CN210630126U

CN210630126U - Heat dissipation device and electronic equipment

Info

Publication number: CN210630126U
Application number: CN201921234198.4U
Authority: CN
Inventors: 张晓燕; 陈良龙; 田婷
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2019-07-31
Filing date: 2019-07-31
Publication date: 2020-05-26
Anticipated expiration: 2029-07-31

Abstract

The embodiment of the application discloses heat abstractor, the device includes: a heat dissipation body; the heat conducting medium is coated on the surface of the body to be cooled; the heat dissipation body is placed on the first surface of the body to be dissipated through the heat conducting medium; the baffle plate is arranged on the body to be heated in a surrounding mode, the first end of the baffle plate is connected with the heat dissipation body in a sealing mode, and the second end of the baffle plate abuts against the supporting surface of the body to be heated; a space is defined by the baffle, the heat dissipation body and the first surface of the body to be dissipated, and the heat conducting medium is sealed in the space. The embodiment of the application also discloses the electronic equipment.

Description

Heat dissipation device and electronic equipment

Technical Field

The present disclosure relates to heat dissipation technologies, and particularly to a heat dissipation device and an electronic apparatus.

Background

The application of computers has become an integral part of people's daily life, and although the volume of integrated circuits inside the computers is smaller and smaller, the heat generated during operation is higher and higher, especially the heat generated by a Central Processing Unit (CPU) is the highest, so that the temperature around the CPU is increased. The operation in high temperature environment causes the problems of slow speed and even damage of the integrated circuit.

Immersion water cooling is widely used in the field of computers to solve the problem of heat dissipation during computer operation. Because the heat conduction silicone grease used in the existing air-cooled heat dissipation has the problems of corrosion and the like under the action of the cooling liquid, and can cause pollution to the cooling liquid. In the current immersion type water cooling design, an indium sheet is added between a CPU and a heat dissipation plate to improve the heat dissipation efficiency of the CPU, but the heat conductivity of the indium sheet is far lower than that of heat conduction silicone grease, and the cost is greatly improved.

SUMMERY OF THE UTILITY MODEL

An embodiment of the present application provides a heat dissipation device, the device includes:

a heat dissipation body;

the heat conducting medium is coated on the first surface of the body to be cooled; the heat dissipation body is placed on the first surface of the body to be dissipated through the heat conducting medium;

the baffle plate is arranged on the body to be heated in a surrounding mode, the first end of the baffle plate is connected with the heat dissipation body in a sealing mode, and the second end of the baffle plate abuts against the supporting surface of the body to be heated;

a space is defined by the baffle, the heat dissipation body and the first surface of the body to be dissipated, and the heat conducting medium is sealed in the space.

In some embodiments, the apparatus further comprises:

and the sealing medium is filled between the second end of the baffle and the supporting surface, so that the second end of the baffle is hermetically connected with the supporting surface of the to-be-cooled body.

In some embodiments, the heat dissipating body comprises one or more heat sinks connected by a connector through which heat can be transferred between the one or more heat sinks.

In some embodiments, the heat dissipation body further comprises a heat pipe, the heat pipe is disposed between the one or more heat dissipation fins, one end of the heat pipe abuts against the heat conducting medium, and the heat pipe can transfer heat between the one or more heat dissipation fins and the heat conducting medium.

In some embodiments, the thermally conductive medium comprises at least one of: heat-conducting colloid, heat-conducting paste, heat-conducting liquid and heat-conducting particles.

The embodiment of the application also provides electronic equipment, and the electronic equipment comprises any heat dissipation device.

In some embodiments, the heat sink is submerged in the thermally conductive fluid.

In some embodiments, the electronic device further comprises: the heat dissipation device comprises a box body stored with heat conduction fluid, and the heat dissipation device is placed in the box body.

In some embodiments, the electronic device further comprises: the driving device and a heat-conducting fluid circulating pipeline are communicated with the box body;

the driving device is communicated with the heat-conducting fluid circulating pipeline and can drive the heat-conducting fluid to flow in the circulating pipeline.

In some embodiments, the electronic device further comprises: and the radiator is communicated with the heat conduction fluid circulating pipeline, and heat conduction fluid in the heat conduction fluid circulating pipeline can exchange heat with the external environment through the radiator.

In the embodiment of the application, a space is defined by the heat dissipation body, the baffle and the first surface of the heat dissipation body, the heat-conducting medium is sealed in the space, the heat-conducting medium is sealed, the heat-conducting medium can be prevented from contacting with the external environment, and the influence of the heat-conducting medium on the external environment is reduced.

Drawings

The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed herein.

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present application;

fig. 3 is a schematic partial structure diagram of a heat dissipation device according to an embodiment of the present disclosure;

fig. 4 is a schematic partial structure diagram of a heat dissipation device according to an embodiment of the present application;

reference numerals: 110. a heat dissipation body; 120. a heat-dissipating medium; 130. a baffle plate; 300. a body to be cooled; 310. a support surface; 101. a space; 140. a sealing medium; 111. a heat sink; 112. a connecting member; 113. a heat conducting pipe.

Detailed Description

The present application will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connected" should be interpreted broadly, for example, as an electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate, and the specific meaning of the terms may be understood by those skilled in the art according to specific situations.

It should be noted that the terms "first \ second \ third" referred to in the embodiments of the present application are only used for distinguishing similar objects, and do not represent a specific ordering for the objects, and it should be understood that "first \ second \ third" may exchange a specific order or sequence order if allowed. It should be understood that "first \ second \ third" distinct objects may be interchanged under appropriate circumstances such that the embodiments of the application described herein may be implemented in an order other than those illustrated or described herein.

The electronic device according to the embodiment of the present application will be described in detail below with reference to fig. 1 to 4.

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application, and as shown in fig. 1, the heat dissipation device according to the embodiment of the present application includes: a heat dissipation body 110, a heat conductive medium 120, and a baffle 130; wherein the content of the first and second substances,

the heat conducting medium 120 is coated on the first surface of the body to be heated; the heat dissipation body 110 is placed on a first surface of the body 300 to be heat dissipated through the heat conductive medium 120.

In the embodiment of the present application, the object to be cooled may be a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), or other devices or devices that require heat dissipation through a heat sink, which is merely an exemplary illustration and is not a limitation on the scope of the application.

The baffle 130 surrounds the body to be heated, a first end of the baffle 130 is hermetically connected to the heat dissipation body 110, and a second end of the baffle 130 abuts against the supporting surface 310 of the body 300 to be heated.

In the embodiment of the present application, the supporting surface 310 may include a main board or other flat surface for supporting the object 300 to be cooled.

A space 101 is defined by the baffle 130, the heat dissipation body 110 and the first surface of the object 300, and the heat conducting medium 120 is enclosed in the space 101.

In the embodiment of the present application, the specific structure of the baffle 130 is not limited. For example, the material of the baffle 130 may include metal, plastic, glass, and ceramic.

In the embodiment of the present application, the heat conducting medium 120 includes at least one of the following components: heat conducting colloid, heat conducting paste, heat conducting liquid or heat conducting particles.

Specifically, the heat conductive colloid includes heat conductive silica gel, and heat conductive silica gel is a heat conductive compound widely used in the field of electronics at present, has characteristics such as difficult solidification, insulation, and can have super strong heat conduction effect on the surface such as risk such as short circuit of circuit.

The heat-conducting paste comprises heat-conducting silicone grease, wherein the heat-conducting silicone grease is organic grease specially prepared for heat transfer of electronic components and is formed by compounding metal oxide with good heat conductivity and insulativity and organic siloxane.

The heat-conducting liquid comprises heat-conducting oil, fluorinated liquid, organic solute and the like.

The heat conducting particles comprise graphene particles, diamond particles or metal particles and other materials with good heat conducting performance.

Fig. 2 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present application, as shown in fig. 2, in some optional implementations of the embodiment of the present application, the device further includes: a sealing medium 140; wherein the content of the first and second substances,

and the sealing medium 140 is filled between the second end of the baffle 130 and the supporting surface 310 of the object 300 to be heated, so that the second end of the baffle 130 and the supporting surface 310 of the object 300 to be heated are in sealed connection.

Fig. 3 is a partial structural schematic view of a heat dissipation device according to an embodiment of the present invention, as shown in fig. 3, in some embodiments of the present invention, a heat dissipation body 110 includes one or more heat dissipation fins 111, the one or more heat dissipation fins 111 are connected by a connection member 112, and heat can be transferred between the one or more heat dissipation fins 111 through the connection member 112.

One or more heat dissipating fins 111 have a gap therebetween and can accommodate the passage of the heat transfer fluid. The heat dissipation body 110 is formed by more than one heat dissipation fins 111 and the connecting member 112, so that the heat dissipation efficiency of the heat dissipation body 110 can be effectively improved.

Fig. 4 is a partial structural schematic view of a heat dissipation device according to an embodiment of the present invention, as shown in fig. 3, in some embodiments of the present invention, the heat dissipation body 110 further includes a heat pipe 113, the heat pipe 113 is disposed between the at least one heat dissipation fin 111, one end of the heat pipe 113 abuts against the heat conductive medium 120, and the heat pipe 113 can perform heat transfer between the at least one heat dissipation fin 111 and the heat conductive medium 120. The heat pipe 113 is inserted between the at least one heat sink 111 of the heat sink body 110, so that the heat transfer rate between the at least one heat sink 111 can be increased, and the heat dissipation efficiency of the heat sink body 110 can be improved.

The embodiment of the application provides electronic equipment, and the electronic equipment comprises the heat dissipation device in any embodiment of the application.

Here, the structure of the electronic device is not limited. For example, the electronic device may be a computer, a server, a notebook computer, a mobile phone, a game machine, or the like.

In embodiments of the present application, the heat transfer fluid may include at least one of: water, fluorinated liquids or organic solvents.

In some embodiments, the electronic device further comprises: a tank storing a heat transfer fluid; the heat dissipation device is placed in the box body.

In some embodiments, the electronic device further comprises: drive arrangement and with the heat conduction fluid matter circulation pipeline of box intercommunication.

The technical solutions described in the embodiments of the present application can be arbitrarily combined without conflict.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application.

Claims

1. A heat dissipation device, the device comprising:

a heat dissipation body;

the baffle plate is arranged on the body to be heated in a surrounding mode, the first end of the baffle plate is connected with the heat radiating body in a sealing mode, and the second end of the baffle plate abuts against the supporting surface of the body to be heated;

2. The apparatus of claim 1, further comprising:

3. The device according to claim 1 or 2,

the heat dissipation body comprises more than one heat dissipation fin, the more than one heat dissipation fin are connected through a connecting piece, and heat can be transferred among the more than one heat dissipation fin through the connecting piece.

4. The apparatus of claim 3,

the heat dissipation body further comprises a heat conduction pipe, the heat conduction pipe penetrates through the space between the more than one heat dissipation fins, one end of the heat conduction pipe is abutted to the heat conduction medium, and the heat conduction pipe can conduct heat transfer between the more than one heat dissipation fins and the heat conduction medium.

5. The apparatus of claim 1 or 2, wherein the heat transfer medium comprises at least one of: heat conducting colloid, heat conducting paste, heat conducting liquid or heat conducting particles.

6. An electronic device characterized in that the electronic device comprises the heat dissipating apparatus according to any one of claims 1 to 5.

7. The electronic device of claim 6,

the heat sink is immersed in the thermally conductive fluid.

8. The electronic device of claim 7, further comprising: the heat dissipation device comprises a box body stored with heat conduction fluid, and the heat dissipation device is placed in the box body.

9. The electronic device of claim 8, further comprising: the driving device and a heat-conducting fluid circulating pipeline communicated with the box body;

10. The electronic device of claim 9, further comprising: and the radiator is communicated with the heat conduction fluid circulating pipeline, and heat conduction fluid in the heat conduction fluid circulating pipeline can exchange heat with the external environment through the radiator.