KR101207379B1 - LED assembly and LED lighting apparatus of bulb type using the same - Google Patents

Abstract

The present invention relates to an LED assembly having improved withstand voltage characteristics and a bulb type LED lighting device using the same.
The present invention is a plurality of LED mounted LED substrate; A heat dissipation housing for dissipating heat generated from the LED package mounted at one side; A driving circuit board disposed in the heat dissipation housing and mounted with various elements for driving the plurality of LEDs; An insulation member surrounding the circuit board for insulation between the various elements of the circuit board and the heat dissipation housing; A screw cap coupled to the other side of the heat dissipation housing to apply power to the LED package; And a transparent or translucent globe coupled to one side of the heat dissipation device for casing the LED substrate.

Description

LED assembly and LED lighting apparatus of bulb type using the same}

The present invention relates to an LED assembly and a bulb-type LED lighting device using the same, and more particularly to an LED assembly and a bulb-type LED lighting device using the same that can improve the breakdown voltage characteristics without increasing the processing cost while maintaining heat dissipation characteristics and weight. .

Generally, in order to use a light emitting diode (LED) as a white light source for lighting, red, green, and blue LEDs are produced in a single package to generate white light by three-element light (in this case, The voltage and current applied to each LED must be precisely adjusted so that the illumination of each light is uniform.), And the light emitted from the blue or yellow LED passes through the yellow or blue phosphor so that the short wavelength is light of various wavelengths. In this case, a pseudo white is obtained, or near ultraviolet rays pass through a phosphor, and a white color is produced like a fluorescent lamp.

Among them, a white light source combining a blue LED, an ultraviolet LED, and a fluorescent material is the mainstream.

The fluorescent material may be coated on a hemispherical cover of a lighting fixture, or a method of attaching a phosphor tape to the front surface, and in some cases, may be configured by coating a phosphor on the surface of the LED.

The white light source using the LED as described above has been spotlighted as a new illumination light source because of its excellent luminous efficiency, high luminous intensity, high speed response and long life. That is, the illuminance of 40 to 60W incandescent light bulbs can be replaced with 5-10W power using about 80 LEDs, and the 100W incandescent light bulb can implement the same illuminance at about 13W power using 128 LEDs. Therefore, the power consumed to implement the same illuminance environment is very low compared to the fluorescent lamp as well as the conventional "A" type incandescent lamp.

However, such a bulb type LED lighting device must maintain a withstand voltage of 4 kV or more for at least 1 minute in order to meet the withstand voltage standard required by the European Union (CE), which is recommended for the sale of products to the European Community.

Therefore, the conventional bulb-type LED lighting device has a problem that a large heat dissipation housing to be installed inside to meet the required withstand voltage. In order to avoid this, the heat dissipation housing was made of aluminum (Al) having excellent heat transfer characteristics, and then a method of forming an insulating material alumina (Al ₂ O ₃ ) on its surface was used.

However, when the surface of the Al heat dissipation housing is treated with a ceramic such as alumina, the heat dissipation characteristics are reduced, the weight is increased, and the expensive treatment cost is generated, resulting in a decrease in the price competitiveness of the product. There was a problem to let.

Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, the object of which is to increase the processing cost while maintaining the heat dissipation characteristics and weight by using an Al heat dissipation housing without a separate insulation treatment as a heat dissipation housing It is to provide a LED assembly and a bulb-type LED lighting device using the same that can improve the withstand voltage characteristics without.

It is another object of the present invention to provide an LED assembly in which an LED is mounted and a circuit pattern and a heat transfer pattern are optimized while mounting an LED using a substrate made of an insulating flame retardant resin to reinforce the withstand voltage characteristics.

The present invention to achieve the above object, a plurality of LED mounted LED substrate; A heat dissipation housing for dissipating heat generated from the LED of the LED substrate mounted on one side; A driving circuit board disposed in the heat dissipation housing and mounted with various elements for driving the plurality of LEDs; An insulation member surrounding the circuit board for insulation between the various elements of the circuit board and the heat dissipation housing; A screw cap coupled to the other side of the heat dissipation housing to apply external power to the driving circuit board; And a globe coupled to one side of the heat dissipation device to casing the LED substrate.

The heat dissipation housing may use an Al heat dissipation housing without a separate insulation treatment, thereby suppressing the increase in processing cost while maintaining the heat dissipation characteristics and weight.

The insulating member may have a cutout formed at one side thereof, and a heat conductor for transferring heat generated from a portion of the driving circuit board to the insulating housing may be disposed at the cutout. In this case, it is preferable that one side of the thermal conductor is in close contact with an element or terminal having high heat generation in the driving circuit board, and the other side is in close contact with the inner circumferential surface of the heat dissipating housing. In addition, the thermal conductor may be formed of a thermal pad.

The insulating member may be formed of a cap-shaped PC injection molding, the insulating member is preferably made of a flame-retardant synthetic resin, for example, polycarbonate. In addition, the insulating member may be formed of a tape made of polyethylene or polyimide. In addition, the insulating member may be made of a silicon molding filled between the heat dissipation housing and the driving circuit board.

The LED substrate is made of an insulating flame retardant resin, it is preferable that the flame retardant grade is a resin corresponding to FR-4.

The LED substrate may include a wiring hole disposed at a center of the power supply wiring for supplying power to the plurality of LEDs; A plurality of bolting holes disposed at a distance from the wiring hole and passing through a plurality of fixing members for fixing the LED substrate to the heat dissipation housing; A plurality of heat transfer patterns disposed at intervals from the wiring holes and the plurality of bolt fastening holes to transfer heat generated from the plurality of LEDs to the heat dissipation housing; A plurality of pairs of LED bonding pads spaced from the wiring holes and the plurality of bolt fastening holes and disposed adjacent to the plurality of heat transfer patterns, respectively; And a plurality of linear circuit patterns for interconnecting the LED bonding pads to serially connect the plurality of LEDs mounted on the plurality of pairs of LED bonding pads.

The heat transfer pattern may be formed on the front and rear surfaces of the LED substrate, and may be connected to a plurality of conductive through holes penetrating the heat transfer pattern. In this case, the LED substrate is preferably coated with insulating silicon on at least one of the front and back surfaces.

A plurality of linear circuit patterns for interconnecting the LED bonding pads are preferably spaced apart from the wiring holes and the plurality of bolt fastening holes.

The fixing member may include a bolt and an insulation washer that are sequentially fastened through the LED substrate and the heat dissipation housing.

The fixing member may include a plurality of protrusions formed on the heat dissipation housing, and the plurality of protrusions may be inserted through the LED substrate and then fix the LED substrate to the heat dissipation housing by any one of caulking, riveting, and rolling. Of course it is possible.

The insulation pad may further include an insulation pad inserted between the heat dissipation housing and the LED substrate. In this case, the insulation pad may be formed of any one of silicon, acrylic, and urethane. In addition, the insulating pad is preferably a filler for thermal conductivity is added.

The heat dissipation housing is set so that a wiring hole through which power wiring for supplying power to the plurality of LEDs penetrates is larger than a wiring hole of the LED substrate, so that the circuit pattern of the LED substrate is separated between the heat dissipation housings. It is desirable to.

The screw cap is bolted to the heat dissipation housing, and the bolt connection portion may be coated with silicon.

According to another feature of the invention, the LED assembly for the bulb type LED lighting device, comprising: a plurality of LEDs; And an LED substrate on which the plurality of LEDs are mounted and made of an insulating flame retardant resin, wherein the LED substrate comprises: a wiring hole disposed at a center of the power supply wiring for supplying power to the plurality of LEDs; A plurality of bolting holes disposed at a distance from the wiring hole and passing through a plurality of fixing members for fixing the LED substrate to the heat dissipation housing; A plurality of heat transfer patterns disposed at intervals from the wiring holes and the plurality of bolt fastening holes to transfer heat generated from the plurality of LEDs to the heat dissipation housing; A plurality of pairs of LED bonding pads spaced from the wiring holes and the plurality of bolt fastening holes and disposed adjacent to the plurality of heat transfer patterns, respectively; And a plurality of linear circuit patterns for interconnecting the LED bonding pads to serially connect the plurality of LEDs mounted on the plurality of pairs of LED bonding pads.

As described above, in the present invention, various elements and power terminals mounted on the driving circuit board through the insulating cap may not only come into contact with the main surface of the heat dissipation housing made of metal, but also may be insulated together to improve the breakdown voltage. In addition, the heat generated from the high heat generating element of the driving circuit board is transferred to the heat dissipation housing through the heat transfer member disposed through the cutout portion of the insulating cap, thereby improving the withstand voltage and performing efficient cooling.

In addition, the present invention, as well as optimizing the position and size of the circuit pattern and heat transfer pattern while mounting the LED using a substrate made of insulating flame retardant resin (FR-4) to reinforce the withstand voltage characteristics of the LED substrate of the LED assembly In addition, the circuit pattern of the LED substrate may be linearly formed so as to widen the spacing with a plurality of bolts, thereby improving the withstand voltage characteristic of the LED lighting apparatus.

Furthermore, the present invention can improve the withstand voltage characteristics between the heat generating housing and the LED substrate by disposing an insulation pad including the heat conductive filler between the heat generating housing and the LED substrate.

In addition, the present invention can improve the withstand voltage characteristics by widening the through-hole of the heat dissipation housing through which the DC power wiring passes, thereby increasing the distance between the circuit pattern of the LED substrate and the heat dissipation housing.

As described above, the present invention can maintain the heat dissipation characteristics and weight as it is, while improving the withstand voltage characteristics, it is not necessary to manufacture the expensive insulating material of the heat dissipation housing can reduce the manufacturing cost.

1 is an assembled perspective view showing a light bulb-type LED lighting apparatus according to an embodiment of the present invention,
2 and 3 are exploded perspective views respectively showing the bulb-type LED lighting apparatus according to an embodiment of the present invention,
4 is a longitudinal cross-sectional view taken along line IV-IV shown in FIG. 1;
5 is a cross-sectional view taken along the line VV of FIG. 4,
6 is a plan view of an LED assembly showing a circuit pattern and a thermal conductivity pattern disposed on the front surface of the LED substrate;
7 is a partially enlarged view of FIG. 6;
FIG. 8 is a rear view of the LED assembly shown in FIG. 6.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the bulb-type LED lighting apparatus according to an embodiment of the present invention.

1 to 3, the bulb type LED lighting device 1 of the present embodiment uses three LEDs 71, for example, and consumes power that satisfies the 4 kV withstand voltage characteristic required by safety standards such as CE. It can be implemented as a 3.5W bulb-type LED lamp.

However, the present invention is not limited to the 3.5W lamp described above, but is also applicable to a bulb type LED lighting device and a lamp having a large power capacity.

The LED lighting device 1 includes a heat dissipation housing 10, a driving circuit board 30, an insulation cap 50, a screw cap 60, an LED substrate 70, an insulation pad 80, and a glove 90. It includes.

The heat dissipation housing 10 is open at the top and closed at the bottom thereof, and has a substantially cylindrical space 11 for inserting the driving circuit board 30 therein. In addition, the heat dissipation housing 10 protrudes with a substantially constant thickness in the vertical direction, and a plurality of heat dissipation fins 13 arranged radially at an equal angle along the outer circumference are integrally formed. Such a plurality of heat dissipation fins 13 have a wider interval from the upper side to the lower side, and transfer the heat conducted from the LED substrate 70 and the driving circuit board 30 to the heat dissipation housing 10 to the plurality of heat dissipation fins 13. .

In this case, as the plurality of heat dissipation fins 13 are disposed in the vertical direction, the heat generated from the plurality of LEDs 71 is transferred to the heat transfer patterns 78a-78c, 74a-74c and the insulating pads of the LED substrate 70. 80 is conducted to the heat dissipation housing 10 through a plurality of heat dissipation fins 13 exposed to the atmosphere, the heat exchange is made while the rising air around the uniformly passes between the plurality of heat dissipation fins 13. As described above, the plurality of heat dissipation fins 13 are arranged in the vertical direction so that air cooling is performed without disturbing the natural convection flow in which the hot air rises.

Furthermore, the heat dissipation housing 10 has a circular flat surface 15 on which the LED substrate 70 and the insulating pad 80 are fixed by the bolts 21, and the outer periphery of the circular flat surface 15 is formed. Accordingly, an annular insertion groove 17 into which the upper end 91 of the glove 90 is inserted is formed. The flange portion 14 is formed to be interconnected to the bottom of the plurality of heat radiation fins 13 has a groove along the outer periphery between the circular flat surface 15 so as to form an annular insertion groove 17 therein Is formed, and the heat generated from the plurality of LEDs 71 is transmitted to the circular flat surface 15, and serves as a path to the lower end of the heat radiation fin (13).

In addition, the heat dissipation housing 10 has a through hole 19 through which the DC power wirings 35a and 35b pass through the center of the circular flat surface 15. In this case, the through hole 19 of the heat dissipation housing 10 is larger than the through hole 73 through which the DC power wirings 35a and 35b of the LED substrate 70 pass. Accordingly, it is possible to increase the breakdown voltage characteristic of the LED lighting apparatus 1 of the present embodiment by widening the interval between the circuit patterns 76a-76d (see FIG. 6) of the LED substrate 70 and the heat dissipation housing 10.

The driving circuit board 30 is inserted approximately perpendicular to the space 11 of the heat dissipation housing 10 in a state surrounded by the insulating cap 50. The drive circuit board 30 includes various elements 38 such as an integrated circuit (IC) for an AC / DC converter, a power transistor, an Al capacitor, a chip resistor, and the like. .

As shown in FIG. 4, the driving circuit board 30 is provided with AC power supply terminals 33a and 33b to which AC power wirings 31a and 31b are connected to a portion adjacent to the screw cap 60, and an LED substrate 70. The DC power supply terminals 37a and 37b to which the DC power supply wirings 35a and 35b are connected are formed in a portion adjacent to the.

The insulating cap 50 may include the driving circuit board 30 such that various elements 38 and the power terminals 33a, 33b; 37a, 37b mounted on the driving circuit board 30 do not contact the inner circumferential surface of the heat dissipation housing 10. It is inserted into the space portion 11 of the heat dissipation housing 10 in a state surrounding the. The insulating cap 50 may be made of an injection made of a flame retardant synthetic resin, for example, polycarbonate (PC). In this case, the insulating cap 50 is preferably provided with a pair of slots spaced apart from the bottom surface in order to fix the driving circuit board 30 inserted into the internal space (see Fig. 5).

Meanwhile, in the present embodiment, the insulating cap 50, which is an injection molded product, is used to insulate the various elements 38 and the power terminals 33a, 33b; 37a, 37b of the driving circuit board 30 and the heat dissipation housing 10 as an example. For example, the present invention is not limited thereto. Instead of the insulating cap 50, the driving circuit board 30 may be wrapped with a tape made of polyethylene or polyimide.

In addition, the LED lighting device 1 of the present invention is a drive circuit board embedded in the inner space 11 of the heat dissipation housing 10 instead of the tape with an insulating cap 50 and polyethylene or polyimide (PE) ( It is also possible to fill the silicon with an insulating material in the inner space of the heat dissipation housing 10, the screw cap 60 and the connecting member 61 for waterproof / dustproof 30.

The insulating cap 50 has an approximately cylindrical shape in which the upper part is opened and the lower part is closed. The open upper portion of the insulating cap 50 has a driving circuit board 30 inserted therein, and a through hole 53 (refer to FIG. 4) is formed at a lower portion thereof so that the DC power wirings 35a and 35b pass therethrough.

In this case, the insulation cap 50 forms a cutout 51 on one circumferential surface, and the heat transfer member 55 is disposed on the cutout 51. As shown in FIGS. 4 and 5, the heat transfer member 55 is in close contact with a high heat generating element 39 such as an integrated circuit (IC) or a power transistor or a terminal thereof mounted on the driving circuit board 30. For example, the other side is in close contact with the heat dissipation housing 10, and is preferably a thermal pad. Accordingly, the heat generated from the high heat generating element 39 or the terminal can be transferred to the heat dissipation housing 10 through the heat conductor 55 to efficiently cool the driving circuit board 30.

In addition, the insulating cap 50, as shown in Figure 5, may be filled with epoxy or silicon (57) therein for waterproof / dustproof. In addition, instead of the insulating cap 50, the inside of the heat dissipation housing 10 may be filled with epoxy or silicon 57 only for waterproof / dustproof.

The screw cap (or base) 60 may be made of a metal material such as nickel (Ni), for example, and is bolted to an upper end of the heat dissipation housing 10 through a connection member 61 made of an insulator. In this case, the connection member 61 is formed with a plurality of bolt fastening holes 61a to which the plurality of bolts 63 are fastened, and in this case, a silicon molding is formed in the bolt fastening holes 61a to form the LED lighting device 1. Withstand voltage characteristics can be improved.

The screw cap 60 is threaded to be screwed into a conventional socket. In addition, the screw cap 60 is provided with (+) and (-) power contacts 60a and 60b connected through the AC power wirings 31a and 31b drawn out from the driving circuit board 30.

For example, in the case of a 3.5W lamp, the LED substrate 70 has three 1W LEDs 71 disposed at approximately the same angle in the radial direction, and a through hole through which the DC power wirings 35a and 35b pass in the center thereof. 73) is formed. In this case, the LED substrate 70 is made of an insulating flame retardant resin, not a conventional metal substrate, the flame retardant grade is preferably equivalent to FR-4. As such, since the LED substrate 70 is made of an insulating flame retardant resin, the withstand voltage of the LED lighting apparatus 1 may be increased as compared with the case of using a conventional metal substrate.

6 to 8, the LED bonding pad 72, the circuit patterns 76a-76d, and the heat transfer patterns 78a-78c, 74a-74c are conventionally designed in addition to the material of the substrate. Unlike this, the withstand voltage can be increased. That is, the LED substrate 70 is mounted on the circular flat surface 15 of the heat dissipation housing 10 by fastening a plurality of bolts 21 to the bolt fastening holes 75, for example, bolt fastening holes ( 75 is preferably disposed between the through-hole 73 located in the central portion of the LED substrate 70 and the outer peripheral portion of the LED substrate 70.

The heat transfer patterns 78a-78c and 74a-74c are located on the same or similar circumference as the three bolt fastening holes 75 and are disposed between the three bolt fastening holes 75, and the heat transfer patterns 78a are provided. A portion of the lower side of the LED 71 is mounted at -78c) to transfer heat generated by the operation. In addition, a pair of LED bonding pads in which a pair of power pads (not shown) are mounted adjacent to the heat transfer patterns 78a-78c on which some of the lower surfaces of the LED 71 are mounted. 72a and 72b are arrange | positioned at intervals.

Three pairs of LED bonding pads 72a and 72b disposed adjacent to the three heat transfer patterns 78a and 78b are interconnected by four first to fourth circuit patterns 76a to 76d, and two The first and second circuit patterns 76a and 76b connect two pairs of LED bonding pads 72a and 72b to each other, and the remaining two third and fourth circuit patterns 76c and 76d have one through hole 73 at one end thereof. DC power wirings 35a and 35b drawn from the N / A are connected to DC power terminals 37c and 37d to be connected, respectively, and the other end is connected to the LED bonding pads 72a and 72b.

In this case, the four circuit patterns 76a-76d formed on the front surface of the LED substrate 70 are set to pass between the through holes 73 and the three bolts 21, and the through holes 73 and the three bolts ( The circuit pattern 76 is formed in a linear line so as to widen the gap between the two. In this case, the four circuit patterns 76a to 76d connect three LEDs 71 in series, and DC power terminals 37c to which one side of two third and fourth circuit patterns 76c and 76d are connected. When the DC power wirings 35a and 35b passing through the through hole 73 are connected to 37d), the three LEDs 71 are supplied with DC power in a series connection manner.

In addition, heat transfer patterns 78a-78c and 74a-74c for transferring heat generated from the plurality of LEDs 71 to the heat dissipation housing 10 are three arcs each on the front and rear surfaces of the LED substrate 70. It is formed in a band shape and is connected to a plurality of conductive through holes 79 passing through the heat transfer patterns 78a-78c and 74a-74c.

In this case, the heat transfer patterns 78a-78c on the front surface of the LED substrate 70 are made of a smaller area than the conventional heat transfer patterns so as to widen the gap between adjacent bolts 21 as much as possible, and each LED 71 is mounted thereon. It is formed in a portion adjacent to the LED bonding pads (72a, 72b), and transfers the heat generated from the LED (71) to the heat transfer pattern (74a-74c) on the back of the LED substrate 70, and then through the insulating pad 80 Indirect transmission to the heat dissipation housing (10).

On the other hand, the insulating pad 80 is for improving the breakdown voltage between the heat dissipation housing 10 and the LED substrate 70, it is disposed between the heat dissipation housing 10 and the LED substrate 70. The insulating pad 80 may be made of any one of silicon, acrylic, and urethane having insulation. In this case, it is preferable that the insulating pad 80 adds a heat conductive filler in order to efficiently transfer the heat transferred from the heat transfer patterns 74a-74c to the heat dissipation housing 10.

The insulating pad 80 is formed to be substantially the same as or larger than the diameter of the LED substrate 70, and the through-hole 83 and the plurality of bolts 21 through which the DC power wirings 35a and 35b penetrate at the center thereof. A plurality of bolting holes 85 are formed.

Meanwhile, when the bolt 21 is fastened to the LED substrate 70, the bolt 21 may be fastened through the insulating washer 23, thereby insulating the circuit patterns 76a-76d and the bolt 21 to help improve the breakdown voltage. have.

Meanwhile, in the present embodiment, the example in which a plurality of bolts 21 are used as fixing members for fixing the LED substrate 70 and the insulating pad 80 to the heat dissipation housing 10 has been described, but is not limited thereto. Forming a plurality of protrusions (not shown) integrally formed on the circular flat surface 15 of the housing 10, and inserting the plurality of protrusions through the LED substrate 70 and the insulating pad 80 and then caulking, It is also possible to fix the LED substrate 70 and the insulating pad 80 to the heat dissipation housing 10 by any one of riveting and rolling.

The glove 90 is formed in a substantially spherical shape with one side open with a transparent or semi-transparent glass. The glove 90 has an upper end 91 coupled to the insertion groove 17 of the heat dissipation housing 10 to casing the LED 71 and the LED substrate 70. In this case, molding treatment for waterproofing can be performed to the insertion groove 31d of the heat dissipation housing 10 by using epoxy, for example.

In the present invention configured as described above, by forming the heat dissipation housing as Al and not performing a separate alumina insulation treatment as follows, it is possible to increase the withstand voltage characteristics while reducing cost, improving heat dissipation characteristics and suppressing weight increase. have.

That is, the various elements 38 and the power terminals 33a, 33b; 37a, 37b mounted on the driving circuit board 30 through the insulating cap 50 do not contact the inner circumferential surface of the heat dissipating housing 10 made of metal. Insulation can be performed together to improve the breakdown voltage. In addition, the heat generated from the high heat generating element 39 of the driving circuit board 30 is transferred to the heat dissipating housing 10 through the heat transfer member 55 disposed through the cutout 51 of the insulating cap 50. In addition, efficient cooling can be performed along with the improved withstand voltage.

In addition, the LED substrate 70 may be made of an insulating flame retardant resin (FR-4: glass epoxy) instead of a general metal PCB, and the circuit patterns 76a-76d of the LED substrate 70 may have a plurality of bolts 21. It is possible to improve the breakdown voltage characteristics of the LED lighting device 1 by forming a linear to widen the gap.

Furthermore, as the insulating pad 80 including the conductive filter is disposed between the heat generating housing 10 and the LED substrate 70, the breakdown voltage characteristic between the heat generating housing 10 and the LED substrate 70 can be improved.

In addition, the through-hole 19 of the heat dissipation housing 10 through which the DC power wirings 37a and 37b pass is widened so that the distance between the circuit patterns 76a-76d of the LED substrate 70 and the heat dissipation housing 10 is increased. By doing so, the breakdown voltage characteristic can be improved.

Therefore, the present invention can improve the breakdown voltage characteristics while maintaining the heat dissipation characteristics and weight of the heat dissipation housing, and can reduce manufacturing cost since it is not necessary to perform expensive ceramic insulation treatment on the heat dissipation housing.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

10: housing 11: space part
13: heat sink 15: circular flat surface
17: annular insertion groove 19,54,73: through hole
21,63: bolt 23: insulation washer
30: drive circuit board 31a, 31b: AC power wiring
33a, 33b: AC power supply terminal 35a, 35b: DC power supply wiring
37a-37d: DC power supply terminal 38: device
14: flange 50: insulating cap
51: notch 55: heat transfer body
60: screw cap 61: connecting member
70: LED substrate 71: LED
72a, 72b: LED bonding pads 76a-76d: circuit pattern
78a-78c, 74a-74c: Heat Transfer Pattern 79: Conductive Through Hole
80: insulation pad 90: glove

Claims (20)

An LED substrate on which a plurality of LEDs are mounted;
A heat dissipation housing for dissipating heat generated from the LED of the LED substrate mounted on one side;
A driving circuit board disposed in the heat dissipation housing and mounted with various elements for driving the plurality of LEDs;
An insulation member surrounding the circuit board for insulation between the various elements of the circuit board and the heat dissipation housing, the insulating member including a cap-shaped injection molding;
A screw cap coupled to the other side of the heat dissipation housing to apply external power to the driving circuit board; And
Light bulb type LED lighting device comprising a glove coupled to one side of the heat dissipation housing to casing the LED substrate.
delete The method of claim 1, wherein the insulating member has a cutout portion is formed on one side, the bulb-shaped LED lighting, characterized in that the heat conductor for transferring the heat generated from the drive circuit board to the heat dissipation housing is disposed. Device. The bulb type LED lighting device of claim 3, wherein the thermal conductor is a thermal pad. According to claim 1, wherein the insulating member is a bulb type LED lighting device, characterized in that made of flame-retardant synthetic resin. The method of claim 1, wherein the insulating member is a bulb type LED lighting apparatus, characterized in that the tape made of polyethylene or polyimide. An LED substrate on which a plurality of LEDs are mounted;
A heat dissipation housing for dissipating heat generated from the LED of the LED substrate mounted on one side;
A driving circuit board disposed in the heat dissipation housing and mounted with various elements for driving the plurality of LEDs;
An insulation member formed of a silicon molding filled between the heat dissipation housing and the driving circuit board to surround the circuit board for insulation between the various elements of the circuit board and the heat dissipation housing;
A screw cap coupled to the other side of the heat dissipation housing to apply external power to the driving circuit board; And
Light bulb type LED lighting device comprising a glove coupled to one side of the heat dissipation housing to casing the LED substrate. The bulb type LED lighting apparatus of claim 1, wherein the heat dissipation housing has a wiring hole through which a power line for supplying power to the plurality of LEDs passes, larger than the wiring hole of the LED substrate. The bulb type LED lighting apparatus according to claim 1, wherein the LED substrate is made of an insulating flame retardant resin. 10. The bulb type LED lighting device according to claim 9, wherein the insulating flame retardant resin is a resin having a flame retardant grade of FR-4. The method of claim 9, wherein the LED substrate,
A wiring hole disposed at the center of the power supply wiring for supplying power to the plurality of LEDs;
A plurality of bolting holes disposed at a distance from the wiring hole and passing through a plurality of fixing members for fixing the LED substrate to the heat dissipation housing;
A plurality of heat transfer patterns disposed at intervals from the wiring holes and the plurality of bolt fastening holes to transfer heat generated from the plurality of LEDs to the heat dissipation housing;
A plurality of pairs of LED bonding pads spaced from the wiring holes and the plurality of bolt fastening holes and disposed adjacent to the plurality of heat transfer patterns, respectively; And
And a plurality of linear circuit patterns for interconnecting the LED bonding pads to serially connect the plurality of LEDs mounted on the plurality of pairs of LED bonding pads.  The light-emitting type LED lighting apparatus of claim 11, wherein the heat transfer patterns are formed on the front and rear surfaces of the LED substrate, and are connected to a plurality of conductive through holes penetrating the heat transfer patterns. 12. The bulb type LED lighting device according to claim 11, wherein a plurality of linear circuit patterns for interconnecting the LED bonding pads are disposed at intervals from the wiring holes and the plurality of bolt fastening holes. 12. The bulb type LED lighting device of claim 11, wherein the fixing member comprises a bolt and an insulation washer that are sequentially fastened to the LED substrate and the heat dissipation housing. 12. The method of claim 11, wherein the fixing member is a plurality of protrusions formed in the heat dissipation housing, the plurality of protrusions is inserted into the LED substrate through the caulking, riveting and rolling (rolling) any one of the LED substrate Bulb-type LED lighting device, characterized in that fixed to the heat dissipation housing. The bulb type LED lighting apparatus of claim 1, further comprising an insulation pad inserted between the heat dissipation housing and the LED substrate. The bulb type LED lighting apparatus of claim 16, wherein the insulation pad is any one of silicon, acrylic, and urethane. The method of claim 16, wherein the insulating pad is a bulb-type LED lighting device, characterized in that the filler for thermal conductivity is added. The method of claim 1, wherein the heat dissipation housing is a bulb type LED lighting device, characterized in that made of Al. In the LED assembly for the bulb type LED lighting device,
Multiple LEDs; And
The plurality of LEDs are mounted and includes an LED substrate made of an insulating flame retardant resin,
The LED substrate,
A wiring hole disposed at the center of the power supply wiring for supplying power to the plurality of LEDs;
A plurality of bolting holes disposed at a distance from the wiring hole and passing through a plurality of fixing members for fixing the LED substrate to the heat dissipation housing;
A plurality of heat transfer patterns disposed at intervals from the wiring holes and the plurality of bolt fastening holes to transfer heat generated from the plurality of LEDs to the heat dissipation housing;
A plurality of pairs of LED bonding pads spaced from the wiring holes and the plurality of bolt fastening holes and disposed adjacent to the plurality of heat transfer patterns, respectively; And
And a plurality of linear circuit patterns for interconnecting the LED bonding pads to serially connect the plurality of LEDs mounted on the plurality of pairs of LED bonding pads.

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