CN107968081A - A kind of combined radiator for being easy to heat dissipation - Google Patents

Abstract

The invention discloses a combined heat sink which is easy to dissipate heat. It comprises a base plate and a heat sink. The bottom of the base plate is covered with a layer of copper foil. A plurality of heat sinks are arranged at intervals on the top of the base plate. The heat sink is a tower with a thin top and a thick bottom. Shaped structure, the left and right ends of the heat sink are respectively provided with strip-shaped protrusions, the strip-shaped protrusions extend along the length direction of the heat sink, and the strip-shaped protrusions are evenly arranged on the heat sink. The bottom of the substrate of the present invention is coated with copper foil made of oxygen-free copper. Since oxygen-free copper has excellent thermal conductivity, placing the copper foil between the heating device and the radiator speeds up the heat conduction speed between the heating device and the radiator. , to achieve the purpose of rapid cooling. There are strip-shaped protrusions evenly distributed on the left and right ends of the heat sink. The strip-shaped protrusions increase the heat dissipation area of the heat sink. On a radiator with the same volume, the contact area between the heat sink and the outside world increases, which improves the heat dissipation. The heat dissipation efficiency of the device can achieve rapid heat dissipation even without using a fan to cool down.

Description

A combined heat sink that is easy to dissipate heat

technical field

The invention relates to the technical field of equipment heat dissipation, in particular to a combined heat sink that is easy to dissipate heat.

Background technique

Integrated circuits are heavily used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. The function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. Most heat sinks absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air in the chassis, and then the chassis transfers the hot air to the outside of the chassis to complete the cooling of the computer. There are many types of radiators. CPUs, graphics cards, motherboard chipsets, hard disks, chassis, power supplies, and even optical drives and memory will all need radiators. These different radiators cannot be mixed, and the most common contact is the radiator of the CPU. . According to the way heat is taken away from the radiator, the radiator can be divided into active cooling and passive cooling. The former is common for air-cooled radiators, while the latter is common for heat sinks.

The heat sink is a device for cooling the heat-prone electronic components in electrical appliances. It is mostly made of aluminum alloy, brass or bronze into plates, sheets, and multi-sheets. For example, the CPU central processing unit in a computer needs to use a large Heat sinks, power tubes in TVs, line tubes, and power amplifier tubes in power amplifiers all use heat sinks. Generally, the heat sink should be coated with a layer of heat-conducting silicone grease on the contact surface between the electronic components and the heat sink during use, so that the heat emitted by the components can be more effectively transferred to the heat sink, and then dissipated into the surrounding air through the heat sink. As far as the heat sink material is concerned, each material has different thermal conductivity, and the thermal conductivity is arranged from high to low, namely silver, copper, aluminum, and steel. However, it would be too expensive to use silver as a heat sink, so the best solution is to use copper.

Compared with copper heat sinks, aluminum alloy heat sinks are more economical. Therefore, when using aluminum alloy to make heat sinks with the same heat dissipation effect, many manufacturers reduce the temperature by increasing the volume of heat sinks, or Using an external fan to cool down, no matter which method is used, will inevitably increase the size of the heat sink and the cost of use.

Contents of the invention

The purpose of the present invention is to solve the deficiencies of the prior art, and the purpose is to provide a combined heat sink that is easy to dissipate heat.

The present invention realizes through following technical scheme:

A combined heat sink that is easy to dissipate heat, including a base plate and a heat sink. The bottom of the base plate is covered with a layer of copper foil, and a plurality of heat sinks are arranged at intervals on the top of the base plate. The heat sink is a tower-shaped structure with a thin top and a thick bottom. , the left and right ends of the heat sink are respectively provided with strip-shaped protrusions, the strip-shaped protrusions extend along the length direction of the heat sink, and the strip-shaped protrusions are evenly arranged on the heat sink.

In the preferred solution, the left and right ends of the substrate are respectively provided with radiator installation parts, and the upper and lower ends of the radiator installation part are respectively provided with T-shaped grooves. The device mounting part is connected vertically.

In a preferred solution, short heat sinks are also provided in the heat dissipation channels of the adjacent heat sinks, the short heat sinks are vertically connected to the substrate, and the height of the short heat sinks is smaller than that of the heat sink.

In a preferred solution, the base plate, heat sink, heat sink installation part, and short heat sink are integrally extruded from aluminum alloy profiles.

Preferably, the copper foil is made of oxygen-free copper.

In a preferred solution, the heat sink is vertically connected to the substrate, and the included angle between the strip-shaped protrusion and the heat sink is 45°.

In a preferred solution, the heat sinks and the short heat sinks are evenly arranged at equal intervals on the substrate.

Compared with the prior art, the present invention has the following advantages and beneficial effects: the bottom of the substrate of the copper-aluminum composite self-cooling radiator of the present invention is coated with copper foil made of oxygen-free copper, because oxygen-free copper has excellent heat conduction Performance, the copper foil is placed between the heating equipment and the radiator, which speeds up the heat conduction speed between the heating equipment and the radiator, and achieves the purpose of rapid cooling. The heat sink is a tower-shaped structure with a thin top and a thick bottom. The heat sink is integrally formed with the base plate. The heat sink adopts a tower-shaped structure with a thin top and a thick bottom because the contact area between the lower part of the heat sink and the base plate is large, which can accelerate the heat on the base plate. Conduction, the heat sink quickly transfers the heat on the substrate to the heat sink, which improves the heat dissipation efficiency. The left and right ends of the heat sink are evenly distributed with strip-shaped protrusions. The strip-shaped protrusions increase the heat dissipation area of the heat sink. On a radiator with the same volume, the contact area between the heat sink and the outside world increases, which improves the heat dissipation. The heat dissipation efficiency of the device can achieve rapid heat dissipation even without using a fan to cool down.

Description of drawings

The drawings described here are used to provide a further understanding of the embodiments of the present invention, constitute a part of the application, and do not limit the embodiments of the present invention. In the attached picture:

Fig. 1 is a structural schematic diagram of the combined heat sink which is easy to dissipate heat according to the present invention.

Marks and corresponding parts names in the attached drawings:

1-base plate, 2-T-shaped groove, 3-heat sink, 4-short heat sink, 5-horizontal heat sink.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the examples and accompanying drawings. As a limitation of the present invention.

Example

As shown in Fig. 1, a kind of combined radiator of the present invention that is easy to dissipate heat includes a substrate 1 and a heat sink 3, and the bottom of the substrate 1 is coated with a layer of copper foil, and the copper foil is preferably made of oxygen-free copper, because oxygen-free copper has Excellent thermal conductivity, the copper foil is placed between the heating equipment and the radiator, which speeds up the heat conduction speed between the heating equipment and the radiator, and achieves the purpose of rapid cooling. The top of the substrate 1 is arranged with a plurality of cooling fins 3 at intervals. The cooling fins 3 have a tower-shaped structure with a thin top and a thick bottom. The large area can speed up the heat conduction on the substrate 1, and the heat sink 3 quickly transfers the heat on the substrate 1 to the heat sink 3, thereby improving the heat dissipation efficiency. The left and right ends of the heat sink 3 are respectively provided with strip-shaped protrusions, the strip-shaped protrusions extend along the length direction of the heat sink 3 , and the strip-shaped protrusions are evenly arranged on the heat sink 3 . The strip-shaped protrusions increase the heat dissipation area of the heat sink 3, and on a heat sink with the same volume, the contact area between the heat sink 3 and the outside increases, which improves the heat dissipation efficiency of the heat sink.

In a preferred embodiment, the left and right ends of the base plate 1 are respectively provided with a radiator mounting portion, the upper and lower ends of the radiator mounting portion are respectively provided with a T-shaped groove 2, and the radiator mounting portion is also provided with a horizontal cooling fin 5 for horizontal heat dissipation. The sheet 5 is vertically connected with the radiator mounting part. The thickness of the radiator installation part is greater than that of the heat sink 3, and the radiator installation part can prevent the heat sink 3 from being bumped or squeezed, so as to protect the heat sink. At the same time, a T-shaped groove 2 is also set on the radiator installation part , The heat sink can be connected with other components through snap-fitting, which improves the convenience of installing and dismounting the heat sink.

In a preferred embodiment, a short heat sink 4 is also provided in the heat dissipation channel adjacent to the heat sink 3 , the short heat sink 4 is vertically connected to the substrate 1 , and the height of the short heat sink 4 is smaller than the height of the heat sink 3 . The short heat sink 4 increases the heat exchange area of the radiator while not affecting the heat dissipation of the heat sink 3, and improves the heat dissipation performance of the radiator.

In a preferred embodiment, the base plate 1, the heat sink 3, the heat sink mounting part, and the short heat sink 5 are integrally extruded from an aluminum alloy profile. During processing, molds can be used for one-time extrusion molding, which speeds up production efficiency and reduces production costs, and is suitable for large-scale and large-scale production.

In a preferred embodiment, the heat sink 3 is vertically connected to the substrate 1, and the angle between the strip-shaped protrusion and the heat sink 3 is 45°. The strip-shaped protrusion forms an angle of 45° upward on the heat sink 3. When the heat sink 3 transmits the high-temperature air flow outward, the strip-shaped protrusion cuts upwards along the direction of the high-temperature air flow, forming an angle that is conducive to the high-temperature air flow. The flow guide channel improves the heat dissipation performance of the radiator.

In a preferred embodiment, the cooling fins 3 and the short cooling fins 4 are uniformly arranged on the substrate 1 at equal intervals. The appearance of the radiator is more beautiful and practical.

The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the scope of the present invention. Protection scope, within the spirit and principles of the present invention, any modification, equivalent replacement, improvement, etc., shall be included in the protection scope of the present invention.

Claims (7)

1. a kind of combined radiator for being easy to heat dissipation, including substrate and heat sink, it is characterised in that the base plate bottom cladding One layer of copper foil, multiple heat sinks have been spaced on the top of substrate, and heat sink is the pyramidal structure of upper-thin-lower-thick, heat sink Left and right ends are respectively equipped with strip bulge portion, and strip bulge portion extends along the length direction of heat sink, and strip bulge portion is radiating On piece uniformly arranges.

A kind of 2. combined radiator for being easy to heat dissipation according to claim 1, it is characterised in that described substrate or so two End is respectively equipped with radiator mounting portion, and the upper and lower ends of radiator mounting portion are respectively equipped with T-shaped groove, are gone back on radiator mounting portion Equipped with horizontal heat sink, horizontal heat sink and radiator mounting portion vertical connection.

A kind of 3. combined radiator for being easy to heat dissipation according to claim 1, it is characterised in that the abutting fins Heat dissipation channel in be additionally provided with short heat sink, short heat sink and substrate vertical connection, the height of short heat sink are less than heat sink Highly.

4. a kind of combined radiator for being easy to heat dissipation according to any one of claims 1 to 3, it is characterised in that described Substrate, heat sink, radiator mounting portion, short heat sink are aluminium alloy extrusions one extrusion forming.

5. a kind of combined radiator for being easy to heat dissipation according to claim 1, it is characterised in that the copper foil is anaerobic Copper material.

A kind of 6. combined radiator for being easy to heat dissipation according to claim 1, it is characterised in that the heat sink With substrate vertical connection, strip bulge portion and heat sink angle are 45 °.

A kind of 7. combined radiator for being easy to heat dissipation according to claim 1 or 3, it is characterised in that the heat sink The equidistantly uniformly distributed arrangement on substrate with short heat sink.