the outside and a circulation pump that circulates the refrigerant between the heat receiver and the radiator via a refrigerant pipe, and cools the electronic components mounted on the board The cooling device includes a heat conductive sheet that covers one or more electronic components, and the heat conductive sheet is connected to an outer surface of a predetermined portion of the refrigerant pipe so as to be able to transfer heat. ing.

  This configuration has the following effects.

  The heat of one or a plurality of electronic components is transferred from the heat conductive sheet to the refrigerant circulating through a predetermined portion of the refrigerant pipe, and the heat of the electronic components received by the heat receiving body directly or through the heat conductive sheet is transmitted. By transmitting to the refrigerant passing through the refrigerant flow path and dissipating heat with the radiator, the electronic components can be reliably cooled with a simple structure, reducing the size and thickness of the electronic equipment without taking up space in the housing. I can plan.

  By providing a flexible heat conductive sheet, the heat conductive sheet can be brought into contact with each of a plurality of electronic components having different heights from the substrate, and a plurality of components mounted within a predetermined range on the substrate can be provided. Heat is received from the electronic component, and the plurality of electronic components can be reliably cooled.

  By contacting the heat receiving body directly or via a heat conductive sheet to the upper part of an electronic component with a large amount of heat generation such as a CPU, the heat of the electronic component can be received by the heat receiving body, and Since the heat of the electronic component can also be received by the predetermined part of the refrigerant pipe via the heat conductive sheet, a plurality of electronic components having different heat generation amounts can be efficiently cooled according to the respective heat generation amounts.

  Since it has the circulation pump which circulates a refrigerant | coolant, the heat receiving in a heat receiving body and sheet | seat heat transfer refrigerant | coolant piping and the heat radiation in a heat radiating body can be repeated continuously by circulating a refrigerant | coolant.

  Since cooling of a plurality of electronic components within a predetermined range on the substrate is performed by heat dissipation by circulation of liquid refrigerant, the amount of outside air introduced into the casing of the electronic device can be reduced, and the number of cooling fan rotations can be reduced or cooled. The number of fans mounted can be reduced, and the noise can be reduced compared to the conventional one.

  Here, as the material of the heat receiving body, a metal having excellent thermal conductivity such as aluminum, aluminum alloy, copper, copper alloy or the like is preferably used. The refrigerant flow path of the heat receiving body may be formed by disposing a rib-shaped partition wall between a pair of flat plates spaced apart from each other in parallel, or at least of two flat plate-like members. Alternatively, a groove processed by a press or the like may be joined. By forming the refrigerant flow path meandering, the distance can be increased and the volume of the refrigerant can be increased, so that the heat capacity that can be received by the heat receiving body can be increased, and the cooling effect can be enhanced.

  A radiator such as a radiator may be fanless, but if sufficient cooling capacity cannot be obtained with only the radiator, it may be used in combination with a cooling fan. In addition, a heat radiator and a circulation pump can be arrange | positioned in the arbitrary positions inside the housing | casing of an electronic device. By forming ventilation openings at the main points of the housing, it is possible to cool the heat sink by taking in outside air, and prevent the heat from being trapped inside the housing by discharging the warmed air to the outside it can.

  The refrigerant piping connecting the heat receiving body, the heat radiating body, and the circulation pump may be made of metal, synthetic resin, or rubber. Synthetic resin or rubber refrigerant pipes are flexible and can be easily deformed, providing excellent installation flexibility. In particular, when butyl rubber, which is difficult for water molecules to pass through, is used, it is possible to effectively prevent the decrease in the refrigerant and the accompanying thickening, and the reliability is excellent. In addition, the refrigerant | coolant which decreases can be supplemented by providing a reserve tank. Further, by providing an air layer in the reserve tank, it is possible to absorb the volume change of the refrigerant, and to prevent breakage in cold regions and winter seasons.

  The heat receiving body and the circulation pump or the heat radiating body and the reserve tank may be integrated. Thereby, some refrigerant | coolant piping can be abbreviate | omitted, a handleability can be improved and attachment or detachment to an apparatus can be performed easily.

  A heat radiating fin for exchanging heat with the surrounding air can be provided on the surface of the reserve tank or the heat receiving body to also serve as a heat radiating function.

  Water, antifreeze, or the like is used as the refrigerant. As the antifreeze, a mixture of propylene glycol, which is a kind of alcohol, in water as the main component is suitably used. In addition, by using an antifreeze having a rust-preventing effect, corrosion of metal refrigerant pipes, reserve tanks, etc. can be prevented, and the reliability is excellent.

  As a fixing means for fixing the heat receiving body to the substrate, a flange portion protruding from a side portion of the heat receiving body, a bolt nut, a fixing pin, or the like for screwing and fixing the flange portion and the substrate are used. Note that an elastic body such as a coil spring, a leaf spring, or a washer is attached to a bolt, a fixing pin, or the like as a fixing means, and the heat receiving body can be fixed to the substrate while being pressed by the elastic body. Thereby, a heat receiving body, an electronic component, or a heat receiving body, a heat conductive sheet, and an electronic component can be made to adhere | attach reliably, and heat transfer property can be improved.

  The thermal conductive sheet is formed in a polygonal shape, circular shape, and other various shapes that cover a predetermined range according to the placement of the mounted electronic components on the substrate, etc. It is flexible so that a graphite sheet, a silicon rubber sheet containing a heat conductive filler, a metal thin film such as copper or aluminum, or the like is used. In the case of using a graphite sheet, an adhesive layer made of an acrylic resin layer, silicon rubber, or the like may be formed on the contact surface in order to improve the adhesion with the electronic component. The formation of an adhesive layer (slightly adhesive layer) made of silicon rubber is preferable because it is excellent in heat resistance and shock absorbing properties. Moreover, the insulating property of each electronic component can be ensured by forming an insulating layer made of PET, polyimide, or the like instead of or in addition to the adhesive layer.

  As a means for connecting the heat conductive sheet to a predetermined part of the refrigerant pipe so as to be capable of transferring heat, a means for directly contacting the outer surface by coating or winding, adhesion through an adhesive layer, etc. Means or the like for connecting a thermally conductive sheet to a jig that can be fixed by clamping or the like and mechanically connecting via the jig is used. For example, the end portion of the heat conductive sheet is wound around the refrigerant pipe, or a part of the heat conductive sheet is adhered to the outer surface of the refrigerant pipe with an adhesive or the like to transfer heat through the contact portion. In this case, it is preferable to form the refrigerant pipe, the adhesive to be used, the jig, etc. with a material having high thermal conductivity. In addition, the part which contacts a heat conductive sheet in refrigerant | coolant piping is suitably set to the part etc. which are the nearest to a heat conductive sheet according to arrangement | positioning etc. of refrigerant | coolant piping.

  A second invention made to solve the above problems includes a heat receiving body that has a refrigerant flow path therein and receives heat from an electronic component, a refrigerant pipe connected to the refrigerant flow path of the heat receiving body, and a refrigerant pipe. A radiator that radiates the heat of the refrigerant to the outside and a circulation pump that circulates the refrigerant between the heat receiver and the radiator via a refrigerant pipe, and cools the electronic components mounted on the board The cooling device includes a heat conductive sheet that is covered with a substrate, and the heat conductive sheet is connected to an outer surface of a predetermined portion of the refrigerant pipe so as to be able to transfer heat.

  This configuration has the following effects.

  The heat of one or a plurality of electronic components is transferred from the substrate or the lead of the electronic component to the refrigerant circulating through the heat conductive sheet and a predetermined part of the refrigerant pipe, and the heat of the electronic component directly received by the heat receiving body is By transmitting to the refrigerant passing through the flow path and radiating heat with the heat radiating body, the electronic component can be reliably cooled with a simple structure, and the electronic device can be made smaller and thinner without taking up space in the housing.

  By covering the flexible heat conductive sheet on the surface of the substrate opposite to the mounting surface of the electronic component, the heat of the plurality of electronic components is received through the substrate or leads, and the plurality of electronic components are received. Cooling can be ensured.

  By bringing a heat receiving body into contact with an upper part of a heat generating electronic component such as a CPU, the heat of the electronic component can be directly received by the heat receiving member, and the heat of other electronic components with a relatively small heat generating amount is thermally conductive. Since heat can be received by the refrigerant pipe via the sheet, a plurality of electronic components having different heat generation amounts can be efficiently cooled according to each heat generation amount.

  Since it has the circulation pump which circulates a refrigerant | coolant, the heat receiving in a heat receiving body and sheet | seat heat transfer refrigerant | coolant piping and the heat radiation in a heat radiating body can be repeated continuously by circulating a refrigerant | coolant.

  Since cooling of a plurality of electronic components within a predetermined range on the substrate is performed by heat dissipation by circulation of liquid refrigerant, the amount of outside air introduced into the casing of the electronic device can be reduced, and the number of cooling fan rotations can be reduced or cooled. The number of fans mounted can be reduced, and the noise can be reduced compared to the conventional one.

  Here, what was mentioned above is used as a heat receiving body, its fixing means, a heat radiator, a circulation pump, refrigerant | coolant piping, and a heat conductive sheet.

  3rd invention made | formed in order to solve the said subject is a cooling device as described in 1st or 2nd invention, Comprising: The edge part of a heat conductive sheet is wound around the outer surface of the predetermined part of refrigerant | coolant piping. It has a connected configuration.

  With this configuration, in addition to the functions of the first or second invention, the following functions are provided.

  By winding the end portion of the heat conductive sheet around the outer surface of the predetermined portion of the refrigerant pipe, the heat transfer area can be widened to improve the heat transfer performance, and the cooling performance can be improved.

  A fourth invention made to solve the above-described problem is the cooling device according to any one of the first to third inventions, wherein the heat conductive sheet includes a heat receiving member and an electronic component. It has a configuration that is sandwiched between them.

  With this configuration, in addition to the operation of any one of the first to third inventions, the following operation is provided.

  Since the heat conductive sheet is sandwiched between the heat receiving body and the electronic component, the heat of the electronic component received by the heat conductive sheet can be transmitted to the refrigerant passing through the refrigerant channel through the heat receiving body. The heat transfer path from the electronic component to the refrigerant is increased, so that the heat transfer can be improved and the cooling performance can be improved.

  It is easy to attach and remove the heat receiving body and the heat conductive sheet to the substrate, and it is excellent in maintainability of electronic parts and the like.

  A fifth invention made to solve the above-mentioned problems is the cooling device according to any one of the first to fourth inventions, comprising a plurality of heat conductive sheets, and a plurality of heats. The conductive sheet has a configuration connected in series via a refrigerant pipe.

  With this configuration, in addition to the operation of any one of the first to fourth inventions, the following operation is provided.

  By connecting a plurality of thermal conductive sheets in series, it is possible to correspond to the number and arrangement of various electronic components, and not only electronic components mounted on the same substrate, but also a plurality of adjacent substrates It is possible to dispose a heat conductive sheet or a heat receiving body connected by one refrigerant path, and a heat receiving mechanism can be designed freely.

  6th invention made | formed in order to solve the said subject is a cooling device as described in any one of 1st thru | or 5th invention, Comprising: The surface on the opposite side to the heat receiving surface of a heat conductive sheet And a cushioning material having flexibility and a presser plate for pressing and fixing the cushioning material to the heat conductive sheet.

  With this configuration, in addition to the operation of any one of the first to fifth inventions, the following operation is provided.

  Since the cushioning material follows and deforms a plurality of electronic components having different heights, the heat conductive sheet can be pressed and securely adhered to the electronic components, and heat transferability can be improved.

  The cushioning material can be pressed and held and fixed to the heat conductive sheet by the presser plate, and the cushioning material can be prevented from peeling off or moving from the heat conductive sheet, thereby preventing a decrease in adhesion.

  Here, when making a heat receiving body contact a heat conductive sheet, an opening part is provided in the location corresponding to a buffer material or a presser plate. By disposing the heat receiving body inside the opening, it is possible to prevent the periphery of the heat receiving body from being blocked, and thus it is possible to prevent a reduction in heat dissipation efficiency.

  As a fixing means for fixing the presser plate to the substrate, a bolt nut or a fixing pin is used. An elastic body such as a coil spring, a leaf spring, or a washer is attached to a bolt, a fixing pin, or the like as a fixing means, and the pressing plate can be fixed to the substrate by the elastic body. Thereby, adhesiveness can be improved and heat transferability can be improved between the heat conductive sheet and the electronic component.

  By using a material with thermal conductivity for the cushioning material and the presser plate, the heat of the electronic components can be radiated from the thermal conductive sheet to the air inside the housing via the bufferer and the presser plate, increasing the heat dissipation efficiency. be able to. In this case, the heat radiation efficiency can be further enhanced by providing a plurality of heat radiation fins on the upper surface of the holding plate.

  7th invention made | formed in order to solve the said subject is a cooling device as described in 6th invention, Comprising: It has the structure provided with the through-hole in which a shock absorbing material and a pressing board communicate mutually.

  With this configuration, in addition to the operation of the sixth invention, the following operation is provided.

  Since it has a through hole that communicates with the cushioning material and the presser plate, it is possible to prevent moisture in the air in the space between the electronic components from condensing due to heat generated by the electronic components, and to prevent occurrence of short circuits and corrosion. .

  An eighth invention made to solve the above-described problem is the cooling device according to any one of the first to seventh inventions, wherein the heat receiving body integrally forms a circulation pump. It has the structure which is an integrated heat receiving body.

  With this configuration, in addition to the operation of any one of the first to seventh inventions, the following operation is provided.

  By using a pump-integrated heat receiving body instead of the heat receiving body and the circulation pump, the number of components is reduced, and space saving is excellent, and the electronic device can be reduced in size and thickness.

  Since the refrigerant in the pump chamber adjacent to the heat receiving portion is agitated by the impeller, the heat receiving performance can be improved.

  Since there is no pressure loss in the heat receiving part, the circulation pump can be made small and space saving is excellent.

  A ninth invention made to solve the above problems is an electronic device, and has a configuration including the cooling device according to any one of the first to eighth inventions.

  This configuration has the following effects.

  A heat conductive sheet having flexibility is brought into contact with a plurality of electronic components having different heights from the substrate, and a heat receiving body is brought into contact with an electronic component having a large amount of heat generation such as a CPU directly or through the heat conductive sheet. Therefore, the heat of a plurality of electronic components mounted within a predetermined range on the board can be received by a heat receiving body or a heat conductive sheet and dissipated by liquid cooling, and the plurality of electronic components can be efficiently cooled. It is possible to prevent the electronic component mounted on the substrate from being heated more than necessary, and it is excellent in reliability.

  Multiple electronic components can be reliably cooled with a simple structure with a small number of parts, and the electronic equipment can be reduced in size and thickness without taking up space in the housing, and heat can be dissipated by circulating liquid refrigerant into the housing. The amount of outside air introduced can be reduced, the number of rotations of the cooling fan can be reduced, or the number of mounted cooling fans can be reduced.

  Here, the cooling device of the first to eighth inventions can be mounted on various electronic devices having electronic components mounted on a substrate, such as an OA device such as a personal computer, a server device, and a copying machine.

(Embodiment 1)
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a main part showing a cooling device according to Embodiment 1 of the present invention, and FIG. 2 (a) is a cross-sectional view of a main part showing through holes formed in a presser plate, a cushioning material and a heat conductive sheet. FIG. 2B is a cross-sectional view of the main part showing the heat dissipating fins erected on the upper surface of the presser plate.

  As shown in FIG. 1, the cooling device 1 according to the first embodiment of the present invention is mounted on a substrate A in a housing of an electronic device (not shown) such as an OA device such as a personal computer, a server device, or a copy machine. Cooled electronic components X1 such as a semiconductor element such as a CPU having a relatively large calorific value and electronic components X2 to X5 having a relatively small calorific value such as a video processor and a liquid crystal driver IC mounted in the vicinity of the electronic component X1 To do. The heat receiving mechanism R1 of the cooling device 1 includes a heat receiving body 2 formed in a block shape or a plate shape with a metal such as aluminum, an aluminum alloy, copper, or a copper alloy, and a heat conductive sheet 3 having flexibility. The heat generated in the parts X1 to X5 is received by the heat conductive sheet 3 and the heat receiving body 2. The heat conductive sheet 3 is covered with the electronic components X1 to X5, the end 3a of the heat conductive sheet 3 is wound around the predetermined portion 6a 'of the refrigerant pipe 6a, and is adhered to the outer surface of the predetermined portion 6a' with an adhesive. Has been. Further, the heat receiving body 2 is disposed in contact with the upper surface of the heat conductive sheet 3 on the upper part of the electronic component X1, and the buffer material 4 is in contact with the upper surface of the heat conductive sheet 3 on the upper part of the electronic components X2 to X5. The presser plate 5 is disposed above the cushioning material 4.

  A refrigerant flow path 2a for allowing the refrigerant to pass therethrough is formed inside the heat receiving body 2 in a meandering manner, and a circulation pump 7 for circulating the refrigerant through the refrigerant pipe 6a at the flow path inlet 2b of the refrigerant flow path 2a. And a radiator 8 such as a radiator for radiating the heat received by the heat receiver 2 through the refrigerant pipe 6b is connected to the flow path outlet 2c. A refrigerant tank 6a between the circulation pump 7 and the radiator 8 is provided with a reserve tank 9 for supplementing the decreasing refrigerant. Further, a cooling fan (not shown) is provided in the vicinity of the radiator 8 for blowing air to the radiator 8 to promote cooling. The refrigerant pipes 6a and 6b are made of butyl rubber which is difficult for water molecules to pass through.

  The refrigerant flow path 2a of the heat receiving body 2 may be formed by disposing a rib-like partition wall between a pair of flat plates or block bodies arranged parallel to each other at intervals, or two flat plate shapes. A member that is grooved by pressing or the like may be joined to at least one of the members. In addition, the refrigerant flow path 2a is formed by meandering, and by increasing the distance, the contact area between the heat receiving body 2 and the refrigerant flow path 2a can be increased, and the amount of heat transfer can be increased. The heat capacity that can receive heat is increased and the cooling effect is enhanced.

  As the heat conductive sheet 3, a graphite sheet or the like is used. When a graphite sheet is used, the heat conductivity in the direction along the sheet surface (plane direction) is high, so the heat conduction speed can be increased and the cooling efficiency can be increased.

  The buffer material 4 is formed of a polymer compound such as a gel or a sponge, and has flexibility and shape variability. Thereby, the buffer material 4 is deformed according to the shape of the electronic components X2 to X5 by pressing the buffer material 4 toward the electronic components X2 to X5, and the heat conductive sheet 3 is changed to the height of the electronic components X2 to X5 having different heights. It can be adhered to the upper surface. The presser plate 5 is formed of a metal plate such as aluminum or copper, a synthetic resin plate, or the like. Note that an opening 10 for arranging the heat receiving body 2 is formed in a predetermined portion of the cushioning material 4 and the presser plate 5.

  As shown in FIG. 2A, an electronic component X <b> 1 is formed below the heat conductive sheet 3 by forming a through hole 11 that penetrates the heat conductive sheet 3, the buffer material 4, and the presser plate 5. And the space part D such as between the electronic components X2 and X3 and the space above the pressing plate 5 (the space inside the housing of the electronic device) can be communicated with each other. Thereby, the dew condensation in the space part D by the heat_generation | fever of the electronic components X1-X5 can be prevented.

  Further, as shown in FIG. 2B, a plurality of radiating fins 12 may be erected on the upper surface of the holding plate 5. Thereby, the heat transmitted from the electronic components X1 to X5 to the presser plate 5 via the heat conductive sheet 3 and the buffer material 4 can be efficiently radiated.

  In FIG. 1, fixing means S <b> 1 for fixing the heat receiving body 2 to the substrate A projects a flange portion 13 having a bolt insertion hole 13 a at a predetermined portion, for example, a corner portion of the side surface of the heat receiving body 2. The bolt 14a is continuously inserted into the bolt insertion holes 13a and B of the substrate A, and the nut 14c is mounted with an elastic body 14b such as a coil spring or a leaf spring between the head of the bolt 14a and the upper surface of the flange portion 13. It is configured by tightening and fixing with. Thereby, while fixing the heat receiving body 2 firmly to the board | substrate A, the adhesiveness of the heat conductive sheet 3 and the electronic component X1 and the adhesiveness of the heat receiving body 2 and the heat conductive sheet 3 are improved by the elastic body 14b, Heat transfer can be increased.

  As the fixing means S2 for fixing the presser plate 5 to the substrate A, the same means as the fixing means S1 for the heat receiving body 2 can be used. The fixing means S2 is formed with a bolt insertion hole 15a in the vicinity of the end portion of the presser plate 5. The bolt 16a is inserted into the presser plate 5 and the bolt insertion holes 15a and C of the substrate A, and an elastic body 16b is attached to the bolt 16a. In the mounted state, the nut 16c is fastened and fixed. As a result, the presser plate 5 can be firmly fixed to the substrate A, and the adhesiveness between the heat conductive sheet 3 and the electronic components X2 to X5 can be improved by the elastic body 16b, thereby improving heat transferability.

  In the present embodiment, a cooling fan is used in combination with the radiator 8. However, when a sufficient cooling capacity can be obtained with only the radiator 8, a fanless fan may be used. Note that the size and the number of rotations of the cooling fan can be appropriately selected according to the cooling capacity of the radiator 8. In addition, when the number of rotations of the cooling fan is changed according to the temperature of the electronic components X1 to X5, or when the rotation and stop are switched, efficient cooling can be performed, and the energy saving performance is excellent. Noise generated by rotation can be suppressed to the minimum, and low noise is excellent.

  Further, the circulation pump 7 can be installed in the reserve tank 9, or the surface of the reserve tank 9 can be formed in a fin shape so as to function as the radiator 8. Furthermore, by providing an air layer in the reserve tank 9, changes in the volume of the refrigerant can be absorbed, and damage in cold regions and winter seasons can be prevented. In the present embodiment, freezing of the refrigerant is prevented by using an antifreeze liquid as the refrigerant.

  By using butyl rubber, which is difficult for water molecules to pass through, to the refrigerant pipes 6a and 6b connecting the respective parts of the cooling device 1, the moisture content and viscosity increase of the refrigerant are effectively prevented. The refrigerant pipes 6a and 6b may be made of synthetic resin or metal other than rubber. The synthetic resin and rubber refrigerant pipes 6a and 6b are flexible and can be easily deformed. They are lightweight, excellent in handling and installation, and are preferable.

  The operation of the cooling device 1 according to Embodiment 1 of the present invention configured as described above will be described.

  The heat generated in the electronic components X1 to X5 is received by the heat receiving surface of the heat conductive sheet 3 (the surface in contact with the electronic components X1 to X5), and the predetermined portion of the refrigerant pipe 6a from the end 3a of the heat conductive sheet 3 is received. It is transmitted to the refrigerant in 6a '. Moreover, the heat of the electronic components X1 to X5 is transmitted from the heat conductive sheet 3 to the refrigerant in the refrigerant flow path 2a through the heat receiving body 2. By driving the circulation pump 7, the refrigerant moves to the heat radiating body 8, and heat is radiated. By appropriately selecting whether or not the cooling fan is rotating and the number of rotations, the amount of heat released from the radiator 8 is controlled, and the temperature of the electronic components X1 to X5 is adjusted. The refrigerant cooled by the radiator 8 passes through the reserve tank 9 and is sent again to the heat receiver 2 by the circulation pump 7.

  As described above, the cooling device 1 according to the first embodiment and the electronic apparatus including the same have the following operations.

  Since the end portion 3a of the heat conductive sheet 3 is wound around the outer surface of the predetermined portion 6a ′ of the refrigerant pipe 6a, the predetermined portion of the heat conductive sheet 3 is sandwiched between the heat receiving body 2 and the electronic component X1. The heat received by the heat conductive sheet 3 can be directly transmitted to the refrigerant passing through the refrigerant pipe 6a, and can be transmitted to the refrigerant passing through the refrigerant flow path 2a via the heat receiving body 2, thereby transferring a plurality of heats. Since it has a path, heat transferability can be improved.

  Since the heat receiving body 2 is disposed on the upper part of the electronic component X1 such as a CPU having a large heat generation amount via the heat conductive sheet 3, the heat transfer distance is shortened (only the thickness of the heat conductive sheet 3). Since the heat of the electronic component X1 can be received sufficiently and the heat of the other electronic components X2 to X5 having a relatively small heat generation amount can be received by the heat conductive sheet 3, a plurality of electronic components X1 to X5 having different heat generation amounts can be obtained. It can cool efficiently according to each calorific value.

  Since the heat conductive sheet 3 is provided, the heat conductive sheet 3 can be securely adhered to the upper surfaces of the electronic components X1 to X5 having different heights from the substrate A even when the height difference is large. All of the electronic components X1 to X5 within the predetermined range can be reliably radiated by the one heat conductive sheet 3.

  Since the heat conductive sheet 3 is covered with the electronic components X1 to X5 and is pressed and fixed so as to be in close contact with the respective electronic components X1 to X5 by the buffer material 4 and the presser plate 5, the heat of the electronic components X1 to X5 Can be reliably received by the heat conductive sheet 3.

  Since the radiator 8 is connected to the heat receiver 2, the heat received by the heat receiver 2 can be efficiently radiated by the radiator 8.

  Since it has the circulation pump 7 which circulates a refrigerant | coolant between the heat receiving body 2 and the heat radiating body 8, the heat receiving in the heat receiving body 2 and the heat radiating in the heat radiating body 8 are continuously repeated by circulating the refrigerant with the circulation pump 7. It can be carried out.

  Since cooling of the plurality of electronic components X1 to X5 is performed by heat dissipation by circulation of the liquid refrigerant, the amount of outside air introduced into the housing of the electronic device can be reduced, and the number of rotations of the cooling fan can be reduced or the cooling fan can be mounted. The number can be reduced, noise such as fan drive noise can be reduced, and noise reduction can be achieved.

  By transferring the heat of the plurality of electronic components X1 to X5 to the refrigerant through the heat conductive sheet 3 or the heat receiving body 2, the plurality of electronic components X1 to X5 can be reliably cooled with a simple structure with a small number of components, Electronic devices can be made smaller and thinner without taking up space in the housing.

  Since the heat receiving body 2 is fixed to the substrate A by the fixing means S1 using the bolts 14a and the like, and the heat conductive sheet 3 is fixed to the substrate A by the fixing means S2 using the bolts 16a and the like, the heat receiving body 2 and the heat The conductive sheet 3 can be attached to and detached from the substrate A, and maintenance of the electronic components X1 to X5 can be easily performed.

(Embodiment 2)
FIG. 3 is a cross-sectional view of the main part showing the heat receiving mechanism of the cooling device in Embodiment 2 of the present invention.

  As shown in FIG. 3, the cooling device 1a in the second embodiment is different from the first embodiment in that in the heat receiving mechanism R2, the heat conductive sheet 3 and the electronic components X2 to X5 are used instead of the cushioning material and the holding plate. The adhesive layer 3b made of acrylic resin or the like is formed on the contact surface (heat transfer surface). Thereby, even if it does not attach the buffer material 4 and the presser plate 5, the heat conductive sheet 3 and the electronic components X2-X5 can be made to adhere | attach reliably, and heat transferability can be improved.

  As described above, the cooling device 1a according to the second embodiment and the electronic apparatus including the same have the following operations in addition to the operations of the first embodiment.

  Since the heat conductive sheet 3 is in close contact with the electronic components X2 to X5 via the adhesive layer 3b, the heat of the electronic components X2 to X5 can be reliably transmitted to the heat conductive sheet 3 to efficiently dissipate heat. Can do. In addition, since there is no need to provide a cushioning material, a presser plate, and a fixing means for the presser plate, the number of parts can be reduced, and the electronic device can be made smaller and thinner without taking up space in the housing.

(Embodiment 3)
FIG. 4 (a) is a cross-sectional view showing the main part of the cooling device according to Embodiment 3 of the present invention, and FIG. 4 (b) uses a heat conductive sheet having an adhesive layer in place of the cushioning material and the holding plate. It is principal part sectional drawing which shows the heat receiving mechanism of a cooling device. In FIG. 4, the same components as those described in the first or second embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 4A, the cooling device 1b according to the third embodiment of the present invention includes an electronic component X1 mounted on the substrate A and an electronic component X2 mounted close to or away from the electronic component X1. In order to cool X5, a heat receiving mechanism R3 including the heat receiving body 2 and the heat conductive sheet 3 is provided, and the fixing means S1 described in the first embodiment is provided by bringing the lower surface of the heat receiving body 2 into contact with the upper surface of the electronic component X1 (see FIG. 4 (a) (not shown) and fixed to the substrate A, the thermal conductive sheet 3 is covered with the electronic components X2 to X5, and the cushioning material 4 and the pressing plate 5 are disposed on the upper surface. It fixes to the board | substrate A by the fixing means S2 (not shown in FIG. 4A) demonstrated in the form 1, and the heat conductive sheet 3 and the electronic components X2-X5 are stuck. And the edge part 3a of the heat conductive sheet 3 is wound around the predetermined part 6b 'of the refrigerant | coolant piping 6b, and it adhere | attached on the outer surface with the adhesive agent.

  In addition, as shown in FIG.4 (b), it may replace with the shock absorbing material 4 and the holding plate 5, and may provide the adhesion layer 3b demonstrated in Embodiment 2 on the lower surface of the heat conductive sheet 3. As shown in FIG.

  The operation of cooling device 1b according to Embodiment 3 of the present invention configured as described above will be described.

  The heat generated in the electronic component X1 is transmitted from the heat receiving body 2 to the refrigerant in the refrigerant flow path 2a, and the heat generated in the electronic components X2 to X5 is conducted through the heat conductive sheet 3 in the surface direction to conduct heat. The refrigerant is transferred from the end portion 3a of the conductive sheet 3 to the refrigerant in the predetermined portion 6b 'of the refrigerant pipe 6b, and when the circulation pump 7 is driven, the refrigerant moves to the radiator 8 and heat is radiated. The refrigerant cooled by the radiator 8 passes through the reserve tank 9 and is sent again to the heat receiver 2 by the circulation pump 7.

  As described above, the cooling device 1b according to the third embodiment and the electronic apparatus including the same have the following operations.

  The electronic component X1 having a large calorific value is received by contacting the heat receiving body 2, and the electronic components X2 to X5 having a relatively small calorific value are mounted on the substrate A by receiving the heat by contacting the heat conductive sheet 3. A plurality of electronic components X1 to X5 having different calorific values can be efficiently radiated.

  Since the heat receiving body 2 and the heat conductive sheet 3 are connected by the refrigerant pipe 6b, the electronic component X1 having a large amount of heat generation and the other electronic components X2 to X5 are mounted separately on the same substrate A or different substrates. Even when mounted on A, the length of the refrigerant pipe 6b between the heat receiving body 2 and the predetermined portion 6b 'is formed long, so that the electronic components X1 to X5 can be reliably connected regardless of the arrangement or the like. Can be cooled.

(Embodiment 4)
FIG. 5 is a cross-sectional view of the main part showing the heat receiving mechanism of the cooling device in Embodiment 4 of the present invention. In FIG. 5, the same components as those described in the first to third embodiments are denoted by the same reference numerals and the description thereof is omitted.

  As shown in FIG. 5, the cooling device 1c in the fourth embodiment is different from the third embodiment in that a heat conductive sheet 3 is attached to the lower surface of the substrate A via an adhesive layer 3b in the heat receiving mechanism R4. It is a point. Thereby, the heat of the electronic components X1 to X5 can be received by the heat conductive sheet 3 through the leads of the electronic components X1 to X5 protruding from the substrate A or the lower surface of the substrate A, and the electronic components X1 to X5 and the substrate The temperature rise of A can be suppressed. Moreover, it has the effect | action that it can thermally radiate efficiently by using in combination with the thermal radiation by making the heat conductive sheet 3 and the heat receiving body 2 contact the electronic components X1-X5 demonstrated in Embodiment 3. FIG.

  In addition, as the adhesive layer 3b of the heat conductive sheet 3, an insulating layer is used to prevent a short circuit. As the insulating adhesive layer 3b, a PET tape, a polyimide tape or the like is used. Further, the heat conductive sheet 3 can be brought into close contact with the lower surface of the substrate A by using the buffer material 4, the presser plate 5 and the fixing means S <b> 2 described in the first embodiment instead of the adhesive layer 3 b. In this case, the heat conductive sheet 3 is formed of an insulating material, or an insulating layer made of PET, polyimide, or the like is interposed between the heat conductive sheet 3 and the substrate A.

(Embodiment 5)
FIG. 6 is a main part perspective view showing a cooling device in Embodiment 5 of the present invention, and FIG. 7 is a main part perspective view showing a modification of the cooling device in Embodiment 5 of the present invention. In the fifth embodiment, the circulation pump and the reserve tank are not shown.

  As shown in FIG. 6, the cooling device 1d includes a heat receiving member R and a heat receiving mechanism R5 including a plurality of heat conductive sheets 3, 3 ', 3 ", and ends of the heat conductive sheets 3, 3', 3". The part 3a is wound around and bonded to a predetermined part 6b 'of the refrigerant pipe 6b, and the heat receiving body 2, the heat conductive sheets 3, 3', 3 "and the heat radiator 8 are connected in series by the refrigerant pipes 6a, 6b. Thereby, it can respond to various board | substrates A irrespective of the mounting number, arrangement | positioning, etc. of the electronic component X. In addition, not only the electronic component X mounted in the same board | substrate A but several board | substrate A adjacent. The heat conductive sheets 3, 3 ′, 3 ″ and the heat receiving body 2 may be arranged over the range. Moreover, the number of the heat receiving bodies 2 arranged in one refrigerant circulation system is not limited to one, and a plurality of the heat receiving bodies 2 may be arranged in series.

  Further, as in the cooling device 1e shown in FIG. 7, in the heat receiving mechanism R6, the heat receiving body 2 and the plurality of heat conductive sheets 3, 3 ′, 3 ″ are connected in series as described above, and a predetermined electronic component is used. The heat receiving body 2 can be brought into contact with the upper portion of X via the heat conductive sheet 3, that is, the heat receiving mechanism R1 described in the first embodiment can be combined, and various types can be used regardless of the number and arrangement of the electronic components X. The heat receiving mechanism can be designed freely corresponding to the substrate A.

  In addition, although illustration is abbreviate | omitted in order to make description easy to understand, in this Embodiment 5, the adhesive layer 3b is added to the buffer material 4 and the holding plate 5 which were demonstrated in Embodiment 1, etc. or the heat conductive sheet 3. FIG. You may provide suitably.

(Embodiment 6)
FIG. 8 is a cross-sectional view of a main part showing a pump-integrated heat receiving body of a cooling device according to Embodiment 6 of the present invention.

  As shown in FIG. 8, the pump-integrated heat receiving body 20 includes a block-shaped or plate-shaped heat receiving portion 21 having a meandering refrigerant flow path 21 a therein, and a pump casing portion fixed to the upper portion of the heat receiving portion 21. 22, a pump chamber 23 is formed inside the pump casing portion 22, and a motor 24 is disposed above the pump casing portion 22. An impeller 26 fixed to the motor shaft 25 is disposed in the pump chamber 23. The impeller 26 rotates by driving the motor 24, sucks the refrigerant into the pump chamber 23 from the flow path inlet 21b side, discharges it to the refrigerant flow path 21a side of the heat receiving portion 21, and flows to the flow path outlet 21c side. ing.

  By using the pump-integrated heat receiving body 20 instead of the heat receiving body 2 and the circulation pump 7 described in the first to fifth embodiments, the number of parts is reduced, and space saving is excellent, and installation is easy. Have.

  The present invention relates to a cooling device that cools electronic components such as a plurality of semiconductor elements mounted on a substrate inside a housing of an electronic device such as a personal computer or an OA device, and an electronic device including the same. According to the present invention, a plurality of electronic components having different heights from the substrate or a substrate can be reliably brought into contact with the heat conductive sheet or the heat receiving body, and all electronic components within a predetermined range can be reliably cooled, and a plurality of heat generation amounts can be varied. A cooling device that can sufficiently and efficiently cool the electronic components according to the amount of heat generated, and an electronic component mounted on the substrate can be prevented from being heated more than necessary, and has excellent reliability. An electronic device can be provided.

Sectional drawing which shows the principal part which shows the cooling device in Embodiment 1 of this invention (A) Main part sectional view showing through hole formed in presser plate, cushioning material and heat conductive sheet, (b) Main part cross sectional view showing radiating fin erected on upper surface of presser plate Sectional drawing which shows the principal part which shows the heat receiving mechanism of the cooling device in Embodiment 2 of this invention (A) Main part sectional drawing which shows the cooling device in Embodiment 3 of this invention, (b) The main part which shows the heat-receiving mechanism of the cooling device using the heat conductive sheet which has an adhesion layer instead of a buffer material and a pressing board Sectional view Sectional drawing which shows the principal part which shows the heat receiving mechanism of the cooling device in Embodiment 4 of this invention The principal part perspective view which shows the cooling device in Embodiment 5 of this invention. The principal part perspective view which shows the modification of the cooling device in Embodiment 5 of this invention. Sectional drawing which shows the principal part which shows the pump integrated heat receiving body of the cooling device in Embodiment 6 of this invention.

Explanation of symbols

1, 1a, 1b, 1c, 1d, 1e Cooling device 2 Heat receiving body 2a Refrigerant flow path 2b Flow path inlet 2c Flow path outlet 3, 3 ', 3 "Thermal conductive sheet 3a End part of thermal conductive sheet 3b Adhesive layer 4 Buffer material 5 Holding plate 6a, 6b Refrigerant piping 7 Circulating pump 8 Radiator 9 Reserve tank 10 Opening part 11 Through hole 12 Radiation fin 13 Flange part 13a, 15a Bolt insertion hole 14a, 16a Bolt 14b, 16b Elastic body 14c, 16c Nut 20 Pump-integrated heat receiving member 21 Heat receiving portion 21a Refrigerant flow path 21b Flow path inlet 21c Flow path outlet 22 Pump casing portion 23 Pump chamber 24 Motor 25 Motor shaft 26 Impeller A Substrate B, C Bolt insertion holes R1 to R6 Heat receiving mechanism S1, S2 fixing means X, X1-X5 electronic parts

Claims (9)

A heat receiving body that has a refrigerant flow path inside and receives heat from an electronic component, a refrigerant pipe connected to the refrigerant flow path of the heat receiving body, and heat dissipation that radiates heat of the refrigerant connected to the refrigerant pipe to the outside A cooling pump that cools the electronic component mounted on a substrate, and a circulation pump that circulates the refrigerant between the heat receiving body and the heat radiating body via the refrigerant pipe,
A cooling device comprising a heat conductive sheet covering one or more of the electronic components, wherein the heat conductive sheet is connected to an outer surface of a predetermined portion of the refrigerant pipe so as to be able to transfer heat. . A heat receiving body that has a refrigerant flow path inside and receives heat from an electronic component, a refrigerant pipe connected to the refrigerant flow path of the heat receiving body, and heat dissipation that radiates heat of the refrigerant connected to the refrigerant pipe to the outside A cooling pump that cools the electronic component mounted on a substrate, and a circulation pump that circulates the refrigerant between the heat receiving body and the heat radiating body via the refrigerant pipe,
A cooling device comprising: a heat conductive sheet covering the substrate, wherein the heat conductive sheet is connected to an outer surface of a predetermined portion of the refrigerant pipe so as to be able to transfer heat. The cooling device according to claim 1 or 2, wherein an end portion of the heat conductive sheet is wound around and connected to an outer surface of a predetermined portion of the refrigerant pipe. The cooling device according to any one of claims 1 to 3, wherein the thermally conductive sheet is interposed between the heat receiving body and the electronic component. The cooling according to any one of claims 1 to 4, further comprising a plurality of the heat conductive sheets, wherein the plurality of heat conductive sheets are connected in series via the refrigerant pipe. apparatus. A cushioning material having flexibility disposed on a surface opposite to the heat receiving surface of the thermal conductive sheet, and a press plate for pressing and fixing the cushioning material to the thermal conductive sheet. The cooling device according to any one of claims 1 to 5. The cooling device according to claim 6, wherein the cushioning material and the presser plate have through holes communicating with each other. The cooling device according to any one of claims 1 to 7, wherein the heat receiving body is a pump-integrated heat receiving body in which the circulation pump is integrally formed. An electronic apparatus comprising the cooling device according to any one of claims 1 to 8.

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