CN107968081A - A kind of combined radiator for being easy to heat dissipation - Google Patents
A kind of combined radiator for being easy to heat dissipation Download PDFInfo
- Publication number
- CN107968081A CN107968081A CN201711235933.9A CN201711235933A CN107968081A CN 107968081 A CN107968081 A CN 107968081A CN 201711235933 A CN201711235933 A CN 201711235933A CN 107968081 A CN107968081 A CN 107968081A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- heat
- radiator
- heat dissipation
- easy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of combined radiator for being easy to heat dissipation, including substrate and heat sink, base plate bottom coats one layer of copper foil, multiple heat sinks have been spaced on the top of substrate, heat sink is the pyramidal structure of upper-thin-lower-thick, the left and right ends of heat sink are respectively equipped with strip bulge portion, and strip bulge portion extends along the length direction of heat sink, and strip bulge portion uniformly arranges on a heat sink.Base plate bottom of the present invention has coated the copper foil of oxygen-free copper material, since oxygen-free copper has excellent heat-conductive characteristic, copper foil is placed between heat-producing device and radiator, the heat conduction velocity between heat-producing device and radiator is accelerated, achievees the purpose that fast cooling.Strip bulge portion is evenly equipped with the left and right ends of heat sink, strip bulge portion adds the heat dissipation area of heat sink, on the radiator of same volume, heat sink increases with extraneous contact area, the radiating efficiency of radiator is improved, the effect of quick heat radiating can be also reached when without using fan for cooling.
Description
Technical field
The present invention relates to equipment cooling technical field, and in particular to a kind of combined radiator for being easy to heat dissipation.
Background technology
Largely integrated circuit is used in machine element.It is well known that high temperature is the formidable enemy of integrated circuit.High temperature not only can
Cause system operation unstable, service life shortens, it could even be possible to burning some components.The heat of high temperature is caused to be not from
Outside computer, but computer-internal, or perhaps IC interior.The effect of radiator be exactly by these heat absorptions,
Then diffuse in cabinet or outside cabinet, ensure that the temperature of machine element is normal.Most radiators by and heat generating components
Surface contacts, and absorbs heat, then transfers heat to by various methods, then cabinet
These hot-airs are passed to outside cabinet, complete the heat dissipation of computer.The species of radiator is very more, CPU, video card, mainboard chip
Group, hard disk, cabinet, power supply even CD-ROM drive and memory can all need radiator, these different radiators cannot be used with, and
What is wherein most often contacted is exactly the radiator of CPU.According to the mode that heat is taken away from radiator, radiator can be divided into actively
Heat dissipation and passive heat dissipation.The former commonly air-cooled radiator, and the latter it is common be exactly heat sink.
Heat sink is a kind of device of the easy heat-generating electronic elements heat dissipation in electric appliance, more by aluminium alloy, brass or bronze
Tabular, sheet, splintery etc. are made, as cpu central processing unit will use sizable heat sink in computer, power supply in television set
Pipe, row are managed, and the power tube in amplifirer will use heat sink.General heat sink in use will be in electronic component and heat sink
Contact surface applies last layer heat-conducting silicone grease, the heat that component is sent more effectively is transmitted on heat sink, then dissipated through heat sink
It is dealt into surrounding air.For heat sink material, its heat conductivility of every kind of material be it is different, by heat conductivility from height to
Low arrangement, is silver, copper, aluminium, steel respectively.But if with silver come make heat sink can be too expensive, therefore best scheme be using copper
Matter.
Compared to more copper heat sink, the heat sink of aluminum alloy material is more economical, therefore in the aluminum alloy material system of use
When making radiator in the case of identical heat dissipation effect, many manufacturers are cooled down by increasing the volume of heat sink, or are adopted
Cooled down with additional fans, no matter which kind of mode all to undesirably increase the volume and use cost of heat sink using.
The content of the invention
To be solved by this invention is the deficiencies in the prior art, and it is an object of the present invention to provide a kind of combined heat dissipation for being easy to heat dissipation
Device.
The present invention is achieved through the following technical solutions：
A kind of combined radiator for being easy to heat dissipation, including substrate and heat sink, the base plate bottom coat one layer of copper foil,
Multiple heat sinks it have been spaced on the top of substrate, heat sink is the pyramidal structure of upper-thin-lower-thick, the left and right ends of heat sink
Strip bulge portion is respectively equipped with, strip bulge portion extends along the length direction of heat sink, and strip bulge portion is uniformly distributed on a heat sink
Arrangement.
Preferred solution, the substrate left and right ends are respectively equipped with radiator mounting portion, the upper and lower ends of radiator mounting portion
T-shaped groove is respectively equipped with, horizontal heat sink is additionally provided with radiator mounting portion, horizontal heat sink is vertical with radiator mounting portion to be connected
Connect.
Preferred solution, is additionally provided with short heat sink in the heat dissipation channel of the abutting fins, short heat sink is vertical with substrate
Connection, the height of short heat sink are less than the height of heat sink.
Preferred solution, the substrate, heat sink, radiator mounting portion, short heat sink are integrally squeezed into for aluminium alloy extrusions
Type.
Preferred solution, the copper foil are oxygen-free copper material.
Preferred solution, the heat sink and substrate vertical connection, strip bulge portion and heat sink angle are 45 °.
The equidistantly uniformly distributed arrangement on substrate of preferred solution, the heat sink and short heat sink.
Compared with prior art, the present invention have the following advantages and advantages：The copper-aluminum composite of the present invention is self cooling
The base plate bottom of radiator has coated the copper foil of oxygen-free copper material, since oxygen-free copper has excellent heat-conductive characteristic, copper foil
It is placed between heat-producing device and radiator, accelerates the heat conduction velocity between heat-producing device and radiator, reach fast cooling
Purpose.Heat sink is the pyramidal structure of upper-thin-lower-thick, and heat sink is integrally formed with substrate, and heat sink is using upper-thin-lower-thick
Pyramidal structure is because the lower part of heat sink and the contact area of substrate are big, can accelerate the heat conduction on substrate, heat sink
Heat on substrate is rapidly transmitted on heat sink, improves radiating efficiency.Bar shaped is evenly equipped with the left and right ends of heat sink
Lug boss, strip bulge portion add the heat dissipation area of heat sink, and on the radiator of same volume, heat sink connects with extraneous
Contacting surface product increase, improves the radiating efficiency of radiator, and the effect of quick heat radiating can be also reached when without using fan for cooling
Fruit.
Brief description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is the combined radiator structure diagram for being easy to heat dissipation of the present invention.
Mark and corresponding parts title in attached drawing：
1- substrates, 2-T connected in stars, 3- heat sinks, the short heat sinks of 4-, the horizontal heat sinks of 5-.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment
As shown in Figure 1, a kind of combined radiator for being easy to heat dissipation of the present invention, including substrate 1 and heat sink 3,1 bottom of substrate
Portion coats one layer of copper foil, and copper foil is preferably oxygen-free copper material, and since oxygen-free copper has excellent heat-conductive characteristic, copper foil is placed in
Between heat-producing device and radiator, the heat conduction velocity between heat-producing device and radiator is accelerated, reaches the mesh of fast cooling
's.Multiple heat sinks 3 are spaced on the top of substrate 1, heat sink 3 is the pyramidal structure of upper-thin-lower-thick, and heat sink 3 is upper
Because the lower part of heat sink 3 and the contact area of substrate 1 are big, the heat that can accelerate on substrate 1 passes thin lower thick pyramidal structure
Lead, heat sink 3 is rapidly transmitted to the heat on substrate 1 on heat sink 3, improves radiating efficiency.The left and right ends of heat sink 3
Strip bulge portion is respectively equipped with, strip bulge portion extends along the length direction of heat sink 3, and strip bulge portion is equal on heat sink 3
Cloth arranges.Strip bulge portion adds the heat dissipation area of heat sink 3, on the radiator of same volume, heat sink 3 and the external world
Contact area increases, and improves the radiating efficiency of radiator.
Preferred embodiment, the left and right ends of substrate 1 are respectively equipped with radiator mounting portion, and up and down the two of radiator mounting portion
End is respectively equipped with T-shaped groove 2, and horizontal heat sink 5, horizontal heat sink 5 and radiator mounting portion are additionally provided with radiator mounting portion
Vertical connection.The thickness of radiator mounting portion is more than the thickness of heat sink 3, and radiator mounting portion can prevent that heat sink 3 from being knocked
Touch or extrude, play the purpose of protection heat sink, while T-shaped groove 2 is also provided with radiator mounting portion, radiator can lead to
The mode for crossing clamping is connected with other parts, improves the convenience of the installation and removal of radiator.
Preferred embodiment, short heat sink 4, short heat sink 4 and substrate 1 are additionally provided with the heat dissipation channel of abutting fins 3
Vertical connection, the height of short heat sink 4 are less than the height of heat sink 3.Short heat sink 4 is not while the heat dissipation of heat sink 3 is influenced
The heat exchange area of radiator is increased, improves the heat dissipation performance of radiator.
Preferred embodiment, substrate 1, heat sink 3, radiator mounting portion, short heat sink 5 integrally extrude for aluminium alloy extrusions
Shaping.In processing, the disposable extrusion forming of mould can be used, accelerates production efficiency, lowers production cost, is adapted to large quantities of
Amount, large-scale production.
Preferred embodiment, heat sink 3 and 1 vertical connection of substrate, strip bulge portion and 3 angle of heat sink are 45 °.Bar shaped
Lug boss is upwardly formed 45 ° of angles on heat sink 3, and when heat sink 3 outwards transmits high temperature gas flow, strip bulge portion is along height
The direction of warm air flowing is cut upwards tiltedly, forms a flow-guiding channel for being beneficial to high temperature gas flow circulation, improves radiator
Heat dissipation performance.
The equidistantly uniformly distributed arrangement on substrate 1 of preferred embodiment, heat sink 3 and short heat sink 4.Radiator appearance is more
It is both artistic and practical.
Above-described embodiment, has carried out the purpose of the present invention, technical solution and beneficial effect further
Describe in detail, it should be understood that the foregoing is merely the embodiment of the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done, should all include
Within protection scope of the present invention.
Claims (7)
1. a kind of combined radiator for being easy to heat dissipation, including substrate and heat sink, it is characterised in that the base plate bottom cladding
One layer of copper foil, multiple heat sinks have been spaced on the top of substrate, and heat sink is the pyramidal structure of upper-thin-lower-thick, heat sink
Left and right ends are respectively equipped with strip bulge portion, and strip bulge portion extends along the length direction of heat sink, and strip bulge portion is radiating
On piece uniformly arranges.
A kind of 2. combined radiator for being easy to heat dissipation according to claim 1, it is characterised in that described substrate or so two
End is respectively equipped with radiator mounting portion, and the upper and lower ends of radiator mounting portion are respectively equipped with T-shaped groove, are gone back on radiator mounting portion
Equipped with horizontal heat sink, horizontal heat sink and radiator mounting portion vertical connection.
A kind of 3. combined radiator for being easy to heat dissipation according to claim 1, it is characterised in that the abutting fins
Heat dissipation channel in be additionally provided with short heat sink, short heat sink and substrate vertical connection, the height of short heat sink are less than heat sink
Highly.
4. a kind of combined radiator for being easy to heat dissipation according to any one of claims 1 to 3, it is characterised in that described
Substrate, heat sink, radiator mounting portion, short heat sink are aluminium alloy extrusions one extrusion forming.
5. a kind of combined radiator for being easy to heat dissipation according to claim 1, it is characterised in that the copper foil is anaerobic
Copper material.
A kind of 6. combined radiator for being easy to heat dissipation according to claim 1, it is characterised in that the heat sink
With substrate vertical connection, strip bulge portion and heat sink angle are 45 °.
A kind of 7. combined radiator for being easy to heat dissipation according to claim 1 or 3, it is characterised in that the heat sink
The equidistantly uniformly distributed arrangement on substrate with short heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711235933.9A CN107968081A (en) | 2017-11-30 | 2017-11-30 | A kind of combined radiator for being easy to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711235933.9A CN107968081A (en) | 2017-11-30 | 2017-11-30 | A kind of combined radiator for being easy to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107968081A true CN107968081A (en) | 2018-04-27 |
Family
ID=61999186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711235933.9A Withdrawn CN107968081A (en) | 2017-11-30 | 2017-11-30 | A kind of combined radiator for being easy to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107968081A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111657580A (en) * | 2020-06-16 | 2020-09-15 | 杨尚尊 | Intelligent constant-temperature clothes |
| CN115334834A (en) * | 2022-07-25 | 2022-11-11 | 阿里巴巴（中国）有限公司 | Radiator, electronic equipment and manufacturing method of radiator |
-
2017
- 2017-11-30 CN CN201711235933.9A patent/CN107968081A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111657580A (en) * | 2020-06-16 | 2020-09-15 | 杨尚尊 | Intelligent constant-temperature clothes |
| CN115334834A (en) * | 2022-07-25 | 2022-11-11 | 阿里巴巴（中国）有限公司 | Radiator, electronic equipment and manufacturing method of radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180427 |
|
| WW01 | Invention patent application withdrawn after publication |