CN101715283A - Radiation device - Google Patents
Radiation device Download PDFInfo
- Publication number
- CN101715283A CN101715283A CN200910189744A CN200910189744A CN101715283A CN 101715283 A CN101715283 A CN 101715283A CN 200910189744 A CN200910189744 A CN 200910189744A CN 200910189744 A CN200910189744 A CN 200910189744A CN 101715283 A CN101715283 A CN 101715283A
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- China
- Prior art keywords
- sealing housing
- heat
- cavity
- heat abstractor
- radiation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a radiation device, which comprises a sealed shell, radiation liquid and an air radiation pipe, wherein the sealed shell accommodates an element of which heat is to be radiated; the radiation liquid is encapsulated in the sealed shell and covers the element of which heat is to be radiated; and the air cooling pipe passes through the shell wall of the sealed shell and a cavity in the sealed shell. In the device, liquid radiation and air cooling radiation are smartly combined, the heat absorbed by liquid is radiated outside by the shell and the radiation pipe, and the radiation effect is excellent. The device can radiate the heat of the element of which the heat is to be radiated under a sealed condition, has excellent effect of preventing pollution by dust, pest and the like and particularly ensures the long-time normal operation of electrical and electronic equipments.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applicable to electric equipment and electronic equipment based on the liquid cools heat radiation.
[background technology]
For various electric equipments and electronic equipment, because the heat that work produces can't obtain the problem of timely and effective processing, just heat dissipation problem is one of most important reason that influences operate as normal.
Industry has proposed various heat sink conceptions, cuts both ways.
For example, dispel the heat, adopt fin coupling fan to carry out wind-cooling heat dissipating more for electronic equipment for electric equipment such as transformer adopting insulating oil.
But, there is no liquid cooling and air-cooled cooperation heat sink conception preferably at present.
[summary of the invention]
In view of this, be necessary to provide a kind of liquid cooling and air-cooled ingenious cooperation and radiating effect is splendid, and be applicable to the heat abstractor of electric equipment and electronic equipment.
To achieve the above object, the present invention adopts following technical scheme:
A kind of heat abstractor comprises: seal casinghousing, the ccontaining device that needs heat radiation; Radiator liquid is encapsulated in the sealing housing and is enough to cover the device that this need dispel the heat; And the air hot channel, run through the shell wall of sealing housing and pass cavity in the sealing housing.
Preferably, this air hot channel comprises the shell wall that runs through the sealing housing and passes the tracheae of the cavity of sealing housing.
Preferably, this air hot channel further comprises the air chamber that is arranged at sealing housing middle part, and the cross section of this air chamber is greater than this tracheae, and this tracheae runs through the shell wall of sealing housing and passes the cavity of sealing housing and be connected with this air chamber.
Preferably, the outside wall surface of the air chamber of this air hot channel and tracheae are positioned to extend on the outside wall surface at position of sealing housing and are provided with a plurality of fin.
Preferably, this tracheae comprises two at least, runs through the shell wall of sealing housing respectively and passes the cavity of sealing housing and be connected with this air chamber.
Preferably, this annulus trachealis is around the cavity that passes the sealing housing.
Preferably, fan is housed to this air hot channel coupling.
Preferably, this air hot channel is covered by this radiator liquid.
Preferably, this radiator liquid is not filled up the cavity of sealing housing, and the outside wall surface of sealing housing is provided with a plurality of fin.
Preferably, this device that need dispel the heat is electric equipment or electronic equipment, and the electric wire of this electric equipment or electronic equipment leads to the sealing outside, and this radiator liquid is an iknsulating liquid.
The present invention utilizes the dual heat radiation of liquid heat radiation and the ingenious cooperation of wind-cooling heat dissipating, and the heat that liquid absorbed not only looses outward by housing, and rejects heat to the outside by hot channel, and radiating effect is fabulous.
The present invention is dispelled the heat under the condition of sealing to the device of need heat radiation, prevents that the effect of dust, insect and other pollution is splendid, particularly for electric equipment and electronic equipment, has guaranteed the realization of long-time operate as normal.
[description of drawings]
For further understanding feature of the present invention and technology contents, see also following relevant accompanying drawing of the present invention, yet appended graphic reference and the explanation usefulness of only providing not is to be used for the present invention is limited.
Fig. 1 is the schematic diagram of heat abstractor of the present invention.
Each label is in the accompanying drawing:
1 seal casinghousing, 11 fin
2 air chambers
3 tracheaes
4 fin
5 circuit boards, 51 electronic components, 52 electric wires
6 iknsulating liquids
[embodiment]
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
As shown in Figure 1, the present invention is applied to high-frequency plasma electrodeless discharge lamp and low frequency electrodeless lamp, because bulb inside does not have filament, therefore the life-span of light fixture is depended on the electronic circuit and the bulb manufacturing technology of lamp, that is to say, the heat radiation of electronic circuit is very big to the lamp life influence, and the advantage of heat radiation of the present invention has obtained splendid embodiment.And, the high-frequency plasma electrodeless discharge lamp extensively should be in industry, commerce and public illumination, as market, factory building, venue, station, harbour, airport, subway station, highway, town road, bridge and tunnel etc., the comparatively abominable place of particularly most of environment, the present invention is dispelled the heat under the condition of sealing to circuit, prevents that the effect of dust, insect and other pollution is splendid.
Heat abstractor of the present invention comprises seal casinghousing 1, air hot channel and is encapsulated in the seal casinghousing 1 and is enough to cover the device (circuit board 5) that needs heat radiation and the radiator liquid 6 of air hot channel;
Seal casinghousing 1 is the housing that is provided with sealed cavity in, and the outside wall surface of seal casinghousing 1 is provided with a plurality of fin 11;
Circuit board 5 is packed in the bottom of seal casinghousing 1 cavity, and the electric wire 52 of circuit board 5 leads to the outside of seal casinghousing 1;
The air hot channel comprises the shell wall that runs through seal casinghousing 1 and passes the tracheae 3 and the air chamber 2 that is arranged at seal casinghousing 1 middle part of the cavity of seal casinghousing 1; The cross section of air chamber 2 is much larger than tracheae 3; Tracheae 3 can be designed as many (shown in the figure being two), run through the shell wall of seal casinghousing 1 respectively and pass the cavity of seal casinghousing 1 and be connected with air chamber 2, tracheae 3 also can be designed as around the cavity that passes seal casinghousing 1 to obtain better radiating effect; The outside wall surface of air chamber 2 and tracheae 3 are positioned to extend on the outside wall surface at position of seal casinghousing 1 and are provided with a plurality of fin 4; At the correct position of air hot channel, all fan can be housed as in the air chamber 2 or tracheae 3 outsides, to obtain better radiating effect;
Circuit board 5 and on electronic component 51, air hot channel in air chamber 2, tracheae 3 and fin 4 all covered by radiator liquid 6 fully, the cavity that radiator liquid 6 is not filled up seal casinghousing 1 is to destroy seal casinghousing 1 in order to prevent expanded by heating; The device that present embodiment need dispel the heat is a circuit board, and radiator liquid 6 adopts iknsulating liquid, as transformer oil or other suitable liquid.
The present invention can be applicable to electric equipment and electronic equipment, also can be applicable to the device that other need dispel the heat.
As known by the technical knowledge, the present invention can realize by other the embodiment that does not break away from its spirit or essential feature.Therefore, above-mentioned disclosed embodiment with regard to each side, all just illustrates, and is not only.All within the scope of the present invention or the change in being equal to scope of the present invention all be included in the invention.
Claims (10)
1. heat abstractor comprises:
Seal casinghousing, the ccontaining device that needs heat radiation; And
Radiator liquid is encapsulated in the sealing housing and is enough to cover the device that this need dispel the heat;
It is characterized in that, further comprise:
The air hot channel runs through the shell wall of sealing housing and passes cavity in the sealing housing.
2. heat abstractor according to claim 1 is characterized in that, this air hot channel comprises the shell wall that runs through the sealing housing and passes the tracheae of the cavity of sealing housing.
3. heat abstractor according to claim 2, it is characterized in that, this air hot channel further comprises the air chamber that is arranged at sealing housing middle part, the cross section of this air chamber is greater than this tracheae, and this tracheae runs through the shell wall of sealing housing and passes the cavity of sealing housing and be connected with this air chamber.
4. heat abstractor according to claim 3 is characterized in that, the outside wall surface of the air chamber of this air hot channel and tracheae are positioned to extend on the outside wall surface at position of sealing housing and are provided with a plurality of fin.
5. heat abstractor according to claim 3 is characterized in that, this tracheae comprises two at least, runs through the shell wall of sealing housing respectively and passes the cavity of sealing housing and be connected with this air chamber.
6. heat abstractor according to claim 2 is characterized in that this annulus trachealis is around the cavity that passes the sealing housing.
7. according to each described heat abstractor in the claim 1 to 6, it is characterized in that, fan is housed to this air hot channel coupling.
8. according to each described heat abstractor in the claim 1 to 6, it is characterized in that this air hot channel is covered by this radiator liquid.
9. according to claim 1 or 6 described heat abstractors, it is characterized in that this radiator liquid is not filled up the cavity of sealing housing, the outside wall surface of sealing housing is provided with a plurality of fin.
10. heat abstractor according to claim 1 is characterized in that, this device that need dispel the heat is electric equipment or electronic equipment, and the electric wire of this electric equipment or electronic equipment leads to the sealing outside, and this radiator liquid is an iknsulating liquid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910189744A CN101715283A (en) | 2009-08-27 | 2009-08-27 | Radiation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910189744A CN101715283A (en) | 2009-08-27 | 2009-08-27 | Radiation device |
Publications (1)
Publication Number | Publication Date |
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CN101715283A true CN101715283A (en) | 2010-05-26 |
Family
ID=42418425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN200910189744A Pending CN101715283A (en) | 2009-08-27 | 2009-08-27 | Radiation device |
Country Status (1)
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CN (1) | CN101715283A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102537783A (en) * | 2011-12-09 | 2012-07-04 | 东莞勤上光电股份有限公司 | Power module for LED road lamp |
CN104541226A (en) * | 2012-06-29 | 2015-04-22 | 阿塞泰克丹麦公司 | Server memory cooling apparatus |
CN108322019A (en) * | 2018-03-30 | 2018-07-24 | 湖州旭源电气科技有限公司 | A kind of modular power source of low power consumption high efficiency |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2598249Y (en) * | 2003-01-20 | 2004-01-07 | 李海平 | High-power switch power supply for electroplating |
US20060118280A1 (en) * | 2004-12-03 | 2006-06-08 | Foxconn Technology Co.,Ltd | Cooling device incorporating boiling chamber |
CN101018471A (en) * | 2007-03-05 | 2007-08-15 | 方志宏 | No-noise liquid cooling method |
CN201479532U (en) * | 2009-08-27 | 2010-05-19 | 李建权 | Radiating device |
-
2009
- 2009-08-27 CN CN200910189744A patent/CN101715283A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2598249Y (en) * | 2003-01-20 | 2004-01-07 | 李海平 | High-power switch power supply for electroplating |
US20060118280A1 (en) * | 2004-12-03 | 2006-06-08 | Foxconn Technology Co.,Ltd | Cooling device incorporating boiling chamber |
CN101018471A (en) * | 2007-03-05 | 2007-08-15 | 方志宏 | No-noise liquid cooling method |
CN201479532U (en) * | 2009-08-27 | 2010-05-19 | 李建权 | Radiating device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102537783A (en) * | 2011-12-09 | 2012-07-04 | 东莞勤上光电股份有限公司 | Power module for LED road lamp |
CN104541226A (en) * | 2012-06-29 | 2015-04-22 | 阿塞泰克丹麦公司 | Server memory cooling apparatus |
CN104541226B (en) * | 2012-06-29 | 2020-08-07 | 阿塞泰克丹麦公司 | Server memory cooling device |
CN108322019A (en) * | 2018-03-30 | 2018-07-24 | 湖州旭源电气科技有限公司 | A kind of modular power source of low power consumption high efficiency |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
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Application publication date: 20100526 |